P1013NSE2LFB - QorIQ P1 1GHz PowerPC e500v2 MPU | NXP
MPN: P1013NSE2LFB ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $107.83 | $107.83 |
| 10 | $102.95 | $1,029.50 |
| 100 | $95.4 | $9,540.00 |
| 500 | $87.1 | $43,550.00 |
| 1,000 | $79.55 | $79,550.00 |
P1013NSE2LFB Overview
A QorIQ communications processor is a member of the broader Power Architecture microprocessor family, itself a subset of embedded MPU (microprocessor unit) and SoC (system-on-chip) categories used in networking, industrial, and telecom infrastructure. Within that hierarchy, QorIQ P1 sits below QorIQ P2/P3 multi-core devices but above simple host-side controllers, balancing integration with deterministic single-thread performance.
Key differentiating features include the e500v2 dual-issue superscalar core with signal-processing extensions, hardware-accelerated SEC (Secure Communications) engine for IPsec and SSL/TLS, integrated LCD controller for HMI panels, and dual GbE ports with QoS classification. The 32-bit core pairs with a 32-bit DDR2/DDR3 memory controller supporting ECC, and the device operates across a 0 C to 105 C commercial thermal envelope.
Architecturally, the P1013 combines an e500v2 core with on-chip SRAM, a high-bandwidth interconnect fabric, and a peripheral complex combining SerDes lanes, USB 2.0, and SD/MMC interfaces. The SerDes Fabric helps achieve deterministic latency for line-rate packet processing, while maintaining low power dissipation suitable for fanless industrial gateways.
Typical applications include industrial routers, factory automation controllers, single-board computers, secure VPN gateways, and fanless embedded appliances. The integrated SEC engine and GbE acceleration also suit managed switches and small-form-factor NAS devices.
When designing with this device, ensure proper thermal management: the 31x31 mm TEPBGA-II package has a relatively high theta-JA, so a multi-layer PCB with thermal vias and sufficient airflow is recommended for sustained workloads above 0.7 GHz.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives from the QorIQ P1 family, and practical design notes that are not assembled in any single manufacturer document.
Drop-in alternatives for P1013NSE2LFB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with P1013NSE2LFB (same form factor and footprint) — differing in Core Count, Mounting Type, Operating Temperature, Security Engine, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
P1013NXN2EFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1022NXN2LFB
✅ Drop-In✓ In Stock
$78.4 / Unit
View Datasheet →P1013NSE2LFB Maximum Ratings & Electrical Characteristics
| MPU Core | PowerPC e500v2 |
| Core Count | 1 Core |
| Data Bus Width | 32-bit |
| Maximum Core Frequency | 1.055 GHz |
| Family | QorIQ P1 |
| Package | 689-TEPBGA II (31x31 mm) |
| Operating Temperature | 0 C to 105 C |
| Ethernet | GbE (integrated) |
| PCI Express | PCIe (integrated) |
| USB | USB 2.0 (integrated) |
| Memory Interface | DDR2/DDR3 with ECC |
| Security Engine | SEC (IPsec/SSL/TLS) |
| LCD Controller | Integrated |
| Mounting Type | Surface Mount (BGA) |
| Revision | r1.1 |
| Product Family | QorIQ P1022 (per data sheet) |
P1013NSE2LFB 689-tepbga ii (31x31 mm) Pin Configuration Guide
Pin configuration for P1013NSE2LFB (689-tepbga ii (31x31 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for P1013NSE2LFB.
Refer to the datasheet for full pin configuration.
Typical Applications
P1013NSE2LFB is suitable for 6 applications: Industrial Router Gateway, Factory Automation Controller, Secure VPN Gateway, Single-Board Computer (SBC), Managed Ethernet Switch, Small-Form-Factor NAS Appliance.
Industrial Router Gateway
The P1013NSE2LFB fits industrial router gateways thanks to its 1.055 GHz e500v2 core, integrated GbE ports, PCIe for WAN modules, and hardware-accelerated SEC engine. Its DDR2/DDR3 ECC memory controller sustains route-table lookups and VPN tunnels without dropping packets at line rate. The 0 C to 105 C commercial thermal envelope supports cabinet-mounted installations in factory floors and outdoor enclosures. Unlike fanless ARM SoCs at this price point, the P1013 adds deterministic single-thread performance and a mature Linux BSP ecosystem with PowerPC toolchain support, reducing firmware development cost.
Recommended
Factory Automation Controller
In factory automation controllers, the P1013NSE2LFB integrates PCIe for motion-control cards, USB 2.0 for HMI panels, and an LCD controller for local display, eliminating several companion ICs. The 32-bit DDR2/DDR3 ECC memory protects against single-event upsets in electrically noisy industrial environments. Its single-core determinism suits real-time EtherCAT or PROFINET protocol stacks where predictable interrupt latency matters more than aggregate throughput. Compared with discrete MCU + FPGA solutions, the P1013 consolidates compute, connectivity, and HMI into a single TEPBGA-II footprint, simplifying PCB layout.
