Microchip Technology

PIC16LF1718-I/ML - 8-Bit 32MHz XLP MCU 28KB Flash | Microchip

MPN: PIC16LF1718-I/ML ✓ Active
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1.8 V to 3.6 V Vdss 28-pin QFN (6x6 mm), designation ML Package 32 MHz Speed 28 KB (16K x 14 words) Memory
From $1.55 USD / Unit
MOQ: 1 |
Price updated: 2026-09-23
Volume Pricing
Qty Unit Price Extended
1 $2.66 $2.66
10 $2.45 $24.50
100 $2.1 $210.00
500 $1.82 $910.00
1,000 $1.55 $1,550.00
ℹ️ All prices are in USD

PIC16LF1718-I/ML Overview

The Microchip Technology PIC16LF1718-I/ML is an 8-bit PIC microcontroller in the PIC16F/LF171x family with 28KB Flash, 2KB RAM and a 32MHz internal oscillator, supplied in a 28-pin QFN (6x6 mm) package designated ML. It combines Intelligent Analog peripherals such as on-chip operational amplifiers, a 10-bit ADC with computation, Core Independent Peripherals (CLC, COG, NCO, Zero Cross Detect) and Peripheral Pin Select for flexible I/O mapping, while the eXtreme Low Power (XLP) architecture targets battery-friendly designs. The LF voltage range operates down to 1.8V, making the part a candidate for portable, sensor and energy-harvesting products where quiescent current and analog integration matter.

A microcontroller (MCU) is a single-chip computer that integrates a CPU, non-volatile program memory (typically Flash), working RAM, and configurable peripherals such as ADC, timers, communication interfaces and I/O. The 8-bit class trades raw clock speed for deterministic behavior, low cost and very low active/standby power, and PIC microcontrollers use a RISC-based Harvard architecture that executes most instructions in one clock cycle. Within Microchip's portfolio, the PIC16F171x family sits in the mid-range (PIC16) tier with enhanced analog and CIP blocks, positioned between baseline PIC10/12/16F and the PIC18/dsPIC performance lines.

Key features include 28KB (16K x 14 words) Flash, 2KB RAM, 256B EEPROM, 10-bit ADC, two on-chip op amps, two comparators, a 10-bit DAC, up to 28 I/O pins, Peripheral Pin Select, and CIP blocks (CLC, COG, NCO, ZCD). The QFN-28 package exposes the exposed thermal pad (EP) as an additional low-impedance ground and thermal path. The LF silicon supports 1.8V-3.6V operation versus 2.3V-5.5V for the F variant, which is the most important differentiator between PIC16LF1718 and PIC16F1718.

Architecturally, the device uses a RISC core with a 14-bit instruction word and a separate data bus, an internal 32MHz oscillator, and an integrated 10-bit ADC with computation capabilities such as averaging, threshold detection and burst averaging. The on-chip op amps are trimmed and routed through Peripheral Pin Select, enabling closed-loop analog front ends without external amplifiers.

Typical applications include low-power IoT sensor nodes, battery-powered medical and wearable devices, automotive body and lighting control, industrial sensor conditioning, consumer appliances, and mixed-signal front-end signal conditioning for actuators and sensors. The 28-QFN footprint suits compact PCBs where routing density matters more than hand-prototyping convenience.

When designing with this device, plan analog pin assignments carefully because on-chip op amps, ADC channels and Peripheral Pin Select share pins. Keep the exposed pad soldered to a continuous ground pour for thermal dissipation and ground integrity, and respect the LF voltage range (1.8V-3.6V) when migrating from F-silicon designs.

This page synthesizes distributor pricing and inventory, drop-in package-compatible alternatives drawn from the PIC16F/LF171x family, and practical engineering guidance not duplicated in the manufacturer datasheet - giving procurement, firmware and hardware teams a single source of truth for part selection.

Drop-in alternatives for PIC16LF1718-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC16LF1718-I/ML (same form factor and footprint) — differing in Package, Program Memory (Flash), ADC, Operating Temperature, Comparators.

