MX7582K/D - 12-Bit 4-Channel SAR ADC Die | Maxim Integrated
MPN: MX7582K/D ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.75 | $38.75 |
| 10 | $34.85 | $348.50 |
| 100 | $30.1 | $3,010.00 |
| 500 | $26.4 | $13,200.00 |
| 1,000 | $23.2 | $23,200.00 |
MX7582K/D Overview
An ADC (analog-to-digital converter) is a data-acquisition component that converts real-world analog signals into discrete digital codes for processing by microcontrollers, DSPs, or FPGAs. Successive-approximation-register (SAR) ADCs use a binary-search algorithm with an internal DAC and comparator to resolve N bits in N clock cycles, trading conversion speed for low power consumption and high noise immunity. The MX7582K/D is part of Maxim Integrated's CMOS 12-bit SAR portfolio alongside the MX7572 and MX7672 series, sitting at the multi-channel end of the family.
Key features include 4 single-ended analog input channels multiplexed into a single 12-bit SAR core, an internal clock and reference buffer, true bipolar input capability via external scaling, and a parallel microprocessor interface with /CS, RD, WR, and INT control. The die form factor allows hybrid and MCM (multi-chip module) integrators to place the converter directly on the substrate to minimize analog trace length and improve noise immunity.
Drop-in alternatives for MX7582K/D — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MX7582KN+
✅ Drop-In📋 Reference alternative (not in catalog)
MX7582KEWI
✅ Drop-In📋 Reference alternative (not in catalog)
MX7582KEWG
✅ Drop-In📋 Reference alternative (not in catalog)
MX7582KE
✅ Drop-In📋 Reference alternative (not in catalog)
MX7582T
✅ Drop-In📋 Reference alternative (not in catalog)
MX7582K/D Maximum Ratings & Electrical Characteristics
| Resolution | 12 bit |
| Number of Input Channels | 4 single-ended |
| Converter Architecture | Successive Approximation (SAR) |
| Conversion Time | 100 us (typical) |
| Auto-Zero Zero Error | <100 uV (typical) |
| Maximum Analog Input Voltage | 5 V |
| Temperature Grade | Commercial (K suffix) |
| Operating Temperature Range | 0C to +70C |
| Package | Die (D suffix, waffle tray / waffle pack) |
| Terminal Form | No Lead (die form) |
| Package Code | DIE |
| Mounting Type | Die mount / hybrid integration |
| Interface | Parallel microprocessor (/CS, RD, WR, INT) |
| Calibration | Factory calibrated, no external trim required |
MX7582K/D die Pin Configuration Guide
Pin configuration for MX7582K/D (die package). This analog component features input, output, and power supply pins. Refer to the manufacturer datasheet for offset null, compensation, and enable pin configurations. Ideal for signal conditioning and amplifier circuits.
No detailed pinout data available for MX7582K/D.
Refer to the datasheet for full pin configuration.
Typical Applications
MX7582K/D is suitable for 6 applications: Hybrid Multi-Channel Data Acquisition Module, Industrial Process Control Signal Digitizer, Hybrid Medical Imaging Front-End, Multi-Channel Sensor Array Digitizer, Automotive Sensor Cluster Readout, Hybrid Instrumentation Front-End.
Hybrid Multi-Channel Data Acquisition Module
The MX7582K/D is purpose-built for hybrid and MCM (multi-chip module) data-acquisition front-ends where the 4 single-ended channels are time-division multiplexed into one 12-bit SAR core at 10 kSPS per channel. Placing the bare die directly on the ceramic or silicon substrate eliminates the lead inductance and package capacitance of a packaged ADC, reducing aperture-time jitter and improving settling behavior for fast input signals. Its 100 us auto-zeroed conversion with <100 uV zero error lets the integrator meet 12-bit INL/DNL without external trimming, which is critical when the die cannot be reworked after substrate attach. The 5 V maximum analog input, commercial 0C to +70C range, and parallel /CS-RD-WR interface drop straight onto industry-standard 8-bit microprocessor read/write cycles, simplifying hybrid-to-PCB interconnect. Pair with the MX7575 or MAX190 family for higher-resolution (14- to 16-bit) companion channels in the same MCM.