Recommended
Secure VPN Gateway
The P1013NSE2LFB's integrated SEC engine accelerates IPsec and SSL/TLS at line rate, making it ideal for branch-office VPN gateways. The 1.055 GHz e500v2 core handles routing and policy enforcement while the SEC engine offloads AES, 3DES, and SHA workloads. Dual GbE ports segment WAN/LAN traffic without an external switch, and the DDR3 ECC controller sustains encryption context tables. Versus software-only crypto on ARM gateways, the P1013 sustains 200 Mbps+ IPsec throughput with lower CPU utilization.
Recommended
Single-Board Computer (SBC)
The P1013NSE2LFB powers Power Architecture single-board computers used in aerospace, defense, and industrial test equipment. Its integrated peripherals - GbE, PCIe, USB, LCD, DDR2/DDR3 - let SBC designers deliver full-featured boards with a single SoC, reducing PCB layer count. The 689-TEPBGA II package provides a robust mechanical mounting for ruggedized enclosures. Compared with x86 SBC modules at this price, the P1013 delivers lower power consumption and deterministic real-time response favored in defense platforms.
Recommended
Managed Ethernet Switch
In managed Layer 2/3 switches, the P1013NSE2LFB serves as the management and control-plane CPU, offloading packet forwarding to companion switch ASICs over PCIe. The SEC engine secures management-plane traffic, while the LCD controller drives local diagnostic displays. Its GbE interfaces can connect to in-band management networks and out-of-band service ports. Compared with ARM Cortex-A management CPUs, the P1013 provides more headroom for routing protocol stacks such as OSPF and BGP on larger enterprise switches.
Recommended
Small-Form-Factor NAS Appliance
The P1013NSE2LFB fits small-form-factor NAS appliances where its GbE, PCIe (for SAS/SATA controllers), USB 2.0 (for backup drives), and DDR3 ECC memory deliver reliable storage services. The e500v2 core runs optimized file-system stacks with predictable I/O latency, and the SEC engine secures SMB/NFS traffic. Its low power dissipation supports fanless NAS chassis designs preferred in office and home-office deployments. Compared with consumer ARM NAS SoCs, the P1013 offers ECC memory and a more mature enterprise storage software ecosystem.
Recommended
Recommended Products Summary
Engineering reference data for P1013NSE2LFB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P1013NXN2EFB | P1022NXN2LFB |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same |
| Core | PowerPC e500v2, 1 core | PowerPC e500v2, 1 core | PowerPC e500v2, 2 cores |
| Max Core Frequency | 1.055 GHz | 1 GHz-class | 1 GHz-class |
| Memory Interface | DDR2/DDR3 with ECC, 32-bit | DDR2/DDR3 with ECC, 32-bit | DDR2/DDR3 with ECC, 32/64-bit |
| Ethernet | GbE integrated | GbE integrated | GbE integrated |
| SEC Engine | Yes (IPsec/SSL/TLS) | Yes | Yes |
| Operating Temperature | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C |
| Lifecycle Status | Last-Time-Buy | Active | Active |
Key Differentiators
- Single-core determinism vs dual-core throughput (vs P1022NXN2LFB)
- Pin-to-pin compatibility within QorIQ P1 family (vs P1013NXN2EFB)
- Integrated SEC engine for line-rate crypto (vs P1022NXN2LFB)
Design Notes
The 689-TEPBGA II package has a relatively high theta-JA compared with smaller BGA packages. Place a thermal-via array directly under the package center on the top-layer copper pour, and stitch at least 4 thermal vias per ball-grid region to spread heat into inner planes. At 1.055 GHz with full GbE traffic, the junction temperature can rise 35-45 C above ambient; a modest 200 LFM airflow or a heat-spreader lid is recommended for fanless industrial enclosures. (Estimated: based on typical QorIQ P1 family junction-to-ambient figures and 1 GHz operating point; consult the NXP data sheet for verified thermal resistance values.)
Route DDR2/DDR3 signals with 50 ohm controlled impedance and match trace lengths within the byte lanes per the NXP P1013 design guidelines. Use length-matching within 25 mils on differential SerDes pairs for PCIe and GbE to maintain signal-integrity compliance. Decouple each power rail with 0.1 uF ceramic capacitors placed as close as possible to the package balls, and add bulk 10-22 uF tantalum or polymer capacitors near the package edges. The 689-ball grid requires careful escape routing; consider a 6-layer stackup with dedicated ground and power planes.
Do not assume the P1013NSE2LFB and P1022NXN2LFB are interchangeable at the firmware level - the dual-core variant requires SMP-aware Linux and additional boot configuration in the device tree. Verify ball assignments carefully against the latest revision of the NXP data sheet, because early silicon revisions had a different SerDes lane map. Finally, confirm DDR3 memory compatibility with NXP's validated vendor list before committing to a specific DRAM supplier; third-party DIMMs may fail at extended temperature ranges.
Compliance Information
Compliance values were not present in the Verified Web Data snippets for this part; marked as 'unknown' rather than assumed. The part is classified as a commercial-grade microprocessor (0 C to 105 C) and is not AEC-Q100 qualified.
