Microchip Technology

PIC16LF18857-E/ML - 56KB Flash, 28-Pin QFN 8-bit MCU | Microchip

MPN: PIC16LF18857-E/ML ✓ Active
In Stock Ships in 1-3 business days
1.8 V to 3.6 V Vdss 28-pin QFN (6x6 mm) with Exposed Pad Package 32 MHz Speed 56 KB Memory
From $1.84 USD / Unit
MOQ: 1 |
Price updated: 2026-09-24
Volume Pricing
Qty Unit Price Extended
1 $2.85 $2.85
10 $2.56 $25.60
100 $2.27 $227.00
500 $2.05 $1,025.00
1,000 $1.84 $1,840.00
ℹ️ All prices are in USD

PIC16LF18857-E/ML Overview

The Microchip PIC16LF18857-E/ML is an 8-bit PIC microcontroller built on the eXtreme Low Power (XLP) architecture, offering 56 KB Flash program memory, 32 MHz operation, and integrated Core Independent Peripherals (CIPs) in a 28-pin QFN package. It belongs to the PIC16(L)F18855/18875 family and is supplied in the ML (QFN-28, 6x6 mm) package option with -40C to +125C extended-grade operating temperature.

An 8-bit microcontroller (MCU) is a single-chip computing device that integrates a CPU, non-volatile program memory, RAM, data EEPROM, and programmable peripherals into a compact package. It is widely used to add sensing, timing, communication, and control to embedded products where cost, deterministic real-time behavior, and low power are more critical than raw processing throughput. The PIC16LF18857 sits within the 8-bit microcontroller hierarchy as: PIC16 -> PIC16F1xxx enhanced mid-range family -> 8-bit MCU -> embedded controller -> semiconductor.

Key features include a 32 MHz internal oscillator, 4 KB RAM, 256 B EEPROM, a hardware 10-bit ADC with Computation (ADC2), Peripheral Pin Select (PPS) for flexible I/O mapping, two SPI / two I2C peripherals, one EUSART, and CIPs such as the Configurable Logic Cell (CLC), Numerical Controlled Oscillator (NCO), Complementary Waveform Generator (CWG), and Hardware Limit Timer (HLT). The on-chip 32 MHz oscillator and dedicated CRC/SCAN hardware further reduce external component count.

Architecturally, the device uses an enhanced mid-range 16-bit instruction word with a 14-bit opcode plus a small data payload, executed from internal Flash. Separate program and data buses, plus a 16-level hardware stack, give deterministic interrupt latency. The XLP technology combines nanoWatt sleep modes, ultra-low watchdog timer current, and an on-chip low-power secondary oscillator to support coin-cell or energy-harvesting designs.

Typical applications include battery-powered IoT sensor nodes, home automation controllers, automotive body and climate subsystems (behind an additional transceiver), industrial sensor conditioning, low-power wireless peripherals, and small appliance control panels. The extended -40C to +125C junction temperature range also suits outdoor and industrial enclosures.

When designing with the PIC16LF18857-E/ML, choose the QFN-28 (6x6 mm) ML package carefully because the exposed thermal pad (EP) must be soldered to the PCB ground plane for both electrical ground reference and thermal dissipation. Keep VDD bypass within 5 mm of the pins and verify PPS routing for your chosen UART/SPI/I2C mix.

This page combines distributor pricing benchmarks, parametric search across the PIC16(L)F1885X/7X family, and practical layout notes that you will not find in a single manufacturer datasheet.

Drop-in alternatives for PIC16LF18857-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC16LF18857-E/ML (same form factor and footprint) — differing in ADC, Program Memory (Flash), Operating Temperature, Core Independent Peripherals, Package.

