PIC16F15355T-I/MV - 8-bit MCU, 14KB Flash, 32MHz, 28-UQFN | Microchip
MPN: PIC16F15355T-I/MV ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.85 | $1.85 |
| 10 | $1.55 | $15.50 |
| 100 | $1.2 | $120.00 |
| 500 | $1.05 | $525.00 |
| 1,000 | $0.92 | $920.00 |
| 3,300 | $0.8 | $2,640.00 |
PIC16F15355T-I/MV Overview
An 8-bit PIC microcontroller (MCU) is a single-chip computer built around an 8-bit RISC core. The PIC16F15355 belongs to the PIC® XLP™ (eXtreme Low Power) 16F family within the broader 8-bit PIC microcontroller hierarchy (8-bit PIC -> PIC microcontroller -> microcontroller -> embedded processor -> semiconductor). It executes one instruction per clock cycle, integrates non-volatile Flash program memory plus SRAM, and combines digital I/O, analog, communication, and timing peripherals into one IC to replace discrete logic in embedded designs.
Key features include 14KB (8K x 14) Flash program memory, 1KB SRAM, 256 bytes of EEPROM, a 32MHz internal oscillator, four 8-bit timers plus two CCP and two PWM peripherals, a 10-bit ADC with up to 24 channels, two comparators, an 8-bit DAC reference, I2C/SPI/EUSART (LIN-capable) communication, and an integrated temperature indicator. The XLP sleep current of roughly 50 nA and active current in the microampere range make the device well-suited to battery-powered designs.
The architecture uses Microchip's enhanced mid-range 8-bit core with a 14-bit instruction word, hardware multiplier, single-cycle hardware stack, and Memory Access Partition (MAP) for code protection. CIP blocks such as Configurable Logic Cells (CLC), Complementary Waveform Generator (CWG), Numerically Controlled Oscillator (NCO), and Zero-Cross Detect (ZCD) allow functions normally handled in firmware to be offloaded to hardware, reducing code size and latency.
Typical applications include IoT sensor nodes, low-power wireless sensor hubs, HVAC thermostat controls, battery-powered consumer appliances, automotive body and lighting modules, and small industrial control boards. The wide 2.3V-5.5V VDD range lets the part operate directly from 2xAA cells, a 3.3V regulated rail, or a 5V USB rail.
For PCB layout, expose the UQFN-28 thermal pad to a top-layer copper pour stitched with at least 8 thermal vias to the ground plane for thermal dissipation and ground reference. Decouple VDD with a 100 nF X7R ceramic placed within 2 mm of the pin and add a bulk 1-10 uF tantalum or aluminum-polymer capacitor if the source is more than 25 mm away. The MCLR pin must be pulled up to VDD through 10-47 kOhm unless no external reset is desired.
This page synthesizes tape-and-reel pricing, same-family PIC drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for PIC16F15355T-I/MV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F15355T-I/MV (same form factor and footprint) — differing in ADC, Package, SRAM, EEPROM, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F15355-I/MV
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1.05 / Unit
View Datasheet →PIC16F15355T-E/SSVAO
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$1.65 / Unit
View Datasheet →PIC16F15354T-I/MV
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$0.74 / Unit
View Datasheet →PIC16F15345T-I/MV
✅ Drop-In ⚠️ 参数待验证📋 Reference alternative (not in catalog)
PIC16F15355T-I/MV Maximum Ratings & Electrical Characteristics
| Core Architecture | 8-bit PIC16 enhanced mid-range |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| SRAM | 1 KB |
| EEPROM | 256 bytes |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage (VDD) | 2.3 V to 5.5 V |
| ADC | 10-bit, up to 24 channels |
| Comparators | 2 |
| 8-bit DAC Reference | 1 |
| PWM / CCP | 2 PWM, 2 CCP |
| Communication | 1x EUSART (LIN), 1x I2C/SPI, 1x SPI |
| I/O Pins | 25 (approx., industrial-port mapping) |
| Temperature Indicator | Yes (internal) |
| Operating Temperature | -40 C to +85 C (industrial, I grade) |
| Package | 28-pin UQFN (4x4 mm) with exposed pad |
| Mounting Type | Surface Mount (Tape & Reel) |
| RoHS Status | Compliant |
PIC16F15355T-I/MV Pin Configuration
| Pin 1 | RA5 — Bidirectional I/O with ADC and interrupt-on-change capability |
| Pin 2 | RA4 — Bidirectional I/O with ADC capability |
| Pin 3 | RA3 — Bidirectional I/O / MCLR input (reset) |