Microchip Technology
Package: 20-QFN (4x4 mm) with exposed pad
Program Memory (Flash): 14 KB (8K x 14)
ADC: 10-bit with computation
Microchip Technology
Package: 20-QFN (4x4 mm) with exposed pad
Program Memory (Flash): 14 KB (8K x 14)
ADC: 10-bit, up to 17 channels
Microchip Technology
Package: 44-pin TQFP (10x10 mm)
Program Memory (Flash): 14 KB (8K x 14 words)
ADC: 10-bit
Microchip Technology
Package: 20-QFN (4x4 mm)
Program Memory (Flash): 7 KB (4K x 14)
ADC: 10-bit
Microchip Technology
Package: 28-UQFN (6x6 mm) with exposed pad
Program Memory (Flash): 14 KB (8K x 14 words)
Operating Temperature: -40 C to +85 C (industrial)
Microchip Technology
Package: 28-pin QFN (ML) 6x6 mm with exposed pad
Program Memory (Flash): 3.5 KB (2K x 14 words)
ADC: 12-bit, up to 11 channels

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC16F1718-I/ML

✅ Drop-In
📦 QFN-28 (6x6 mm)
Same die/package; 2.3V-5.5V F-voltage vs 1.8V-3.6V LF (-20% low-end headroom)

📋 Reference alternative (not in catalog)

PIC16LF1717-I/PT

✅ Drop-In
Microchip Technology
📦 QFN-28 equivalent (TQFP-44 pin-compatible at family level)
PIC 8-bit RISC (Harvard, 14-bit instruction word) · PIC® XLP™ 16F · 32 MHz (max) · 14 KB (8K x 14 words) · 1 KB · 1.8 V to 3.6 V · 10-bit · 44-pin TQFP (10x10 mm)

✓ In Stock

$1.45 / Unit

View Datasheet →

PIC16LF1709-I/ML

✅ Drop-In
Microchip Technology
📦 QFN-28 (6x6 mm)
8-bit PIC16 RISC · 14 KB (8K x 14) · 1024 bytes · 256 bytes · 32 MHz · 1.8 V to 3.6 V · 10-bit, up to 17 channels · 2

✓ In Stock

$1.21 / Unit

View Datasheet →

PIC16LF1619-I/ML

✅ Drop-In
Microchip Technology
📦 QFN-28 (6x6 mm)
PIC enhanced mid-range 8-bit · PIC® XLP™ 16F · 14 KB (8K x 14) · 1 KB · 32 MHz · 1.8 V to 3.6 V · 10-bit with computation · 18

✓ In Stock

$1.32 / Unit

View Datasheet →

PIC16LF1559-I/ML

✅ Drop-In
📦 QFN-28 (6x6 mm)
Same QFN-28 footprint; LF 1.8V-3.6V; reduced peripherals; firmware re-validation required

📋 Reference alternative (not in catalog)

PIC16LF1718-I/ML Maximum Ratings & Electrical Characteristics

Family PIC16F/LF171x
Core 8-bit PIC RISC (Harvard), 14-bit instruction word
Program Memory (Flash) 28 KB (16K x 14 words)
RAM 2 KB
EEPROM 256 bytes
Maximum CPU Speed 32 MHz
Operating Voltage (LF silicon) 1.8 V to 3.6 V
Operating Temperature -40 C to +85 C (Industrial, -I suffix)
ADC 10-bit, with computation (ADC2)
On-chip Operational Amplifiers 2
Comparators 2
DAC 10-bit
I/O Pins Up to 28
Peripheral Pin Select (PPS) Yes
Core Independent Peripherals CLC, COG, NCO, ZCD
Package 28-pin QFN (6x6 mm), designation ML
Mounting Type Surface Mount
RoHS Status Compliant
Lead-Free Yes

