Microchip Technology

PIC16F18857-I/ML - 56KB Flash 8-bit MCU, 32MHz, XLP | Microchip

MPN: PIC16F18857-I/ML βœ“ Active
In Stock Ships in 1-3 business days
1.8 V to 5.5 V Vdss 28-QFN (6x6 mm) Package 32 MHz Speed 56 KB (32K x 14 words) Memory
From $1.8 USD / Unit
MOQ: 1 |
Price updated: 2026-09-20
Volume Pricing
Qty Unit Price Extended
1 $2.45 $2.45
10 $2.3 $23.00
100 $2.1 $210.00
500 $1.95 $975.00
1,000 $1.8 $1,800.00
ℹ️ All prices are in USD

PIC16F18857-I/ML Overview

The Microchip Technology PIC16F18857-I/ML is an 8-bit RISC PIC microcontroller built around the PIC16 core with a maximum operating frequency of 32MHz and 56KB (32K x 14 words) of on-chip Flash program memory. Housed in a 28-pin QFN (6x6 mm) package with the -I (Industrial) temperature grade, the device targets general-purpose and battery-powered applications thanks to its eXtreme Low Power (XLP) technology and Functional Safety (FuSa) support. The PIC16F18857-I/ML features 4KB SRAM, 256 bytes of EEPROM, 10-bit Analog-to-Digital Converter (ADC), Core Independent Peripherals (CIPs) including CRC/SCAN and HLT (Hardware Limit Timer), and rich communication peripherals such as EUSART, I2C, and SPI.

An 8-bit MCU in the Microchip PIC16 family uses a RISC Harvard-architecture core, providing deterministic instruction execution (most instructions in one instruction cycle) for predictable real-time behavior. The "16" in the prefix denotes the mid-range PIC16 architecture, which sits between the baseline PIC10/12/16 families and the high-performance PIC18/PIC24 families. These MCUs are widely used in industrial automation, IoT sensor nodes, automotive body electronics, and consumer devices where low power, robust peripherals, and easy in-circuit programmability outweigh the need for high clock speed.

Key differentiating specifications include 56KB Flash, 4KB SRAM, 256 bytes EEPROM, an integrated temperature indicator, multiple operating modes (Run, Doze, Idle, Sleep), and a 32MHz internal oscillator with PLL options. The device supports up to 25 analog channels (ADC), 36 digital I/O pins, and integrates 5 CCP (Capture/Compare/PWM) modules plus 3 ECCP (Enhanced CCP) for motor or power-conversion control. Functional safety features include a Windowed Watchdog Timer (WWDT), hardware CRC/SCAN, and a built-in self-test BIST that allows the device to satisfy IEC 60730 Class B safety requirements for home appliances.

Architecturally the PIC16F18857-I/ML uses a 14-bit instruction word Flash-based mid-range core with a 32MHz oscillator driving four clock phases per instruction cycle. The CIP blocks - Configurable Logic Cells (CLC), Numerically Controlled Oscillator (NCO), and Complementary Waveform Generator (CWG) - execute tasks without CPU intervention, freeing the core for application logic. Voltage regulator flexibility from 1.8V to 5.5V, with brown-out-reset (BOR) and low-power sleep modes, lets designers run from a single Li-ion coin cell or a regulated 3.3V supply.

Typical applications include IoT sensor nodes, battery-powered remote controls, home appliances with IEC 60730 Class B safety requirements, automotive body and interior modules, sensor interface boards, and low-cost motor-control designs. Pairing the device with an MCP2210 USB-to-SPI bridge or an external EEPROM is straightforward because the peripheral pin-select (PPS) remapping feature lets designers route digital functions to any available I/O.

When designing with this device, ensure that the Watchdog Timer window and BOR thresholds are configured in software using the __EEPROM bytes reserved in the configuration area, and confirm the QFN exposed pad is soldered to the ground plane for thermal dissipation. Using the MPLAB X IDE with the XC8 compiler in free/professional mode is recommended for full CIP-aware code generation and IEC 60730 safety library support.

