DSPIC33EP64GS502T-E/2N - 16-bit 60 MIPS DSC 64KB Flash | Microchip
MPN: DSPIC33EP64GS502T-E/2N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.8 | $5.80 |
| 10 | $5.22 | $52.20 |
| 100 | $4.64 | $464.00 |
| 500 | $4.18 | $2,090.00 |
| 1,000 | $3.73 | $3,730.00 |
DSPIC33EP64GS502T-E/2N Overview
A digital signal controller combines the compute architecture of a microcontroller with the math acceleration of a DSP. In the power-management hierarchy, the dsPIC33EP GS family sits at the intersection of MCU control flow and DSP-intensive control-loop execution, making it a single-chip alternative to MCU-plus-DSP two-chip solutions in switch-mode power supplies.
Key features include the interconnected high-Speed PWM module purpose-built for multi-loop SMPS topologies, a high-speed analog-to-digital converter, programmable gain amplifiers (PGA), and analog comparators that close control loops without external components. The -E temperature grade covers -40C to +125C ambient, and the AEC-Q100 qualification plus FuSa support allows use in safety-relevant automotive power stages.
Architecturally, the dsPIC33EP core uses a modified Harvard pipeline with DSP instruction extensions (MAC, multiply-divide) and hardware division, enabling deterministic execution of proportional-integral control loops at switching frequencies well into the hundreds of kilohertz. The interconnected PWM, ADC and comparators can trigger each other autonomously, offloading cycle-by-cycle current limiting from software.
Typical applications include AC-DC power supplies, interleaved power factor correction (PFC), DC-DC converters, solar micro-inverters, battery chargers, and LED drivers. Microchip reference designs such as the Interleaved PFC (350W, universal input) are built directly on this controller family.
Design consideration: the exposed pad of the UQFN package is the primary thermal and ground path - connect it to a solid ground plane with multiple vias; without it, thermal and EMI performance degrade significantly.
This page synthesizes distributor pricing, drop-in same-family alternatives, pinout/package data, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP64GS502T-E/2N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP64GS502T-E/2N (same form factor and footprint) — differing in Packaging, Package, Core Architecture, Maximum CPU Speed, Qualification.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP64GS502-E/2N
✅ Drop-In✓ In Stock
$3.1 / Unit
View Datasheet →DSPIC33EP64GS502I-E/2N
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP32GS502-E/2N
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.5 / Unit
View Datasheet →DSPIC33EP64GS502T-E/2N Maximum Ratings & Electrical Characteristics
| Core Architecture | 16-bit dsPIC33EP RISC with DSP extensions |
| Maximum CPU Speed | 60 MIPS |
| Program Memory (Flash) | 64KB (64K x 8) |
| Supply Voltage | 3.3 V |
| Package | 28-UQFN (6x6 mm) with exposed pad |
| Qualification | AEC-Q100 automotive |
| Functional Safety Support | Yes (FuSa) |
| Operating Temperature Range | -40C to +125C (E grade) |
| Specialty Features | Interconnected High-Speed PWM, ADC, PGA, Comparators for SMPS/digital power |
| Application Target | SMPS and digital power conversion |
| Mounting Type | Surface Mount |
| Packaging | Tape & Reel (T/R) |
| RoHS Status | Compliant |
DSPIC33EP64GS502T-E/2N 28-uqfn (6x6 mm) with exposed pad Pin Configuration Guide
Pin configuration for DSPIC33EP64GS502T-E/2N (28-uqfn (6x6 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP64GS502T-E/2N.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP64GS502T-E/2N is suitable for 6 applications: AC-DC Power Supplies, Interleaved Power Factor Correction (PFC), DC-DC Converters, Solar Micro-Inverters, Battery Chargers, LED Drivers.
AC-DC Power Supplies
The DSPIC33EP64GS502T-E/2N is a natural fit for digitally controlled AC-DC power supplies because its interconnected high-Speed PWM, high-speed ADC, programmable gain amplifiers, and analog comparators allow voltage-mode, current-mode, and multi-loop control to be executed by a single 60 MIPS core. The hardware interconnects handle cycle-by-cycle current limiting and fast fault shutdown without software latency, which is essential for meeting hold-up and transient-response requirements. Placed as the sole controller, it replaces an analog PWM controller plus a supervisory MCU, reducing BOM count. The -40C to +125C E grade and AEC-Q100 qualification extend its use into automotive and industrial PSU environments where consumer-grade controllers cannot be qualified.
Recommended
Interleaved Power Factor Correction (PFC)
Microchip's 350W universal-input Interleaved PFC reference design is built directly on the dsPIC33EP64GS502, demonstrating the part's suitability for two-phase interleaved boost PFC stages. The interconnected high-Speed PWM module generates phase-shifted interleaved drive with programmable phase relationship, while the high-speed ADC samples inductor currents synchronized to each PWM cycle so both phases can share current equally. The analog comparators implement cycle-by-cycle overcurrent protection in hardware. Running at 60 MIPS leaves ample headroom for the outer voltage loop plus power-metering math. The 3.3V supply, 64KB Flash, and AEC-Q100 qualification make it viable from consumer PSU front-ends through automotive on-board charger PFC stages without changing controllers.
