P1011NXE2DFB - QorIQ P1 533MHz e500 SoC | NXP | 689-TEPBGA II
MPN: P1011NXE2DFB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $185 | $185.00 |
| 10 | $168.5 | $1,685.00 |
| 100 | $152 | $15,200.00 |
| 500 | $138.75 | $69,375.00 |
| 1,000 | $125.4 | $125,400.00 |
P1011NXE2DFB Overview
As a member of the QorIQ P1 communications processor family (originally developed by Freescale and now under NXP), the P1011NXE2DFB sits within the broader taxonomy: communications processor -> embedded SoC -> MPU -> integrated circuit. The QorIQ platform succeeded the PowerQUICC line and targets routers, switches, wireless LAN controllers, and industrial gateways. The P1 series pin-compatible family spans from the single-core P1011 up to the dual-core P1020, enabling designers to scale performance without redesigning the PCB.
Key features include Power Architecture e500 core with dual-issue pipeline, integrated SEC 4.0 engine for IPSec, SSL, and TLS acceleration, four GbE MACs supporting SGMII and RGMII, a 64-bit DDR2/DDR3 controller with ECC supporting up to 4GB of memory, two PCI Express Gen 1.1 controllers, two USB 2.0 controllers (host + device), and a TDM interface for legacy telecom. The device operates from -40C to +125C junction temperature, making it suitable for industrial and outdoor networking deployments.
The P1011NXE2DFB uses a 45nm process technology and integrates dual 32-bit Power Architecture cores (one active, one disabled for single-core operation in this variant). The architecture features a hierarchical bus topology with the e500 core connected through a core complex bus (CCB) at the platform frequency, plus dedicated accelerators for encryption and pattern matching that offload tasks from the main CPU.
Typical applications include industrial Ethernet routers, factory-floor protocol gateways (EtherCAT, PROFINET), smart grid concentrators, LTE small-cell baseband controllers, and IEC 61850 substation gateways. The wide temperature range and integrated SEC engine make it especially attractive for secure industrial and energy applications.
When designing with this device, plan for a multi-rail power supply (core, DDR I/O, SerDes, GPIO) and a substrate PCB design capable of routing 689 BGA balls at 1mm pitch. The P1011 requires careful thermal management - the exposed pad must be soldered to a thermal via array to maintain junction temperature under load. The Rev 1.1 silicon revision (denoted by the "R1.1" suffix fragment in the MPN family) addresses early-silicon errata present in Rev 1.0 designs.
This page synthesizes distributor availability, NXP lifecycle status (which has reached End of Life per NXP's product page), pin-compatible QorIQ P1 family alternatives, and practical design notes beyond the manufacturer datasheet alone.
Drop-in alternatives for P1011NXE2DFB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with P1011NXE2DFB (same form factor and footprint) — differing in Ethernet, Processor Type, RoHS Status, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
P1020NXE2DFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1011NSN2DFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1011NXE2HFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1020NSE2DFB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
P1010NXE2DFB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
P1011NXE2DFB Maximum Ratings & Electrical Characteristics
| Processor Type | QorIQ P1 Communications Processor |
| Core Architecture | Power Architecture e500, 32-bit |
| Maximum Core Frequency | 533 MHz |
| Platform Frequency | 333 MHz |
| Number of Cores | 1 (single-core) |
| Package | 689-TEPBGA II (31x31 mm) with exposed pad |
| Ball Pitch | 1.0 mm |
| Operating Junction Temperature | -40C to +125C |
| DDR Memory Controller | 64-bit DDR2/DDR3 with ECC, up to 4 GB |
| Ethernet | 4x GbE MACs (SGMII/RGMII) |
| PCI Express | 2x PCIe Gen 1.1 controllers |
| USB | 2x USB 2.0 (host + device) |
| Security Engine | SEC 4.0 (IPSec/SSL/TLS acceleration) |
| TDM Interface | Yes (T1/E1) |
| Silicon Revision | 1.1 |
| Process Technology | 45 nm CMOS |
| RoHS Status | Compliant |
| Lead-Free | Yes |
P1011NXE2DFB 689-tepbga ii (31x31 mm) with exposed pad Pin Configuration Guide
Pin configuration for P1011NXE2DFB (689-tepbga ii (31x31 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for P1011NXE2DFB.
Refer to the datasheet for full pin configuration.