This page synthesizes distributor inventory, real-time pricing across qty tiers, pin-compatible drop-in alternatives in the PIC16F1885X/7X family, and practical design notes that go beyond the manufacturer datasheet.

Drop-in alternatives for PIC16F18857-I/ML β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC16F18857-I/ML (same form factor and footprint) β€” differing in ADC, Package, Program Memory (Flash), Core Architecture, Timers.

Microchip Technology
ADC: 10-bit ADC2 with Computation
Package: QFN-28 (6x6 mm)
Program Memory (Flash): 7 KB (4K x 14 words)
Microchip Technology
ADC: 10-bit ADC2 with computation, up to 24 channels
Package: 28-pin QFN (ML) 6x6 mm with exposed pad
Program Memory (Flash): 14 KB (8K x 14 words)
Microchip Technology
ADC: 10-bit, up to 24 channels (ADC2 with Computation)
Package: 28-QFN (ML) 6x6 mm with Exposed Pad
Program Memory (Flash): 14 KB (8K x 14 words)
Microchip Technology
ADC: 10-bit ADC with Computation (ADC2)
Package: 44-pin QFN (8x8 mm)
Program Memory (Flash): 14 KB (8K x 14)

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

PIC16F18855-I/ML

βœ… Drop-In
Microchip Technology
πŸ“¦ 28-QFN (6x6)
8-bit PIC enhanced mid-range (14-bit instruction word) Β· PIC16(L)F1885X/7X Β· 32 MHz Β· 14 KB (8K x 14 words) Β· 1 KB Β· 256 B Β· 2.5 V to 5.5 V Β· 1.8 V to 3.6 V

βœ“ In Stock

$1.38 / Unit

View Datasheet β†’

PIC16F18856-I/ML

βœ… Drop-In
πŸ“¦ 28-QFN (6x6)
same 28-QFN footprint; 28KB Flash / 2KB SRAM vs 56KB / 4KB (same memory as '55)

πŸ“‹ Reference alternative (not in catalog)

PIC16F18857-E/ML

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 28-QFN (6x6)
same die/package; Extended temperature range -40C to +125C vs Industrial -40C to +85C

πŸ“‹ Reference alternative (not in catalog)

PIC16F18857T-I/ML

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
Microchip Technology
πŸ“¦ 28-QFN (6x6)
PIC16 8-bit Enhanced Mid-Range Β· 56 KB (32K x 14 words) Β· 4 KB Β· 256 B Β· 32 MHz Β· 28-QFN (6x6 mm) Β· 1.8 V to 5.5 V Β· -40 C to +85 C (Industrial)

βœ“ In Stock

$1.88 / Unit

View Datasheet β†’

PIC16LF18857-I/ML

βœ… Drop-In ⚠️ 参数待ιͺŒθ―
πŸ“¦ 28-QFN (6x6)
same 28-QFN footprint; L (low-voltage) variant with extended XLP sleep current at low VDD; identical Flash/SRAM and core

πŸ“‹ Reference alternative (not in catalog)

PIC16F18857-I/ML Maximum Ratings & Electrical Characteristics

Core Architecture PIC16 8-bit RISC
Program Memory (Flash) 56 KB (32K x 14 words)
Data SRAM 4 KB
Data EEPROM 256 B
Maximum CPU Frequency 32 MHz
Operating Voltage Range 1.8 V to 5.5 V
Package 28-QFN (6x6 mm)
Pin Count 28
Temperature Grade -40C to +85C (Industrial, 'I' suffix)
Digital I/O Pins Up to 36 (function-share limited)
ADC 10-bit, multiple channels
Communication EUSART, I2C, SPI
PWM / CCP 5 CCP + 3 ECCP
Timers Multiple 8/16-bit timers
Watchdog Windowed Watchdog Timer (WWDT)
Low-Power Technology eXtreme Low Power (XLP)
Functional Safety FuSa support; IEC 60730 Class B
Cipher Type Advanced (per family description)
Mounting Type Surface Mount
RoHS Compliant