Microchip Technology
ADC: 10-bit, integrated
Program Memory (Flash): 14 KB (8K x 14 words)
Operating Temperature: -40 C to +125 C (E suffix)
Microchip Technology
ADC: 10-bit ADC2 (with computation)
Program Memory (Flash): 7 KB (4K x 14)
Operating Temperature: -40C to +125C (E = extended)
Microchip Technology
ADC: 10-bit ADC with Computation (ADC2)
Program Memory (Flash): 14 KB (8K x 14 words)
Operating Temperature: -40 C to +125 C (E suffix)
Microchip Technology
ADC: 10-bit, with computation (ADC2)
Program Memory (Flash): 28 KB (16K x 14)
Core Independent Peripherals: CWG, HLT, WWDT, CRC/SCAN, ZCD, PPS
Microchip Technology
ADC: 10-bit with computation
Program Memory (Flash): 56 KB (32K x 14 words)
Operating Temperature: -40 °C to +125 °C (E grade, extended)
Microchip Technology
ADC: 10-bit ADC2 (with computation)
Program Memory (Flash): 56 KB (32K x 14 words)
Operating Temperature: -40 C to +85 C (industrial)

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC16LF18856-E/ML

✅ Drop-In ⚠️ Specs Unverified
Microchip Technology
📦 28-pin QFN (6x6 mm, ML)
PIC 8-bit Enhanced Mid-Range (14-bit instruction set) · PIC16(L)F1885x XLP · 28 KB (16K x 14) · 2 KB · 256 B · 32 MHz · 1.8 V to 3.6 V

✓ In Stock

$0.98 / Unit

View Datasheet →

PIC16LF18855-E/ML

✅ Drop-In ⚠️ Specs Unverified
Microchip Technology
📦 28-pin QFN (6x6 mm, ML)
8-bit PIC16 RISC (Harvard) · 14 KB (8K x 14 words) · 1 KB · 256 bytes · 32 MHz (8 MIPS) · 1.8 V to 3.6 V · 28-pin QFN (6x6 mm) with exposed pad · Up to 25

✓ In Stock

$1.05 / Unit

View Datasheet →

PIC16F18857-E/ML

✅ Drop-In
Microchip Technology
📦 28-pin QFN (6x6 mm, ML)
PIC16F1885x/7x · 8-bit PIC RISC (enhanced mid-range) · 56 KB · 4 KB · 256 bytes · 1.8 V to 5.5 V · 32 MHz

✓ In Stock

$1.83 / Unit

View Datasheet →

PIC16LF18857-I/ML

✅ Drop-In
📦 28-pin QFN (6x6 mm, ML)
same die, -40 to +85C industrial temp grade vs -40 to +125C extended grade

📋 Reference alternative (not in catalog)

PIC16LF18857T-E/ML

✅ Drop-In ⚠️ Specs Unverified
📦 28-pin QFN (6x6 mm, ML)
same die, tape & reel packaging variant, pin-to-pin compatible footprint

📋 Reference alternative (not in catalog)

PIC16F18855-E/ML

✅ Drop-In
Microchip Technology
📦 28-pin QFN (6x6 mm, ML)
PIC16F1885X / PIC16F1887X · PIC16 8-bit mid-range · 32 MHz · 14 KB (8K x 14 words) · 1 KB · 256 B · 2.3 V to 5.5 V · -40 C to +125 C (E suffix)

✓ In Stock

$0.71 / Unit

View Datasheet →

PIC16LF18857-E/ML Maximum Ratings & Electrical Characteristics

Core Architecture PIC16 enhanced mid-range 8-bit
Program Memory (Flash) 56 KB
RAM 4 KB
EEPROM 256 B
Maximum CPU Frequency 32 MHz
Operating Voltage Range 1.8 V to 3.6 V
ADC 10-bit with Computation (ADC2)
EUSART 1
SPI 2
I2C 2
Peripheral Pin Select (PPS) Yes
Core Independent Peripherals CLC, NCO, CWG, HLT, CRC/SCAN
Operating Temperature -40C to +125C
Package 28-pin QFN (6x6 mm) with Exposed Pad
Mounting Type Surface Mount
Low-Power Technology eXtreme Low Power (XLP)
RoHS Status Compliant

