PIC18F47K40-E/MV - 8-bit 64MHz 128KB Flash MCU | Microchip
MPN: PIC18F47K40-E/MV ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.95 | $3.95 |
| 10 | $3.55 | $35.50 |
| 100 | $3.16 | $316.00 |
| 500 | $2.84 | $1,420.00 |
| 1,000 | $2.55 | $2,550.00 |
PIC18F47K40-E/MV Overview
A microcontroller (MCU) such as the PIC18F47K40 is a single-chip computer that integrates a CPU, non-volatile program memory (Flash), volatile data memory (SRAM), EEPROM, digital I/O and analog peripherals onto one die. It belongs to the product hierarchy MCU -> microcontroller -> 8-bit microcontroller -> RISC microcontroller -> embedded controller -> semiconductor. The XLP (eXtreme Low Power) family targets battery-powered and energy-harvesting designs where nano-amp sleep currents are mandatory.
Key features include 256 bytes of EEPROM, an instruction set optimized for C compilers, Peripheral Pin Select (PPS) for flexible signal routing, Hardware CVD for capacitive touch, Zero-Cross Detect, and the extended (-40C to +125C) operating temperature range indicated by the "-E" suffix. The "MV" suffix indicates the 40-pin UQFN (5x5 mm) package with an exposed thermal pad. The 64 MHz internal oscillator and 4 KB of SRAM enable complex state machines and small RTOS implementations without external memory.
Typical applications are general-purpose embedded control, capacitive touch user interfaces (buttons, sliders, proximity), home appliance controls, IoT sensor nodes, low-power metering, and small motor / LED lighting controllers. The rich Core Independent Peripheral (CIP) mix lets the CPU remain in sleep for most tasks, dramatically reducing average current draw and extending battery life.
When designing with the MV package, leave the exposed pad soldered to a continuous ground pour to meet thermal and electrical performance; both VDD and the pad must be connected for correct ADC and EEPROM operation. Add a 0.1 uF decoupling capacitor adjacent to every VDD pin and bulk 10 uF near the regulator.
Drop-in alternatives for PIC18F47K40-E/MV — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC18F47K40-E/MV (same form factor and footprint) — differing in ADC, Operating Temperature, Package, Comparators, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC18F47K40-I/MV
✅ Drop-In📋 Reference alternative (not in catalog)
PIC18F47K40T-I/MV
✅ Drop-In✓ In Stock
$2.51 / Unit
View Datasheet →PIC18F46K40-E/MV
✅ Drop-In✓ In Stock
$1.86 / Unit
View Datasheet →PIC18F46K40-I/ML
✅ Drop-In✓ In Stock
$2.55 / Unit
View Datasheet →PIC18F46K42-E/P
✅ Drop-In✓ In Stock
$2.41 / Unit
View Datasheet →PIC18F47K40-E/MV Maximum Ratings & Electrical Characteristics
| Device Family | PIC18 XLP |
| Core Size | 8-bit |
| Maximum CPU Clock | 64 MHz |
| Program Memory (Flash) | 128 KB (64K x 16) |
| Data Memory (SRAM) | 4 KB |
| Data EEPROM | 256 bytes |
| Package | 40-pin UQFN (MV) 5x5 mm with exposed pad |
| ADC | 10-bit with Computation (ADCC) |
| DAC | 5-bit |
| Comparators | Yes |
| PWM / CCP / CWG | Yes |
| Windowed Watchdog (WWDT) | Yes |
| Memory Scan / CRC | Yes |
| Peripheral Pin Select (PPS) | Yes |
| Hardware CVD (Capacitive Touch) | Yes |
| Zero-Cross Detect | Yes |
| Operating Temperature | -40C to +125C (extended, "-E" suffix) |
| Mounting Type | Surface Mount |
PIC18F47K40-E/MV Pin Configuration
| Pin 1 | RE3/MCLR/VPP — Digital input RE3, master clear input or programming voltage |
| Pin 2 | RA0 — Port A bit 0 / analog input |
| Pin 3 | RA1 — Port A bit 1 / analog input |
| Pin 4 | RA2 — Port A bit 2 / analog input |
| Pin 5 | RA3 — Port A bit 3 / analog input |
| Pin 6 | RA4 — Port A bit 4 / analog input |
| Pin 7 | RA5 — Port A bit 5 / analog input |
| Pin 8 | RA6 — Port A bit 6 / analog input |
| Pin 9 | RA7 — Port A bit 7 / analog input |
| Pin 10 | VSS — Ground |
| Pin 11 | VDD — Positive supply voltage |
| Pin 12 | RB0 — Port B bit 0 / analog input |
| Pin 13 | RB1 — Port B bit 1 / analog input |
| Pin 14 | RB2 — Port B bit 2 / analog input |
| Pin 15 | RB3 — Port B bit 3 / analog input |
| Pin 16 | RB4 — Port B bit 4 / analog input |
| Pin 17 | RB5 — Port B bit 5 / analog input |