PIC16F18857-I/ML Pin Configuration

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 RA0/AN0 β€” Analog input 0 / GPIO
Pin 2 RA1/AN1 β€” Analog input 1 / GPIO
Pin 3 RA2/AN2 β€” Analog input 2 / GPIO
Pin 4 RA3/AN3 β€” Analog input 3 / GPIO
Pin 5 RA4 β€” GPIO / Timer0 clock
Pin 6 RA5 β€” GPIO / I/O
Pin 7 VSS β€” Ground
Pin 8 RA7/OSC1 β€” GPIO / Crystal oscillator input
Pin 9 RA6/OSC2 β€” GPIO / Crystal oscillator output
Pin 10 RC0 β€” GPIO / I/O
Pin 11 RC1 β€” GPIO / I/O
Pin 12 RC2 β€” GPIO / I/O
Pin 13 RC3 β€” GPIO / I/O
Pin 14 RC4 β€” GPIO / I/O
Pin 15 RC5 β€” GPIO / I/O
Pin 16 RC6 β€” GPIO / I/O
Pin 17 RC7 β€” GPIO / I/O
Pin 18 RB7 β€” GPIO / I/O
Pin 19 RB6 β€” GPIO / I/O
Pin 20 RB5 β€” GPIO / I/O
Pin 21 RB4 β€” GPIO / I/O
Pin 22 RB3 β€” GPIO / I/O
Pin 23 RB2 β€” GPIO / I/O
Pin 24 RB1 β€” GPIO / I/O
Pin 25 RB0 β€” GPIO / I/O
Pin 26 VDD β€” Positive supply voltage
Pin 27 RE3 β€” GPIO / I/O
Pin 28 EP β€” Exposed thermal pad (ground)

Typical Applications

PIC16F18857-I/ML is suitable for 6 applications: IoT Sensor Node (Battery-Powered), Home Appliance with IEC 60730 Class B, Automotive Body Electronics Interior Module, Remote Control and Human-Interface Device, Low-Voltage Sensor Interface Board, Low-Cost BLDC Motor Control.

🧩

IoT Sensor Node (Battery-Powered)

The PIC16F18857-I/ML suits IoT sensor nodes because its XLP technology drops the active current into the low-microampere range during sleep, giving multi-year coin-cell life. The 32MHz PIC16 core executes sensor reads and radio handshakes in well under 1ms, while 4KB of SRAM buffers 10-bit ADC readings between transmissions. Designers wire it to a sub-GHz radio like the MRF89XA or a BLE module via EUSART/SPI, and the WWDT plus IEC 60730 library keep the firmware safe during unattended operation.

🏭

Home Appliance with IEC 60730 Class B

The PIC16F18857-I/ML carries Microchip's Functional Safety (FuSa) feature set, including the Windowed Watchdog Timer, hardware CRC/SCAN, and the IEC 60730 safety library, which lets household appliance designers certify washers, dryers, and dishwashers for Class B safety. The 56KB Flash holds the entire safety library plus application code without expensive external memory, while 4KB SRAM manages state machines and user-interface animations. The CWG and ECCP modules directly drive TRIAC-control logic for heating elements and motor switching.

πŸš—

Automotive Body Electronics Interior Module

The PIC16F18857-I/ML (Industrial grade) handles interior lighting dimming, HVAC control panels, and mirror-position memory because its Core Independent Peripherals (CLC, NCO, CWG) offload bit-banged control logic to hardware, freeing the core for communication. The 36 I/O pins comfortably support RGB-LED arrays, keyscan matrices, and LIN-spy via the EUSART, while 10-bit ADC reading potentiometers and thermistors keeps BOM small. Pair the design with a TJA1027 LIN transceiver for chassis-side communication.

πŸ“±

Remote Control and Human-Interface Device

The PIC16F18857-I/ML drives low-cost RF remote controls, IR transmitters, and consumer HIDs because its XLP sleep current and Brown-Out Reset make coin-cell operation reliable. The on-chip CIP blocks - Complementary Waveform Generator (CWG) for IR, Configurable Logic Cells (CLC) for keystroke debouncing - let designers shrink code size and stay within the 56KB Flash budget. The 256-byte EEPROM stores pairing codes and user preferences across battery swaps, while the 4KB SRAM handles display frame buffers for OLED modules.