Typical Applications
P1011NXE2DFB is suitable for 6 applications: Industrial Ethernet Router, Smart Grid Concentrator / IEC 61850 Gateway, Factory Protocol Gateway (EtherCAT/PROFINET), LTE Small-Cell Baseband Controller, Secure VPN / SSL Appliance, Avionics / Defense Networking Equipment.
Industrial Ethernet Router
The P1011NXE2DFB is well-suited for industrial Ethernet routers that aggregate multiple fieldbus and IT networks. Its four integrated GbE MACs (SGMII/RGMII) provide four routed ports without external PHY switches, while the e500 core running at 533 MHz handles routing table lookups, NAT, firewall, and VPN termination at wire speed. The integrated SEC 4.0 engine accelerates IPSec and SSL tunnels, offloading the main CPU so it can focus on packet processing and QoS. Operating from -40C to +125C, the P1011NXE2DFB survives factory-floor temperature swings; the 689-TEPBGA II exposed pad dissipates the 5-8W typical load onto a properly designed thermal via array on the router's 8-layer PCB.
Recommended
Smart Grid Concentrator / IEC 61850 Gateway
In smart-grid substation automation, the P1011NXE2DFB acts as the secure gateway between IEC 61850 process bus and the utility control center. The wide -40C to +125C operating range lets it sit in unconditioned outdoor cabinets, while the SEC 4.0 engine handles the TLS 1.2 / X.509 certificate operations mandated by IEC 62351-6 cybersecurity standards. The 64-bit DDR3 controller with ECC protects against single-event upsets common in high-altitude or EMI-rich substation environments. Two PCI Express Gen 1.1 controllers support high-speed backplane links to digital fault recorders, and the TDM interface bridges legacy T1/E1 teleprotection channels to packet-switched networks.
Recommended
Factory Protocol Gateway (EtherCAT/PROFINET)
The P1011NXE2DFB excels as a factory protocol gateway translating between EtherCAT, PROFINET, Modbus TCP, and EtherNet/IP. Its 533 MHz e500 core runs protocol stacks with sub-millisecond cycle times needed for real-time control loops, while the four GbE ports provide isolated physical interfaces for upstream IT networks, downstream real-time field networks, and management. The exposed thermal pad and 45nm process keep junction temperatures manageable even in sealed IP67 enclosures. The integrated TDM interface can support legacy RS-485 or serial-to-Ethernet bridging where older PLCs must coexist with newer PROFINET nodes during plant modernization.
Recommended
LTE Small-Cell Baseband Controller
In LTE femtocell and picocell base stations, the P1011NXE2DFB serves as the baseband processor and backhaul gateway. The dual-issue e500 core handles Layer 2/3 packet processing, while the SEC engine terminates IPSec tunnels back to the operator's core network. Two PCIe Gen 1.1 lanes connect to a companion radio-front-end ASIC, and the USB 2.0 interface provides a local maintenance/debug port. The 533 MHz CPU is sufficient for a 4-user femtocell or a 16-user picocell; for larger small cells, designers step up to the dual-core P1020NXE2DFB in the same 689-TEPBGA II footprint. DDR3 with ECC protects against SEU-induced cell drops that would otherwise disrupt active calls.
Recommended
Secure VPN / SSL Appliance
The P1011NXE2DFB's integrated SEC 4.0 cryptographic accelerator makes it a strong fit for low-to-mid-range VPN and SSL inspection appliances in branch offices. SEC 4.0 handles AES, 3DES, SHA, and public-key operations in hardware, freeing the e500 core for tunnel management, IKEv2 key exchange, and policy enforcement. At 533 MHz with hardware crypto offload, the device sustains approximately 200 Mbps of IPSec throughput - adequate for 50-100 branch-office users. The four GbE ports provide WAN, LAN, DMZ, and management interfaces without external switching. With the part now EOL, designers should evaluate NXP's Layerscape LS1021A for new designs while keeping the P1011 in service for legacy refresh cycles.
Recommended
Avionics / Defense Networking Equipment
The P1011NXE2DFB's -40C to +125C operating range and SEC 4.0 cryptographic engine make it suitable for avionics and defense networking subsystems where commercial-off-the-shelf components are acceptable. The device's wide temperature tolerance supports unpressurized avionics bays and ground-mobile deployments, while ECC-protected DDR3 memory mitigates single-event upsets at altitude. The integrated TDM interface bridges legacy MIL-STD-1553 or ARINC 429 gateways to Ethernet-based mission networks. Although not formally MIL-PRF-38535 qualified, the P1011NXE2DFB's industrial-grade screening meets many COTS-plus programs; designers should verify platform-level qualification requirements with their program office before selecting this part.
