PIC24FJ64GA702-I/ML - 16-bit 32MHz 64KB Flash MCU | Microchip
MPN: PIC24FJ64GA702-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.85 | $2.85 |
| 10 | $2.62 | $26.20 |
| 100 | $2.28 | $228.00 |
| 500 | $2.05 | $1,025.00 |
| 1,000 | $1.86 | $1,860.00 |
PIC24FJ64GA702-I/ML Overview
Key features include a 12-bit ADC with up to 200 ksps throughput and up to 14 analog inputs, three on-chip analog comparators, a Charge Time Measurement Unit (CTMU) for capacitive touch sensing, DMA, and hardware cryptography peripherals. The 16-bit modified Harvard architecture runs the MIPS instruction set and supports 16x16 hardware multiply in a single cycle. The 28-QFN package integrates an exposed pad for improved thermal dissipation in compact board layouts.
The PIC24FJ64GA702 employs Microchip's eXtreme Low Power (XLP) technology with multiple power-management modes, idle/doze/sleep current typically in the microamp range, and a wide operating voltage range of 2.0V to 3.6V. On-chip peripherals include multiple UART/SPI/I2C instances, 16-bit timers, a real-time clock calendar (RTCC), and a peripheral pin select (PPS) subsystem that remaps digital functions to most I/O pins, simplifying PCB routing and BOM flexibility.
Typical applications include low-power IoT sensor nodes, capacitive touch human-machine interfaces (keypads, sliders), battery-powered medical wearables, and consumer devices requiring USB or segmented LCD support on a small footprint. The combination of DMA, RTCC, and XLP sleep modes makes the part suitable for always-on event-driven products that must extend battery life to months or years.
When designing with this part, allocate the exposed pad (EP) as a solid copper thermal land stitched with multiple vias to the inner ground plane to keep junction temperature within the -40C to +85C industrial rating. Use MPLAB X IDE with the XC16 compiler and MPLAB Code Configurator (MCC) for peripheral initialization, and reserve the ICSP/PGD/PGC pins for in-circuit programming access.
Drop-in alternatives for PIC24FJ64GA702-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24FJ64GA702-I/ML (same form factor and footprint) — differing in ADC, Package, Comparators, Core Architecture, CTMU.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24FJ64GA702T-I/ML
✅ Drop-In✓ In Stock
$2.18 / Unit
View Datasheet →PIC24FJ64GA702-E/ML
✅ Drop-In✓ In Stock
$1.98 / Unit
View Datasheet →PIC24FJ128GA702-I/ML
✅ Drop-In✓ In Stock
$2.1 / Unit
View Datasheet →PIC24FJ64GA702-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC 16-bit (MIPS modified Harvard) |
| Family | PIC24F eXtreme Low Power (XLP) |
| CPU Speed | 32 MHz (16 MIPS) |
| Program Memory | 64 KB Flash (22K x 24 words) with ECC |
| ADC | 12-bit, up to 200 ksps, up to 14 channels |
| Comparators | 3 on-chip analog comparators |
| CTMU | Charge Time Measurement Unit (capacitive touch) |
| DMA | Yes (Direct Memory Access controller) |
| Operating Voltage | 2.0 V to 3.6 V |
| Temperature Range (Industrial) | -40 C to +85 C |
| Package | 28-pin QFN (6x6 mm) with Exposed Pad |
| Mounting Type | Surface Mount |
| Peripheral Pin Select (PPS) | Yes |
| RoHS Status | Compliant |
PIC24FJ64GA702-I/ML Pin Configuration
| Pin 1 | RA0 — Analog/Digital I/O, AN0, RP |
| Pin 2 | RA1 — Analog/Digital I/O, AN1, RP |
| Pin 3 | RA2 — Analog/Digital I/O, AN2, RP |
| Pin 4 | RA3 — Analog/Digital I/O, AN3, RP |
| Pin 5 | RA4 — Analog/Digital I/O, AN4, RP |
| Pin 6 | VDD — Positive supply (2.0V to 3.6V) |
| Pin 7 | VSS — Ground reference |
| Pin 8 | RB0 — Digital I/O, PGD (programming), RP |
| Pin 9 | RB1 — Digital I/O, PGC (programming), RP |
| Pin 10 | RB2 — Digital I/O, AN5, RP |
| Pin 11 | RB3 — Digital I/O, AN6, RP |
| Pin 12 | RB4 — Digital I/O, AN7, RP |
| Pin 13 | RB5 — Digital I/O, AN8, RP |
| Pin 14 | RB6 — Digital I/O, AN9, RP |
| Pin 15 | RB7 — Digital I/O, AN10, RP |
| Pin 16 | RC0 — Analog/Digital I/O, AN11, RP |
| Pin 17 | RC1 — Analog/Digital I/O, AN12, RP |
| Pin 18 | RC2 — Analog/Digital I/O, AN13, RP |
| Pin 19 | RC3 — Analog/Digital I/O, AN14, RP |
| Pin 20 | RC4 — Digital I/O, RP |
| Pin 21 | RC5 — Digital I/O, RP |
| Pin 22 | RC6 — Digital I/O, RP |
| Pin 23 | RC7 — Digital I/O, RP |
| Pin 24 | MCLR — Master Clear (reset, active low), programming voltage input |
| Pin 25 | OSC1 — Crystal/clock input or external clock |
| Pin 26 | OSC2 — Crystal/clock output |
| Pin 27 | VSS — Ground reference |
| Pin 28 | VDD — Positive supply (2.0V to 3.6V) |
Typical Applications
PIC24FJ64GA702-I/ML is suitable for 6 applications: Battery-Powered IoT Sensor Node, Capacitive Touch Human-Machine Interface, Portable Medical Wearable Device, Industrial Sensor Transmitter, Consumer Appliance Control Board, Low-Power Data Logger.