Recommended
Industrial Process Control Signal Digitizer
For industrial process-control signal chains the MX7582K/D provides 4 input channels that can be scaled by external op-amps to digitize 4-20 mA loop signals, thermocouple EMF, or 0-10 V sensor outputs at 12-bit resolution. Its SAR core does not require pipeline latency, so each channel can be polled on demand from a microcontroller without first-in-first-out buffering, simplifying the supervisory control loop. The 100 us conversion window is fast enough to track process variables such as pressure, level, and flow at typical control-loop update rates of 100 Hz. The factory-calibrated linearity eliminates the need for field trim, which lowers assembly cost in distributed I/O modules where remote calibration is impossible. The commercial 0C to +70C temperature range is sufficient for enclosed control-cabinet environments.
Recommended
Hybrid Medical Imaging Front-End
In hybrid medical imaging front-ends (ultrasound, CT detector readout boards, and patient monitor modules) the MX7582K/D contributes low-noise 12-bit digitization with a 100 us settling window per channel. The auto-zero cycle keeps the zero-error drift below 100 uV across the commercial temperature range, which is critical for maintaining DC accuracy when measuring microvolt-level biomedical signals. The 4-channel multiplexing fits naturally into detector preamplifier arrays where multiple transducer channels must share one ADC. Bare-die integration enables the imaging head to be co-located with the sensor to keep analog traces short, reducing EMI pickup from digital switching in the imaging system. Reference the MAX1200 or MAX1156 family for 14-bit upgrades in next-generation designs.
Recommended
Multi-Channel Sensor Array Digitizer
Sensor-array products such as strain-gauge bridges, thermistor banks, and photodiode arrays naturally map onto the MX7582K/S 4-channel input. The bare die lets the integrator place one ADC adjacent to a group of 4 sensors, dramatically shortening analog traces and improving noise immunity for low-level sensor outputs. The 12-bit resolution is sufficient for industrial-grade strain, temperature, and light-intensity measurements where the full-scale signal has been pre-conditioned to the 0-5 V input range. Each conversion completes in 100 us, supporting up to 10 kSPS per channel when sensors are polled sequentially. The factory calibration removes channel-to-channel gain mismatch, simplifying downstream digital filtering.
Recommended
Automotive Sensor Cluster Readout
Although specified for commercial 0C to +70C, the MX7582K/D can be used in cabin-electronics and non-powertrain automotive sensor clusters where the operating environment stays within commercial limits. Four channels are sufficient to digitize cabin temperature, humidity, light level, and a fourth sensor such as seat occupancy or HVAC damper position. The bare-die form factor lets the ADC be embedded in the sensor cluster housing, eliminating the connector between sensor and ADC. The 100 us conversion latency is well below the 10 ms update period expected by the body-control module, allowing the cluster to be polled without scheduling overhead. Reference the MAX1254 or MAX11131 family for AEC-Q100 automotive-grade upgrades.
Recommended
Hybrid Instrumentation Front-End
Precision instrumentation products such as bench multimeters, weigh scales, and process calibrators benefit from the MX7582K/S 4-channel multiplexing and low-zero-error SAR core. The factory calibration holds 12-bit linearity across the commercial temperature range, eliminating the need for periodic user recalibration and reducing field-service cost. Bare-die integration into the instrument front-end lets the ADC sit directly behind the input protection and signal-conditioning network, minimizing leakage paths and improving common-mode rejection. The 5 V maximum analog input is compatible with typical 0-5 V or 0-10 V instrument input ranges after scaling. Reference the MAX1302 or MAX1149 for higher-resolution or higher-channel-count upgrades.