| Pin 4 | RA2 — Bidirectional I/O with ADC and DAC reference |
| Pin 5 | RA1 — Bidirectional I/O with ADC and comparator input |
| Pin 6 | RA0 — Bidirectional I/O with ADC and ICSPDAT |
| Pin 7 | VSS — Ground reference |
| Pin 8 | RA7 — Bidirectional I/O with oscillator output |
| Pin 9 | RA6 — Bidirectional I/O with oscillator input |
| Pin 10 | RC0 — Bidirectional I/O with EUSART TX |
| Pin 11 | RC1 — Bidirectional I/O with EUSART RX/CK |
| Pin 12 | RC2 — Bidirectional I/O with comparator and PWM output |
| Pin 13 | RC3 — Bidirectional I/O with SCL/I2C and SPI clock |
| Pin 14 | RC4 — Bidirectional I/O with SDA/I2C and SPI data |
| Pin 15 | RC5 — Bidirectional I/O with SPI chip select |
| Pin 16 | RC6 — Bidirectional I/O |
| Pin 17 | RC7 — Bidirectional I/O |
| Pin 18 | VSS — Ground reference (second pin) |
| Pin 19 | VDD — Positive supply voltage 2.3V-5.5V |
| Pin 20 | RB0 — Bidirectional I/O with interrupt-on-change |
| Pin 21 | RB1 — Bidirectional I/O with interrupt-on-change |
| Pin 22 | RB2 — Bidirectional I/O with interrupt-on-change |
| Pin 23 | RB3 — Bidirectional I/O with interrupt-on-change |
| Pin 24 | RB4 — Bidirectional I/O with interrupt-on-change |
| Pin 25 | RB5 — Bidirectional I/O with interrupt-on-change |
| Pin 26 | RB6 — Bidirectional I/O with ICSPCLK |
| Pin 27 | RB7 — Bidirectional I/O with ADC and EUSART TX alt |
| Pin 28 | VSS_PAD — Exposed pad / thermal pad (must be soldered to ground) |
Typical Applications
PIC16F15355T-I/MV is suitable for 7 applications: IoT Sensor Nodes, Battery-Powered HVAC Thermostats, Automotive Body and Lighting Modules, Small Industrial Control Boards, Consumer Appliance Control, Low-Power Wireless Sensor Hubs, Portable Medical Monitoring Devices.
IoT Sensor Nodes
The PIC16F15355T-I/MV fits IoT sensor nodes because of its PIC16 XLP sleep current around 50 nA, 2.3V-5.5V VDD range that accepts 2xAA cells directly, and 14 KB Flash for protocol stacks like LoRaWAN or BLE beaconing. The 10-bit ADC with up to 24 channels scans multiple analog sensors while the integrated temperature indicator reduces external component count. Combined with the 28-UQFN 4x4 mm footprint, the part enables coin-cell powered nodes measuring temperature, humidity, and motion without external op-amps or references.
Recommended
Battery-Powered HVAC Thermostats
HVAC thermostat control benefits from PIC16F15355T-I/MV's 14 KB Flash for PID/fuzzy logic temperature code, 1 KB SRAM for scheduling variables, and the 10-bit ADC scanning thermistor inputs. The two PWM peripherals drive TRIAC-based heater/cooler elements, while the EUSART with LIN capability interfaces to remote HVAC controllers. XLP technology enables 2-5 year battery life on 2xAA cells, and the -40 to +85 C industrial rating covers mechanical room installations.
Recommended
Automotive Body and Lighting Modules
Automotive body and lighting controllers use PIC16F15355T-I/MV for LIN-bus communication via EUSART, PWM channels for LED dimming, and 14 KB Flash for sequencing logic. The PIC16F15355T-E/SSVAO automotive variant (-40 to +125 C) is preferred for underhood modules, but the I/MV industrial part suits cabin lighting and ambient controls. Hardware CIPs like CLC and CWG offload flicker-free LED driving to peripherals, freeing CPU cycles for diagnostics.
Recommended
Small Industrial Control Boards
Industrial control boards use PIC16F15355T-I/MV for relay drivers, sensor conditioning, and Modbus-RTU communication. The 32 MHz CPU handles scan loops under 1 ms while two comparators implement windowed current sensing for motor protection. The 28-UQFN package survives vibration when properly potted, and the 14 KB Flash stores Modbus mapping tables plus ladder-logic interpreters. Industrial -40 to +85 C rating covers most factory environments.
Recommended
Consumer Appliance Control
Consumer appliances like coffee machines, blenders, and rice cookers benefit from PIC16F15355T-I/MV's small 28-UQFN footprint that fits inside cramped enclosures, the 10-bit ADC for temperature and weight sensing, and 14 KB Flash for user-interface state machines. The integrated temperature indicator eliminates a thermistor in entry-level appliances, while two PWMs drive heating elements or variable-speed motors at frequencies above audible range for silent operation.
