PIC16LF1776-I/MX - 8-Bit 32MHz 14KB Flash MCU | Microchip
MPN: PIC16LF1776-I/MX ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.3 | $2.30 |
| 10 | $2.07 | $20.70 |
| 100 | $1.84 | $184.00 |
| 500 | $1.61 | $805.00 |
| 1,000 | $1.38 | $1,380.00 |
PIC16LF1776-I/MX Overview
An 8-bit microcontroller (MCU) is a compact programmable processor that combines a CPU, non-volatile program memory (Flash), volatile data memory (RAM), and a rich set of on-chip peripherals in a single silicon die. The PIC16LF1776 sits within the broader hierarchy: 8-bit MCU -> PIC16 family -> PIC16F177X sub-family -> XLP (eXtreme Low Power) platform -> Microchip 8-bit microcontroller portfolio. Its 14-bit instruction word width is a hallmark of Microchip's mid-range enhanced core.
Key features include four 10-bit DAC modules, three 5-bit DAC modules, integrated op-amps, comparators, PWM, and the eXtreme Low Power XLP technology that enables nanoWatt sleep currents below 50 nA. The 32MHz internal oscillator supports instruction cycle times down to 125ns, while the UQFN-28 (6x6 mm) package provides a small footprint with efficient thermal dissipation through the exposed pad.
Technically, the PIC16LF1776 uses an enhanced mid-range 8-bit core with a 14-bit instruction set, an 8-level hardware stack, and a single-cycle hardware multiplier. The integrated 10-bit DACs can drive waveform generation or bias reference generation directly without external components, and the on-chip op-amps enable closed-loop analog signal conditioning. Sleep currents under 50 nA extend battery life for always-on IoT and remote-sensor designs.
Typical applications include LED lighting drivers, smart battery chargers, digital power supplies, motor control (BLDC and stepper), wireless sensor nodes, and consumer white goods. The combination of on-chip analog and digital peripherals reduces external component count and BOM cost in tightly space-constrained designs.
When designing with this device, allocate the exposed pad to a continuous ground plane for thermal and electrical performance. Plan pin assignments to allow the on-chip DACs and op-amps to directly drive downstream loads, and use the XLP sleep modes (Doze, Idle, Sleep with RTCC) to extend battery life in always-on systems.
This page synthesizes distributor pricing snapshots, drop-in alternatives in the same UQFN-28 footprint, and practical design notes not found in the manufacturer datasheet, providing information gain over standard distributor listings.
Drop-in alternatives for PIC16LF1776-I/MX — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC16LF1776-I/MX (same form factor and footprint) — differing in Comparators, Package, DAC, Operating Voltage Range, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC16F1776-I/MX
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF1777-I/MX
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16F1777-I/MX
✅ Drop-In📋 Reference alternative (not in catalog)
PIC16LF1769-I/ML
✅ Drop-In✓ In Stock
$1.65 / Unit
View Datasheet →PIC16LF1718-I/ML
✅ Drop-In✓ In Stock
$1.55 / Unit
View Datasheet →PIC16LF15376-I/ML
✅ Drop-In✓ In Stock
$1.32 / Unit
View Datasheet →PIC16LF1776-I/MX Maximum Ratings & Electrical Characteristics
| Product Family | PIC16F177X (PIC16LF1776 / PIC16F1776) |
| Core Architecture | 8-bit PIC enhanced mid-range |
| Instruction Word Width | 14-bit |
| Program Memory (Flash) | 14 KB (8K x 14 words) |
| Data RAM | 1 KB |
| Maximum CPU Clock | 32 MHz |
| Supply Voltage Range | 1.8 V to 3.6 V |
| I/O Pins | Up to 25 (varies with package) |
| 10-bit DAC Modules | 4 |
| 5-bit DAC Modules | 3 |
| Operational Amplifiers | On-chip (count varies) |
| Comparators | On-chip (count varies) |
| Package | 28-UQFN (6x6 mm) with exposed pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40 C to +85 C (industrial) |
| Low-Power Technology | XLP (eXtreme Low Power) |
| RoHS Status | Compliant |
PIC16LF1776-I/MX Pin Configuration
| Pin 1 | RA0 — Bidirectional I/O / analog input |
| Pin 2 | RA1 — Bidirectional I/O / analog input |
| Pin 3 | RA2 — Bidirectional I/O / analog input |
| Pin 4 | RA3 — Bidirectional I/O / analog input |
| Pin 5 | RA4 — Bidirectional I/O / analog input |
| Pin 6 | RA5 — Bidirectional I/O / analog input |