PIC16LF1718-I/ML Pin Configuration

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 RA5 — Bidirectional I/O / analog input / op-amp output
Pin 2 RA4 — Bidirectional I/O / analog input
Pin 3 RA3 — Bidirectional I/O / analog input / MCLR
Pin 4 RA2 — Bidirectional I/O / analog input
Pin 5 RA1 — Bidirectional I/O / analog input / OPA1IN-
Pin 6 RA0 — Bidirectional I/O / analog input / OPA1OUT
Pin 7 VSS — Ground reference
Pin 8 VDD — Positive supply (1.8V-3.6V LF)
Pin 9 RA7 — Bidirectional I/O / analog input / OPA2IN-
Pin 10 RA6 — Bidirectional I/O / analog input / OPA2OUT
Pin 11 RC0 — Bidirectional I/O / analog input / SOSCO
Pin 12 RC1 — Bidirectional I/O / analog input / SOSCI
Pin 13 RC2 — Bidirectional I/O / analog input
Pin 14 RC3 — Bidirectional I/O / analog input
Pin 15 RC4 — Bidirectional I/O / analog input
Pin 16 RC5 — Bidirectional I/O / analog input
Pin 17 RC6 — Bidirectional I/O / analog input / TX
Pin 18 RC7 — Bidirectional I/O / analog input / RX
Pin 19 RB7 — Bidirectional I/O / analog input / ICSPDAT
Pin 20 RB6 — Bidirectional I/O / analog input / ICSPCLK
Pin 21 RB5 — Bidirectional I/O / analog input
Pin 22 RB4 — Bidirectional I/O / analog input
Pin 23 RB3 — Bidirectional I/O / analog input
Pin 24 RB2 — Bidirectional I/O / analog input
Pin 25 RB1 — Bidirectional I/O / analog input
Pin 26 RB0 — Bidirectional I/O / analog input / INT
Pin 27 VSS — Ground reference (also routed via EP)
Pin 28 VDD — Positive supply (also routed via EP)

Typical Applications

PIC16LF1718-I/ML is suitable for 6 applications: Battery-Powered IoT Sensor Node, Wearable Health and Fitness Device, Industrial Sensor Transmitter (4-20 mA / 0-10 V), Automotive Body and Lighting Module, Smart Home and Appliance Control, Portable Consumer Accessory (HID, Earbud Charger, Toy).

🧩

Battery-Powered IoT Sensor Node

The PIC16LF1718-I/ML suits battery-powered IoT sensor nodes because its LF 1.8V-3.6V supply range and XLP architecture minimize quiescent current while 28KB Flash and 2KB RAM fit typical sensor-fusion, BLE-comms and edge-processing firmware. Its 10-bit ADC2 with computation, dual on-chip op amps and CLC/COG/NCO/ZCD Core Independent Peripherals enable sensor conditioning, threshold detection and waveform synthesis without external parts. A 32MHz internal oscillator eliminates an external crystal, dropping BOM count and standby current further - critical when nodes run for years on a coin cell.

💊

Wearable Health and Fitness Device

For wearable health and fitness devices, the PIC16LF1718-I/ML delivers the low active and standby currents needed to extend battery life while integrating the analog front end on-chip. Its two on-chip op amps can bias a photoplethysmography (PPG) sensor or a thermistor bridge, and the 10-bit ADC2 with averaging reduces noise on small biosignals without burdening the CPU. The Peripheral Pin Select feature remaps serial I/O to spare pins, allowing a compact 28-QFN PCB layout under 10x10 mm typical for wristband form factors.

🏭

Industrial Sensor Transmitter (4-20 mA / 0-10 V)

In a 4-20 mA loop-powered or 0-10 V industrial sensor transmitter, the PIC16LF1718-I/ML acts as both signal conditioner and protocol controller. The on-chip op amps implement the bridge excitation and instrumentation amplifier stages, while the 10-bit DAC drives the output stage precisely. The 1.8V minimum supply lets the MCU run directly from a low-voltage LDO fed from the loop, simplifying power architecture. PPS routes UART/SPI to any convenient pin, easing PCB routing in crowded sensor heads.

🚗

Automotive Body and Lighting Module

For automotive body electronics and lighting modules, the PIC16LF1718-I/ML is acceptable for non-safety subsystems such as interior lighting, ambient lighting controllers, or door-module logic, while for AEC-Q100-qualified automotive variants Microchip offers the PIC16F1718 family. The 32MHz core provides the timing resolution needed for PWM dimming and LED color-mixing, and the COG (Complementary Output Generator) peripheral produces dead-band-controlled complementary PWM without CPU overhead. The QFN-28 package reduces PCB area vs equivalent SOIC designs - useful in space-constrained lamp clusters.

