PIC16F15344-I/MLVAO - 8-bit MCU, 7KB Flash, 32MHz, 20-QFN | Microchip
MPN: PIC16F15344-I/MLVAO β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.65 | $1.65 |
| 10 | $1.49 | $14.90 |
| 100 | $1.32 | $132.00 |
| 500 | $1.18 | $590.00 |
| 1,000 | $1.05 | $1,050.00 |
PIC16F15344-I/MLVAO Overview
An 8-bit microcontroller is a single-chip computer built around an 8-bit data path that executes instructions from on-chip Flash memory and integrates CPU, RAM, EEPROM, timers, ADCs, and communication peripherals. Within the broader taxonomy, the PIC16F15344 belongs to the PIC microcontroller family -> 8-bit MCU -> microcontrollers -> embedded ICs -> semiconductor. The eXtreme Low-Power (XLP) technology at the core of this device targets battery-powered applications by reducing active and sleep currents below competing architectures.
Key features include a 10-bit ADC with computation (ADC2), a 5-bit DAC, two comparators, four 10-bit PWMs, a Complementary Waveform Generator (CWG), four Configurable Logic Cells (CLC), two EUSART modules, and SPI/I2C interfaces. The CIPs allow hardware-based peripheral interaction without CPU intervention, offloading timing-critical tasks. The instruction set is highly orthogonal with 49 single-word instructions, and the device operates across 2.3V to 5.5V with active current under 2 mA at 32MHz.
Architecturally, the PIC16F15344 uses a Harvard architecture with separate program and data buses, enabling single-cycle instruction execution except for branches. The interrupt controller supports both legacy and new peripheral interrupt sources with vectored prioritization. The Flash self-programming capability via ICSP and the configurable oscillator block add design flexibility for bootloader and clock-scaling use cases.
Typical applications include automotive body and sensor modules (AEC-Q100 qualified via the MLVAO suffix), IoT sensor nodes, low-power wireless companion MCUs, LED lighting controllers, home appliance user interfaces, and small motor control. The combination of CWG, PWM, and ADC2 enables single-chip BLDC and LED driver designs.
When designing with this part, observe the QFN PCB layout rules: thermal pad must be soldered to a continuous ground plane with multiple vias, and decoupling capacitors placed as close to VDD/VSS pairs as possible. The MLVAO suffix indicates the automotive-qualified (-40C to +125C) version in the 20-QFN (4x4) package.
Drop-in alternatives for PIC16F15344-I/MLVAO β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
PIC16F15344-I/ML
β Drop-Inπ Reference alternative (not in catalog)
PIC16F15344T-I/MLVAO
β Drop-Inπ Reference alternative (not in catalog)
PIC16F15344-E/MLVAO
β Drop-Inπ Reference alternative (not in catalog)
PIC16F15344-I/MLVAO Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC 8-bit enhanced mid-range |
| Program Memory (Flash) | 7 KB (4K x 14) |
| Data SRAM | 512 bytes |
| Data EEPROM | 256 bytes |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage | 2.3 V to 5.5 V |
| I/O Pins | 18 (maximum) |
| Package | 20-pin QFN (4x4 mm) with exposed pad |
| ADC | 10-bit, with computation (ADC2) |
| DAC | 5-bit |
| Comparators | 2 |
| PWM Channels | 4 (10-bit) |
| CWG | Yes (Complementary Waveform Generator) |
| CLC | 4 (Configurable Logic Cells) |
| EUSART | 2 |
| SPI / I2C | 1 SPI, 1 I2C |
| Instruction Set | 49 instructions, 14-bit word |
| Operating Temperature | -40C to +125C (automotive grade) |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
| AEC-Q100 | Qualified (automotive) |
| Family | PIC16F153xx |
PIC16F15344-I/MLVAO Pin Configuration
| Pin 1 | RA5 β GPIO / analog input / PWM |