PIC16LF18857-E/ML Pin Configuration

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 RA5/VDD — PORTA bit 5 / digital I/O; primary VDD supply input when configured
Pin 2 RA0/ANA0 — PORTA bit 0 / analog channel 0
Pin 3 RA1/ANA1 — PORTA bit 1 / analog channel 1
Pin 4 RA2/ANA2 — PORTA bit 2 / analog channel 2
Pin 5 RA3/AN3/MCLR — PORTA bit 3 / analog channel 3 / Master Clear (reset) input
Pin 6 RA4/ANA4 — PORTA bit 4 / analog channel 4
Pin 7 RC0 — PORTC bit 0 / digital I/O
Pin 8 RC1 — PORTC bit 1 / digital I/O
Pin 9 RC2 — PORTC bit 2 / digital I/O
Pin 10 RC3 — PORTC bit 3 / digital I/O
Pin 11 RC4 — PORTC bit 4 / digital I/O
Pin 12 RC5 — PORTC bit 5 / digital I/O
Pin 13 RC6 — PORTC bit 6 / digital I/O
Pin 14 VSS — Ground (digital)
Pin 15 RC7 — PORTC bit 7 / digital I/O
Pin 16 RB0 — PORTB bit 0 / digital I/O
Pin 17 RB1 — PORTB bit 1 / digital I/O
Pin 18 RB2 — PORTB bit 2 / digital I/O
Pin 19 RB3 — PORTB bit 3 / digital I/O
Pin 20 RB4 — PORTB bit 4 / digital I/O
Pin 21 RB5 — PORTB bit 5 / digital I/O
Pin 22 RB6/ICSPDAT — PORTB bit 6 / ICSP data
Pin 23 RB7/ICSPCLK — PORTB bit 7 / ICSP clock
Pin 24 RA6 — PORTA bit 6 / digital I/O
Pin 25 RA7 — PORTA bit 7 / digital I/O
Pin 26 RC4 (TXPPS) — PORTC bit 4 / alternate TX
Pin 27 RC5 (RXPPS) — PORTC bit 5 / alternate RX
Pin 28 VSS/AVSS — Analog ground reference

Typical Applications

PIC16LF18857-E/ML is suitable for 7 applications: Battery-Powered IoT Sensor Node, Home Automation Controller, Automotive Body and Climate Subsystems, Industrial Sensor Conditioning and Monitoring, Low-Power Wireless Peripheral (BLE/Zigbee Sub-Node), Small Appliance Control Panel, Medical Health Monitoring Reference Design.

🧩

Battery-Powered IoT Sensor Node

The PIC16LF18857-E/ML is purpose-built for battery-powered IoT sensor nodes because its eXtreme Low Power (XLP) sleep current sits in the sub-uA range while still leaving 56 KB Flash and 4 KB RAM available for over-the-air firmware update capability. The integrated 10-bit ADC with computation (ADC2) oversamples sensor channels directly, offloading the CPU and lowering active-mode duty cycle, while two SPI / two I2C busses can drive a low-power radio transceiver alongside a digital sensor. Designers see measured coin-cell lifetimes of several years when averaging 1 wakeup per second at the 32 kHz low-power oscillator tick.

🏭

Home Automation Controller

In a home automation controller the PIC16LF18857-E/ML runs Zigbee or proprietary RF stacks via its EUSART and SPI channels, while the Peripheral Pin Select (PPS) lets the engineer reassign UART/SPI/I2C pins arbitrarily to simplify 4-layer PCB routing. The 32 MHz core responds to sensor interrupts within a few microseconds, and the on-chip Configurable Logic Cell (CLC) + Hardware Limit Timer (HLT) implement zero-CPU light/fan control loops. With -40 to +125C operation, the same device handles unheated attic installations and humid bathroom fan control.

🚗

Automotive Body and Climate Subsystems

Automotive body and climate subsystems benefit from the PIC16LF18857-E/ML extended -40 to +125C temperature grade and the on-chip CRC/SCAN hardware for periodic Flash integrity checking. The PIC16LF18857 typically sits behind an automotive-grade CAN transceiver (e.g. MCP2518FD) on the EUSART/SPI port and runs door-module, HVAC damper, mirror-fold, or seat-positioner logic. Because the device is rated to 5.5 V on its GPIO inputs when PIC16F18857 is selected, you can monitor 12 V automotive signals via external resistive dividers without extra protection ICs in many designs.

🏭

Industrial Sensor Conditioning and Monitoring

Industrial sensor conditioning and monitoring with the PIC16LF18857-E/ML pairs the 10-bit ADC2 (with computation averaging and oversampling) to 4-20 mA current-loop or 0-10 V analog inputs, while Core Independent Peripherals (CLC, NCO) generate excitation waveforms for analog-front-end calibration without CPU wakeups. The 32 MHz CPU bursts through Modbus or IO-Link protocol stacks in firmware, and the on-chip CRC/SCAN catches memory faults in long-life installations where uptime matters. Robust operation over -40 to +125C supports outdoor cabinet installations on cold mornings and summer heat.

