P1020NXN2HFB - QorIQ P1 Dual-Core 800MHz MPU | NXP Semiconductors
MPN: P1020NXN2HFB ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $191.13 | $191.13 |
| 10 | $179.5 | $1,795.00 |
| 100 | $162.2 | $16,220.00 |
| 500 | $148.75 | $74,375.00 |
| 1,000 | $134.5 | $134,500.00 |
P1020NXN2HFB Overview
Background: An MPU (Microprocessor Unit) in this category is the principal CPU of an embedded compute platform, distinct from a microcontroller in that it typically relies on external memory (DDR, NOR/NAND) and an external chipset for I/O. Within NXP's portfolio, the QorIQ P1 series sits below the P2/P3 layerscale parts and above the legacy PowerQUICC line; the P1020 is the dual-core sibling of the single-core P1011, sharing a common pinout and reference platform. The package name 689-TEPBGA II denotes a 31x31 mm thermally-enhanced plastic BGA with 689 balls.
Key features include two Power Architecture e500v2 cores with hardware MMU and double-precision FPU support, integrated security engine with protocol acceleration, integrated DMA, multiple 10/100/1000 Ethernet MACs, PCI Express controllers, USB, SDHC, I2C, SPI, UART, and TDM interfaces. According to the vendor product family, the P1 series is built on a 45 nm process and optimized for power-efficient packet processing.
Typical applications include industrial control gateways, secure routers and firewalls, networked printers and PoS terminals, defense and aerospace embedded controllers, factory-floor protocol converters, and edge telecom line cards. The dual-core configuration allows one core to run a control-plane stack while the second handles data-plane forwarding.
Design consideration: the 689-ball BGA requires controlled-impedance PCB stack-up with matched-length DDR traces and a solid thermal copper pour under the exposed pad; designers should evaluate NXP's validated reference designs before board bring-up.
This page consolidates distributor pricing, lifecycle status (currently End-of-Life per NXP), recommended drop-in same-family alternatives, and design considerations not always collated in a single vendor datasheet.
Drop-in alternatives for P1020NXN2HFB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with P1020NXN2HFB (same form factor and footprint) — differing in Memory Controller, Operating Temperature, USB, Mounting Type, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
P1011NXN2HFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1021NSN2HFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1020NSE2HFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1020NSN2FFB
✅ Drop-In✓ In Stock
$24.95 / Unit
View Datasheet →P1020NXE2FFB
✅ Drop-In✓ In Stock
$54.95 / Unit
View Datasheet →P1011NSN2HFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1020NXN2HFB Maximum Ratings & Electrical Characteristics
| Processor Family | PowerPC e500v2 |
| CPU Cores | 2 |
| Data Bus Width | 32-bit |
| Maximum Core Frequency | 800 MHz |
| Package / Case | 689-TEPBGA II (31 x 31 mm) with exposed thermal pad |
| Process Technology | 45 nm CMOS |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | RoHS Compliant |
| Lead-Free Status | Lead Free |
| Series | QorIQ P1 |
| Peripherals | Ethernet MACs, PCI Express, USB, SDHC, I2C, SPI, UART, TDM, DMA, Security Engine |
| Security | Integrated security/crypto engine (per QorIQ P1 family) |
| Memory Interface | DDR3/DDR2 controller with ECC (per QorIQ P1 family) |
P1020NXN2HFB 689-tepbga ii (31 x 31 mm) with exposed thermal pad Pin Configuration Guide
Pin configuration for P1020NXN2HFB (689-tepbga ii (31 x 31 mm) with exposed thermal pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for P1020NXN2HFB.
Refer to the datasheet for full pin configuration.
Typical Applications
P1020NXN2HFB is suitable for 6 applications: Industrial Network Gateway, Telecom Line Card / Control Plane, Defense / Aerospace Embedded Controller, Secure Router / Firewall Appliance, Networked Industrial Printer / PoS Terminal, Factory Floor Protocol Converter.
Industrial Network Gateway
The P1020NXN2HFB fits industrial gateway designs because its two e500v2 cores let one core run the routing/control plane while the second processes filtered traffic, and on-die multi-port Gigabit Ethernet MACs remove the need for an external switch ASIC. With QorIQ P1 hardware accelerators (table-lookup engine, queue manager) the part sustains wire-rate classification on modest 533-667 MHz industrial profiles, while integrated crypto and tamper I/O support IPsec, MACsec, and secure boot demanded by industrial firewall gateways. Practical design note: pair the BGA with a 4-layer DDR3 reference layout from the NXP P1020 hardware design checklist, and place a copper pour under the exposed pad to keep junction temperature inside industrial-grade limits.
Recommended
Telecom Line Card / Control Plane
In telecom line-card applications the P1020NXN2HFB acts as the control processor, leveraging its dual e500v2 cores to segregate OS and management-plane tasks from data-plane forwarding. Its integrated PCI Express and multiple Ethernet MACs are well-matched to TDM/IP interworking and to legacy E1/T1 bridging, while the security engine accelerates MACsec keys without taxing the cores. Designers typically pair the BGA with a DDR3-800 SODIMM and a CPLD for hot-swap control. The part's last-time-buy status means new telecom programs should plan migration to a current QorIQ Layerscape successor for long-term deployments.
Recommended
Defense / Aerospace Embedded Controller
The P1020NXN2HFB suits defense and aerospace embedded controllers because QorIQ P1 parts were qualified to MIL-STD harsh-environment profiles and integrate cryptographic engines, secure boot and tamper response required for tactical routers, secure communications, and avionic data concentrators. The two 800 MHz cores can be partitioned between trusted control-plane Linux and untrusted guest workloads via hardware virtualization extensions. Designers must validate the part's industrial versus military temperature grade against the specific avionics program, evaluate radiation mitigation per the program's environmental requirements, and use a BGA-equipped 8-layer PCB per NXP's reference layout.