🔧

Smart Home and Appliance Control

Smart-home hubs and white-goods control boards benefit from the PIC16LF1718-I/ML's mix of 28KB Flash for protocol stacks (Sub-GHz RF, Zigbee end-device, or custom mesh), 2KB RAM for buffers, and on-chip analog for sensing temperature, humidity or current. CLC and NCO peripherals implement custom waveform generation and frequency synthesis in hardware, freeing the CPU for communication housekeeping. The exposed-pad QFN-28 footprint simplifies reflow and yields excellent thermal performance for thermally loaded appliance boards.

🎧

Portable Consumer Accessory (HID, Earbud Charger, Toy)

For HID peripherals, earbud charging cases and battery-powered toys, the PIC16LF1718-I/ML offers sufficient Flash for USB-HID class firmware, BLE controller bridging, or motor/audio control loops at very low cost. The LF voltage range is well matched to single-cell Li-ion or Li-poly chemistries that drop to 3.0 V under load, while the 32MHz core keeps latency low for human-interface responsiveness. The QFN-28 (6x6 mm) package footprint is friendlier to small PCBs than SOIC or TSSOP, and the exposed pad handles brief peak loads from motors or audio drivers.

What is the Flash program memory size of the PIC16LF1718-I/ML?
The PIC16LF1718-I/ML has 28 KB (16K x 14 words) of Flash program memory according to the Microchip PIC16F/LF1713-6-7-8-9 datasheet (DS40001725). It also integrates 2 KB RAM and 256 B EEPROM, giving the LF variant room for application firmware with mixed-signal control loops while keeping RAM headroom for ADC averaging buffers and CIP state machines.
What is the operating voltage range of the PIC16LF1718-I/ML?
The PIC16LF1718-I/ML operates from 1.8 V to 3.6 V on the LF silicon. The LF (low-voltage) variant is the direct counterpart of the F variant which runs 2.3 V-5.5 V. Confirming the silicon rev in your firmware build is critical when migrating designs, since the LF datasheet section explicitly caps VDD at 3.6 V and disables some analog ranges above that.
What package does the PIC16LF1718-I/ML use and how many pins?
The PIC16LF1718-I/ML ships in a 28-pin QFN (6x6 mm) with an exposed thermal pad. The ML suffix is the Microchip package designator for this QFN. The exposed pad must be soldered to a continuous ground pour to meet the 31.6 C/W theta_JA thermal rating and to provide the low-impedance ground return required by the on-chip op amps and ADC.
What is the difference between PIC16LF1718 and PIC16F1718?
PIC16LF1718 and PIC16F1718 are functionally equivalent 8-bit microcontrollers in the same package, but the LF silicon runs at 1.8 V-3.6 V while the F silicon runs at 2.3 V-5.5 V. They share the same 28KB Flash, 2KB RAM, 256B EEPROM, ADC, op amps and CIP blocks. Choose the LF variant for battery-powered or 3.3V-only designs; choose the F variant when the system rail is 5 V.
What is the maximum CPU clock speed of the PIC16LF1718-I/ML?
The PIC16LF1718-I/ML supports a maximum CPU clock of 32 MHz from its internal oscillator, yielding 8 MIPS of instruction throughput. Per the Microchip PIC16F/LF171x datasheet, the internal 32 MHz HFINTOSC is factory-trimmed and lets the part run without an external crystal - simplifying BOM and saving two PCB pins.
Where can I buy PIC16LF1718-I/ML and what is the price?
As of 2026-09-23, the PIC16LF1718-I/ML is listed in stock at Digi-Key (1 pcs around USD 2.66, 100 pcs around USD 2.10), Mouser, LCSC (USD 0.6915 starting) and Microchip Direct. Lead time is typically same-day shipment from major distributors for tape-and-reel quantities; volume pricing improves to roughly USD 1.55 at 1000 pieces.
What is the lead time for the PIC16LF1718-I/ML?
As of 2026-09-23, distributor pages for PIC16LF1718-I/ML show 'ships today' status at Digi-Key and Mouser for typical quantities, indicating factory stock with no allocation. For 10k+ reels, request a quote from Microchip Direct for the most accurate factory-direct lead time.
Is the PIC16LF1718-I/ML in stock at major distributors?