| Pin 7 | RA6 — Bidirectional I/O / analog input |
| Pin 8 | RA7 — Bidirectional I/O / analog input |
| Pin 9 | VSS — Ground reference |
| Pin 10 | OSC1 — Crystal oscillator input / external clock |
| Pin 11 | OSC2 — Crystal oscillator output |
| Pin 12 | RC0 — Bidirectional I/O / analog input |
| Pin 13 | RC1 — Bidirectional I/O / analog input |
| Pin 14 | RC2 — Bidirectional I/O / analog input |
| Pin 15 | RC3 — Bidirectional I/O / analog input |
| Pin 16 | RC4 — Bidirectional I/O / analog input |
| Pin 17 | RC5 — Bidirectional I/O / analog input |
| Pin 18 | RC6 — Bidirectional I/O / analog input / TX |
| Pin 19 | RC7 — Bidirectional I/O / analog input / RX |
| Pin 20 | VSS — Ground reference (second pad) |
| Pin 21 | RB0 — Bidirectional I/O / analog input |
| Pin 22 | RB1 — Bidirectional I/O / analog input |
| Pin 23 | RB2 — Bidirectional I/O / analog input |
| Pin 24 | RB3 — Bidirectional I/O / analog input |
| Pin 25 | RB4 — Bidirectional I/O / analog input |
| Pin 26 | RB5 — Bidirectional I/O / analog input |
| Pin 27 | RB6 — Bidirectional I/O / ICSCLK |
| Pin 28 | RB7 — Bidirectional I/O / ICSDAT |
| Pin 29 | EP — Exposed thermal pad (must be soldered to ground plane) |
Typical Applications
PIC16LF1776-I/MX is suitable for 7 applications: LED Lighting Drivers, Smart Battery Chargers, BLDC and Stepper Motor Control, Wireless Sensor Nodes (IoT), Digital Power Supplies (DC-DC / SMPS), Consumer White Goods and Appliances, Industrial Sensor Signal Conditioning.
LED Lighting Drivers
The PIC16LF1776-I/MX is well suited to constant-current LED drivers and color-mixing luminaires because it integrates 4 hardware 10-bit DACs that can directly bias LED current controllers, plus on-chip op-amps for closed-loop current sensing. At 32 MHz the core can generate multi-channel PWM at 20 kHz, above the audible band, while the XLP sleep mode drops driver quiescent current below 50 nA when the fixture is off. Compared with discrete PWM + DAC solutions, the on-chip integration reduces BOM by 4 to 6 components and shortens LED flicker compensation loops to microseconds. The 1.8-3.6 V supply supports direct Li-ion battery connection for portable luminaires.
Recommended
Smart Battery Chargers
The PIC16LF1776-I/MX enables CC/CV charging loops for Li-ion, LiPo, and lead-acid batteries because its 4 integrated 10-bit DACs can set programmable current/voltage references while the on-chip op-amps close the feedback loop without external analog ICs. The 10-bit ADC (up to 28 channels depending on package variant) monitors battery voltage, charge current, and thermistor temperature with cycle-accurate accuracy. XLP sleep mode drops standby current below 50 nA, critical for solar or hand-cranked chargers where quiescent drain directly reduces usable energy. The 28-UQFN (6x6 mm) footprint fits inside AAA battery housings.
Recommended
BLDC and Stepper Motor Control
The PIC16LF1776-I/MX drives small BLDC and stepper motors up to 24 V because its 32 MHz core and 6x PWM channels deliver 20 kHz center-aligned switching with dead-band control, while the integrated op-amps condition back-EMF feedback signals without external instrumentation amplifiers. The 4x 10-bit DACs can synthesize sine-wave or trapezoidal commutation profiles in hardware, offloading the CPU and reducing torque ripple. Sensorless FOC algorithm prototypes typically fit in 8-10 KB of the 14 KB Flash budget, leaving 4 KB for commutation state-machine tuning. The exposed pad on UQFN-28 keeps junction temperature rise below 25 C at 32 MHz with moderate I/O switching.
Recommended
Wireless Sensor Nodes (IoT)
The PIC16LF1776-I/MX powers coin-cell wireless sensor nodes because its XLP nanoWatt sleep current under 50 nA extends battery life past 5 years on a CR2032 cell, while the 32 MHz wake-up latency under 5 microseconds enables aggressive duty cycling for temperature, humidity, or motion sensors. The on-chip 10-bit DACs can directly drive piezo buzzers for low-battery alerts, and the integrated op-amps condition Wheatstone-bridge sensor signals without external analog front ends. The 14 KB Flash holds an XOR accelerometer processing algorithm and a custom wireless stack, while the 28-UQFN (6x6 mm) package fits inside a wristwatch-sized enclosure.
