PIC18F25Q10-I/SO - 32KB Flash 8-bit MCU, 28-SOIC | Microchip
MPN: PIC18F25Q10-I/SO ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.95 | $2.95 |
| 10 | $2.55 | $25.50 |
| 100 | $2.18 | $218.00 |
| 500 | $1.86 | $930.00 |
| 1,000 | $1.62 | $1,620.00 |
| 3,000 | $1.39 | $4,170.00 |
PIC18F25Q10-I/SO Overview
An 8-bit microcontroller (MCU) is a single-chip computer built around an 8-bit data path that integrates a CPU, non-volatile program memory, RAM, peripherals and I/O on one die. PIC18F "Q10" devices sit in Microchip's mid-range PIC18 family, which itself belongs to the 8-bit MCU category, and they target robust real-time control, sensor interfacing and low-power connected nodes with 5V operation for increased noise immunity in harsh industrial environments.
Key specifications include a 10-bit ADC2 (Analog-to-Digital Converter with Computation) supporting Capacitive Voltage Divider (CVD) touch sensing, a 5-/8-bit DAC, two comparators, a 10-bit PWM with complementary outputs and a Configurable Logic Cell (CLC), alongside Core Independent Peripherals (CIPs) such as CWG, HLT, WWDT, CRC/SCAN and a hardware RTCC. The device operates from 1.8V to 5.5V (functional) and supports 5V rail operation directly, eliminating level shifters in many industrial designs.
Architecturally the PIC18F25Q10 uses an enhanced Harvard architecture with a 16-bit instruction word, a hardware multiply and a 31-level hardware stack. The ADC2 block performs automated averaging, oversampling and threshold comparisons in hardware, offloading CPU cycles - useful for touch sensing and sensor fusion at low power. eXtreme Low Power (XLP) sleep currents and IDLE/DOZE modes extend battery life on sensor nodes.
Typical applications include IoT sensor nodes, industrial touch-button panels, motor and BLDC control loops, HVAC controllers, and consumer device user interfaces. Designers also use the part in automotive body and interior modules under 5V environments where the larger PIC18F ecosystem, MPLAB X IDE support and a deep toolchain accelerate development.
A key design consideration when selecting this MCU is pin compatibility with the smaller-memory PIC18F24Q10 in the same 28-SOIC footprint, enabling scalable designs with one PCB that can be populated with either density at low cost. Always validate ADC2 sampling time against source impedance to avoid conversion noise.
This page synthesizes XAIPART distributor pricing, drop-in pin-compatible alternatives and practical PCB design notes not found in the manufacturer datasheet, helping engineers evaluate and source the PIC18F25Q10-I/SO efficiently.
Drop-in alternatives for PIC18F25Q10-I/SO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18F25Q10-I/SO (same form factor and footprint) — differing in ADC, Package, DAC, Family, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18F24Q10-I/SO
✅ Drop-In✓ In Stock
$1.08 / Unit
View Datasheet →PIC18F25Q10-I/SP
✅ Drop-In✓ In Stock
$2.71 / Unit
View Datasheet →PIC18F25Q10-E/SO
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC18F25Q10-I/SS
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F25Q10-I/SO Maximum Ratings & Electrical Characteristics
| Family | PIC18F "Q10" mid-range 8-bit MCU |
| Core Architecture | PIC18 Harvard, 8-bit data path, 16-bit instructions |
| Maximum CPU Speed | 64 MIPS at 64 MHz |
| Program Flash Memory | 32 KB |
| SRAM | 2 KB |
| EEPROM | 256 bytes |
| ADC | 10-bit ADC2 with Computation (CVD support) |
| DAC | 5-/8-bit DAC |
| Comparators | 2 |
| PWM | 10-bit PWM with complementary outputs |
| Operating Voltage Range | 1.8 V to 5.5 V |
| Operating Temperature Range | -40C to +85C (industrial) |
| Package | 28-pin SOIC (wide body, 7.50 mm) |
| I/O Pins | 25 |
| Low-Power Modes | XLP IDLE/DOZE, Sleep, Peripheral Module Disable |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
PIC18F25Q10-I/SO Pin Configuration
| Pin 1 | RA0/AN0 — Digital I/O / Analog input channel 0 |
| Pin 2 | RA1/AN1 — Digital I/O / Analog input channel 1 |
| Pin 3 | RA2/AN2 — Digital I/O / Analog input channel 2 |
| Pin 4 | RA3/AN3 — Digital I/O / Analog input channel 3 |
| Pin 5 | RA4/AN4 — Digital I/O / Analog input channel 4 |
| Pin 6 | RA5/AN5 — Digital I/O / Analog input channel 5 |
| Pin 7 | RA6/AN6 — Digital I/O / Analog input channel 6 |
| Pin 8 | RA7/AN7 — Digital I/O / Analog input channel 7 |
| Pin 9 | VSS — Ground reference |
| Pin 10 | VDD — Positive supply (1.8 V to 5.5 V) |
| Pin 11 | RB0/INT0 — Digital I/O / External interrupt 0 |
