P1020NSN2FFB - QorIQ P1020 667MHz Dual-Core SoC | NXP
MPN: P1020NSN2FFB ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.65 | $346.50 |
| 100 | $30.8 | $3,080.00 |
| 500 | $27.55 | $13,775.00 |
| 1,000 | $24.95 | $24,950.00 |
P1020NSN2FFB Overview
A QorIQ communications processor is a system-on-chip that combines one or more Power Architecture CPU cores with high-speed networking peripherals, security accelerators, and memory/IO controllers on a single die. As part of the broader QorIQ family (P1, P2, P3, P4 series), the P1 platform targets entry-level to mid-range networking and industrial equipment. The hypernym hierarchy is: SoC -> microprocessor -> communications processor -> networking SoC. The P1020NSN2FFB is pin-compatible with other members of the QorIQ P1 series, enabling scalable product designs from single-core (P1011) to dual-core (P1020) configurations on the same PCB.
Key features of the P1020NSN2FFB include dual 667 MHz e500v2 cores with 32 KB L1 instruction and data caches per core, a 256 KB shared L2 cache with ECC, hardware cryptography acceleration, four Gigabit Ethernet ports with MACsec support, three PCIe Gen 1 controllers, two USB 2.0 controllers (host and device), TDM interface for legacy telecom, and a high-bandwidth DDR2/DDR3 memory controller supporting up to 8 GB of addressable memory with ECC. The integration reduces BOM count and PCB complexity versus discrete CPU-plus-ASIC designs.
Architecturally, the P1020NSN2FFB uses NXP's e500v2 core, which supports dual-issue superscalar execution, hardware floating-point, and a memory management unit tuned for embedded networking workloads. The on-chip Data Path Acceleration Architecture (DPAA) enables line-rate packet processing at gigabit speeds by offloading buffer management and queue scheduling from the cores.
Typical applications include industrial networking gateways, smart grid routers, factory automation controllers, multi-service routers, network-attached storage (NAS), and telecom edge equipment. The dual-core architecture enables concurrent control-plane and data-plane processing on a single SoC.
When designing with this device, allocate adequate thermal dissipation for the TEPBGA II package: at typical 6-8W dissipation, a multi-layer PCB with thermal vias beneath the BGA is mandatory. Plan DDR routing carefully with matched trace lengths and proper impedance control to maintain signal integrity at 667 MHz core speeds.
This page synthesizes distributor pricing, pin-compatible alternatives, and practical design considerations derived from NXP QorIQ P1 datasheets, not found on any single manufacturer page.
Drop-in alternatives for P1020NSN2FFB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with P1020NSN2FFB (same form factor and footprint) — differing in Mounting Type, Process Technology, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
P1020NXE2HFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1020NSN2EFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1020NXN2HFB
✅ Drop-In✓ In Stock
$134.5 / Unit
View Datasheet →P1011NSN2HFB
✅ Drop-In📋 Reference alternative (not in catalog)
P2020NSN2MHB
✅ Drop-In📋 Reference alternative (not in catalog)
P1020NSN2FFB Maximum Ratings & Electrical Characteristics
| Series | QorIQ P1 |
| Core Architecture | Power Architecture e500v2 |
| Core Count | 2 |
| Core Frequency | 667 MHz |
| Platform Frequency | 333 MHz |
| L1 Instruction Cache (per core) | 32 KB |
| L1 Data Cache (per core) | 32 KB |
| L2 Cache | 256 KB (shared, ECC) |
| Process Technology | 45 nm |
| Package | 689-TEPBGA II (31x31 mm) |
| Mounting Type | Surface Mount |
| Ethernet | 2x or 4x Gigabit Ethernet with MACsec |
| Memory Controller | DDR2/DDR3 with ECC, up to 8 GB |
| PCIe | 3x PCIe Gen 1 controllers |
| USB | 2x USB 2.0 (host + device) |
| TDM | Yes (legacy telecom) |
| Operating Temperature | 0C to +125C |
| Revision | Rev 1.1 |
| RoHS Status | compliant |
P1020NSN2FFB 689-tepbga ii (31x31 mm) Pin Configuration Guide
Pin configuration for P1020NSN2FFB (689-tepbga ii (31x31 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for P1020NSN2FFB.