πŸŽ₯

Low-Voltage Sensor Interface Board

The PIC16F18857-I/ML powers sensor interface boards running from a regulated 1.8V-3.3V rail, taking advantage of its full 1.8V-5.5V supply range and ultra-low sleep current. Designers use the 10-bit ADC to read multiple sensors simultaneously via DMA-equivalent hardware accumulation, freeing the core for averaging and threshold detection. The EUSART/SCK/I2C serve as bridges to digital sensors (BME280, MPU-6050), while 256 bytes of EEPROM stores calibration constants. The 28-QFN footprint drops into ultra-compact boards.

🏭

Low-Cost BLDC Motor Control

The PIC16F18857-I/ML's three Enhanced CCP (ECCP) modules with programmable dead-band and auto-shutdown directly drive BLDC motor half-bridges without an external gate driver. The 32MHz clock provides the 31.25 kHz PWM at 8-bit resolution needed for quiet commutation, while the 10-bit ADC samples back-EMF for sensorless operation. Designers save BOM cost by eliminating dedicated BLDC controllers and using the CWG for complementary high/low-side drive with hardware fault handling.

Recommended Products Summary

MRF89XA Sub-GHz transceiver (SPI interface) Used in: IoT Sensor Node (Battery-Powered) MCP1700 3.3V LDO regulator Used in: IoT Sensor Node (Battery-Powered) PIC16F18855-I/ML Microchip Technology Used in: IoT Sensor Node (Battery-Powered) MCP2210 USB-SPI bridge (debug/PC interface) Used in: Home Appliance with IEC 60730 Class B PIC16F18856-I/ML Cost-optimized variant for sub-appliances Used in: Home Appliance with IEC 60730 Class B TJA1027 LIN transceiver Used in: Automotive Body Electronics Interior Module MCP2517FD CAN FD controller (if upgrading) Used in: Automotive Body Electronics Interior Module PIC16F18857-E/ML Extended-temp variant for under-hood Used in: Automotive Body Electronics Interior Module, Low-Cost BLDC Motor Control PIC16F18854-I/ML Microchip Technology Used in: Remote Control and Human-Interface Device MCP73831 Li-ion charge controller (for rechargeable) Used in: Remote Control and Human-Interface Device ATSAM4S8CA-CFN Microchip Technology Used in: Remote Control and Human-Interface Device BME280 Humidity/Temp/Pressure sensor (I2C) Used in: Low-Voltage Sensor Interface Board PIC16F18455-I/SP Microchip Technology Used in: Low-Voltage Sensor Interface Board MCP8024 3-phase BLDC driver Used in: Low-Cost BLDC Motor Control DSPIC30F2010-30I/MM Site MPN - upgrade path for sensorless FOC Used in: Low-Cost BLDC Motor Control
What is the program memory size of PIC16F18857-I/ML?
The PIC16F18857-I/ML provides 56 KB of on-chip Flash program memory organized as 32K x 14-bit words. According to the Microchip PIC16(L)F1885X/7X datasheet, this size supports applications requiring substantial look-up tables, communication protocol stacks, or IEC 60730 safety libraries. Use the free MPLAB XC8 compiler in PRO mode to take full advantage of the 56KB code space.
What is the maximum operating frequency of PIC16F18857-I/ML?
The PIC16F18857-I/ML runs at a maximum CPU clock of 32MHz, derived from the internal oscillator or an external HF crystal. According to the Microchip datasheet, instructions at 32MHz execute in 125ns (FOSC/4), giving a 16 MIPS instruction throughput. This speed is sufficient for polling sensor loops at sub-millisecond intervals and supporting standard baud rates up to 1 Mbaud on the EUSART.
What is the difference between PIC16F18857-I/ML and PIC16F18855-I/ML?
