PIC16F15355T-I/MV - 8-bit MCU, 14KB Flash, 32MHz, 28-UQFN | Microchip
MPN: PIC16F15355T-I/MV ✓ פעילPIC16F15355T-I/MV סקירה
An 8-bit PIC microcontroller (MCU) is a single-chip computer built around an 8-bit RISC core. The PIC16F15355 belongs to the PIC® XLP™ (eXtreme Low Power) 16F family within the broader 8-bit PIC microcontroller hierarchy (8-bit PIC -> PIC microcontroller -> microcontroller -> embedded processor -> semiconductor). It executes one instruction per clock cycle, integrates non-volatile Flash program memory plus SRAM, and combines digital I/O, analog, communication, and timing peripherals into one IC to replace discrete logic in embedded designs.
Key features include 14KB (8K x 14) Flash program memory, 1KB SRAM, 256 bytes of EEPROM, a 32MHz internal oscillator, four 8-bit timers plus two CCP and two PWM peripherals, a 10-bit ADC with up to 24 channels, two comparators, an 8-bit DAC reference, I2C/SPI/EUSART (LIN-capable) communication, and an integrated temperature indicator. The XLP sleep current of roughly 50 nA and active current in the microampere range make the device well-suited to battery-powered designs.
The architecture uses Microchip's enhanced mid-range 8-bit core with a 14-bit instruction word, hardware multiplier, single-cycle hardware stack, and Memory Access Partition (MAP) for code protection. CIP blocks such as Configurable Logic Cells (CLC), Complementary Waveform Generator (CWG), Numerically Controlled Oscillator (NCO), and Zero-Cross Detect (ZCD) allow functions normally handled in firmware to be offloaded to hardware, reducing code size and latency.
Typical applications include IoT sensor nodes, low-power wireless sensor hubs, HVAC thermostat controls, battery-powered consumer appliances, automotive body and lighting modules, and small industrial control boards. The wide 2.3V-5.5V VDD range lets the part operate directly from 2xAA cells, a 3.3V regulated rail, or a 5V USB rail.
For PCB layout, expose the UQFN-28 thermal pad to a top-layer copper pour stitched with at least 8 thermal vias to the ground plane for thermal dissipation and ground reference. Decouple VDD with a 100 nF X7R ceramic placed within 2 mm of the pin and add a bulk 1-10 uF tantalum or aluminum-polymer capacitor if the source is more than 25 mm away. The MCLR pin must be pulled up to VDD through 10-47 kOhm unless no external reset is desired.
This page synthesizes tape-and-reel pricing, same-family PIC drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
חלופות תחליף ישיר עבור PIC16F15355T-I/MV — אותו מארז, תואם פין-לפין. חלקים במארז שונה הדורשים עיבוד מחדש של ה-PCB אינם נכללים.
וריאנטים בסדרה זו
דגמים מאותה סדרה התואמים Drop-in עם PIC16F15355T-I/MV (אותו גורם צורה וטביעת רגל) — שונים ב ADC, Package, Core Architecture, DAC, Program Memory (Flash).
PIC16F15355-I/MV
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC16F15355T-E/SSVAO
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC16F15354T-I/MV
✅ Drop-In ⚠️ מפרטים לא מאומתיםצור קשר לקבלת מחיר
הצג גיליון נתונים ←PIC16F15345T-I/MV
✅ Drop-In ⚠️ מפרטים לא מאומתים📋 חלופה להתייחסות (לא בקטלוג)
PIC16F15355T-I/MV דירוגים מרביים ומאפיינים חשמליים
| Core Architecture | 8-bit PIC16 enhanced mid-range |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| SRAM | 1 KB |
| EEPROM | 256 bytes |
| Maximum CPU Speed | 32 MHz |
| Operating Voltage (VDD) | 2.3 V to 5.5 V |
| ADC | 10-bit, up to 24 channels |
| Comparators | 2 |
| 8-bit DAC Reference | 1 |
| PWM / CCP | 2 PWM, 2 CCP |
| Communication | 1x EUSART (LIN), 1x I2C/SPI, 1x SPI |
| I/O Pins | 25 (approx., industrial-port mapping) |
| Temperature Indicator | Yes (internal) |
| טמפרטורת פעולה | -40 C to +85 C (industrial, I grade) |
| מארז | 28-pin UQFN (4x4 mm) with exposed pad |
| סוג הרכבה | Surface Mount (Tape & Reel) |
| סטטוס RoHS | Compliant |
תצורת פינים של PIC16F15355T-I/MV
| פין 1 | RA5 — Bidirectional I/O with ADC and interrupt-on-change capability |
| פין 2 | RA4 — Bidirectional I/O with ADC capability |
| פין 3 | RA3 — Bidirectional I/O / MCLR input (reset) |
| פין 4 | RA2 — Bidirectional I/O with ADC and DAC reference |
| פין 5 | RA1 — Bidirectional I/O with ADC and comparator input |