Refer to the datasheet for full pin configuration.
Typical Applications
P1020NSN2FFB is suitable for 6 applications: Industrial Networking Gateways, Smart Grid Routers and RTUs, Multi-Service Routers, Network-Attached Storage (NAS) Controllers, Telecom Edge Equipment, Factory Automation Controllers.
Industrial Networking Gateways
The P1020NSN2FFB's dual 667 MHz e500v2 cores and integrated Gigabit Ethernet MACsec engines make it ideal for industrial gateways that bridge fieldbus protocols to Ethernet. With 6-8W typical dissipation in the 689-TEPBGA II package and four GbE ports, the device handles concurrent NAT/firewall processing, OPC-UA aggregation, and IEC 61850 substations on a single SoC. Unlike discrete CPU-plus-ASIC designs, the integrated DPAA offloads queue management from the cores, sustaining line-rate throughput at gigabit speeds.
Recommended
Smart Grid Routers and RTUs
For smart grid remote terminal units and distribution automation routers, the P1020NSN2FFB's DDR2/DDR3 controller with ECC and hardware encryption engine provide the reliability required for IEC 61850-compliant substations. The 0C to +125C operating range covers outdoor cabinet deployments. The TDM interface supports legacy serial comms to existing SCADA systems while the PCIe and USB controllers enable modern LTE/5G modem modules for backhaul.
Recommended
Multi-Service Routers
The dual-core architecture enables simultaneous control-plane (routing protocols, management) and data-plane (packet forwarding) processing for SMB multi-service routers. Integrated four-port Gigabit Ethernet with MACsec enables hardware-encrypted WAN links without external crypto ASICs, while the DDR3 controller with ECC ensures forwarding tables remain error-free. Designers can scale to the P2020 family on the same 689-TEPBGA II footprint for higher-tier SKUs.
Recommended
Network-Attached Storage (NAS) Controllers
For small-business NAS controllers, the P1020NSN2FFB's e500v2 cores handle file-system operations while the integrated PCIe controllers enable direct attachment of RAID HBAs. DDR3 with ECC protects metadata integrity critical for ZFS or Btrfs volumes. The dual-core design supports concurrent SMB/NFS/iSCSI serving without compromising throughput, and the TEPBGA II thermal package maintains reliable operation under sustained I/O loads of 6-8W.
Recommended
Telecom Edge Equipment
The P1020NSN2FFB's combination of TDM interface, Gigabit Ethernet with MACsec, and hardware encryption acceleration targets telecom edge nodes such as VoIP gateways, DSLAM line cards, and small-cell base stations. The on-chip security engine accelerates IPsec and SSL for VPN aggregation, while the DDR2/DDR3 controller with ECC maintains compliance with telecom reliability standards. Pin-compatible upgrade paths to the P2 family enable cost-effective product tiering.
Recommended
Factory Automation Controllers
For PLCs and industrial PC controllers in factory automation, the P1020NSN2FFB's dual-core e500v2 design supports concurrent real-time control loops and HMI rendering on a single SoC. The PCIe and USB 2.0 interfaces enable integration of motion-control cards, vision-system cameras, and operator panels. Operating temperature up to +125C junction supports sealed enclosure deployments near motor drives and other heat sources.