The PIC16F18857-I/ML and PIC16F18855-I/ML are pin-to-pin compatible in the 28-QFN package, but the '57 variant ships with 56KB Flash / 4KB SRAM, while the '55 variant offers a smaller memory map. Both share the same 32MHz core, ADC, CIP block, and XLP technology. Choose the '57 for code-rich applications and drop down to the '55 when BOM cost is sensitive.
Where to download the PIC16F18857-I/ML datasheet PDF?
The official PIC16F18857-I/ML datasheet PDF is hosted on Microchip's product page at https://www.microchip.com/en-us/product/PIC16F18857, with the family datasheet DS40001782B covering PIC16(L)F1885X/7X. Distributor pages (DigiKey, Mouser) also expose the datasheet PDF link directly. The family datasheet covers memory maps, ADC timing, CIP configuration registers, and IEC 60730 Class B safety library examples.
Does PIC16F18857-I/ML support IEC 60730 Class B functional safety?
Yes, the PIC16F18857-I/ML is a Functional Safety (FuSa) capable MCU and supports IEC 60730 Class B safety requirements for household appliances. According to the Microchip datasheet, this is enabled by the built-in Windowed Watchdog Timer (WWDT), hardware CRC/SCAN, and the dedicated Functional Safety ready firmware library. The hardware CIP blocks execute periodic self-tests independently of the CPU, making Class B certification tractable for washing machines, ovens, and dishwashers.
What is the operating voltage range of PIC16F18857-I/ML?
The PIC16F18857-I/ML operates over a 1.8V to 5.5V supply voltage range, supporting both 3.3V and 5V system designs. According to the datasheet, an internal voltage regulator with selectable brown-out-reset (BOR) thresholds protects the Flash and SRAM during voltage dips. Battery-powered applications can run directly from a single 3V CR2032 coin cell with XLP active.
What is the operating temperature range of PIC16F18857-I/ML?
The PIC16F18857-I/ML (Industrial grade) operates from -40C to +85C, matching standard industrial operating profiles for outdoor enclosures, factory sensor nodes, and consumer appliances. According to the Microchip datasheet ordering information, 'I' is the industrial grade; 'E' is the extended grade up to +125C if your application needs automotive-style thermal headroom.
How much SRAM and EEPROM does PIC16F18857-I/ML have?
The PIC16F18857-I/ML integrates 4 KB of data SRAM and 256 bytes of data EEPROM. The 4KB SRAM is sufficient for TCP/IP lite stacks, sensor fusion buffers, or display frame buffers, while the 256B EEPROM supports user-configurable settings, calibration constants, or counters that survive power cycling. According to the datasheet, EEPROM endurance is rated at 100K write cycles minimum.
Can PIC16F18857-I/ML be used for battery-powered IoT sensor nodes?
Yes, the PIC16F18857-I/ML is engineered for battery-powered IoT with XLP technology that drops the active current below the datasheet figure when peripherals are switched off. According to the Microchip datasheet, sleep current with WWDT disabled is in the low-microampere range, supporting multi-year battery life on a single coin cell when the MCU wakes briefly to read sensors every few seconds.
Is there a drop-in replacement for PIC16F18857-I/ML?
Yes, the best drop-in replacements in the same 28-QFN footprint include the PIC16F18855-I/ML (smaller Flash/SRAM) and PIC16F18856-I/ML (mid-density Flash). All three share the 28-QFN pinout, the same 32MHz PIC16 core, and identical CIP blocks, so they can be swapped without PCB rework. For pin-to-pin replacement always verify the peripheral pin-select (PPS) mapping tables in the datasheet.
Which tools and compiler are recommended for PIC16F18857-I/ML?
