PIC16F15354T-I/MV - 8-bit MCU 32MHz 7KB Flash 28-UQFN | Microchip
MPN: PIC16F15354T-I/MV β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.42 | $1.42 |
| 10 | $1.28 | $12.80 |
| 100 | $1.1 | $110.00 |
| 500 | $0.96 | $480.00 |
| 1,000 | $0.84 | $840.00 |
| 3,300 | $0.74 | $2,442.00 |
PIC16F15354T-I/MV Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU, memory (Flash/RAM/EEPROM), and peripherals onto one die. The PIC16F15354T-I/MV belongs to the PIC16 family β an 8-bit Harvard-architecture MCU widely used for general-purpose and low-power embedded control. The product hierarchy is: PIC16F15354T-I/MV β PIC16F15354 β PIC16F153XX family β PIC16 family β PIC MCU β 8-bit microcontroller β embedded computing β semiconductor IC.
Key features include four 10-bit PWM channels with complementary waveform generation, a 10-bit ADC with computation, a 5-bit DAC, comparators, two EUSART (configurable for SPI/I2C/UART), and Core Independent Peripherals (CIPs) that offload the CPU. The XLP variant typically delivers nano-Watt sleep currents. The PIC16F15354T-I/MV operates from 2.3V to 5.5V across -40C to +85C industrial temperature range, making it well suited for battery-powered and always-on applications.
The 28-UQFN (4x4 mm) exposed-pad package maximizes board density while the exposed die pad improves thermal dissipation. The device supports in-circuit serial programming (ICSP) via two pins, enabling firmware updates after PCB assembly. Programmable code protection, brown-out reset (BOR), and a watchdog timer with its own on-chip RC oscillator contribute to reliable field operation.
Typical applications include consumer electronics, IoT sensor nodes, low-power wireless HMI controllers, LED lighting controllers, and battery-powered instrumentation. The combination of eXtreme Low-Power sleep modes and CIPs makes it well matched to event-driven designs that spend most of their time in deep sleep and wake periodically to service interrupts.
When designing, plan for adequate decoupling (100 nF + 1 Β΅F near VDD) and ensure the exposed pad is soldered to a sufficiently large ground copper pour for thermal relief. Choose the '-I' industrial temperature grade when the product will see 0C to 70C commercial environments that may experience slight thermal excursions, or the '-E' extended grade for harsher conditions.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for PIC16F15354T-I/MV β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16F15354T-I/MV (same form factor and footprint) β differing in ADC, Package, EEPROM, Mounting Type, Program Memory (Flash).
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Request AlternativesPIC16F15354T-I/MV Maximum Ratings & Electrical Characteristics
| Core Architecture | 8-bit PIC RISC |
| Family | PIC16F153XX (XLP) |
| CPU Speed | 32 MHz |
| Program Memory (Flash) | 7 KB (4K x 14 words) |
| SRAM | 512 B |
| EEPROM | 256 B |
| Operating Voltage | 2.3 V to 5.5 V |
| Temperature Grade | Industrial -40C to +85C (I) |
| Package | 28-UQFN (4x4 mm) with Exposed Pad |
| Mounting Type | Surface Mount |
| ADC | 10-bit with Computation |
| DAC | 5-bit |
| PWM Channels | 4 x 10-bit |
| Communication | 2x EUSART (SPI/I2C/UART) |
| Core Independent Peripherals | Yes (CIPs) |
| eXtreme Low-Power (XLP) | Yes |
| ICSP Programming | Yes (2-wire) |
PIC16F15354T-I/MV Pin Configuration
| Pin 1 | RA5 β Bidirectional I/O / ADC input / DAC reference |
| Pin 2 | RA4 β Bidirectional I/O / ADC input |
| Pin 3 | RA3 β Bidirectional I/O / MCLR (programming input) |
