P1022NSN2HFB - QorIQ 32-Bit Power Arch SoC 800MHz 2-Core | NXP
MPN: P1022NSN2HFB ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $85.74 | $85.74 |
| 10 | $78.5 | $785.00 |
| 100 | $68.9 | $6,890.00 |
| 500 | $62.4 | $31,200.00 |
| 1,000 | $58.2 | $58,200.00 |
P1022NSN2HFB Overview
A QorIQ SoC is a system-on-chip that integrates one or more Power Architecture CPU cores, memory controllers, high-speed interconnect fabrics, and peripheral IP blocks onto a single die. QorIQ platforms sit within the broader NXP processor taxonomy: SoC -> communications processor -> embedded microprocessor -> Power Architecture device -> semiconductor. The QorIQ P1 family is positioned for cost-sensitive multi-core networking and industrial control workloads where integration reduces BOM and PCB complexity.
Key features of the P1022 include dual e500 cores with double-precision floating-point support, an integrated DDR2/DDR3 memory controller with ECC, three Gigabit Ethernet controllers (one 10/100/1000 plus two RGMII), two PCI Express controllers (x1/x2), a USB 2.0 controller (host/device), an LCD controller, secure boot, and Trust Architecture features. The device is fabricated in a 45 nm CMOS process, and the PBGA-689 exposed-pad package provides a low thermal resistance path for sustained compute workloads.
Architecturally, the P1022 implements a hierarchical interconnect with coherent L1 caches per core and a shared L2 cache. The CoreNet platform coherently fabric fabric is shared with the DDR memory controller. Hardware accelerators for cryptography and pattern matching (SEC 4.0 engine) are integrated for line-rate security processing. This combination delivers wire-speed networking throughput while freeing CPU cores for application and control-plane tasks.
Typical applications for the P1022NSN2HFB include IP networking equipment such as branch-office routers, Ethernet switches, industrial gateways, and network-attached storage (NAS). The integrated LCD controller and DDR3/2 controller also make it suitable for human-machine interface (HMI) controllers, building automation, and factory-floor protocol bridges where deterministic Power Architecture performance is required.
When designing with this device, engineers should pay close attention to power-rail sequencing and the exposed-pad thermal management. The 689-ball PBGA requires a properly stitched thermal via array beneath the exposed pad to dissipate the full-chip power; a four-layer PCB with 2 oz copper on outer layers is typically the minimum recommended stack-up.
This page synthesizes distributor availability, datasheet pinout details, same-family drop-in alternatives, and lifecycle status not consolidated in the manufacturer part page alone, giving procurement and design engineers a single decision-ready reference for the P1022NSN2HFB.
Drop-in alternatives for P1022NSN2HFB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with P1022NSN2HFB (same form factor and footprint) — differing in Operating Temperature, RoHS Status, USB, Ethernet, Maximum Core Frequency.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
P1022NSE2HFB
✅ Drop-In✓ In Stock
$75 / Unit
View Datasheet →P1022NXN2HFB
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$52.65 / Unit
View Datasheet →P1013NSN2HFB
✅ Drop-In📋 Reference alternative (not in catalog)
P1024NSN2HFB
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
P1020NSN2HFB
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$55.8 / Unit
View Datasheet →P1022NSN2HFB Maximum Ratings & Electrical Characteristics
| Product Family | QorIQ P1 |
| Architecture | 32-bit Power Architecture (e500 v2) |
| Number of Cores | 2 |
| Core Frequency | 800 MHz |
| Platform Frequency | 400 MHz |
| DDR Memory Frequency | 667 MHz |
| Memory Controller | DDR2 / DDR3 with ECC |
| Ethernet Controllers | 3x Gigabit (1x SGMII + 2x RGMII) |
| PCI Express | 2x PCIe controllers (x1/x2) |
| USB | USB 2.0 (host + device) |
| LCD Controller | Yes (integrated) |
| Security Engine | SEC 4.0 |
| Process Technology | 45 nm CMOS |
| Operating Temperature | 0 C to 105 C |
| Package | PBGA-689 with exposed pad |
| Silicon Revision | Rev 2.0 |
| RoHS Status | Compliant (Pb-free) |
P1022NSN2HFB pbga-689 with exposed pad Pin Configuration Guide
Pin configuration for P1022NSN2HFB (pbga-689 with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for P1022NSN2HFB.