Microchip recommends the free MPLAB X IDE with the MPLAB XC8 compiler for PIC16F18857-I/ML development. According to the Microchip datasheet and product page, MPLAB Code Configurator (MCC) generates initialization code for the ADC, CIP blocks (CLC, NCO, CWG), and IEC 60730 safety library. The PICkit 5 or MPLAB Snap in-circuit debugger handles programming and live debug.
What is the A/D converter specification of PIC16F18857-I/ML?
The PIC16F18857-I/ML integrates a 10-bit Analog-to-Digital Converter with multiple input channels (the exact channel count depends on package pin sharing). According to the datasheet, the ADC supports hardware accumulation, threshold interrupts, and on-the-fly channel scanning. Threshold-triggered ADC interrupts free the CPU from polling loops, reducing overall active time and current consumption.
PIC16F18857-I/ML vs PIC16F18856-I/ML - which has more memory?
The PIC16F18857-I/ML ships with 56 KB Flash / 4 KB SRAM, while the PIC16F18856-I/ML provides 28 KB Flash / 2 KB SRAM in the same 28-QFN package. Both share the PIC16 core, CIP blocks, XLP technology, and peripheral set, so the '57 is the better choice when code size or SRAM demand grows. They are drop-in compatible in the 28-QFN footprint, allowing memory upsize without PCB changes.
How many PWM channels does PIC16F18857-I/ML have?
The PIC16F18857-I/ML includes 5 standard CCP (Capture/Compare/PWM) modules and 3 ECCP (Enhanced CCP) modules for advanced PWM, half-bridge, and full-bridge motor-control topologies. According to the datasheet, the ECCP integrates programmable dead-band delay and auto-shutdown on fault events, directly supporting brushless DC motor and high-current LED driving applications.
Where to buy PIC16F18857-I/ML at the best price?
The PIC16F18857-I/ML is in stock at distributors including DigiKey, Mouser, LCSC, and Octopart with pricing starting around USD 2.45 per unit at qty 1 (as of 2026-09-21). For best lead time on small qty (under 100) buy from authorized distributors DigiKey and Mouser; for volume orders LCSC and direct Microchip channels deliver lower per-unit costs. Always compare distributor stock using Octopart to ensure the part is not obsoleted.
Is the PIC16F18857-I/ML RoHS compliant?
Yes, the PIC16F18857-I/ML is RoHS compliant per the manufacturer ordering information. According to Microchip's product environmental compliance data, the 28-QFN (ML) package is lead-free (Pb-free) and uses a matte-tin finish compatible with reflow profiles per IPC/JEDEC J-STD-020. The part also meets REACH and standard conflict-minerals reporting requirements.
What is the lead time when ordering PIC16F18857-I/ML in production quantities?
Distributor DigiKey and Mouser typically ship PIC16F18857-I/ML in stock with same-day fulfillment for orders up to 5,000 units. According to distributor inventory listings as of 2026-09-21, lead time on 10,000+ unit reels is 8-12 weeks when sourced through Microchip franchised channels. Plan ahead by reserving volume via Microchip's direct sales team if you need guaranteed multi-year supply.
Hey Google, can PIC16F18855-I/ML replace PIC16F18857-I/ML directly?
Yes, the PIC16F18855-I/ML is a drop-in replacement for PIC16F18857-I/ML in the same 28-QFN package as long as the compiled firmware fits in the smaller Flash/SRAM space. According to the Microchip family datasheet, both parts share the same peripheral set, PPS mapping, and core, so the firmware can be rebuilt for either MPN by changing the device header. For a memory-upsize path without PCB rework, the '55 is the lower-cost variant and the '57 is the higher-memory variant.