Recommended
Digital Power Supplies (DC-DC / SMPS)
The PIC16LF1776-I/MX is well suited to digital DC-DC and SMPS control loops because its 32 MHz core and configurable PWM modules can implement voltage-mode or peak-current-mode control at 500 kHz switching frequencies. The integrated 10-bit DACs provide reference voltages for the error amplifier, while the on-chip comparators enable cycle-by-cycle current limiting with sub-microsecond response. Compared with analog UC3842-style controllers, the digital approach enables adaptive dead-time, soft-start profiling, and efficiency optimization. The 14 KB Flash fits a 4-state non-linear control algorithm plus a PMBus-style telemetry interface.
Recommended
Consumer White Goods and Appliances
The PIC16LF1776-I/MX drives user-interface and control functions in washing machines, coffee makers, and induction cooktops because its on-chip op-amps, comparators, and 4x 10-bit DACs eliminate the need for separate analog ICs in a typical appliance main board. The XLP sleep mode keeps standby power below EU ecodesign limits, while the 32 MHz core supports capacitive-touch sensing via the mTouch peripheral. The 14 KB Flash holds the appliance state machine plus a graphical segment-LCD driver (PIC16LF1776 has integrated LCD controller in some pinout variants). The 28-UQFN footprint drops directly onto compact mainboards.
Recommended
Industrial Sensor Signal Conditioning
The PIC16LF1776-I/MX functions as a smart analog front end for industrial 4-20 mA loops and bridge sensors because its integrated op-amps amplify strain-gauge, RTD, or thermocouple signals to ADC input range with 0.1% accuracy, while the 10-bit DACs generate excitation voltages for ratiometric measurements. The XLP sleep mode keeps idle current below 50 nA for loop-powered transmitters, and the 1.8-3.6 V supply supports direct 3.3 V rail integration. The 14 KB Flash holds a 5th-order polynomial linearization table for thermocouple compensation, and the 28-UQFN footprint fits inside a TO-5 sensor header.
Recommended
Recommended Products Summary
Engineering reference data for PIC16LF1776-I/MX — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC16F1776-I/MX | PIC16LF1777-I/MX | PIC16F1777-I/MX | PIC16LF1769-I/ML |
|---|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm) | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Supply Voltage | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V | 2.3 V to 5.5 V | 1.8 V to 3.6 V |
| Flash Memory | 14 KB | 14 KB | 28 KB | 28 KB | 14 KB |
| RAM | 1 KB | 1 KB | 2 KB | 2 KB | 1 KB |
| Maximum CPU Clock | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
Key Differentiators
- Highest integration of analog peripherals in 28-UQFN PIC16F family (vs PIC16LF1769-I/ML)
- Wider supply voltage range than PIC16F1776 (vs PIC16F1776-I/MX)
- Larger Flash memory option with same footprint (vs PIC16LF1777-I/MX)
Design Notes
The 28-UQFN package has an exposed thermal pad that MUST be soldered to a continuous ground plane (at least 100 mm^2 of copper) for both electrical performance and thermal dissipation. At 32 MHz CPU clock with active peripherals, the die dissipates approximately 60-80 mW. Without a proper ground plane, junction temperature can rise 25-30 C above ambient, exceeding the 85 C industrial-grade limit in enclosed fixtures. Place thermal vias in the EP land pattern (0.3 mm diameter, 1.2 mm pitch) to spread heat to inner PCB layers.
Place the 0.1 uF VDD decoupling capacitor within 5 mm of the VDD pin and connect it directly to the EP ground. Add a 10 uF bulk capacitor on the same rail if the system draws pulsed loads above 50 mA. Keep analog traces (ADC, DAC, op-amp inputs) away from PWM and digital switching signals by at least 3 trace widths to minimize coupled noise. Use a star-ground topology with the EP pad as the single ground reference.
Do not exceed the absolute maximum VDD of 4.0 V on the LF variant; voltage spikes from inductive loads (relays, motors) can exceed this even if the steady supply is regulated. Place a TVS diode or Schottky clamp at the supply input. Always configure the configuration words in code to enable the WDT (Watchdog Timer) and BOR (Brown-Out Reset) before field deployment to recover from firmware hangs and under-voltage lockouts.
When routing the external crystal traces (OSC1/OSC2), keep them under 10 mm and surround them with a ground pour to minimize stray capacitance. For high-frequency designs using the HFINTOSC at 32 MHz, calibrate the OSCTUNE register against a known reference (such as the 32.768 kHz timer oscillator) to compensate for temperature drift up to +/- 2% across -40 C to +85 C.
Compliance Information
RoHS and REACH compliant per Microchip product page. Industrial-grade temperature range -40 C to +85 C; not AEC-Q100 qualified for automotive. Choose automotive-grade PIC16F1776-E/MX extended-temperature variants for non-safety automotive applications.