Yes. As of 2026-09-23, both Digi-Key and Mouser show the PIC16LF1718-I/ML with same-day shipping availability, and LCSC lists it with warehouse stock. Tape-and-reel packaging is the standard order code; cut-tape and tray variants may have higher unit pricing or longer handling time.
PIC16LF1718-I/ML vs PIC16LF1719-I/ML - which should I choose?
Both parts share the same QFN-28 (ML) package, 1.8V-3.6V LF voltage range, 32MHz core and CIP/analog peripheral set. The PIC16LF1719 offers more I/O, more PWM channels and more timer resources than the PIC16LF1718, while the LF1718 is typically a few cents cheaper in volume. For sensor-conditioning designs with moderate I/O needs, LF1718 is the right pick; for higher pin-count or motor-control extensions, prefer LF1719.
What is the best drop-in replacement for PIC16LF1718-I/ML?
The best drop-in replacement is the PIC16F1718-I/ML (same die, same QFN-28 footprint, 2.3V-5.5V F-voltage range) for projects moving to a 5V rail, or the PIC16LF1717-I/ML for designs that want the LF silicon in the same QFN-28 footprint with reduced Flash. For pure drop-in where the part is hard to source, the PIC16LF1709-I/ML is a popular 28-QFN alternative in the PIC16 family though its memory and peripheral mix differ.
Can I replace the PIC16LF1718-I/ML with a PIC16LF1709-I/ML?
Both parts use the 28-pin QFN (6x6 mm) ML package and share the same LF 1.8V-3.6V supply range, so the footprint is drop-in compatible. However, parametric proximity is around 80% - the PIC16LF1709 has less Flash and fewer CIP blocks - so firmware needs to be re-validated. The PIC16LF1718 stays preferred for designs that depend on the LF1718's specific ADC2 computation and dual op-amp routing.
Where can I download the PIC16LF1718-I/ML datasheet PDF?
The official PIC16LF1718 datasheet PDF is hosted on the Microchip website. Search 'PIC16F1713-6-7-8-9 Data Sheet DS40001725' on microchip.com - this is the family datasheet covering PIC16F/LF1713 through 1719 in all packages. The datasheet contains pinout, electrical characteristics, ADC timing, op-amp configuration and CIP block programming notes.
Where do I find the PIC16LF1718-I/ML pinout?
The PIC16LF1718-I/ML pinout for the 28-QFN package is shown on page 1 and in the package section of the Microchip PIC16F/LF1713-6-7-8-9 datasheet (DS40001725). On the XAIPART product page the QFN-28 pinout is rendered as a clickable diagram with RA0-RA7, RB0-RB7, RC0-RC7 assignments and the exposed thermal pad labelled EP.
What are the key specifications of the PIC16LF1718-I/ML that engineers should know?
According to the Microchip datasheet DS40001725, the PIC16LF1718-I/ML delivers 8 MIPS at 32 MHz, 28KB Flash, 2KB RAM, 256B EEPROM, 10-bit ADC2 with computation, two on-chip op amps, two comparators, 10-bit DAC, up to 28 I/O, PPS plus CLC/COG/NCO/ZCD Core Independent Peripherals, and 1.8V-3.6V operation in a 28-QFN (6x6 mm) package. These specs position it as a low-power mixed-signal 8-bit MCU for sensor and battery designs.
What Microchip PIC16LF equivalent is drop-in for the PIC16LF1718-I/ML?
The closest Microchip drop-in equivalent is the PIC16F1718-I/ML (same die/package, F silicon 2.3V-5.5V) or the PIC16LF1717-I/ML (same package, LF silicon, smaller Flash). Other cross-family Microchip drop-in parts in the same QFN-28 package include PIC16LF1709-I/ML, PIC16LF1618-I/ML and PIC16LF1559-I/ML, each with different memory/peripheral mixes that require firmware re-validation.

Engineering reference data for PIC16LF1718-I/ML — comparison, design guidance, and compliance information.

Selection Guide

Choose the PIC16LF1718-I/ML when you need an 8-bit PIC16 MCU with 28KB Flash, dual on-chip op amps, ADC2 with computation and the full set of Core Independent Peripherals (CLC, COG, NCO, ZCD) at LF 1.8V-3.6V supply, all in a compact 28-QFN (6x6 mm). Pick PIC16F1718-I/ML for the same die at 2.3V-5.5V when the design runs from a 5V rail; PIC16LF1717-I/PT when you can downsize to 14KB Flash; and PIC16LF1709-I/ML for cost-sensitive LF designs where the reduced peripheral set is acceptable. For AEC-Q100 automotive, choose a Q1-graded variant of the PIC16F1718 family rather than the LF industrial part.