Refer to the datasheet for full pin configuration.
Typical Applications
P1022NSN2HFB is suitable for 6 applications: Branch-Office IP Router, Industrial Ethernet Gateway, Network-Attached Storage (NAS) Controller, Human-Machine Interface (HMI) Controller, Smart Energy / Substation Gateway, Edge Computing Appliance.
Branch-Office IP Router
The P1022NSN2HFB is well suited for branch-office routers because its dual 800 MHz e500 cores deliver wire-speed IPv4/IPv6 forwarding with integrated DDR3 SEC 10/100/1000 RGMII ports. The three Gigabit Ethernet controllers map to WAN uplink plus LAN switch ports, eliminating external bridge ASICs and shrinking BOM cost. Compared to discrete CPU-plus-NPU architectures, the P1022's integrated SEC 4.0 engine offloads IPSec and SSL/TLS, freeing CPU cycles for routing and QoS. Power Architecture determinism ensures low-latency forwarding even under DoS conditions. Use the P1022 with an external PHY such as the VSC8520 or KSZ9021 for full GbE switch port density.
Recommended
Industrial Ethernet Gateway
The P1022NSN2HFB's industrial 0 C to 105 C temperature grade and integrated dual GbE make it an excellent gateway for protocol translation between PROFINET, EtherCAT, Modbus TCP, and Ethernet/IP networks. The dual e500 cores run real-time control on one core while the other handles Ethernet/IP or MQTT cloud uplinks with TLS. Hardware-accelerated cryptography via SEC 4.0 secures OPC-UA traffic without burdening the application CPU. The DDR3 controller with ECC protects configuration memory from soft errors on factory floors with high EMI.
Recommended
Network-Attached Storage (NAS) Controller
The P1022NSN2HFB serves as a NAS controller SoC by combining dual e500 cores for RAID management plus the integrated Gigabit Ethernet and PCI Express controllers for high-speed SATA or 10 GbE NIC connectivity. The PCIe lanes connect to SATA controllers or a 10 GbE NIC for SMB/NFS throughput, while the SEC 4.0 engine handles AES-encrypted volumes with negligible CPU overhead. DDR3 with ECC ensures file-system integrity during unexpected power events, critical for NAS data reliability.
Recommended
Human-Machine Interface (HMI) Controller
The integrated LCD controller on the P1022NSN2HFB drives TFT panels up to WXGA resolution, making it ideal for industrial HMI panels used in machine tools, building automation, and process control. The dual e500 cores run the GUI on one core while the other handles fieldbus or Ethernet/IP communication with deterministic latency. The 0 C to 105 C grade supports uncooled enclosures, and the PCI Express lanes can connect to a touchscreen controller or Wi-Fi module for wireless HMI access.
Recommended
Smart Energy / Substation Gateway
The P1022NSN2HFB is positioned for smart-grid gateways and IEC 61850 substation controllers, where dual GbE ports support redundant network paths and hardware crypto offload secures DNP3 / IEC 61850 GOOSE traffic. The industrial temperature grade and ECC-protected DDR3 are required for unattended substation deployments. PCI Express lanes connect to fiber-optic transceivers for high-availability communication with utility SCADA systems, while the SEC 4.0 engine accelerates certificate-based authentication per IEC 62351.
Recommended
Edge Computing Appliance
The P1022NSN2HFB functions as an edge computing node for industrial IoT gateways, combining dual e500 cores for local analytics plus the SEC 4.0 engine for secure MQTT/TLS connectivity to cloud platforms. PCI Express lanes connect to Wi-Fi 6 or 5G modules for uplink, while the three GbE ports provide local device aggregation. ECC-protected DDR3 ensures long-term reliability in vibration-prone edge deployments, and the industrial temperature grade supports outdoor enclosures.