| Pin 12 | RB1/INT1 — Digital I/O / External interrupt 1 |
| Pin 13 | RB2/INT2 — Digital I/O / External interrupt 2 |
| Pin 14 | RB3 — Digital I/O |
| Pin 15 | RB4 — Digital I/O |
| Pin 16 | RB5 — Digital I/O |
| Pin 17 | RB6/ICSPCLK — Digital I/O / ICSP programming clock |
| Pin 18 | RB7/ICSPDAT — Digital I/O / ICSP programming data |
| Pin 19 | RC0 — Digital I/O |
| Pin 20 | RC1 — Digital I/O |
| Pin 21 | RC2 — Digital I/O |
| Pin 22 | RC3 — Digital I/O |
| Pin 23 | RC4 — Digital I/O |
| Pin 24 | RC5 — Digital I/O |
| Pin 25 | RC6 — Digital I/O |
| Pin 26 | RC7 — Digital I/O |
| Pin 27 | RE3/MCLR — Master Clear (reset) / Digital I/O |
| Pin 28 | OSC1/CLKI — Crystal oscillator input / external clock input |
Typical Applications
PIC18F25Q10-I/SO is suitable for 6 applications: Industrial IoT Sensor Nodes, Touch-Sensing User Interfaces, BLDC and DC Motor Control Loops, HVAC and Building Automation Controllers, Automotive Body and Interior Modules, Consumer Appliance User Interfaces.
Industrial IoT Sensor Nodes
The PIC18F25Q10-I/SO fits IoT sensor nodes because its XLP Sleep current of about 20 nA (typical) preserves battery life while the ADC2 with Computation automates averaging and oversampling of temperature, humidity or analog gas-sensor channels. The 32 KB Flash holds Wi-Fi/BLE co-processor command stacks and application code, 2 KB SRAM buffers logged events, and the CLC block implements custom glue logic without a CPLD. Engineers typically pair it with the MCP9808 temperature sensor and an RN4871 BLE module on a 3.3-5V coin-cell or 2xAA supply, achieving multi-year battery life. Compared with 32-bit Cortex-M0+ parts at the same node, the PIC18F25Q10 reduces BOM cost while keeping deterministic 8-bit timing.
Recommended
Touch-Sensing User Interfaces
The ADC2 with built-in Capacitive Voltage Divider (CVD) support and configurable hardware averaging makes the PIC18F25Q10-I/SO ideal for capacitive touch buttons, sliders and proximity sensors in industrial and consumer HMI panels. Hardware CVD performs auto-calibration and noise immunity compensation in the peripheral, freeing the CPU from interrupt-heavy scan loops and cutting average scan power. Designers route PCB pad capacitors to dedicated ADC channels and tune the CWG/timer blocks for spread-spectrum drive to pass IEC 61000-4-6 conducted-noise tests. Twenty-five I/O allow up to 12 touch channels plus LEDs and encoder inputs, suiting appliance control panels.
Recommended
BLDC and DC Motor Control Loops
The PIC18F25Q10-I/SO drives small BLDC and brushed DC motors in fans, pumps and appliance actuators using its 10-bit PWM with complementary outputs, configurable dead-band and the CWG (Complementary Waveform Generator) peripheral. With 64 MIPS the MCU closes PI current and speed loops in under 5 us, while the CLC blocks wire fault-protection logic that would otherwise need discrete gates. A 5V-native ADC front end also reads current-sense amplifiers directly without level shifting. Designers pair it with the MCP8025 3-phase BLDC gate driver and use the comparator inputs for back-EMF zero-cross detection at low RPM, enabling sensorless trapezoidal control.
Recommended
HVAC and Building Automation Controllers
The PIC18F25Q10-I/SO suits HVAC and building-automation thermostats, damper actuators and wireless sensor endpoints due to its industrial -40C to +85C rating and 5V tolerance on all I/O. The 10-bit ADC reads thermistor/resistive temperature bridges, the comparators perform zero-cross detection for triac-driven heater stages, and the CWG generates accurate 50/60 Hz time bases for line-synchronized control. Designers use the on-chip RTCC with battery backup for accurate scheduling and the WWDT for code-flow watchdog. Combined with MCP2551 CAN or RN2483 LoRa transceivers, the controller becomes a connected edge node of a building-automation system.
Recommended
Automotive Body and Interior Modules
Within 5V automotive body and interior modules (lighting controls, seat controllers, climate panels, instrument-cluster periphery), the PIC18F25Q10-I/SO is appropriate when the design stays inside the industrial -40C to +85C window and 5V rails. The PWM and CWG drive LED arrays and small motors, while the ADC2 reads potentiometers and switches. Designers adopt the -E extended-temp part for under-hood scenarios. Microchip's AEC-Q100-qualified PIC18F25Q10-I/SO family is widely supported with CAN/LIN firmware stacks, allowing engineers to reuse code across both 8-bit and 16-bit dsPIC siblings.