| Pin 4 | RA2 β Bidirectional I/O / ADC input |
| Pin 5 | RA1 β Bidirectional I/O / ADC input / DAC output |
| Pin 6 | RA0 β Bidirectional I/O / ADC input |
| Pin 7 | VSS β Ground reference |
| Pin 8 | RA7 β Bidirectional I/O / oscillator |
| Pin 9 | RA6 β Bidirectional I/O / oscillator |
| Pin 10 | RC0 β Bidirectional I/O / PWM / EUSART |
| Pin 11 | RC1 β Bidirectional I/O / PWM / EUSART |
| Pin 12 | RC2 β Bidirectional I/O / PWM / EUSART |
| Pin 13 | RC3 β Bidirectional I/O / PWM / EUSART |
| Pin 14 | RC4 β Bidirectional I/O / EUSART |
| Pin 15 | RC5 β Bidirectional I/O / EUSART |
| Pin 16 | RC6 β Bidirectional I/O / EUSART |
| Pin 17 | RC7 β Bidirectional I/O / EUSART |
| Pin 18 | VSS β Ground (additional UQFN pad) |
| Pin 19 | VDD β Positive supply 2.3 V to 5.5 V |
| Pin 20 | RB0 β Bidirectional I/O / PWM |
| Pin 21 | RB1 β Bidirectional I/O / PWM |
| Pin 22 | RB2 β Bidirectional I/O / PWM |
| Pin 23 | RB3 β Bidirectional I/O / PWM |
| Pin 24 | RB4 β Bidirectional I/O |
| Pin 25 | RB5 β Bidirectional I/O |
| Pin 26 | RB6 β Bidirectional I/O / ICSP clock |
| Pin 27 | RB7 β Bidirectional I/O / ICSP data |
| Pin 28 | VDD β Positive supply (additional UQFN pad) |
Typical Applications
PIC16F15354T-I/MV is suitable for 6 applications: IoT Battery-Powered Sensor Nodes, Consumer Appliance User Interfaces, LED Lighting and Strip Controllers, Automotive Interior Accessories (sub-system), Industrial Sensor Transmitters, Low-Power HMI / Touch Keypads.
IoT Battery-Powered Sensor Nodes
The PIC16F15354T-I/MV's eXtreme Low-Power (XLP) sleep currents in the nanoamp range and 32 MHz active CPU make it ideal for coin-cell or 2xAA powered IoT sensor nodes. Its 10-bit ADC with computation performs automatic oversampling and averaging in hardware without waking the CPU, cutting average current draw. Designers typically run the MCU in deep sleep with the ADC triggered by a windowed watch, wake briefly to transmit via a connected radio module over EUSART SPI, then return to sleep - extending battery life to years on a single CR2032.
Recommended
Consumer Appliance User Interfaces
With four 10-bit PWM channels and hardware CWG, the PIC16F15354T-I/MV directly drives LED indicators, status rings, and small buzzers in washing machines, microwaves, and air purifiers. The 2.3-5.5 V VDD accepts unregulated 5 V rails from wall adapters, and the 5-bit DAC drives analog trim pots or contrast voltages. The CIPs (Core Independent Peripherals) handle debounce and sequencing autonomously, leaving CPU headroom for the appliance's main control loop.
Recommended
LED Lighting and Strip Controllers
The PIC16F15354T-I/MV's four PWMs plus CWG produce multi-channel LED driver waveforms for RGBW strips, architectural lighting, and tunable-white fixtures. The 32 MHz core drives WS2812B-style addressable LEDs via SPI-bridged bit-bang at refresh rates well above 30 Hz, while the 10-bit ADC reads photodiode feedback for ambient-light closed-loop control. The compact 28-UQFN 4x4 mm package fits inside slim aluminum LED profiles.
Recommended
Automotive Interior Accessories (sub-system)
In sub-system automotive accessories like ambient lighting controllers, USB charging hubs, and rear-seat entertainment keypads, the PIC16F15354T-I/MV delivers the right mix of PWM, ADC, and LIN/EUSART connectivity. While not AEC-Q100 qualified itself, the part's industrial -40C to +85C range handles cabin environments. The PIC16F15354T-E/MV variant extends to -40C to +125C for harsher under-hood or door-module sub-tasks.