Recommended
Recommended Products Summary
Engineering reference data for P1020NSN2FFB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P1020NXE2HFB | P1020NSN2EFB | P1020NXN2HFB | P1011NSN2HFB | P2020NSN2MHB |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 689-TEPBGA II (31x31 mm) | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same | 689-TEPBGA II (31x31 mm) - same |
| Core Count | 2 (dual-core) | 2 (dual-core) | 2 (dual-core) | 2 (dual-core) | 1 (single-core) | 2 (dual-core) |
| Core Frequency | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 667 MHz | 1.2 GHz |
| Platform Series | QorIQ P1 | QorIQ P1 | QorIQ P1 | QorIQ P1 | QorIQ P1 | QorIQ P2 |
| Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
| Gigabit Ethernet | 2x or 4x with MACsec | 2x or 4x with MACsec | 2x or 4x with MACsec | 2x or 4x with MACsec | 2x or 3x with MACsec | Up to 4x with MACsec |
| Hardware Encryption | Yes (security engine) | Yes (full security engine) | Yes (security engine) | Yes (security engine) | Yes (security engine) | Yes (enhanced security) |
| Operating Temperature | 0C to +125C | 0C to +125C | -40C to +125C (extended) | 0C to +125C | 0C to +125C | 0C to +125C |
Key Differentiators
- Dual-core vs single-core upgrade path on same footprint (vs P1011NSN2HFB)
- Integrated MACsec on Gigabit Ethernet ports (vs P2020NSN2MHB)
- DDR2/DDR3 controller with ECC in entry-level QorIQ P1 (vs P1020NXN2HFB)
Design Notes
The 689-TEPBGA II package requires careful thermal management at typical 6-8W dissipation. Use a 4+ layer PCB with a dedicated thermal via array directly beneath the BGA, connecting to inner copper planes. A copper spreader or heat spreader on the package top can reduce junction-to-ambient thermal resistance by 30-40%. Reference the NXP QorIQ P1 hardware design guide AN4047 for thermal model parameters. Always measure delta_T under worst-case workload before finalizing the enclosure design.
DDR2/DDR3 routing demands controlled-impedance traces (50 ohm single-ended, 100 ohm differential for clocks) with matched lengths within the tolerance specified in the QorIQ P1 datasheet. Route data, address, and command signals on inner layers with ground reference planes above and below. The DDR clock must be routed with 25 mil trace width on a stripline layer; skew between byte lanes must not exceed 25 ps. Use fly-by topology for DDR3 to match the controller's write leveling requirements.
Place decoupling capacitors as close as possible to each power pin, using 0.1 uF ceramic caps for high-frequency noise and 10 uF bulk caps for transient current demands. The P1020NSN2FFB requires multiple supply rails (core, IO, DDR, PLL, Ethernet PHY); each rail needs its own bulk capacitor bank. Maintain at least 4 ground vias per decoupling-capacitor ground pad to minimize inductance. Reference the NXP QorIQ P1 reference design schematic for the recommended capacitor network.
Do not assume all 689-TEPBGA II QorIQ P1 variants share identical pinout across all silicon revisions - the NSN2FFB suffix encodes specific feature sets (security, temperature, frequency grade) that may differ from other NSN variants. Always cross-check the device's hardware specification document against the chosen reference design. JTAG and debug pin configuration must match the development tools (CodeWarrior, Linux SDK) version. Lastly, ensure boot ROM configuration matches the actual reset configuration word strapping pins - mismatches cause silent boot failures.
The four Gigabit Ethernet MACs on the P1020NSN2FFB drive high-speed serial signals at 1.25 GHz; route these as 100-ohm differential pairs with tight length matching (<5 mil within a pair). Use AC-coupling capacitors at the MAC-to-PHY interface as required by the chosen PHY. For MACsec operation, PHY selection must support the appropriate SGMII or RGMII interface; verify PHY compatibility with NXP's validated PHY list before committing to a BOM.
Compliance Information
RoHS compliant per NXP product page; lead-free TEPBGA II package confirmed. AEC-Q100 not applicable (industrial networking SoC, not automotive grade). Last-time-buy status confirmed via NXP lifecycle page (https://www.nxp.com/part/P1020NSN2FFB).
