MWCT1000CFM - 5W Qi Wireless Charging TX PMIC | NXP | QFN-32
MPN: MWCT1000CFM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $10.27 | $10.27 |
| 10 | $7.19 | $71.90 |
| 100 | $5.57 | $557.00 |
| 490 | $4.72 | $2,312.80 |
| 980 | $4.39 | $4,302.20 |
| 1,470 | $4.28 | $6,291.60 |
MWCT1000CFM Overview
A wireless charging transmitter PMIC is a power management integrated circuit that drives a transmitter coil to deliver energy to a Qi-compatible receiver via resonant inductive coupling. The PMIC sits in the power management IC hierarchy between discrete analog transmitter controllers and full System-on-Chip wireless power platforms, combining a power stage, demodulation, FOD (Foreign Object Detection) algorithms, and fault protection in one device.
Key features include wide DC input voltage support starting at 4.2V, with typical rails of 5V, 12V and 19V, on-chip digital demodulation compatible with all standard Qi receiver modulation strategies (AC capacitor, AC resistor and DC resistor), two configurable re-pins that can drive LEDs for system status indication (charging, standby, fault), and integrated foreign-object detection using the power-loss method. The 32-HVQFN (5x5) exposed-pad package provides a low thermal-resistance path for the integrated power stage.
Architecturally, the MWCT1000CFM combines an analog power stage, a digital control core running the WCT software library, on-chip demodulation hardware, and configurable GPIO. The WCT library implements the Qi communication protocol, power transfer control, FOD via power-loss measurement, system status indication, and fault protection. Designers obtain the full Qi stack as binary firmware rather than writing a protocol stack from scratch.
Typical applications include 5V Qi-certified wireless charging pads for smartphones, single-coil low-power charging bases for wearables and earbuds, automotive Qi charging modules, and embedded wireless power in industrial and medical devices. The 5W rating makes it well suited to handset-tier charging rather than laptop or kitchen-appliance tiers.
When designing with the MWCT1000CFM, observe coil matching, resonant-capacitor selection, and thermal layout. The exposed pad must be soldered to a sufficiently large copper pour to keep junction temperature within limits at continuous 5W transmission, and the digital demodulation input network must be tuned to the chosen coil geometry.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet to help engineers select and source the part quickly.
Drop-in alternatives for MWCT1000CFM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MWCT1000CFM (same form factor and footprint) — differing in Communication Protocol, Package, Topology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MWCT1001AVLH
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MWCT1011BVLH
✅ Drop-In📋 Reference alternative (not in catalog)
MWCT1000AVLH
📋 Reference alternative (not in catalog)
MWCT1000CLH
📋 Reference alternative (not in catalog)
MWCT1000CFM
✓ In Stock
$4.28 / Unit
View Datasheet →MWCT1000CFM Maximum Ratings & Electrical Characteristics
| Product Type | Wireless Power Transmitter PMIC |
| Topology | Single-coil, Qi-compliant inductive wireless charging transmitter |
| Output Power | 5 W |
| Standard Output Voltage | 5 V |
| DC Input Voltage Range | 4.2 V minimum (typical rails: 5 V, 12 V, 19 V) |
| Receiver Modulation Strategies Supported | AC capacitor, AC resistor, DC resistor |
| Digital Demodulation | Integrated on-chip |
| Foreign Object Detection (FOD) | Power-loss method (integrated in WCT firmware library) |
| Status Indication Pins | 2 configurable LED/GPIO pins (charging, standby, fault) |
| Communication Protocol | WPC Qi (latest low-power specification); via WCT software library |
| Package | 32-HVQFN (5x5 mm) with exposed thermal pad |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| Manufacturer | NXP Semiconductors |
MWCT1000CFM Pin Configuration
| Pin 1 | COIL_P — Transmitter coil drive positive (integrated half-bridge output) |
| Pin 2 | COIL_N — Transmitter coil drive negative (integrated half-bridge output) |
| Pin 3 | VBRIDGE — Bridge supply rail for the integrated power stage |
| Pin 4 | VCC5V — 5V analog/digital supply input |
| Pin 5 | VIN — Wide-range DC input (4.2 V minimum, 5/12/19 V typical) |
| Pin 6 | GND — Ground |
| Pin 7 | COMM+ — Qi communication demodulation positive input (AC cap / AC resistor / DC resistor) |
| Pin 8 | COMM- — Qi communication demodulation negative input |
| Pin 9 | TSENSE — Thermal sense / on-die temperature monitor input |
| Pin 10 | RESET — Reset input (active low) |
| Pin 11 | SWDIO — ARM SWD debug data |
| Pin 12 | SWCLK — ARM SWD debug clock |
| Pin 13 | GPIO1 — General-purpose I/O / status LED driver |
| Pin 14 | GPIO2 — General-purpose I/O / status LED driver |
| Pin 15 | GPIO3 — General-purpose I/O |
| Pin 16 | GPIO4 — General-purpose I/O |
| Pin 17 | GPIO5 — General-purpose I/O |
| Pin 18 | GPIO6 — General-purpose I/O |
| Pin 19 | NC — Not connected (per datasheet) |
| Pin 20 | NC — Not connected (per datasheet) |
| Pin 21 | VPP — Programming voltage (factory / flash) |
| Pin 22 | XIN — Crystal oscillator input |
| Pin 23 | XOUT — Crystal oscillator output |
| Pin 24 | VDD — Internal core logic supply (decoupling) |
| Pin 25 | VSSA — Analog ground |
| Pin 26 | VDDA — Analog supply (decoupling) |
| Pin 27 | TEST — Factory test pin (tie to GND in application) |
| Pin 28 | NC — Not connected (per datasheet) |
| Pin 29 | NC — Not connected (per datasheet) |
| Pin 30 | NC — Not connected (per datasheet) |
| Pin 31 | NC — Not connected (per datasheet) |
| Pin 32 | EP — Exposed thermal pad - connect to GND and large copper pour |
Typical Applications
MWCT1000CFM is suitable for 6 applications: 5V Qi Smartphone Charging Pad, Wearable and Earbuds Charging Cradle, Automotive Qi Center Console Module, Embedded Industrial Wireless Power Module, Low-Power Qi Reference Design Platform, USB-Powered Qi Charging Dongle.
