P2020NSN2KHC - QorIQ P2020 Dual-Core e500v2 1.2GHz SoC | NXP
MPN: P2020NSN2KHC ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $123.4 | $123.40 |
| 10 | $117.5 | $1,175.00 |
| 100 | $105.2 | $10,520.00 |
| 500 | $92.8 | $46,400.00 |
| 1,000 | $84.6 | $84,600.00 |
P2020NSN2KHC Overview
A QorIQ communications processor is a system-on-chip (SoC) that combines CPU cores, memory controllers, high-speed serial interfaces, and networking peripherals into a single device. It belongs to the MPU -> microprocessor -> embedded processor -> communications SoC taxonomy and is targeted at networking, industrial, and wireless infrastructure applications where deterministic performance and a rich peripheral set are mandatory.
Key features include dual e500v2 cores with 36-bit physical addressing, dual DDR2/DDR3 memory controllers with ECC, three Gigabit Ethernet controllers, three PCI Express interfaces, two Serial RapidIO (SRIO) ports, USB 2.0, and a security engine. The 45 nm process keeps power consumption below 5 W typical at 1.2 GHz while preserving headroom for line-rate packet processing.
From an architecture standpoint, the P2020 leverages the Power Architecture Book E instruction set with hypervisor and virtualization extensions, a shared L2 cache of 512 KB, and a high-bandwidth Coherent Fabric connecting cores, memory, and I/O. Per NXP product page, the device is pin-compatible with P2010, P1011, and P1020 family parts, allowing a single PCB layout to serve multiple price/performance points.
Typical applications include industrial routers, secure gateways, networked printers, factory automation controllers, and small-cell base stations. The combination of dual 1.2 GHz cores, hardware-accelerated cryptography, and integrated Ethernet/PCIe/SRIO makes it well suited to wireline access and line-card designs where deterministic throughput is required.
When designing with this part, plan the thermal solution around the TEBGA II exposed pad and use NXP's reference board layout guidelines for the high-speed serial lanes to meet signal-integrity targets. Ensure firmware supports the boot ROM configuration and Secure Boot fuse programming before volume deployment.
This page synthesizes distributor pricing, package-level drop-in alternatives, and practical design notes not found in the manufacturer datasheet, providing a single reference for engineers sourcing the P2020NSN2KHC.
Drop-in alternatives for P2020NSN2KHC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with P2020NSN2KHC (same form factor and footprint) — differing in Core Architecture, Ethernet, PCI Express, Package, Process Technology.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
P2010NSN2KHC
✅ Drop-In📋 Reference alternative (not in catalog)
P1020NSN2KHC
✅ Drop-In📋 Reference alternative (not in catalog)
P1011NSN2KHC
✅ Drop-In📋 Reference alternative (not in catalog)
P2020NSN2MFC
✅ Drop-In✓ In Stock
$31.2 / Unit
View Datasheet →P2020NSN2KHC Maximum Ratings & Electrical Characteristics
| Processor Family | QorIQ P2020 |
| Core Architecture | PowerPC e500v2 (32-bit) |
| Number of Cores | 2 |
| Maximum Core Frequency | 1.2 GHz |
| Process Technology | 45 nm CMOS |
| L2 Cache | 512 KB (shared) |
| Memory Controller | Dual-channel DDR2/DDR3 with ECC |
| Ethernet | 3x 10/100/1000 Mbps (SGMII/RGMII) |
| PCI Express | 3x PCIe Gen 1 controllers |
| Serial RapidIO | 2x SRIO ports |
| USB | USB 2.0 |
| Security Engine | Yes (integrated SEC) |
| Package | 689-TEPBGA II (31x31 mm) with exposed pad |
| Operating Temperature | 0C to +125C |
| RoHS Status | RoHS Compliant |
| Lead Free Status | Lead Free |
P2020NSN2KHC 689-tepbga ii (31x31 mm) with exposed pad Pin Configuration Guide
Pin configuration for P2020NSN2KHC (689-tepbga ii (31x31 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for P2020NSN2KHC.
Refer to the datasheet for full pin configuration.
Typical Applications
P2020NSN2KHC is suitable for 6 applications: Industrial Router / Edge Gateway, Small-Cell / Pico Base Station, Factory Automation Controller, Networked Multifunction Printer, Secure VPN Concentrator, Wireless LAN Controller.
Industrial Router / Edge Gateway
The P2020NSN2KHC fits industrial router and edge-gateway designs because its two 1.2 GHz e500v2 cores deliver combined compute for firewall/NAT plus application-layer routing, while three integrated Gigabit Ethernet controllers handle WAN/LAN segmentation without an external switch. The dual-channel DDR3 with ECC controller supports deterministic memory access required for VPN tunnels and secure gateway workloads. Per NXP, the integrated SEC engine offloads AES/SHA/RSA, reducing CPU load on encrypted traffic and enabling wire-speed packet inspection in industrial deployments.
Recommended
Small-Cell / Pico Base Station
The P2020NSN2KHC is well suited to small-cell and pico base station baseband processing thanks to dual e500v2 cores handling PHY layer scheduling and Ethernet backhaul simultaneously. Its three Gigabit Ethernet interfaces support dual SGMII links for CPRI/eCPRI front-haul connectivity alongside traditional network backhaul. The 689-TEPBGA II package provides 125C junction tolerance for outdoor enclosures, and the security engine secures operator signaling traffic. Designers can pair this SoC with a companion RF front-end to build a complete small-cell node.