| פין 6 | RA0 — Bidirectional I/O with ADC and ICSPDAT |
| פין 7 | VSS — Ground reference |
| פין 8 | RA7 — Bidirectional I/O with oscillator output |
| פין 9 | RA6 — Bidirectional I/O with oscillator input |
| פין 10 | RC0 — Bidirectional I/O with EUSART TX |
| פין 11 | RC1 — Bidirectional I/O with EUSART RX/CK |
| פין 12 | RC2 — Bidirectional I/O with comparator and PWM output |
| פין 13 | RC3 — Bidirectional I/O with SCL/I2C and SPI clock |
| פין 14 | RC4 — Bidirectional I/O with SDA/I2C and SPI data |
| פין 15 | RC5 — Bidirectional I/O with SPI chip select |
| פין 16 | RC6 — Bidirectional I/O |
| פין 17 | RC7 — Bidirectional I/O |
| פין 18 | VSS — Ground reference (second pin) |
| פין 19 | VDD — Positive supply voltage 2.3V-5.5V |
| פין 20 | RB0 — Bidirectional I/O with interrupt-on-change |
| פין 21 | RB1 — Bidirectional I/O with interrupt-on-change |
| פין 22 | RB2 — Bidirectional I/O with interrupt-on-change |
| פין 23 | RB3 — Bidirectional I/O with interrupt-on-change |
| פין 24 | RB4 — Bidirectional I/O with interrupt-on-change |
| פין 25 | RB5 — Bidirectional I/O with interrupt-on-change |
| פין 26 | RB6 — Bidirectional I/O with ICSPCLK |
| פין 27 | RB7 — Bidirectional I/O with ADC and EUSART TX alt |
| פין 28 | VSS_PAD — Exposed pad / thermal pad (must be soldered to ground) |
יישומים טיפוסיים
PIC16F15355T-I/MV מתאים עבור 7 יישוםs: IoT Sensor Nodes, Battery-Powered HVAC Thermostats, Automotive Body and Lighting Modules, Small Industrial Control Boards, Consumer Appliance Control, Low-Power Wireless Sensor Hubs, Portable Medical Monitoring Devices.
IoT Sensor Nodes
The PIC16F15355T-I/MV fits IoT sensor nodes because of its PIC16 XLP sleep current around 50 nA, 2.3V-5.5V VDD range that accepts 2xAA cells directly, and 14 KB Flash for protocol stacks like LoRaWAN or BLE beaconing. The 10-bit ADC with up to 24 channels scans multiple analog sensors while the integrated temperature indicator reduces external component count. Combined with the 28-UQFN 4x4 mm footprint, the part enables coin-cell powered nodes measuring temperature, humidity, and motion without external op-amps or references.
מומלץ
Battery-Powered HVAC Thermostats
HVAC thermostat control benefits from PIC16F15355T-I/MV's 14 KB Flash for PID/fuzzy logic temperature code, 1 KB SRAM for scheduling variables, and the 10-bit ADC scanning thermistor inputs. The two PWM peripherals drive TRIAC-based heater/cooler elements, while the EUSART with LIN capability interfaces to remote HVAC controllers. XLP technology enables 2-5 year battery life on 2xAA cells, and the -40 to +85 C industrial rating covers mechanical room installations.
מומלץ
Automotive Body and Lighting Modules
Automotive body and lighting controllers use PIC16F15355T-I/MV for LIN-bus communication via EUSART, PWM channels for LED dimming, and 14 KB Flash for sequencing logic. The PIC16F15355T-E/SSVAO automotive variant (-40 to +125 C) is preferred for underhood modules, but the I/MV industrial part suits cabin lighting and ambient controls. Hardware CIPs like CLC and CWG offload flicker-free LED driving to peripherals, freeing CPU cycles for diagnostics.
מומלץ
Small Industrial Control Boards
Industrial control boards use PIC16F15355T-I/MV for relay drivers, sensor conditioning, and Modbus-RTU communication. The 32 MHz CPU handles scan loops under 1 ms while two comparators implement windowed current sensing for motor protection. The 28-UQFN package survives vibration when properly potted, and the 14 KB Flash stores Modbus mapping tables plus ladder-logic interpreters. Industrial -40 to +85 C rating covers most factory environments.
מומלץ
Consumer Appliance Control
Consumer appliances like coffee machines, blenders, and rice cookers benefit from PIC16F15355T-I/MV's small 28-UQFN footprint that fits inside cramped enclosures, the 10-bit ADC for temperature and weight sensing, and 14 KB Flash for user-interface state machines. The integrated temperature indicator eliminates a thermistor in entry-level appliances, while two PWMs drive heating elements or variable-speed motors at frequencies above audible range for silent operation.