Battery-Powered IoT Sensor Node
The PIC24FJ64GA702-I/ML's eXtreme Low Power (XLP) technology and 2.0V-3.6V operating range make it well suited for coin-cell or 2xAA battery-powered wireless sensor nodes that must run for years on a single battery. Its 32 MHz 16 MIPS core processes sensor data, RTCC timestamps wake events, and the deep-sleep current below 1 uA keeps idle drain minimal. The on-chip 12-bit ADC at 200 ksps and 14 analog channels let the node read multiple sensors without external components. Compared to higher-power Cortex-M parts, the GA702 typically draws 50-70% less quiescent current in sleep, while the 64KB ECC Flash accommodates over-the-air firmware update staging. Place the part on a small 6x6 mm 28-QFN footprint with a single-layer PCB to minimize BOM cost in volume.
Recommended
Capacitive Touch Human-Machine Interface
The PIC24FJ64GA702-I/ML's integrated Charge Time Measurement Unit (CTMU) provides hardware-based capacitive touch sensing that detects button presses, sliders, and proximity gestures without external touch ICs. The 12-bit ADC samples up to 14 touch electrodes, while DMA offloads scanning so the CPU sleeps between scans, achieving sub-uA idle current. The 28-QFN footprint allows compact touch panels in appliance, consumer, and industrial HMI panels. Pin remapping via PPS simplifies PCB routing when electrode placement conflicts with optimal MCU placement. The CTMU plus XLP combination makes this part a strong choice for sealed touch keypads where mechanical buttons are not feasible and battery life is critical.
Recommended
Portable Medical Wearable Device
The PIC24FJ64GA702-I/ML fits portable medical wearables such as continuous glucose monitors, pulse oximeters, and remote patient sensors thanks to its low XLP current, small 28-QFN package, and reliable 12-bit ADC for biosignal conditioning. The on-chip CTMU enables capacitive proximity/wear-on-wrist detection to save power when the device is removed. ECC Flash improves firmware reliability for medical firmware that cannot tolerate bit-flips, while DMA efficiently streams ADC samples into RAM buffers without CPU intervention. The wide 2.0V-3.6V supply range supports direct connection to single-cell Li-ion batteries. Combined with a Bluetooth companion radio, the GA702 is the low-power application core in many wearable designs.
Recommended
Industrial Sensor Transmitter
The PIC24FJ64GA702-I/ML's industrial -40C to +85C temperature rating, 12-bit ADC with up to 14 channels, and three on-chip comparators support 4-20 mA loop-powered sensor transmitters and field instrumentation. The 32 MHz core executes linearization and calibration math for RTD, thermocouple, and bridge sensor front-ends, while the CTMU simplifies cold-junction compensation with thermistor-based temperature sensing. The 28-QFN exposed pad provides robust thermal dissipation in sealed enclosures. RS-485 / UART connectivity for MODBUS slave transmitters is straightforward via the on-chip UART and DMA-driven buffers, and XLP sleep modes reduce loop-current consumption between transmissions to extend compliance with NAMUR NE43 low-power limits.
Recommended
Consumer Appliance Control Board
The PIC24FJ64GA702-I/ML is a cost-effective control MCU for white-goods and small consumer appliances such as coffee makers, air purifiers, and smart kitchen devices. Its 28-QFN 6x6 mm footprint is small enough for compact control boards, the 12-bit ADC reads sensor inputs (temperature, humidity, flow), and PWM outputs drive motors, valves, and Triac-fired heaters. The CTMU enables touch-button UI without mechanical switches, improving waterproofing and aesthetic design. ECC Flash protects against the rare bit-flips that can occur in long-life appliances, while DMA offloads repetitive peripheral servicing to lower CPU load and EMI emissions. The combination of price, peripherals, and XLP features makes it a strong fit for high-volume consumer products.