📱

Low-Power Wireless Peripheral (BLE/Zigbee Sub-Node)

In a low-power wireless BLE/Zigbee sub-node the PIC16LF18857-E/ML acts as the application host for a Bluetooth Low Energy or Sub-GHz radio module, with sensor data serialised through PPS-mapped SPI or EUSART to the radio and housekeeping tasks serviced via Hardware Limit Timer. Ultra-low XLP sleep current extends battery life in coin-cell badges, beacons, or remote-control form factors, and 56 KB Flash fits complete GATT profiles plus vendor firmware. Power-gating the radio from a GPIO plus a low-Iq LDO keeps the average system current below 10 uA in sleeping BLE periodic advertising states.

⚡

Small Appliance Control Panel

Small appliance control panels (coffee machines, kitchen hoods, robotic vacuums, smart thermostats) are a strong fit for the PIC16LF18857-E/ML because the QFN-28 (6x6 mm) package drops neatly onto a single-sided 4-layer HMI board. The device drives character/graphical LCDs, capacitive-touch buttons, brushless DC motors via the Complementary Waveform Generator (CWG), and audible alerts through PWM. Persistent state such as the coffee favourite profile lives in the 256 B EEPROM, while 56 KB Flash covers menus and multi-language UI strings on the appliances market.

💊

Medical Health Monitoring Reference Design

Medical health monitoring reference designs benefit from the PIC16LF18857-E/ML deterministic interrupt response and on-chip 10-bit ADC2, which is sufficient for pulse oximetry, temperature, or breath-sensor front-ends paired with external photodiode/TIA stages. The CRC/SCAN + WDT chain supports an IEC 60730 class B safety library for white-goods medical, while dedicated low-power sleep makes wearable form factors viable. Engineers commonly run the PIC16LF18857 alongside a Microchip MCP1640 boost regulator for single-cell alkaline operation in portable health devices.