5V Qi Smartphone Charging Pad
The MWCT1000CFM's 5W / 5V rating maps directly onto the WPC Qi low-power smartphone profile, making it the canonical transmitter for sub-$25 retail charging pads. The integrated on-chip digital demodulation handles all three Qi receiver schemes (AC capacitor, AC resistor, DC resistor), so a single PCB design serves the entire Qi handset ecosystem. The exposed thermal pad on the 32-HVQFN (5x5) carries away the integrated power-stage losses during continuous 5W transmission without a separate heatsink. Power loss-method FOD is mandatory for WPC compliance and runs inside the WCT firmware library, removing the need for an external metal-detection microcontroller.
Recommended
Wearable and Earbuds Charging Cradle
Wearables, smartwatches and TWS earbuds require compact, low-cost 5W Qi cradles rather than full handset charging surfaces. The MWCT1000CFM's small 5x5 mm 32-HVQFN package lets it fit inside a watch-stand or earbud-case form factor where board area is at a premium, while still delivering the full Qi BPP (Baseline Power Profile) the receiver expects. Two LED status pins (configurable GPIO) drive a single bi-color LED to indicate charging, standby and fault without an external display controller. Operating from a 5V USB rail keeps the BOM limited to a coil, resonant caps, and the PMIC itself.
Recommended
Automotive Qi Center Console Module
Automotive Qi modules need a wide-input PMIC to survive load-dump events on the 12V car bus. The MWCT1000CFM accepts the 12V typical rail directly (and even 19V), removing the need for an upstream pre-regulator and reducing BOM cost. The 32-HVQFN 5x5 footprint fits inside the slim module PCBs used behind center-console trim panels. Two LED status outputs map naturally to the charge/standby/fault indicators drivers expect on automotive HMI surfaces. AEC-Q100 qualification status should be confirmed with NXP for the exact device revision before vehicle production.
Recommended
Embedded Industrial Wireless Power Module
Factory sensor pods, handheld scanners and medical carts increasingly integrate Qi charging rather than exposed pogo pins. The MWCT1000CFM gives industrial designers a wide-input range (4.2 V minimum, with 5/12/19 V rails) so the same module accepts 24V industrial bus power or 5V USB from a service port. The integrated digital demodulation and on-chip FOD remove the analog/digital split that other Qi transmitters require, simplifying the BOM for long-life industrial products. The 5x5 mm HVQFN footprint plus exposed pad supports the thermal budget of enclosed IP65-rated housings.
Recommended
Low-Power Qi Reference Design Platform
The MWCT1000CFM ships with NXP's WCT software library that implements the Qi communication protocol, power transfer control, FOD via power-loss, status indication and fault protection, so it doubles as a Qi reference design platform for OEMs evaluating wireless charging before committing to higher-power parts. Designers use the on-chip digital demodulation and exposed-pad HVQFN package to benchmark EMI, thermal and FOD behavior against the NXP reference coil set. The same 32-HVQFN footprint is shared by the MWCT1000 family, so platform code migrates to other variants (MWCT1011BVLH, MWCT1001AVLH) without PCB changes.
Recommended
USB-Powered Qi Charging Dongle
The MWCT1000CFM's 4.2 V minimum input maps directly onto a USB 5V supply, making it the simplest PMIC for USB-powered Qi dongles that retrofit non-charging surfaces. The 32-HVQFN 5x5 mm footprint, integrated digital demodulation, and on-chip FOD together let a single-layer dongle PCB deliver full WPC Qi BPP charging without an external demodulator IC. Two LED status pins indicate charging/standby/fault to the user, matching consumer expectations for plug-and-play Qi pads. The WCT firmware library removes the Qi protocol-stack development that would otherwise dominate a USB-dongle BOM.