Recommended
Recommended Products Summary
Engineering reference data for P1022NSN2HFB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | P1022NSE2HFB | P1022NXN2HFB | P1013NSN2HFB | P1024NSN2HFB | P1020NSN2HFB |
|---|---|---|---|---|---|---|
| Package | PBGA-689 | PBGA-689 - same | PBGA-689 - same | PBGA-689 - same | PBGA-689 - same | PBGA-689 - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Count | 2 x e500 | 2 x e500 | 2 x e500 | 1 x e500 (-50%) | 2 x e500 | 2 x e500 |
| Core Frequency | 800 MHz | 800 MHz | lower frequency variant | 600 MHz class | higher frequency variant | lower frequency variant |
| Ethernet Controllers | 3x GbE | 3x GbE | 3x GbE | 3x GbE | 3x GbE | 3x GbE |
| PCIe Lanes | 2x PCIe | 2x PCIe | 2x PCIe | 2x PCIe | 2x PCIe | 2x PCIe |
| Operating Temperature | 0 C to 105 C | extended grade | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C | 0 C to 105 C |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
| Security Engine | SEC 4.0 | SEC 4.0 | SEC 4.0 | SEC 4.0 | SEC 4.0 | SEC 4.0 |
Key Differentiators
- Dual e500 cores at 800 MHz versus single-core P1013 (vs P1013NSN2HFB)
- 800 MHz top bin versus lower-binned P1020/P1022NXN2HFB (vs P1020NSN2HFB)
- SEC 4.0 hardware crypto engine versus external accelerator (vs Discrete NPU + CPU architecture)
Design Notes
The 689-ball PBGA exposed pad must be soldered to the PCB and stitched with a thermal-via array (typically 0.3 mm pitch, 5x5 to 10x10 via grid) to a large internal copper pour for proper heat dissipation. Without the exposed-pad solder connection, junction temperature will exceed the 105 C rating under typical 5 to 8 W workloads. A four-layer PCB with 2 oz copper on the outer layers is the recommended minimum stack-up; for industrial enclosures, an aluminum core or 4 oz copper stack-up is preferred.
The P1022NSN2HFB requires multiple power rails (core, DDR, I/O, PLL, SERDES) that must be sequenced per the QorIQ P1022 hardware specification. Failure to follow the power-up sequence can latch-up the device or cause permanent damage. Use a dedicated power-management IC such as the NXP PF0100 or equivalent to manage the rails; do not attempt to use generic buck regulators without sequencing logic. Decoupling: place 0.1 uF and 10 uF capacitors as close to each power pin as possible, plus bulk capacitors at the PCB power-entry.
The PBGA-689 package uses 1.0 mm ball pitch, requiring microvia or laser-drilled via technology for escape routing. HDI (High-Density Interconnect) PCB fabrication is typically required; standard 4 mil/4 mil line/space is acceptable for outer layers but inner layers often need 3 mil/3 mil. The DDR3 memory controller supports DDR3-1600 (667 MHz) with ECC - route the DDR3 interface with matched-length traces (typically +/- 25 mil tolerance) and proper termination per the DDR3 reference design checklist.
Common pitfalls with the P1022NSN2HFB include counterfeit risk in the open market (reported at ~60% per GlobalSpec), failure to verify silicon revision 2.0 compatibility with firmware, and missing the last-time-buy deadline. Always source from authorized distributors (Mouser, Rochester Electronics, Arrow) and request a Certificate of Conformance. Verify the silicon revision printed on the package matches the firmware baseline, since early P1022 silicon (rev 1.x) has known errata that were fixed in rev 2.0.
Compliance Information
RoHS compliant (Pb-free) per NXP product page. Not AEC-Q100 qualified; automotive applications should consider QorIQ automotive-grade variants.