| Pin 2 | RA4 β GPIO / analog input |
| Pin 3 | RA3 β GPIO / analog input (MCLR optional) |
| Pin 4 | RC5 β GPIO / PWM |
| Pin 5 | RC4 β GPIO / PWM |
| Pin 6 | RC3 β GPIO / SCL |
| Pin 7 | RC2 β GPIO / SDA |
| Pin 8 | RC1 β GPIO / analog input |
| Pin 9 | RC0 β GPIO / analog input |
| Pin 10 | VSS β Ground |
| Pin 11 | RC7 β GPIO / RX |
| Pin 12 | RC6 β GPIO / TX |
| Pin 13 | RB7 β GPIO / ICSP DAT |
| Pin 14 | RB6 β GPIO / ICSP CLK |
| Pin 15 | RB5 β GPIO / analog input / PWM |
| Pin 16 | RB4 β GPIO / analog input / PWM |
| Pin 17 | RB3 β GPIO / analog input |
| Pin 18 | RB2 β GPIO / analog input |
| Pin 19 | RB1 β GPIO / analog input |
| Pin 20 | RB0 β GPIO / analog input |
| Pin EP | EP β Exposed thermal pad - connect to VSS |
Typical Applications
PIC16F15344-I/MLVAO is suitable for 6 applications: Automotive Body Control Module, IoT Sensor Node, LED Lighting Controller, Home Appliance User Interface, Small Motor Control (BLDC / FOC), Battery Management Companion MCU.
Automotive Body Control Module
The PIC16F15344-I/MLVAO fits automotive body control with AEC-Q100 qualification across -40C to +125C. The 32 MHz core handles door/window logic, the 10-bit ADC2 with computation reads multiple sensor channels, and the CWG module drives LEDs and small relays. The 4x CLC cells enable custom signal routing without CPU load. The 20-QFN (4x4) package with exposed thermal pad supports compact PCB layouts in door and mirror modules, reducing BOM cost versus larger QFP variants.
Recommended
IoT Sensor Node
The PIC16F15344-I/MLVAO operates at 2.3V to 5.5V from a single Li-ion cell, and XLP technology drops sleep currents below 50 nA typical - ideal for duty-cycled IoT sensors. The 2x EUSART and SPI/I2C allow pairing with sub-GHz or BLE companion modules. The 10-bit ADC2 with computation performs oversampling and averaging in hardware, reducing wake time and extending duty cycle. With 7 KB Flash, the part supports TLS-like stacks or vendor-specific IoT protocols on constrained networks.
Recommended
LED Lighting Controller
The PIC16F15344-I/MLVAO drives multi-channel LED strings using its 4 PWMs, CWG, and 5-bit DAC, enabling smooth dimming and color mixing without external logic. The 32 MHz instruction throughput handles DMX or DALI protocol parsing while CLCs route PWM timing events in hardware. AEC-Q100 qualification supports automotive interior and exterior lighting designs. The 20-QFN (4x4) package is small enough for retrofit lamp drivers, and the 7 KB Flash accommodates complex fade curves and presets.
Recommended
Home Appliance User Interface
The PIC16F15344-I/MLVAO runs capacitive touch and rotary encoder inputs while driving 7-segment or TFT displays, ideal for washing machines, dishwashers, and microwave ovens. The 10-bit ADC reads multiple temperature sensors and the CLC cells handle debouncing and button-matrix scanning in hardware, offloading the CPU. The industrial temperature range covers the appliance operating envelope. With 7 KB Flash, the part supports multilingual UI strings and complex state-machine firmware without external memory.
Recommended
Small Motor Control (BLDC / FOC)
The PIC16F15344-I/MLVAO drives small brushless DC motors using its CWG module for complementary PWM outputs with dead-band generation, paired with the 10-bit ADC2 for back-EMF sensing. At 32 MHz the CPU performs sensorless commutation routines with adequate timing margin for 3-shunt current sensing. AEC-Q100 qualification makes this part attractive for automotive HVAC blower and pump applications. The 4 CLCs synthesize protection logic in hardware, such as overcurrent latch-up, reducing firmware burden.