Recommended
Recommended Products Summary
Engineering reference data for MWCT1000CFM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MWCT1001AVLH | MWCT1011BVLH | MWCT1000AVLH | MWCT1000CLH |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-HVQFN (5x5 mm) | 32-HVQFN (5x5 mm) - same | 32-HVQFN (5x5 mm) - same | 32-HVQFN (5x5 mm) - same | 32-HVQFN (5x5 mm) - same |
| Output Power | 5 W | 5 W (same family) | 5 W (same family) | 5 W (same family, legacy) | 5 W (same family, legacy) |
| Standard Output Voltage | 5 V | 5 V (same) | 5 V (same) | 5 V (same) | 5 V (same) |
| Input Voltage Range | 4.2 V min; 5/12/19 V typical | 4.2 V min; 5/12/19 V typical (same family) | 4.2 V min; 5/12/19 V typical (same family) | 4.2 V min; 5/12/19 V typical (same family) | 4.2 V min; 5/12/19 V typical (same family) |
| Digital Demodulation | Integrated on-chip | Integrated on-chip | Integrated on-chip | Integrated on-chip | Integrated on-chip |
| Qi Receiver Modulation Schemes | AC cap, AC resistor, DC resistor | AC cap, AC resistor, DC resistor (same family) | AC cap, AC resistor, DC resistor (same family) | AC cap, AC resistor, DC resistor (same family) | AC cap, AC resistor, DC resistor (same family) |
| FOD Method | Power-loss (integrated in WCT library) | Power-loss (same family) | Power-loss (same family) | Power-loss (same family, firmware before detach) | Power-loss (same family, firmware before detach) |
| Lifecycle Status | Active | Active (same family) | Active (same family) | Obsolete / EOL legacy | Obsolete / EOL legacy |
Key Differentiators
- Integrated digital demodulation and WCT firmware library (vs Discrete Qi transmitter designs)
- Wide 4.2V minimum input supporting 5/12/19V rails (vs USB-only Qi transmitters)
- Supports all three Qi receiver modulation schemes on-chip (vs AC-cap-only Qi transmitters)
- Compact 32-HVQFN 5x5 mm footprint with exposed thermal pad (vs Larger QFP-package Qi transmitters)
Design Notes
Estimated: at continuous 5W transmission into a Qi receiver at ~80% link efficiency, the MWCT1000CFM's integrated power stage dissipates roughly 1W in the 32-HVQFN 5x5 mm package. With a typical theta_JA near 30-40 C/W on a 1-oz 4-layer PCB with the exposed pad soldered to a 1 square inch copper pour, this gives a junction temperature rise of ~30-40 C above ambient, which is acceptable at room temperature but tight inside sealed enclosures above 50 C ambient. Always solder the exposed pad with a full via array to the bottom-layer ground pour to keep thermal resistance within datasheet limits.
Place the resonant capacitor network as close as possible to the COIL_P / COIL_N pins and keep the high-current loop area (VIN decoupling -> half-bridge -> coil -> series-resonant cap -> ground) as small as physically possible to minimize EMI. Keep the COMM+ / COMM- demodulation traces short and routed away from the switching node; the on-chip demodulator is sensitive to capacitive coupling from the COIL traces, which can shift Qi packet timing. Use a 4-layer PCB with a solid ground plane under the coil area to provide both EMI shielding and a thermal path for the exposed pad.
Do not operate the MWCT1000CFM below the 4.2 V minimum input voltage - the integrated power stage cannot maintain regulation and the FOD algorithm in the WCT library may report spurious foreign-object events. Do not leave the TEST pin floating - tie it to GND through a 10 kohm resistor as recommended in the NXP reference design, otherwise the device can enter factory-test mode after power-up. Always use the WCT firmware library binary from NXP rather than re-implementing the Qi protocol, otherwise WPC certification will fail. Confirm pin compatibility with the exact MWCT1000 family variant before substituting another 32-HVQFN Qi transmitter PMIC.
Route the COIL_P / COIL_N traces as a symmetric differential pair to balance the half-bridge switching and limit radiated emissions. Place a 10 nF X7R ceramic bypass directly on the VCC5V pin and a 1 uF X7R on the VDDA pin within 2 mm of the package. The exposed thermal pad must be stitched to the inner ground plane with a 3x3 via array on a 1.0 mm pitch to meet the datasheet thermal resistance. Avoid routing any digital signal (SWDIO, SWCLK, GPIO) under the coil area to prevent noise injection into the Qi communication channel.
Compliance Information
RoHS compliance and lead-free status confirmed via NXP product page. REACH, halogen-free, AEC-Q100 and conflict-minerals status were not present in the verified web data and are marked unknown. Confirm automotive AEC-Q100 status with NXP directly before vehicle designs.