Recommended
Factory Automation Controller
In factory automation controllers, the P2020NSN2KHC provides deterministic dual-core processing for PLC logic, motion control, and HMI rendering on a single chip. Three PCIe Gen 1 lanes allow connection to FPGA motion controllers or I/O expansion cards, while the two Serial RapidIO ports interface with industrial servo drives for real-time deterministic communication. The 45 nm process keeps the typical power envelope under 5 W, enabling fanless DIN-rail mounted designs operating from 0 to 125C junction temperatures required for harsh industrial environments.
Recommended
Networked Multifunction Printer
The P2020NSN2KHC fits networked multifunction printers (MFPs) where one core manages the real-time print engine and the second runs the network stack, document parsing, and web UI. Its three Gigabit Ethernet ports support dual-LAN segments for office networks and isolated service ports. The DDR3 controller with ECC protects against soft errors during long print runs, while the USB 2.0 interface handles direct printing from USB media. NXP's pin-compatible P1020 alternative provides identical functionality at a different price tier.
Recommended
Secure VPN Concentrator
The P2020NSN2KHC's integrated security engine makes it a strong fit for hardware-accelerated VPN concentrators, offloading AES-256/SHA-256/RSA operations from the e500v2 cores. Dual 1.2 GHz cores can dedicate one core to encryption and the other to tunnel management, sustaining multi-gigabit IPsec/SSL throughput. The three PCIe Gen 1 lanes support NIC expansion cards for additional WAN links, and the 689-BGA package's thermal headroom supports sustained encrypted traffic without throttling in data-center edge deployments.
Recommended
Wireless LAN Controller
Wireless LAN controllers benefit from the P2020NSN2KHC's three Gigabit Ethernet ports for trunked uplinks, two SRIO ports for direct connection to radio MAC chipsets, and dual e500v2 cores handling CAPWAP tunneling plus 802.11 management frames. The integrated security engine accelerates WPA2-Enterprise/AES encryption for hundreds of AP associations, and DDR3 with ECC ensures reliable operation in 24/7 enterprise environments. The same 689-TEPBGA II footprint scales from single-core P1011 to dual-core P2020 across price tiers.
Recommended
Recommended Products Summary
Engineering reference data for P2020NSN2KHC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P2010NSN2KHC | P1020NSN2KHC | P1011NSN2KHC | P2020NSN2MFC |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same |
| Cores | 2 x e500v2 | 1 x e500v2 | 2 x e500v2 | 1 x e500v2 | 2 x e500v2 |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Gigabit Ethernet | 3 | 3 | 3 | 3 | 3 |
| PCI Express | 3 x PCIe Gen 1 | 3 x PCIe Gen 1 | 3 x PCIe Gen 1 | 3 x PCIe Gen 1 | 3 x PCIe Gen 1 |
| Process Technology | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm |
| Operating Temperature | 0C to +125C | 0C to +125C | 0C to +125C | 0C to +125C | 0C to +125C |
Key Differentiators
- Pin-compatible dual-core upgrade path (vs P2010NSN2KHC)
- Faster speed grade than P1011 (vs P1011NSN2KHC)
- Identical silicon with different speed bin (vs P2020NSN2MFC)
Design Notes
The 689-TEPBGA II package with exposed pad requires a thermal pad soldered to an internal ground plane with thermal vias to meet the 0 to 125C operating range. At 1.2 GHz typical 4-5 W dissipation, design at least 25C/W theta_JB with 9 thermal vias in a 3x3 array beneath the exposed pad. Recommended: use NXP's reference board layout for the QorIQ P2020 family, including microvia-in-pad construction for the BGA balls and at least 6 PCB layers for signal-integrity reasons. Estimated: typical thermal dissipation 4.5 W at 1.2 GHz per NXP datasheet guidance.
Place DDR3 traces with matched lengths per byte lane within +/-25 mils and route SGMII/PCIe/SRIO differential pairs with 100 ohm differential impedance and intra-pair length matching under 5 mils. Per NXP hardware specifications, isolate high-speed serial lanes on inner PCB layers with ground plane shielding above and below. Keep the BGA breakout fan-out in a 0.8 mm pitch pattern to match the 689-TEPBGA II land pattern. Decouple each power rail with 0.1 uF and 10 uF ceramic capacitors placed within 50 mils of the respective pins.
The 'NSN2KHC' suffix encodes both speed grade and silicon revision; mixing different suffixes on the same PCB may cause boot failures if the boot ROM does not match the chip revision. Always verify boot ROM/RCW configuration via the I2C EEPROM or flash device. Ensure JTAG pins are accessible for boundary-scan testing and that the RESET configuration pins are pulled correctly at power-on. Per NXP product page, the P2020 family is in last-time-buy status, so validate long-term availability before committing to new designs.
Compliance Information
RoHS and lead-free confirmed by NXP product page and DigiKey listing. Halogen-free status should be verified with NXP environmental documentation. AEC-Q100 not applicable for industrial MPU. Conflict minerals policy available from NXP.