Recommended
Consumer Appliance User Interfaces
Consumer appliances - coffee machines, dishwashers, induction cooktops and smart kitchen displays - use the PIC18F25Q10-I/SO as a low-cost display and control hub. The CLC and PWM drive segmented LCD or LED displays, the ADC2 implements capacitive touch pads, and the DAC generates audio cues for prompts. With 32 KB Flash it stores localized UI strings and sensor-fusion code, and the RTCC handles wash-cycle scheduling. The wide 1.8-5.5V supply lets the same PCB scale from single-cell Li-Ion to mains-rectified 5V rails without changes to firmware.
Recommended
Recommended Products Summary
Engineering reference data for PIC18F25Q10-I/SO — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18F24Q10-I/SO | PIC18F25Q10-I/SP | PIC18F25Q10-E/SO | PIC18F25Q10-I/SS |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-SOIC | 28-SOIC - same footprint | 28-SPDIP - through-hole, pin-compatible | 28-SOIC - same footprint | 28-SSOP - smaller pitch, NOT footprint-compatible without PCB change |
| Program Flash | 32 KB | 16 KB (-50%) | 32 KB (identical) | 32 KB (identical) | 32 KB (identical) |
| SRAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| CPU Speed | 64 MIPS at 64 MHz | 64 MIPS at 64 MHz | 64 MIPS at 64 MHz | 64 MIPS at 64 MHz | 64 MIPS at 64 MHz |
| Operating Temperature | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C (industrial) |
| ADC | 10-bit ADC2 with CVD | 10-bit ADC2 with CVD | 10-bit ADC2 with CVD | 10-bit ADC2 with CVD | 10-bit ADC2 with CVD |
| PWM | 10-bit PWM with complementary outputs | 10-bit PWM with complementary outputs | 10-bit PWM with complementary outputs | 10-bit PWM with complementary outputs | 10-bit PWM with complementary outputs |
| I/O Pins | 25 | 25 | 25 | 25 | 25 |
Key Differentiators
- ADC2 with Computation and CVD support (vs PIC18F25K80-I/SO)
- Configurable Logic Cell (CLC) integrated (vs PIC18F25K83-I/SO)
- 5V-native I/O tolerance (vs STM8S003F3 (ST equivalent class))
Design Notes
Estimated: at full 64 MIPS the core draws roughly 11 mA from a 5V supply; XLP Sleep drops this to ~20 nA typical with PMD on. Add a 100 nF ceramic bypass within 5 mm of VDD (pin 10) and a 10 uF bulk capacitor on the same rail to handle HFINTOSC bursts. For 1.8V operation ensure VDD rise time meets datasheet Power-on Reset timing (< 1 ms) by using a regulated LDO rather than high-impedance divider.
Route the ICSP clock/data traces (RB6/RB7) directly to a 2x3 or 1x6 pin header with no series resistors for production programming. Keep the MCLR pull-up (typically 10 kOhm) within 10 mm of pin 27 and place a 100 nF cap on MCLR if hardware-reset noise is observed. Crystal traces for OSC1/OSC2 should be short (< 10 mm) and guarded with a ground ring if accuracy over 1% is required.
Critical: when migrating from PIC18F25K80 to PIC18F25Q10, the configuration bits (CONFIG registers) change - the legacy 0x3F3F default is not valid on Q10, which uses the new XB18F25Q10 config macros. Always regenerate config fuses with MPLAB X IDE, not copy-paste from a K80 project. Failure to do so results in unprogrammed BOR/WDT and watchdog-induced resets at startup.
Place the ADC reference decoupling (0.1 uF + 10 uF) close to the VREF+/AVDD pins (when used). Separate analog and digital ground returns to a single point near the IC, and avoid routing PWM or switching signals under the analog section. Estimated: with 25 cm of mixed-signal traces, applying a 6.6 mm ground pour reduces reference noise by ~6 dB versus split-plane approaches.
Estimated: at industrial -40C to +85C range the SOIC-28 package theta_JA of approximately 50 C/W on a 2 oz 4-layer FR-4 board allows ~1.2 W dissipation before derating. At 5V with 64 MIPS full load the device dissipates ~0.2 W well below the limit. No heatsink is needed, but ensure copper area below exposed pads is connected to GND for thermal spreading.
Compliance Information
RoHS and REACH compliant per Microchip product page; standard PIC18F25Q10-I/SO is not AEC-Q100 qualified (consult PIC18F25Q10-E/SO for extended temperature; AEC-Q100 variants are within Microchip's separate automotive part number range).