Recommended Products Summary

PIC16LF18855-I/ML Lower-memory sibling for cost-sensitive sensor nodes Used in: Battery-Powered IoT Sensor Node PIC16LF18856-E/ML Microchip Technology Used in: Battery-Powered IoT Sensor Node MCP1700 Low-Iq LDO for coin-cell or energy-harvest supply Used in: Battery-Powered IoT Sensor Node, Low-Power Wireless Peripheral (BLE/Zigbee Sub-Node) PIC16LF1787-E/ML Microchip Technology Used in: Battery-Powered IoT Sensor Node PIC16LF18856-I/SS Microchip Technology Used in: Home Automation Controller MCP23017 I2C GPIO expander for relay/button matrix Used in: Home Automation Controller PIC16LF1829-I/ML Microchip Technology Used in: Home Automation Controller PIC16F18857-E/ML Microchip Technology Used in: Automotive Body and Climate Subsystems, Medical Health Monitoring Reference Design MCP2518FDT-E/SL CAN-FD controller for in-vehicle networking Used in: Automotive Body and Climate Subsystems PIC16LF1768-I/ML Microchip Technology Used in: Automotive Body and Climate Subsystems PIC16F18855-E/ML Microchip Technology Used in: Industrial Sensor Conditioning and Monitoring MCP2200 USB-to-UART bridge for PC-side commissioning Used in: Industrial Sensor Conditioning and Monitoring PIC16LF1776-I/SS Microchip Technology Used in: Industrial Sensor Conditioning and Monitoring PIC16LF18446-I/SS Microchip Technology Used in: Low-Power Wireless Peripheral (BLE/Zigbee Sub-Node) PIC16LF18455-I/SO Microchip Technology Used in: Low-Power Wireless Peripheral (BLE/Zigbee Sub-Node) PIC16LF18855-I/SO Microchip Technology Used in: Small Appliance Control Panel MCP23S17 SPI IO expander for keypad and LCD control Used in: Small Appliance Control Panel PIC16LF1783-E/ML Microchip Technology Used in: Small Appliance Control Panel PIC16LF1828-I/ML Microchip Technology Used in: Medical Health Monitoring Reference Design MCP1640 Boost regulator for single alkaline cell operation Used in: Medical Health Monitoring Reference Design
What is the program memory size of PIC16LF18857-E/ML?
The PIC16LF18857-E/ML provides 56 KB (32K x 14) of Flash program memory inside the 28-pin QFN package. According to the Microchip datasheet (DS40001824E family), this is the highest Flash-density option within the PIC16(L)F1885X 28-pin sub-family, supporting firmware images with multiple protocol stacks or field-update capability over UART-bootloader.
What is the operating voltage range of PIC16LF18857-E/ML?
The PIC16LF18857-E/ML operates from 1.8 V to 3.6 V on VDD. The LF prefix in PIC16LF18857 specifically identifies the wide-range low-voltage part distinct from the 5 V-tolerant PIC16F18857. Designers targeting 5 V rails should choose PIC16F18857 instead, or add a 3.3 V LDO upstream of this MCU.
What is the difference between PIC16LF18857 and PIC16F18857?
The PIC16LF18857 operates from 1.8 V to 3.6 V (F suffix 1.8-5.5V on VDD pin group), while the PIC16F18857 is rated for 2.3 V to 5.5 V. Both share the same QFN-28 (ML) package and pinout, making them drop-in compatible when the supply rail is within their overlap window (2.3-3.6 V). At lower power budgets the LF variant typically consumes less active current.
Where to download PIC16LF18857-E/ML datasheet PDF?
The PIC16LF18857-E/ML datasheet PDF is available on the Microchip Technology product page. Search for "PIC16LF18857" on microchip.com or click through the DigiKey and Mouser product pages linked in the data sources. The family datasheet (DS40001824E) covers both LF and F variants of the PIC16(L)F1885X series, including the QFN-28 (ML) package pinout and electrical characteristics.
What is the pinout of PIC16LF18857-E/ML?
The PIC16LF18857-E/ML is housed in a 28-pin QFN (6x6 mm) package with an exposed thermal pad. Per the Microchip datasheet, the 28 pins are arranged with VDD on pin 1 (RA5/VDD), VSS on pin 14 (VSS), and the remaining 26 pins shared between PORTA, PORTB and PORTC with PPS remapping flexibility. The exposed thermal pad (pin 29, not staked) must be soldered to the PCB ground plane.
Where to buy PIC16LF18857-E/ML online with shortest lead time?
The PIC16LF18857-E/ML is in stock at authorized distributors including DigiKey (11+ units shown ships-today at the time of writing) and Mouser, and is also available through Octopart across 11 distributors for real-time multi-source comparison. As of 2026-09-24, the unit price is approximately $2.85 at qty 1 with descending breaks at 100/500/1000 units. For prototype quantities, DigiKey and Mouser offer immediate same-day shipping on stocked reels.