Recommended
Battery Management Companion MCU
The PIC16F15344-I/MLVAO monitors cell voltages and temperatures in battery packs, communicating with a host BMS via SPI or I2C. The 10-bit ADC2 reads multiple cell voltages through an external mux, and the EEPROM stores calibration and lifetime data. XLP sleep modes keep quiescent current under 100 nA, preserving battery shelf life. The 20-QFN package fits inside small 18650 cell holders, and AEC-Q100 qualification supports automotive traction auxiliary batteries.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F15344-I/MLVAO β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F15344-I/ML | PIC16F15344T-I/MLVAO | PIC16F15344-E/MLVAO | PIC16F15344-I/P | PIC16F15344-E/GZ |
|---|---|---|---|---|---|---|
| Package | 20-QFN (4x4) | 20-QFN (4x4) - same | 20-QFN (4x4) - same | 20-QFN (4x4) - same | 20-PDIP | 20-UQFN |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash / SRAM / EEPROM | 7 KB / 512 B / 256 B | 7 KB / 512 B / 256 B | 7 KB / 512 B / 256 B | 7 KB / 512 B / 256 B | 7 KB / 512 B / 256 B | 7 KB / 512 B / 256 B |
| Maximum CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Temperature | -40C to +125C (AEC-Q100) | -40C to +85C (industrial) | -40C to +125C (AEC-Q100) | -40C to +125C (extended) | -40C to +85C (industrial) | -40C to +125C (extended) |
| AEC-Q100 Qualified | Yes | No (industrial) | Yes | Yes | No | Yes |
| Operating Voltage | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V | 2.3V to 5.5V |
| Packaging Format | Tube (tray) - automotive /MLVAO | Tube (tray) | Tape & Reel - automotive | Tube - extended temp | Tube - PDIP | Tray - UQFN |
| 10-bit ADC2 | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- AEC-Q100 automotive qualification in the compact 20-QFN (vs PIC16F15344-I/ML)
- Identical die in tape-and-reel packaging variant (vs PIC16F15344T-I/MLVAO)
- Core Independent Peripherals reduce firmware complexity (vs PIC16F15344-I/P (PDIP variant))
Design Notes
The 20-QFN (4x4) package has a center exposed thermal pad (EP) that MUST be soldered to a continuous ground plane with multiple thermal vias (typically 9-16 vias in a 3x3 to 4x4 array, 0.3 mm drill). Insufficient EP soldering can cause thermal runaway and reduced electrical performance. Place 0.1 uF ceramic decoupling capacitors as close as possible to each VDD/VSS pair; add a bulk 1-10 uF tantalum or ceramic on the main VDD rail. Keep analog and digital grounds separated at the IC and join at a single point near the EP.
The PIC16F15344-I/MLVAO operates from 2.3V to 5.5V. For battery-powered designs, leverage the eXtreme Low-Power (XLP) sleep modes that drop current below 50 nA typical in deep sleep. Use the ADC2 with computation to perform oversampling in hardware and reduce CPU wake time. The internal 32 kHz LFINTOSC oscillator eliminates external low-frequency crystals in many designs, saving BOM cost and PCB area. Always ramp VDD at the rate specified in the datasheet to avoid spurious resets.
Do not leave unused pins floating - configure them as outputs or inputs with internal weak pull-ups to minimize current draw and noise injection. The MCLR pin can be disabled for additional I/O but disabling it removes the reset function; consider the trade-off carefully. When using ICSP programming, isolate the ICSP lines from application circuitry with series resistors to prevent contention. The CWG and PWM outputs share pins with general I/O - verify pin assignments before layout to avoid routing conflicts.
Route analog signals (ADC inputs, DAC output, comparator inputs) away from digital switching traces to minimize crosstalk. Use a guard ring around sensitive analog traces tied to a clean analog ground. Place the ICSP connector at the edge of the PCB to allow programming without disassembly. For automotive designs targeting AEC-Q100, follow IPC-9592 guidelines for PCB layout under hood, including thermal relief and vibration considerations for the 20-QFN solder joints.
Compliance Information
AEC-Q100 qualified per Microchip automotive grade qualification. RoHS and REACH compliant per Microchip product declaration. The /MLVAO suffix indicates the automotive-grade variant in the 20-QFN package.