Recommended
Recommended Products Summary
Engineering reference data for MX7582K/D — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MX7582KN+ | MX7582KEWI | MX7582KEWG | MX7582KE | MX7582T |
|---|---|---|---|---|---|---|
| Brand | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices | Analog Devices |
| Package | Die (D suffix) | Die - same | Die - same (EWI is ordering-code variant) | Die - same (EWG is ordering-code variant) | Die - same (E is ordering-code variant) | Die - same (T is temperature-grade variant) |
| Resolution | 12 bit | 12 bit | 12 bit | 12 bit | 12 bit | 12 bit |
| Number of Input Channels | 4 single-ended | 4 single-ended | 4 single-ended | 4 single-ended | 4 single-ended | 4 single-ended |
| Conversion Time | 100 us | 100 us | 100 us | 100 us | 100 us | 100 us |
| Temperature Grade (K suffix) | Commercial (0C to +70C) | Commercial (K) | Commercial (K) | Commercial (K) | Commercial (K) | Commercial (T variant) |
| Maximum Analog Input Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| Calibration | Factory calibrated, auto-zero <100 uV | Factory calibrated, auto-zero <100 uV | Factory calibrated, auto-zero <100 uV | Factory calibrated, auto-zero <100 uV | Factory calibrated, auto-zero <100 uV | Factory calibrated, auto-zero <100 uV |
| Interface | Parallel (/CS, RD, WR, INT) | Parallel (/CS, RD, WR, INT) | Parallel (/CS, RD, WR, INT) | Parallel (/CS, RD, WR, INT) | Parallel (/CS, RD, WR, INT) | Parallel (/CS, RD, WR, INT) |
Key Differentiators
- Bare-die form factor optimized for hybrid/MCM integration (vs MX7582KN+)
- Auto-zeroed conversion with <100 uV zero error (vs MX7582KEWI)
- 4 single-ended channels in a 12-bit SAR with 100 us conversion (vs MX7582T)
Design Notes
Estimated: Because the MX7582K/D is supplied as bare die, it cannot be reworked once bonded to the substrate. Carefully review the die mechanical drawing in the MX7582 datasheet (pad coordinates, bond-diagram, ESD handling notes) before tape-out and confirm that downstream production lines have Class 100 or better clean-room capability. Store unpackaged wafers/die in nitrogen-purged dry cabinets and bake per JEDEC J-STD-033 before assembly.
Place the analog input traces on a dedicated inner layer with a solid ground plane underneath, and route the parallel digital bus on the opposite side of the substrate. Keep the analog ground return path separate from the digital ground return until they join at the ADC substrate pin; this star-ground topology prevents digital switching noise from coupling into the SAR comparator. Reference the MX7582 datasheet application information section for a recommended reference and bypass-capacitor placement diagram.
Estimated: The MX7582K/D draws on the order of a few milliwatts during conversion. Decouple the VDD and VREF pins with a 10 uF tantalum bulk capacitor plus a 0.1 uF ceramic bypass placed within 5 mm of the substrate pads. The reference input is critical to 12-bit performance; use a low-noise, low-drift reference such as the MX584 or MAX6250 and follow the datasheet recommended output filter network to prevent reference-induced conversion errors.
The 100 us conversion window includes a 50 us auto-zero phase followed by 50 us of SAR conversion; do not drive the analog input during the SAR phase or the conversion result will be corrupted. For multi-channel scanning, latch the address bits (A0, A1) and the start-of-conversion edge at least 50 ns before asserting /WR, and allow the full 100 us before reading the parallel data bus.
Compliance Information
MX7582K/D is a bare-die Maxim Integrated product now under the Analog Devices brand. RoHS, REACH, lead-free, and halogen-free status are marked unknown because they are not stated on the Analog Devices product page for this legacy die SKU; users integrating this die into finished assemblies are responsible for verifying substance compliance at the module level.
