P1013NSE2LFB - QorIQ P1 1GHz PowerPC e500v2 MPU | NXP
Teilenummer: P1013NSE2LFB ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $107.83 | $107,83 |
| 10 | $102.95 | $1.029,50 |
| 100 | $95.4 | $9.540,00 |
| 500 | $87.1 | $43.550,00 |
| 1.000 | $79.55 | $79.550,00 |
P1013NSE2LFB Übersicht
A QorIQ communications processor is a member of the broader Power Architecture microprocessor family, itself a subset of embedded MPU (microprocessor unit) and SoC (system-on-chip) categories used in networking, industrial, and telecom infrastructure. Within that hierarchy, QorIQ P1 sits below QorIQ P2/P3 multi-core devices but above simple host-side controllers, balancing integration with deterministic single-thread performance.
Key differentiating features include the e500v2 dual-issue superscalar core with signal-processing extensions, hardware-accelerated SEC (Secure Communications) engine for IPsec and SSL/TLS, integrated LCD controller for HMI panels, and dual GbE ports with QoS classification. The 32-bit core pairs with a 32-bit DDR2/DDR3 memory controller supporting ECC, and the device operates across a 0 C to 105 C commercial thermal envelope.
Architecturally, the P1013 combines an e500v2 core with on-chip SRAM, a high-bandwidth interconnect fabric, and a peripheral complex combining SerDes lanes, USB 2.0, and SD/MMC interfaces. The SerDes Fabric helps achieve deterministic latency for line-rate packet processing, while maintaining low power dissipation suitable for fanless industrial gateways.
Typical applications include industrial routers, factory automation controllers, single-board computers, secure VPN gateways, and fanless embedded appliances. The integrated SEC engine and GbE acceleration also suit managed switches and small-form-factor NAS devices.
When designing with this device, ensure proper thermal management: the 31x31 mm TEPBGA-II package has a relatively high theta-JA, so a multi-layer PCB with thermal vias and sufficient airflow is recommended for sustained workloads above 0.7 GHz.
This page synthesizes distributor pricing, pin-compatible drop-in alternatives from the QorIQ P1 family, and practical design notes that are not assembled in any single manufacturer document.
Drop-in-Alternativen für P1013NSE2LFB – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit P1013NSE2LFB (gleiche Bauform und Footprint) – abweichend in Core Count, Mounting Type, Operating Temperature, Security Engine, USB.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
P1013NXN2EFB
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
P1022NXN2LFB
✅ Drop-In✓ Auf Lager
$78.4 / Stück
Datenblatt ansehen →P1013NSE2LFB Grenzwerte & elektrische Eigenschaften
| MPU Core | PowerPC e500v2 |
| Core Count | 1 Core |
| Datenbusbreite | 32-bit |
| Maximum Core Frequency | 1.055 GHz |
| Family | QorIQ P1 |
| Gehäuse | 689-TEPBGA II (31x31 mm) |
| Betriebstemperatur | 0 C to 105 C |
| Ethernet | GbE (integrated) |
| PCI Express | PCIe (integrated) |
| USB | USB 2.0 (integrated) |
| Memory Interface | DDR2/DDR3 with ECC |
| Security Engine | SEC (IPsec/SSL/TLS) |
| LCD Controller | Integrated |
| Montageart | Surface Mount (BGA) |
| Revision | r1.1 |
| Product Family | QorIQ P1022 (per data sheet) |
P1013NSE2LFB 689-tepbga ii (31x31 mm) Pinbelegungsleitfaden
Pinbelegung für P1013NSE2LFB (689-tepbga ii (31x31 mm)-Gehäuse). Dieser digitale IC umfasst GPIO, Kommunikationsschnittstellen (UART, SPI, I2C) und Versorgungspins. Alternative Pin-Funktionen und Konfigurationsoptionen entnehmen Sie dem Herstellerdatenblatt. Unverzichtbar für Embedded-System-Design und PCB-Layout.
Keine detaillierten Pinbelegungsdaten verfügbar für P1013NSE2LFB.
Siehe die Datenblatt für die vollständige Pin-Konfiguration.
Typische Anwendungen
P1013NSE2LFB ist geeignet für 6 Anwendungs: Industrial Router Gateway, Factory Automation Controller, Secure VPN Gateway, Single-Board Computer (SBC), Managed Ethernet Switch, Small-Form-Factor NAS Appliance.
Industrial Router Gateway
The P1013NSE2LFB fits industrial router gateways thanks to its 1.055 GHz e500v2 core, integrated GbE ports, PCIe for WAN modules, and hardware-accelerated SEC engine. Its DDR2/DDR3 ECC memory controller sustains route-table lookups and VPN tunnels without dropping packets at line rate. The 0 C to 105 C commercial thermal envelope supports cabinet-mounted installations in factory floors and outdoor enclosures. Unlike fanless ARM SoCs at this price point, the P1013 adds deterministic single-thread performance and a mature Linux BSP ecosystem with PowerPC toolchain support, reducing firmware development cost.
Empfohlen
Factory Automation Controller
In factory automation controllers, the P1013NSE2LFB integrates PCIe for motion-control cards, USB 2.0 for HMI panels, and an LCD controller for local display, eliminating several companion ICs. The 32-bit DDR2/DDR3 ECC memory protects against single-event upsets in electrically noisy industrial environments. Its single-core determinism suits real-time EtherCAT or PROFINET protocol stacks where predictable interrupt latency matters more than aggregate throughput. Compared with discrete MCU + FPGA solutions, the P1013 consolidates compute, connectivity, and HMI into a single TEPBGA-II footprint, simplifying PCB layout.