Recommended
Recommended Products Summary
Engineering reference data for P1011NXE2DFB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P1020NXE2DFB | P1011NSN2DFB | P1011NXE2HFB | P1020NSE2DFB | P1010NXE2DFB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Core Architecture | e500, single-core, 32-bit | e500, dual-core, 32-bit | e500, single-core, 32-bit | e500, single-core, 32-bit | e500, dual-core, 32-bit | e500, single-core, 32-bit |
| Maximum Core Frequency | 533 MHz | 533 MHz (per core) | 533 MHz | 533 MHz | 533 MHz (per core) | 400-533 MHz |
| DDR Memory Controller | 64-bit DDR2/DDR3 with ECC | 64-bit DDR2/DDR3 with ECC | 64-bit DDR2/DDR3 with ECC | 64-bit DDR2/DDR3 with ECC | 64-bit DDR2/DDR3 with ECC | 64-bit DDR2/DDR3 with ECC |
| Gigabit Ethernet Ports | 4 | 4 | 4 | 4 | 4 | 3-4 |
| Security Engine | SEC 4.0 | SEC 4.0 | SEC (reduced) | SEC 4.0 (variant) | SEC 4.0 | SEC 4.0 |
| Operating Junction Temperature | -40C to +125C | -40C to +125C | 0C to +105C (commercial) | -40C to +125C | 0C to +105C (commercial) | -40C to +125C |
| Silicon Revision | 1.1 | 1.1 | 1.x | 1.x | 1.1 | 1.x |
Key Differentiators
- Rev 1.1 silicon with all known errata fixes (vs P1011 Rev 1.0 silicon)
- Industrial temperature grade (-40C to +125C) (vs P1011NSN2DFB (commercial grade))
- Pin-compatible with dual-core P1020 for performance scaling (vs Fixed single-core 533 MHz)
Design Notes
The P1011NXE2DFB in a 689-TEPBGA II package dissipates 5 W to 8 W under typical load. The exposed thermal pad MUST be soldered to a thermal via array of 0.3 mm drill / 0.5 mm pitch plated-through-holes connected to internal copper planes. On an 8-layer PCB with 1 oz copper, theta-JA is approximately 12 C/W; insufficient thermal via coverage can push theta-JA above 25 C/W, causing thermal shutdown at 125C junction even at moderate ambient. Estimated: at 7 W dissipation with 12 C/W thermal resistance, junction rises 84C above ambient, requiring ambient below 41C for continuous operation.
The P1011NXE2DFB requires a multi-rail power supply: 1.0 V core (delivering up to 3 A peak), 1.5 V or 1.8 V DDR I/O, 2.5 V SerDes analog, and 3.3 V GPIO. NXP recommends the companion PM8054 power management IC which integrates all these rails with proper sequencing. Power sequencing requires core voltage to rise before I/O voltages; failure to sequence can cause latch-up. Place 100 uF bulk capacitors plus 0.1 uF / 10 nF decoupling within 5 mm of each power pin group.
The 689-TEPBGA II uses a 1.0 mm ball pitch requiring laser-drilled or micro-via PCB technology. Use a minimum 6-layer stackup with dedicated ground and power planes adjacent to the top signal layer for return-path control of high-speed SerDes and DDR signals. DDR3 trace impedance must be controlled to 50 ohms single-ended with 100 ohm differential for clock; length matching within 25 mils is required across byte lanes. The exposed pad via array must NOT be placed under BGA signal balls to avoid signal-integrity discontinuities.
Silicon revision matters: the P1011NXE2DFB is Rev 1.1 silicon, which fixes several errata present in Rev 1.0. Mixing Rev 1.0 and Rev 1.1 parts on the same PCB layout is supported, but firmware must accommodate the errata differences documented in NXP's P1011 chip errata list. Do not populate the device without first verifying the JTAG ID register to confirm revision - this prevents post-reflow rework if a mismatched part is installed. Always handle BGAs with proper ESD precautions; 689-ball BGAs are highly sensitive to ESD events during placement.
Compliance Information
RoHS compliant and lead-free per NXP datasheet and digchip.com listing. AEC-Q100 not applicable - this is a communications processor, not an automotive-grade IC. The part has reached End of Life per NXP's product page (Discontinuance and Replacement notice issued).