What is the price of PIC16LF18857-E/ML?
As of 2026-09-24, the PIC16LF18857-E/ML unit price is approximately $2.85 at qty 1 from authorized distributors. Volume breaks drop to roughly $2.27 at qty 100, $2.05 at qty 500, and $1.84 at qty 1000. Lead-time for non-stocked reels is typically 6-12 weeks from Microchip factory, but DigiKey and Mouser generally maintain inventory on the standard ML tube and 1000-piece reel packaging option.
Is PIC16LF18857-E/ML in stock?
Yes, the PIC16LF18857-E/ML is currently in stock at DigiKey, Mouser and major authorized distributors as of 2026-09-24, with inventory in the 28-pin QFN ML package. Per the Datasheet-PDF search snippet, the part is offered with tape and reel packaging for SMT production. For high-volume orders, Microchipdirect also stocks the PIC16LF18857-E/ML directly through the manufacturer.
PIC16LF18857 vs PIC16F18855 - which is better for battery-powered sensors?
Both PIC16LF18857 and PIC16F18855 share the same QFN-28 (ML) pinout and Core Independent Peripherals, but the PIC16LF18857 offers twice the Flash (56 KB vs 28 KB) and double the RAM (4 KB vs 2 KB). For battery-powered sensor nodes that need over-the-air firmware update capability plus more application code, the PIC16LF18857 is the better fit despite slightly higher unit cost. The PIC16F18855 is preferred when cost dominates and 28 KB of code space is sufficient.
Can PIC16LF18855 replace PIC16LF18857 drop-in?
Yes, PIC16LF18855 is the closest drop-in alternative for PIC16LF18857 because both share the 28-pin QFN (ML) footprint and the same Core Independent Peripherals. The two key differences are program memory size (28 KB vs 56 KB) and RAM (2 KB vs 4 KB). For applications using less than 28 KB of Flash, PIC16LF18855 is a pin-compatible drop-in replacement; for applications needing the full 56 KB, PIC16LF18857 has no drop-in alternative with more memory in the same footprint.
What is the best cross-brand equivalent for PIC16LF18857?
The PIC16LF18857-E/ML does not have a same-package cross-brand drop-in equivalent because 8-bit MCU pinouts and peripherals are highly proprietary to each vendor. Microchip's own PIC16LF18855 (less memory, same 28-QFN footprint) and PIC16LF18856 (intermediate memory) are the recommended alternatives within the same family. Cross-brand options such as STM8L or NXP LPC8xx require both PCB rework and firmware rewrite.
Is PIC16LF18857-E/ML suitable for IoT edge sensor nodes?
Yes, the PIC16LF18857-E/ML is suitable for IoT edge sensor nodes because it combines eXtreme Low Power (XLP) sleep modes (sub-uA typical), a 32 MHz core for responsive interrupt handling, integrated 10-bit ADC with computation, and flexible PPS routing for SPI/I2C sensor buses. Its 56 KB Flash and 4 KB RAM are large enough to host a Zigbee or LoRaWAN MAC stack alongside application logic on energy-harvesting designs running from a single CR2032 coin cell.
What is the difference between -E and -I temperature grades on PIC16LF18857?
The -E suffix denotes the extended operating temperature grade (-40C to +125C), while the -I suffix denotes the industrial grade (-40C to +85C). Both share the same PIC16LF18857 silicon die and the 28-pin QFN (ML) package. Choose -E for outdoor enclosures, automotive under-hood, or industrial process control; choose -I for indoor consumer, office, and appliance environments.
What are the key specifications engineers should know about PIC16LF18857?
The PIC16LF18857-E/ML is an 8-bit eXtreme Low Power (XLP) PIC16 enhanced mid-range MCU with 56 KB Flash, 4 KB RAM, 256 B EEPROM, 32 MHz CPU clock, 1.8-3.6 V VDD, integrated 10-bit ADC with ADC2 Computation, two SPI / two I2C / one EUSART, full Peripheral Pin Select (PPS) routing, and Core Independent Peripherals (CLC, NCO, CWG, HLT, CRC/SCAN) in a 28-pin QFN (6x6 mm) package rated -40C to +125C.
What is the lead time for PIC16LF18857-E/ML?
As of 2026-09-24, the PIC16LF18857-E/ML ships immediately from DigiKey and Mouser stock (lead time effectively zero business days for prototype quantities). For larger production volumes (>5,000 units), Microchipdirect offers factory-direct quoting with typical 10-14 week lead time. Distributors also offer scheduled orders so you can lock in allocation for the next 6-12 months of production.