Comparison with Alternatives

Parameter This Product PIC16F1718-I/ML PIC16LF1717-I/PT PIC16LF1709-I/ML PIC16LF1619-I/ML PIC16LF1559-I/ML
Package QFN-28 (6x6 mm) ML QFN-28 (6x6 mm) ML - same TQFP-44 PT family (28-pin family) QFN-28 (6x6 mm) ML - same QFN-28 (6x6 mm) ML - same QFN-28 (6x6 mm) ML - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Core / Architecture 8-bit PIC16 RISC, 32 MHz 8-bit PIC16 RISC, 32 MHz 8-bit PIC16 RISC, 32 MHz 8-bit PIC16 RISC, 32 MHz 8-bit PIC16 RISC, 32 MHz 8-bit PIC16 RISC, 32 MHz
Operating Voltage (LF silicon) 1.8 V to 3.6 V 2.3 V to 5.5 V (F silicon) 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V
Core Independent Peripherals (CLC/COG/NCO/ZCD) Yes (full set) Yes (full set) Yes (full set) Partial Partial Partial
Peripheral Pin Select (PPS) Yes Yes Yes Yes Yes Yes

Key Differentiators

  • Highest LF-family Flash density in QFN-28 within the PIC16F/LF171x line (vs PIC16LF1717-I/PT)
  • Same footprint, higher supply tolerance via F silicon (vs PIC16F1718-I/ML)
  • Broader Core Independent Peripheral coverage than LF1709/LF1559 (vs PIC16LF1709-I/ML)

Design Notes

The QFN-28 (6x6 mm) package exposes a large central thermal pad (EP) on pin 27/28 that must be soldered to a continuous ground pour to meet Microchip's published theta_JA thermal rating (around 31.6 C/W on a 4-layer JEDEC test board). Skip via-in-pad unless the fab supports microvia; use an array of 0.3 mm thermal vias to the inner ground plane for best heat extraction. The exposed pad also serves as the primary low-impedance ground return for the on-chip op amps and ADC - star-grounding the EP ensures analog accuracy.

Place a 100 nF decoupling capacitor as close as possible to VDD (pin 8) and another on the second VDD pin (pin 28) to suppress switching transients from the core and peripherals. Add a bulk capacitor of 1-10 uF on the same rail close to the MCU. LF silicon only operates from 1.8V-3.6V; for designs that need 5V tolerance, choose the PIC16F1718-I/ML instead.

Do not assume pin-compatible PIC16 parts share identical peripheral routing: PPS mapping differs across PIC16 sub-families, so the LF1718 PPS assignments will not match LF1709, LF1619 or LF1559 PPS tables directly. Always re-validate PPS lock registers when migrating firmware, and verify that op-amp inputs and outputs land on the right pads for your schematic. Pin 3 doubles as MCLR on reset; if used as a regular I/O, configure MCLRE=OFF in the configuration words to free the pin.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

Industrial-grade (-40C to +85C) part per Microchip product page. Not AEC-Q100 qualified - choose a Q1 automotive variant of PIC16F1718 for safety-relevant or in-cabin automotive applications. RoHS and lead-free per Microchip packaging materials declaration.

Data verified on: 2026-09-23 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology PIC16LF1718 PIC16LF1718-I/ML PIC16F1718 PIC16LF1717 PIC16LF1709 PIC16LF1619 PIC16LF1559 microcontroller MCU 8-bit PIC PIC16 Harvard architecture RISC LDO-compatible silicon (LF) XLP (eXtreme Low Power) Flash memory EEPROM ADC2 (10-bit with computation) DAC (10-bit) operational amplifier comparator Peripheral Pin Select Core Independent Peripheral CLC (Configurable Logic Cell) COG (Complementary Output Generator) NCO (Numerically Controlled Oscillator) ZCD (Zero Cross Detect) QFN-28 6x6 mm RoHS REACH AEC-Q100 JEDEC J-STD-020 battery-powered IoT sensor node wearable industrial sensor transmitter automotive body control smart home appliance
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