Recommended
Industrial Sensor Transmitters
The PIC16F15354T-I/MV integrates a 10-bit ADC, 5-bit DAC, and two EUSARTs - a complete front-end for 4-20 mA loop-powered sensor transmitters. The XLP sleep modes keep total quiescent current below 3.6 mA even with the ADC continuously sampling, meeting loop-power budgets. Hardware CRC over EUSART protects data integrity in noisy industrial environments.
Recommended
Low-Power HMI / Touch Keypads
For touch-button keypads, slider controls, and small HMI displays, the PIC16F15354T-I/MV's CIPs include a hardware Capacitive Voltage Divider (CVD) that scans capacitive touch keys without CPU intervention. The 10-bit ADC and 5-bit DAC allow direct driving of LCD bias voltages, while two EUSARTs handle simultaneous host UART and I2C sensor traffic. The 28-UQFN 4x4 mm footprint fits beneath a touch-pad PCB stack.
Recommended
Recommended Products Summary
Engineering reference data for PIC16F15354T-I/MV β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F15344T-I/MV | PIC16F15355T-I/MV | PIC16F15354-I/MV | PIC16F15354T-E/MV | PIC16F15354-E/SS |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-UQFN (4x4 mm) | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | 28-UQFN (4x4 mm) - same | SSOP-28 - different |
| Flash | 7 KB | 3.5 KB | 14 KB | 7 KB | 7 KB | 7 KB |
| SRAM | 512 B | 256 B | 1024 B | 512 B | 512 B | 512 B |
| Operating Voltage | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V |
| Temperature Grade | -40C to +85C (I) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +125C (E) | -40C to +125C (E) |
| Packaging Form | Tape & Reel | Tape & Reel | Tape & Reel | Tube | Tape & Reel | Tube (SSOP-28) |
Key Differentiators
- Compact 4x4 mm UQFN with same peripheral set as larger packages (vs PIC16F15354-E/SS (SSOP-28))
- Higher Flash and RAM headroom versus PIC16F15344T-I/MV (vs PIC16F15344T-I/MV)
- eXtreme Low-Power (XLP) compared to non-XLP PIC16 predecessors (vs PIC16F1516T-I/MV (older non-XLP family))
Design Notes
The PIC16F15354T-I/MV supports deep sleep currents below 1 Β΅A when peripherals are disabled and the ADC is off. For lowest-power operation, place the MCU in Sleep mode between events and use peripheral interrupts (IOC, ADC, timer overflow) to wake it. Estimated: at 3.3 V VDD with the ADC and brown-out reset disabled, the device draws roughly 30 nA in Sleep - check exact figures in the PIC16F15354 family electrical characteristics section. Always enable the Low-Voltage Programming (LVP) fuse off unless LVP is required, as it adds a continuous ~5 Β΅A Iq.
The 28-UQFN (4x4 mm) package has an exposed thermal pad on the underside that MUST be soldered to a PCB ground pour to provide mechanical anchoring and thermal relief. Without a soldered pad, the part can delaminate under thermal stress. Place a 100 nF decoupling capacitor and a 1 Β΅F bulk capacitor within 2 mm of the VDD pin, with the 100 nF closest. Tie all VSS pins to a continuous ground plane via short traces or vias to minimize ground bounce.
Route the ICSP clock (RB6) and ICSP data (RB7) lines away from high-frequency switching signals; ICSP programming can fail in noisy environments if these traces pick up significant noise. For applications with PWMs that drive high-current loads (motors, LEDs), keep the PWM traces short and place a small RC snubber near the FET gate if ringing exceeds 10% of the gate drive. Use star-ground topology if mixing analog and digital sections.
Two common PIC16F15354T-I/MV design pitfalls: (1) forgetting to disable the Watchdog Timer (WDTCON register) before Sleep or it will wake the part unexpectedly every few ms; (2) failing to configure the PPS (Peripheral Pin Select) registers when remapping UART/SPI/I2C to non-default pins - the part defaults to specific pins and won't operate on remapped pins without PPS configuration. Always burn the configuration bits (CONFIG1-CONFIG5) explicitly and check the BOR threshold matches your supply.
Compliance Information
RoHS and REACH compliance per Microchip product page. Industrial temperature grade -40C to +85C; not AEC-Q100 qualified - choose Q1/AEC-Q100 variants for automotive applications.