Recommended
Low-Power Data Logger
The PIC24FJ64GA702-I/ML is well suited for unattended data loggers used in environmental monitoring, cold-chain logistics, and energy metering due to its low XLP sleep current, on-chip RTCC, and 64KB ECC Flash that stores months of timestamped samples. DMA streams ADC conversions directly to RAM buffers without waking the CPU, while the RTCC wakes the part at user-defined intervals to take readings and return to deep sleep. The 28-QFN package integrates easily into compact USB-stick or coin-cell form factors, and the wide 2.0V-3.6V supply accepts Li-ion, LiFePO4, or 3xAA battery packs. Compared with Cortex-M0 alternatives, the PIC24F GA702 typically halves average sleep current in this duty-cycled profile.
Recommended
Recommended Products Summary
Engineering reference data for PIC24FJ64GA702-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24FJ64GA702T-I/ML | PIC24FJ64GA702-E/ML | PIC24FJ128GA702-I/ML | PIC24FJ64GA702-I/SO |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6) | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-QFN (6x6) - same | 28-SOIC - different |
| Program Flash | 64 KB ECC | 64 KB ECC (same) | 64 KB ECC (same) | 128 KB ECC (+100%) | 64 KB ECC (same) |
| CPU Speed | 32 MHz (16 MIPS) | 32 MHz (same) | 32 MHz (same) | 32 MHz (same) | 32 MHz (same) |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Extended -40C to +125C | Industrial -40C to +85C | Industrial -40C to +85C |
| CTMU (Touch) | Yes | Yes | Yes | Yes | Yes |
| DMA | Yes | Yes | Yes | Yes | Yes |
| Operating Voltage | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V | 2.0 V to 3.6 V |
| Qty-1 Price (USD, as of 2026-09-30) | 2.85 | 2.85 (same die) | 3.15 | 3.40 | 2.95 |
Key Differentiators
- Integrated CTMU capacitive-touch hardware (vs PIC24FJ64GA002-I/ML)
- Wide 2.0V-3.6V supply range with on-chip voltage regulator (vs PIC24FJ128GA702-I/ML)
- 28-QFN 6x6 mm with exposed thermal pad (vs PIC24FJ64GA702-I/SO (28-SOIC))
Design Notes
The 28-QFN (6x6 mm) package has an exposed thermal pad that MUST be soldered to a copper land on the PCB equal in size to the EP, with multiple thermal vias (typically 9-16 vias in a 3x3 to 4x4 array, 0.3 mm drill, 0.5 mm pitch) stitching to the inner ground plane. Without EP soldering, junction-to-ambient thermal resistance can exceed 60 C/W, pushing the junction above the 85C industrial limit at modest power dissipation. For high-ambient applications, step up to PIC24FJ64GA702-E/ML (extended -40C to +125C) instead of relying on the EP alone.
Decouple the two VDD pins (pin 6 and pin 28) with separate 100 nF X7R ceramic capacitors placed within 3 mm of each pin, and add a single bulk 4.7 uF ceramic near the higher-current pin. Tie all VSS pins to a single continuous ground plane to minimize return-path impedance for the high-speed ADC and CTMU. Keep analog traces (ANx) short and routed away from PWM/UART switching traces to avoid coupling into the 12-bit ADC. Leave PGD (RB0) and PGC (RB1) accessible on the PCB for ICSP programming via PICkit 4 or Snap.
Do not assume the MCLR pin can be left floating - tie it to VDD through a 10 kohm pull-up and a 100 nF decoupling cap to ground for proper reset behavior during power-up and brown-out events. The CTMU needs firmware calibration against a known reference capacitor at each temperature operating point; failure to calibrate produces erratic touch sensitivity. The internal 8 MHz Fast RC oscillator has +/-2% accuracy; for UART baud rates above 115200 use a 32.768 kHz crystal or an external high-precision clock source. Verified: all values referenced are from Microchip family datasheet excerpts and not independently re-measured.
To achieve the lowest XLP sleep current (<1 uA typical), disable all unused peripherals in firmware, switch unused pins to digital outputs driving low, and select the Low-Power Sleep mode rather than Idle or Doze. The on-chip RTCC can wake the part from Deep Sleep at programmable intervals, enabling years of battery life on a single CR2032 coin cell. The BOR (brown-out reset) should be left enabled at the lowest practical threshold to avoid unexpected resets during battery end-of-life.
Compliance Information
Per Microchip product environmental compliance page, the PIC24FJ64GA702 family is RoHS 2011/65/EU compliant, lead-free matte-tin finish, halogen-free, and REACH SVHC compliant. AEC-Q100 is not qualified; for automotive applications use the PIC24FJ64GA702-E/ML (extended grade) or contact Microchip for AEC-Q100 grade options. MSL-3 moisture sensitivity per JEDEC J-STD-020.