Recommended
Low-Power Wireless Sensor Hubs
Wireless sensor hubs use PIC16F15355T-I/MV as a low-power MCU companion to sub-GHz or BLE modules, waking the radio only when sensor thresholds trigger. The PIC16 XLP sleep current around 50 nA plus 32 MHz active CPU lets the hub spend most of its life in deep sleep, waking in microseconds to scan sensors and forward packets. The 1 KB SRAM buffers transmit frames before radio initialization completes, avoiding packet loss at low duty cycles.
Recommended
Portable Medical Monitoring Devices
Portable medical monitoring devices use PIC16F15355T-I/MV for pulse-oximetry or single-lead ECG front ends, where the integrated temperature indicator provides ambient compensation for optical sensors. The 10-bit ADC with 24 channels samples reflectance photoplethysmography waveforms while two comparators implement heart-rate threshold detection in hardware. The 14 KB Flash stores pulse-detection algorithms and BLE beaconing routines, and the XLP sleep current extends battery life across multi-day patient sessions.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F15355T-I/MV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F15355-I/MV | PIC16F15355T-E/SSVAO | PIC16F15354T-I/MV | PIC16F15345T-I/MV |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-UQFN (4x4 mm) - MV | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same |
| Flash Memory | 14 KB | 14 KB | 14 KB | 7 KB (-50%) | 14 KB |
| SRAM | 1 KB | 1 KB | 1 KB | 512 bytes (-50%) | 1 KB |
| Max CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 2.3V-5.5V | 2.3V-5.5V | 2.3V-5.5V | 2.3V-5.5V | 2.3V-5.5V |
| Temperature Range | -40 to +85 C (Industrial) | -40 to +85 C | -40 to +125 C (Extended) | -40 to +85 C | -40 to +85 C |
| Tape & Reel Packaging | Yes (T suffix) | No (tube/tray) | Yes (T suffix) | Yes (T suffix) | Yes (T suffix) |
| Automotive Grade | No (industrial) | No | Yes (VAO suffix) | No | No |
Key Differentiators
- Smallest footprint in PIC16F15355 family at 28-UQFN 4x4 mm (vs PIC16F15355-I/SO (28-SOIC))
- Industrial temperature with tape-and-reel for SMT production (vs PIC16F15355-I/MV (no T&R, tube))
- Full 14 KB Flash vs reduced 7 KB Flash on PIC16F15354 (vs PIC16F15354T-I/MV)
- PIC XLP sleep current around 50 nA for multi-year battery life (vs PIC16F15345T-I/MV)
Design Notes
The 28-UQFN (4x4 mm) exposed pad must be soldered to a top-layer copper pour stitched with at least 8 thermal vias (0.3 mm drill, 0.5 mm pitch) to the inner ground plane. This provides both thermal dissipation and a stable ground reference for the RF-sensitive ADC channels. Without the thermal via array, junction-to-ambient thermal resistance can exceed 80 C/W, causing thermal shutdown during sustained 32 MHz operation at high ambient temperatures.
Decouple VDD (pin 19) with a 100 nF X7R ceramic capacitor placed within 2 mm of the pin, plus a bulk 1-10 uF aluminum-polymer or tantalum capacitor if the source impedance is more than 25 mm away. The MCLR/VPP pin (pin 3) requires a 10-47 kOhm pull-up to VDD unless the system deliberately wants a no-external-reset configuration. AVdd and AVss isolation is not provided on this part, so a clean VDD is critical for ADC accuracy.
Keep the ICSP signals (ICSPDAT on RA0, ICSPCLK on RB6) accessible on production PCBs via a 2x3 0.1 inch header or test pads for in-field firmware updates. Avoid routing high-frequency signals like PWM outputs or oscillator traces over the ADC analog pins (RA0-RA5) without a ground trace between them, to minimize digital-to-analog crosstalk. For 4-wire SPI with multiple slaves, dedicate one I/O as chip-select to avoid bus contention during reset.
Do not exceed 5.5V on VDD even briefly - the PIC16F15355 lacks the internal clamping of larger PIC24/dsPIC parts and absolute maximum ratings on VDD are 6.5V for transient spikes only. The internal 32 MHz HF oscillator requires the OSCCON register to be configured before switching from the default 1 MHz INTOSC; failure to wait for the OST (oscillator start-up timer) bit causes firmware hang on first instruction. XLP sleep modes require explicit context save in interrupts because the CPU state is not retained across deep sleep.
Compliance Information
PIC16F15355T-I/MV is industrial temperature -40 to +85 C; choose PIC16F15355T-E/SSVAO for AEC-Q100 automotive. RoHS and lead-free per Microchip product page; MSL rating not in web data and marked [DATA_NEEDED].