Engineering reference data for PIC16F18857-I/ML β€” comparison, design guidance, and compliance information.

Selection Guide

Choose PIC16F18857-I/ML when your design needs the maximum Flash and SRAM in the 28-QFN PIC16F1885X/7X family and IEC 60730 Class B safety support. If code size is small (under 24KB) and BOM cost is critical, drop down to PIC16F18855-I/ML or PIC16F18856-I/ML which are pin-compatible in the same 28-QFN footprint. For under-hood automotive applications reaching +125C, order the PIC16F18857-E/ML extended-grade variant instead. The PIC16LF18857-I/ML low-voltage variant is the better choice if your system runs on a single coin cell below 2V where the 'F variant's lower XLP sleep current matters. All five options share the same 28-QFN (6x6) footprint, so you can mix and match across product SKUs without PCB rework.

Comparison with Alternatives

Parameter This Product PIC16F18855-I/ML PIC16F18856-I/ML PIC16LF18857-I/ML PIC16F18857-E/ML
Package 28-QFN (6x6) 28-QFN (6x6) - same 28-QFN (6x6) - same 28-QFN (6x6) - same 28-QFN (6x6) - same
Brand Microchip Technology Microchip Technology - same Microchip Technology - same Microchip Technology - same Microchip Technology - same
Flash Memory 56 KB 28 KB (-50%) 28 KB (-50%) 56 KB (0%) 56 KB (0%)
Data SRAM 4 KB 2 KB (-50%) 2 KB (-50%) 4 KB (0%) 4 KB (0%)
Data EEPROM 256 B 256 B (0%) 256 B (0%) 256 B (0%) 256 B (0%)
Maximum CPU Frequency 32 MHz 32 MHz (0%) 32 MHz (0%) 32 MHz (0%) 32 MHz (0%)
Operating Voltage 1.8 V to 5.5 V 1.8 V to 5.5 V (0%) 1.8 V to 5.5 V (0%) 1.8 V to 5.5 V (0%) 1.8 V to 5.5 V (0%)
Temperature Grade -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +85C (Industrial) -40C to +125C (Extended)
Unit Price (qty 1, USD) 2.45 ~2.10 ~2.20 ~2.50 ~2.80
Low-Power Technology XLP XLP (same) XLP (same) XLP enhanced (lower voltage) XLP (same)

Key Differentiators

  • Highest memory density in the 28-QFN PIC16F1885X/7X family (vs PIC16F18855-I/ML)
  • Functional Safety (FuSa) capable for IEC 60730 Class B (vs PIC16F18856-I/ML)
  • Industrial temperature grade availability at modest premium (vs PIC16F18857-E/ML)

Design Notes

The 28-QFN (6x6) package dissipates modest heat because the exposed thermal pad (pin EP) is the only path to the die. Solder the EP to a continuous ground copper pour at least 100 mm^2 on the top layer and stitch with thermal vias to the inner ground plane. For a thermally demanding application such as driving multiple LED strings at 20mA per pin, derate total GPIO current to 8 mA across the device to keep the junction under 90C in a 65C enclosure.

Place a 100nF ceramic decoupling capacitor within 5 mm of the VDD pin and a 1uF bulk capacitor within 25 mm to suppress transients during BOR events. Keep the crystal traces (OSC1/OSC2) short and symmetric, surrounded by a ground guard; for higher-clock stability add a 4.7k-ohm parallel resistor across the crystal. Reserve the MCLR pin with a 10k pull-up and a 100nF capacitor to ground for in-circuit debugger support.

Do not leave unused I/O pins floating - configure them as outputs low or inputs with the internal weak pull-up enabled, otherwise they oscillate and increase supply current by hundreds of uA, negating the XLP benefit. Also remember that PPS-mapped outputs (peripheral pin select) must be unlocked via the PPSLOCK register before any change, and any locked mapping persists through reset until cleared.

For ultra-low sleep current (<1 uA typical), disable the ADC, disable unused peripherals individually, set all unused I/O to logic low, and select the internal LFINTOSC as the sleep clock source. According to the Microchip datasheet, leaving the ADC active in sleep can waste 200 uA, so power it down with ADC.CGOE = 0 before issuing the sleep instruction. Many application notes from Microchip show sub-uA standby designs using these techniques.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per Microchip product ordering information. Industrial temperature grade ('I' suffix). For AEC-Q100 qualified automotive parts, consult the PIC16F18857-E (extended) variant or the dedicated PIC16F18xxx automotive family.

Data verified on: 2026-09-21 β€” data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology PIC16F18857 PIC16F18857-I/ML PIC16F18855-I/ML PIC16F18856-I/ML PIC16LF18857-I/ML PIC16F18857-E/ML PIC16F18857T-I/ML PIC16 (RISC) 8-bit microcontroller PIC16 family PIC16F1885X/7X Flash memory SRAM EEPROM QFN-28 RoHS REACH IEC 60730 Class B Functional Safety (FuSa) eXtreme Low Power (XLP) Core Independent Peripherals (CIP) Enhanced CCP (ECCP) 10-bit ADC EUSART I2C SPI CIP-Configurable Logic Cell (CLC) Complementary Waveform Generator (CWG) Numerically Controlled Oscillator (NCO) Windowed Watchdog Timer (WWDT) CRC/SCAN MPLAB X IDE MPLAB XC8 Industrial temperature grade MCP2210 MCP1700 BME280
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6
Delivered
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