Recommended
DC-DC Converters
For synchronous buck, boost, and buck-boost converters, the DSPIC33EP64GS502T-E/2N offers deterministic loop closure at high switching frequency. The 60 MIPS core executes proportional-integral compensation math in a few microseconds, while the ADC with programmable gain amplifiers digitizes feedback signals directly, eliminating external signal-conditioning op-amps in 3.3V-referenced systems. Hardware comparators trip the PWM outputs within nanoseconds of an overcurrent event - a level of protection speed software alone cannot achieve. Designers typically run the power stage at 100-500 kHz with the ADC triggered by the PWM module for jitter-free sampling. The 28-UQFN (6x6 mm) exposed pad keeps the controller footprint minimal on dense converter boards.
Recommended
Solar Micro-Inverters
Solar micro-inverters demand simultaneous MPPT (maximum power point tracking), grid-synchronization, and DC-AC inversion control from one low-cost, high-reliability controller. The DSPIC33EP64GS502T-E/2N handles this with its interconnected high-Speed PWM generating the inverter switching pattern, the high-speed ADC sampling panel voltage/current for MPPT algorithms, and the DSP MAC instructions accelerating the control-loop and waveform math at 60 MIPS. The -40C to +125C temperature grade suits rooftop enclosures that see extreme ambient swings, and AEC-Q100 robustness translates into field reliability. The 64KB Flash accommodates MPPT, grid monitoring, and anti-islanding code concurrently, and the FuSa support assists with grid-code compliance documentation.
Recommended
Battery Chargers
Multi-chemistry battery chargers require staged charging (pre-charge, constant current, constant voltage, termination) with precise current and voltage regulation plus safety supervision. The DSPIC33EP64GS502T-E/2N implements the CC/CV loops in firmware using its 60 MIPS core and high-speed ADC, while the comparators provide independent hardware overcurrent and overvoltage cutoffs that operate even if firmware misbehaves - a valuable defense-in-depth for lithium charging safety. The interconnected PWM drives synchronous buck charging stages at high frequency for small magnetics. AEC-Q100 qualification supports automotive on-board charger sub-modules, and Functional Safety support simplifies safety analyses. The 28-UQFN 6x6 package fits compact charger PCBs in vehicle and portable applications.
Recommended
LED Drivers
High-power and automotive LED drivers benefit from the DSPIC33EP64GS502T-E/2N's precise, fast current control. The high-Speed PWM supports both fixed-frequency current regulation and burst-dimmable architectures, while the high-speed ADC with PGA reads current-sense signals at low voltage for accurate constant-current loops. Hardware comparators enable cycle-by-cycle LED string overcurrent protection, critical because LED failures are often short-circuit events. Its 60 MIPS core simultaneously runs dimming curves, temperature derating (using on-chip or external temperature sensing), and fault logging. The -40C to +125C grade and AEC-Q100 qualification make it suitable for automotive exterior lighting where thermal cycling and qualification requirements exclude consumer controllers.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP64GS502T-E/2N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP64GS502-E/2N | DSPIC33EP64GS502I-E/2N | DSPIC33EP32GS502-E/2N |
|---|---|---|---|---|
| Package | 28-UQFN (6x6 mm), exposed pad | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same | 28-UQFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Flash Memory | 64KB | 64KB | 64KB | 32KB (-50%) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Operating Temperature | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) |
| Packaging Format | Tape & Reel (T) | Tube/Tray | Tape & Reel (T) | Tape & Reel (T) |
Key Differentiators
- Full 64KB Flash headroom in the same footprint (vs DSPIC33EP32GS502-E/2N)
- Extended -40C to +125C temperature grade (vs DSPIC33EP64GS502I-E/2N)
- Identical drop-in supply flexibility between reel and tube (vs DSPIC33EP64GS502-E/2N)
Design Notes
The exposed pad on the underside of the 28-UQFN (6x6 mm) package is the primary ground and thermal path. Connect it to a solid ground plane through an array of at least 4-9 thermal vias (0.3 mm drill, filled or tented). Omitting this connection is the single most common layout error with UQFN dsPIC parts - it degrades thermal performance, ground integrity for the ADC, and EMI behavior simultaneously. Follow the Microchip UQFN landing-pattern recommendation in the datasheet mechanical drawing exactly; the 6x6 UQFN has fine pitch that demands accurate stencil design (reduce stencil aperture ratio on the center pad to ~50-70% to avoid solder voiding).
Decouple VDD with a 0.1 uF ceramic capacitor placed within 2 mm of each VDD pin, plus one bulk 4.7-10 uF capacitor per supply rail. dsPIC33EP cores at 60 MIPS draw transient current on every clock edge; long, inductive traces cause VDD droop that manifests as spurious resets or ADC noise. If using the internal voltage regulator, follow the datasheet recommendation for the VCAP regulator output capacitor precisely - the wrong capacitance or ESR causes brown-out during Flash writes. Estimated: core transient currents are sub-100 mA, so a single solid ground plane is sufficient for most digital power converter layouts.
Peripheral Pin Select (PPS) on dsPIC33EP devices means default pin functions differ from generic PIC conventions - always map UART, SPI, and PWM pins explicitly in code and verify against the datasheet pin table, not against a previous project. Second pitfall: in digital power designs, keep PWM output traces short and away from ADC input nets; switching-node coupling into high-impedance sense lines corrupts the very loops the ADC samples. Third: the MCLR pin needs the datasheet-specified pull-up and capacitor; floating MCLR causes erratic reset behavior under ESD or noisy supply conditions common in SMPS environments.
Compliance Information
AEC-Q100 automotive qualification and Functional Safety (FuSa) support confirmed by DigiKey and Microchip USA listings. RoHS compliance per standard Microchip current-production status; REACH and halogen-free status not stated in provided data.