Empfohlen
Secure VPN Gateway
The P1013NSE2LFB's integrated SEC engine accelerates IPsec and SSL/TLS at line rate, making it ideal for branch-office VPN gateways. The 1.055 GHz e500v2 core handles routing and policy enforcement while the SEC engine offloads AES, 3DES, and SHA workloads. Dual GbE ports segment WAN/LAN traffic without an external switch, and the DDR3 ECC controller sustains encryption context tables. Versus software-only crypto on ARM gateways, the P1013 sustains 200 Mbps+ IPsec throughput with lower CPU utilization.
Empfohlen
Single-Board Computer (SBC)
The P1013NSE2LFB powers Power Architecture single-board computers used in aerospace, defense, and industrial test equipment. Its integrated peripherals - GbE, PCIe, USB, LCD, DDR2/DDR3 - let SBC designers deliver full-featured boards with a single SoC, reducing PCB layer count. The 689-TEPBGA II package provides a robust mechanical mounting for ruggedized enclosures. Compared with x86 SBC modules at this price, the P1013 delivers lower power consumption and deterministic real-time response favored in defense platforms.
Empfohlen
Managed Ethernet Switch
In managed Layer 2/3 switches, the P1013NSE2LFB serves as the management and control-plane CPU, offloading packet forwarding to companion switch ASICs over PCIe. The SEC engine secures management-plane traffic, while the LCD controller drives local diagnostic displays. Its GbE interfaces can connect to in-band management networks and out-of-band service ports. Compared with ARM Cortex-A management CPUs, the P1013 provides more headroom for routing protocol stacks such as OSPF and BGP on larger enterprise switches.
Empfohlen
Small-Form-Factor NAS Appliance
The P1013NSE2LFB fits small-form-factor NAS appliances where its GbE, PCIe (for SAS/SATA controllers), USB 2.0 (for backup drives), and DDR3 ECC memory deliver reliable storage services. The e500v2 core runs optimized file-system stacks with predictable I/O latency, and the SEC engine secures SMB/NFS traffic. Its low power dissipation supports fanless NAS chassis designs preferred in office and home-office deployments. Compared with consumer ARM NAS SoCs, the P1013 offers ECC memory and a more mature enterprise storage software ecosystem.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für P1013NSE2LFB – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | P1013NXN2EFB | P1022NXN2LFB |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31) | 689-TEPBGA II (31x31) - same | 689-TEPBGA II (31x31) - same |
| Core | PowerPC e500v2, 1 core | PowerPC e500v2, 1 core | PowerPC e500v2, 2 cores |
| Max Core Frequency | 1.055 GHz | 1 GHz-class | 1 GHz-class |
| Memory Interface | DDR2/DDR3 with ECC, 32-bit | DDR2/DDR3 with ECC, 32-bit | DDR2/DDR3 with ECC, 32/64-bit |
| Ethernet | GbE integrated | GbE integrated | GbE integrated |
| SEC Engine | Yes (IPsec/SSL/TLS) | Yes | Yes |
| Operating Temperature | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C |
| Lifecycle Status | Last-Time-Buy | Active | Active |
Wichtigste Unterscheidungsmerkmale
- Single-core determinism vs dual-core throughput (vs. P1022NXN2LFB)
- Pin-to-pin compatibility within QorIQ P1 family (vs. P1013NXN2EFB)
- Integrated SEC engine for line-rate crypto (vs. P1022NXN2LFB)
Designhinweise
The 689-TEPBGA II package has a relatively high theta-JA compared with smaller BGA packages. Place a thermal-via array directly under the package center on the top-layer copper pour, and stitch at least 4 thermal vias per ball-grid region to spread heat into inner planes. At 1.055 GHz with full GbE traffic, the junction temperature can rise 35-45 C above ambient; a modest 200 LFM airflow or a heat-spreader lid is recommended for fanless industrial enclosures. (Estimated: based on typical QorIQ P1 family junction-to-ambient figures and 1 GHz operating point; consult the NXP data sheet for verified thermal resistance values.)
Route DDR2/DDR3 signals with 50 ohm controlled impedance and match trace lengths within the byte lanes per the NXP P1013 design guidelines. Use length-matching within 25 mils on differential SerDes pairs for PCIe and GbE to maintain signal-integrity compliance. Decouple each power rail with 0.1 uF ceramic capacitors placed as close as possible to the package balls, and add bulk 10-22 uF tantalum or polymer capacitors near the package edges. The 689-ball grid requires careful escape routing; consider a 6-layer stackup with dedicated ground and power planes.
Do not assume the P1013NSE2LFB and P1022NXN2LFB are interchangeable at the firmware level - the dual-core variant requires SMP-aware Linux and additional boot configuration in the device tree. Verify ball assignments carefully against the latest revision of the NXP data sheet, because early silicon revisions had a different SerDes lane map. Finally, confirm DDR3 memory compatibility with NXP's validated vendor list before committing to a specific DRAM supplier; third-party DIMMs may fail at extended temperature ranges.
Compliance-Informationen
Compliance values were not present in the Verified Web Data snippets for this part; marked as 'unknown' rather than assumed. The part is classified as a commercial-grade microprocessor (0 C to 105 C) and is not AEC-Q100 qualified.