Recommended
Secure Router / Firewall Appliance
The P1020NXN2HFB delivers dual-core throughput for SMB and branch-office secure routers/firewalls where IPsec and stateful packet inspection can saturate one core while the second manages routing, RADIUS, and management UI. The hardware crypto engine off-loads AES-256/SHA-2 at line-rate on GbE links, allowing small-form-factor fanless appliances. Typical bill of materials pairs the BGA with a DDR3-1600 chip, a NOR flash boot source, and a 1 GbE copper PHY. Because the P1020 family is end-of-life, designers building new appliances should look at NXP's Layerscape LS1012A/LS1028A successors and reuse the P1020 for legacy BOM continuity.
Recommended
Networked Industrial Printer / PoS Terminal
The P1020NXN2HFB is a strong fit for networked industrial printers and PoS terminals because its dual cores can simultaneously drive the print rasterizer pipeline and the encrypted transaction stack, while the integrated USB, SDHC, and Ethernet simplify the BOM. Hardware crypto accelerators secure EMV/PIN transactions without loading the OS, and the BGA's solid thermal path supports fanless sealed enclosures. Design consideration: pair the BGA with high-thermal-conductivity PCB material or a small aluminum spreader since the PoS chassis is often sealed. Plan for last-time-buy supply given the part's end-of-life status.
Recommended
Factory Floor Protocol Converter
For factory-floor protocol conversion (EtherCAT, EtherNet/IP, PROFINET, Modbus TCP) the P1020NXN2HFB's dual cores serve as deterministic protocol-engine plus Linux control stack hosts, with hardware-assisted Ethernet MACs driving industrial PHY interfaces directly. The integrated TDM and UART bridges enable legacy serial fieldbus connections, and the security engine authenticates industrial devices per IEC 62443. A typical reference design uses DDR3-800, a small managed switch on-chip, and an isolated SPI ADC for sensor aggregation. Given the part's last-time-buy status, plan dual-sourcing or migration to LS1021A where industrial programs have multi-year lifetime.
Recommended
Recommended Products Summary
Engineering reference data for P1020NXN2HFB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P1011NXN2HFB | P1021NSN2HFB | P1020NSE2HFB | P1020NSN2FFB | P1020NXE2FFB | P1011NSN2HFB |
|---|---|---|---|---|---|---|---|
| Package | 689-TEPBGA II (31x31) | 689-TEPBGA II - same | 689-TEPBGA II - same | 689-TEPBGA II - same | 689-TEPBGA II - same | 689-TEPBGA II - same | 689-TEPBGA II - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Count | 2 (Dual) | 1 (Single) | 2 (Dual) | 2 (Dual) | 2 (Dual) | 2 (Dual) | 1 (Single) |
| Core Frequency | 800 MHz | 800 MHz | 667 MHz | 800 MHz | 800 MHz | 800 MHz | 800 MHz |
| ISA | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 | PowerPC e500v2 |
| Process Technology | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm | 45 nm |
| Integrated Ethernet MACs | Multi-port GbE | Multi-port GbE | Multi-port GbE | Multi-port GbE | Multi-port GbE | Multi-port GbE | Multi-port GbE |
| Security Engine | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) |
| Lifecycle Status | Last-Time-Buy (End of Life) | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy | Last-Time-Buy |
| RoHS Compliance | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Key Differentiators
- Dual-core 800 MHz with hardware crypto engine (vs P1011NXN2HFB)
- Industrial/extended temperature variant within the same silicon (vs P1021NSN2HFB)
- Higher default clock vs industrial siblings (vs P1020NSE2HFB)
Design Notes
The 689-ball BGA at 31x31 mm requires a 1.0 mm ball pitch with controlled-impedance PCB stack-up; use NXP's reference design as the layout source and verify 50-ohm SE and 100-ohm diff for Ethernet and PCIe SerDes lanes. Match DDR3 trace lengths to within 25 mil across byte lanes and use a 6- or 8-layer board with solid reference ground planes adjacent to the signal layers. Do not place signal vias under BGA balls; fanout using dogbone or microvia-in-pad as needed. The exposed thermal pad must be soldered with a uniform thermal via array to the inner ground plane.
The TEPBGA II package routes heat through the central exposed die-pad to the inner PCB stack. Without a copper pour and thermal vias the junction temperature may exceed 105 C at 800 MHz dual-core full load, triggering thermal throttling or shutdown. Provide at least 1 oz copper weight on the top and bottom layers under the BGA, plus a 6x6 thermal-via array tied to inner ground; for industrial-grade ambient (85 C) consider a small aluminum spreader bonded to the exposed pad.
When migrating an existing 32-bit PowerPC design note that the P1020NXN2HFB has been moved to End-of-Life by NXP; secure last-time-buy quantities for the expected product lifetime before distributor stock depletes. Also note that substituting a P1011 (single-core) or P1021 (sibling industrial) on a populated P1020 board may require firmware bin retag because core count, temperature grade, or security revision differ. Validate against the QorIQ P1 errata document and NXP's pin-compatible device table before any re-spin.
Compliance Information
RoHS compliant and lead-free per DigiKey and Heisener distributor listings. AEC-Q100 not applicable (this is a communications MPU, not an automotive analog IC). Halogen-free, REACH, and conflict-minerals status not explicitly stated in the verified data; consult NXP's product compliance declarations for confirmation.