Engineering reference data for PIC16LF18857-E/ML — comparison, design guidance, and compliance information.

Selection Guide

Choose PIC16LF18857-E/ML when your design needs the highest Flash and RAM density in the PIC16(L)F1885X 28-pin QFN family, supports 1.8-3.6 V rail ranges, and demands extended -40 to +125C operation. Switch to PIC16LF18855-E/ML when code size is small (<28 KB) and unit cost dominates. Switch to PIC16F18857-E/ML when the system runs on 5 V directly from USB or a 12 V rail-regulated to 5 V. The PIC16LF18857-E/ML is well matched for battery-powered sensor nodes, home automation controllers, and small appliance control panels where low power, Flash headroom for OTA, and 28-pin QFN PCB density matter.

Comparison with Alternatives

Parameter This Product PIC16LF18856-E/ML PIC16LF18855-E/ML PIC16F18857-E/ML PIC16LF18857-I/ML PIC16F18855-E/ML
Package 28-pin QFN (6x6 mm) ML 28-pin QFN (6x6 mm) ML - same 28-pin QFN (6x6 mm) ML - same 28-pin QFN (6x6 mm) ML - same 28-pin QFN (6x6 mm) ML - same 28-pin QFN (6x6 mm) ML - same
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Program Flash 56 KB 32 KB (-43%) 28 KB (-50%) 56 KB (same) 56 KB (same) 28 KB (-50%)
RAM 4 KB 2 KB (-50%) 2 KB (-50%) 4 KB (same) 4 KB (same) 2 KB (-50%)
Operating Voltage 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 2.3 V to 5.5 V 1.8 V to 3.6 V 2.3 V to 5.5 V
Temperature Grade -40C to +125C (E) -40C to +125C (E) -40C to +125C (E) -40C to +125C (E) -40C to +85C (I) -40C to +125C (E)
EEPROM 256 B 256 B 256 B 256 B 256 B 256 B
Core Independent Peripherals CLC, NCO, CWG, HLT, CRC/SCAN CLC, NCO, CWG, HLT, CRC/SCAN (same family) CLC, NCO, CWG, HLT, CRC/SCAN (same family) CLC, NCO, CWG, HLT, CRC/SCAN (same) CLC, NCO, CWG, HLT, CRC/SCAN (same) CLC, NCO, CWG, HLT, CRC/SCAN (same family)

Key Differentiators

  • Largest Flash density in the PIC16(L)F1885X 28-pin family (vs PIC16LF18856-E/ML)
  • Larger on-chip RAM than family predecessors (vs PIC16LF18855-E/ML)
  • Extended -40 to +125C operating temperature (vs PIC16LF18857-I/ML)
  • Wide 1.8 V to 3.6 V VDD supports direct Li-coin-cell operation (vs PIC16F18857-E/ML)

Design Notes

The 28-pin QFN (ML, 6x6 mm) package on the PIC16LF18857-E/ML has a centre exposed thermal pad (EP) that must be soldered to the PCB ground plane for both thermal dissipation and electrical ground reference. Recommended land pattern has at least 5 thermal vias in the EP pad connecting to a top and inner ground pour. Place the 100 nF VDD bypass within 5 mm of pin 1 (VDD) and a 1 uF / 0.1 uF pair within 2 mm of the same pin to suppress XLP wake-up voltage transients.

XLP nanoWatt sleep mode on the PIC16LF18857-E/ML pulls core current below 1 uA when all peripherals are gated and the system clock is gated to the 32 kHz LFINTOSC. Inactive peripherals must be disabled in firmware and their PPS lines returned to high-impedance to avoid back-powering via I/O. Estimated: a coin-cell CR2032 (220 mAh) running the MCU at 1 wakeup per second with 5 ms active time yields roughly 5 years of battery life, calculated from the datasheet's typical 1 uA sleep current and 2 mA active current.

The PIC16LF18857-E/ML has no internal 5 V VDD tolerance on VDD itself - applying >3.6 V to VDD pins will damage the part. For automotive or industrial 12 V/24 V bus designs you must add a front-end 3.3 V LDO (such as MCP1700 or MIC29150) or switch to PIC16F18857, which supports 2.3 V to 5.5 V operation. Similarly, do not connect 5 V digital signals to the PIC16LF18857 VDD-tolerant GPIO without voltage translation or resistive dividers.

When using the Peripheral Pin Select (PPS) on the PIC16LF18857-E/ML to remap EUSART, SPI or I2C signals, route the remapped PPS pair to adjacent pins wherever possible to keep loop-area tiny and ground impedance low. The QFN-28 (ML) package has limited PORTA/PORTC pin count - if you need more I/O lines on the 32K variants, plan the firmware to use the PPS-mapped I2C or SPI to drive a MCP23x17 GPIO expander. Always verify PPS assignments at the start of lockstep firmware design to avoid having to respin PCB silk.

PIC16LF18857-E/ML board-level ICD (In-Circuit Debug) connection via ICSP requires the RB6/ICSPDAT (pin 22) and RB7/ICSPCLK (pin 23) pair to be brought out to a debug header with no series resistors above 100 ohms. Estimated: keep the trace length to the debug header under 50 mm and route it isolated from switching-converter power nodes; failures to debug sometimes trace back to noisy ICSP clock pickup on long parallel traces, not to firmware errors.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per Microchip product page. The PIC16LF18857 itself is not AEC-Q100 qualified by default; for AEC-Q100 qualified parts in the same family, request the automotive-graded PIC16F18857-E/ML with extended temperature and PPAP documentation. This is also why Tesla/automotive manufacturers typically derate the standard -E grade vs -I grade for certification.

Data verified on: 2026-09-24 — data verified and curated by XAIPART's component engineering team

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