מומלץ
Low-Power Wireless Sensor Hubs
Wireless sensor hubs use PIC16F15355T-I/MV as a low-power MCU companion to sub-GHz or BLE modules, waking the radio only when sensor thresholds trigger. The PIC16 XLP sleep current around 50 nA plus 32 MHz active CPU lets the hub spend most of its life in deep sleep, waking in microseconds to scan sensors and forward packets. The 1 KB SRAM buffers transmit frames before radio initialization completes, avoiding packet loss at low duty cycles.
מומלץ
Portable Medical Monitoring Devices
Portable medical monitoring devices use PIC16F15355T-I/MV for pulse-oximetry or single-lead ECG front ends, where the integrated temperature indicator provides ambient compensation for optical sensors. The 10-bit ADC with 24 channels samples reflectance photoplethysmography waveforms while two comparators implement heart-rate threshold detection in hardware. The 14 KB Flash stores pulse-detection algorithms and BLE beaconing routines, and the XLP sleep current extends battery life across multi-day patient sessions.
מומלץ
סיכום מוצרים מומלצים
נתוני עזר הנדסיים עבור PIC16F15355T-I/MV — השוואה, הנחיות תכנון ומידע על תאימות.
מדריך בחירה
השוואה עם חלופות
| פרמטר | מוצר זה | PIC16F15355-I/MV | PIC16F15355T-E/SSVAO | PIC16F15354T-I/MV | PIC16F15345T-I/MV |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-UQFN (4x4 mm) - MV | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same |
| Flash Memory | 14 KB | 14 KB | 14 KB | 7 KB (-50%) | 14 KB |
| SRAM | 1 KB | 1 KB | 1 KB | 512 bytes (-50%) | 1 KB |
| Max CPU Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Operating Voltage | 2.3V-5.5V | 2.3V-5.5V | 2.3V-5.5V | 2.3V-5.5V | 2.3V-5.5V |
| Temperature Range | -40 to +85 C (Industrial) | -40 to +85 C | -40 to +125 C (Extended) | -40 to +85 C | -40 to +85 C |
| Tape & Reel Packaging | Yes (T suffix) | No (tube/tray) | Yes (T suffix) | Yes (T suffix) | Yes (T suffix) |
| Automotive Grade | No (industrial) | No | Yes (VAO suffix) | No | No |
מבדילים עיקריים
- Smallest footprint in PIC16F15355 family at 28-UQFN 4x4 mm (לעומתPIC16F15355-I/SO (28-SOIC))
- Industrial temperature with tape-and-reel for SMT production (לעומתPIC16F15355-I/MV (no T&R, tube))
- Full 14 KB Flash vs reduced 7 KB Flash on PIC16F15354 (לעומתPIC16F15354T-I/MV)
- PIC XLP sleep current around 50 nA for multi-year battery life (לעומתPIC16F15345T-I/MV)
הערות תכנון
The 28-UQFN (4x4 mm) exposed pad must be soldered to a top-layer copper pour stitched with at least 8 thermal vias (0.3 mm drill, 0.5 mm pitch) to the inner ground plane. This provides both thermal dissipation and a stable ground reference for the RF-sensitive ADC channels. Without the thermal via array, junction-to-ambient thermal resistance can exceed 80 C/W, causing thermal shutdown during sustained 32 MHz operation at high ambient temperatures.
Decouple VDD (pin 19) with a 100 nF X7R ceramic capacitor placed within 2 mm of the pin, plus a bulk 1-10 uF aluminum-polymer or tantalum capacitor if the source impedance is more than 25 mm away. The MCLR/VPP pin (pin 3) requires a 10-47 kOhm pull-up to VDD unless the system deliberately wants a no-external-reset configuration. AVdd and AVss isolation is not provided on this part, so a clean VDD is critical for ADC accuracy.
Keep the ICSP signals (ICSPDAT on RA0, ICSPCLK on RB6) accessible on production PCBs via a 2x3 0.1 inch header or test pads for in-field firmware updates. Avoid routing high-frequency signals like PWM outputs or oscillator traces over the ADC analog pins (RA0-RA5) without a ground trace between them, to minimize digital-to-analog crosstalk. For 4-wire SPI with multiple slaves, dedicate one I/O as chip-select to avoid bus contention during reset.
Do not exceed 5.5V on VDD even briefly - the PIC16F15355 lacks the internal clamping of larger PIC24/dsPIC parts and absolute maximum ratings on VDD are 6.5V for transient spikes only. The internal 32 MHz HF oscillator requires the OSCCON register to be configured before switching from the default 1 MHz INTOSC; failure to wait for the OST (oscillator start-up timer) bit causes firmware hang on first instruction. XLP sleep modes require explicit context save in interrupts because the CPU state is not retained across deep sleep.
מידע על תאימות
PIC16F15355T-I/MV is industrial temperature -40 to +85 C; choose PIC16F15355T-E/SSVAO for AEC-Q100 automotive. RoHS and lead-free per Microchip product page; MSL rating not in web data and marked [DATA_NEEDED].