| Pin 18 | RB6 — Port B bit 6 / ICS PGC |
| Pin 19 | RB7 — Port B bit 7 / ICS PGD |
| Pin 20 | VSS — Ground |
| Pin 21 | VDD — Positive supply voltage |
| Pin 22 | RC0 — Port C bit 0 / analog input |
| Pin 23 | RC1 — Port C bit 1 / analog input |
| Pin 24 | RC2 — Port C bit 2 / analog input |
| Pin 25 | RC3 — Port C bit 3 / analog input |
| Pin 26 | RC4 — Port C bit 4 / analog input |
| Pin 27 | RC5 — Port C bit 5 / analog input |
| Pin 28 | RC6 — Port C bit 6 / analog input |
| Pin 29 | RC7 — Port C bit 7 / analog input |
| Pin 30 | VSS — Ground |
| Pin 31 | VDD — Positive supply voltage |
| Pin 32 | RD0 — Port D bit 0 / analog input |
| Pin 33 | RD1 — Port D bit 1 / analog input |
| Pin 34 | RD2 — Port D bit 2 / analog input |
| Pin 35 | RD3 — Port D bit 3 / analog input |
| Pin 36 | RD4 — Port D bit 4 / analog input |
| Pin 37 | RD5 — Port D bit 5 / analog input |
| Pin 38 | RD6 — Port D bit 6 / analog input |
| Pin 39 | RD7 — Port D bit 7 / analog input |
| Pin 40 | RE0 — Port E bit 0 / analog input |
| Pin EP | EP — Exposed thermal pad - must be soldered to ground per JEDEC MO-220 |
Typical Applications
PIC18F47K40-E/MV is suitable for 6 applications: Capacitive Touch User Interface, Low-Power IoT Sensor Node, Home Appliance Control, Industrial Sensor and Metering, LED Lighting and Display Drivers, Automotive Interior and Aftermarket.
Capacitive Touch User Interface
The PIC18F47K40-E/MV's Hardware CVD (Capacitive Voltage Divider) automates touch-sensing acquisition on its 10-bit ADCC, enabling robust button, slider and wheel implementations without an external touch controller. Combined with Peripheral Pin Select (PPS) which lets touch channels remap to any spare digital I/O, the part reduces BOM cost for HMI front panels and reduces PCB area by integrating touch and control on one die.
Recommended
Low-Power IoT Sensor Node
XLP technology with nanoWatt sleep currents and a 64 MHz HFINTOSC makes the PIC18F47K40-E/MV attractive for battery-powered sensor nodes transmitting periodically over UART, I2C or SPI. The 128 KB Flash and 4 KB SRAM comfortably fit small TCP/IP or BLE command stacks; Windowed WDT and Memory Scan/CRC ensure housekeeping robustness. With MCU current in the microamp range during sleep, typical coin-cell life exceeds one year for sub-Hz update rates.
Recommended
Home Appliance Control
Appliance front panels, washing-machine motor sequencers and dishwasher user interfaces need extended temperature operation and CIP peripherals for HMI, motor control and safety monitoring. The PIC18F47K40-E/MV's -40C to +125C rating, 10-bit ADC, comparators, PWM/CCP/CWG, and WWDT address every typical appliance block. Its 5x5 mm UQFN footprint fits small boards behind displays, enabling direct replacement of older 40-pin DIP control boards after PCB rework.
Recommended
Industrial Sensor and Metering
Industrial pressure, flow and gas-metering modules demand extended temperature, deterministic CIP peripherals, and reliable EEPROM storage for calibration. The PIC18F47K40-E/MV's 10-bit ADCC with computation hardware, Zero-Cross Detect for triac-based AC control, and 256-byte EEPROM suit metering designs that must retain trim values across power cycles. PPS allows field upgrades that repurpose existing pins for new sensors without hardware rework.
Recommended
LED Lighting and Display Drivers
The PIC18F47K40-E/MV integrates the CWG (Complementary Waveform Generator) and multiple PWM/CCP peripherals suitable for dimmable LED drivers, RGB color engines, and small LCD bias supplies. The 10-bit ADC with computation automates brightness feedback and color mixing loops, freeing the CPU to run user-space protocols. With 4 KB SRAM and 128 KB Flash, designers can embed multiple standard lighting profiles in a single firmware image.
Recommended
Automotive Interior and Aftermarket
Although not AEC-Q100 qualified, the PIC18F47K40-E/MV's extended -40C to +125C range and CAN-friendly peripherals make it popular for aftermarket dashboards, alarm modules and HID lighting controllers. Designers must validate AEC-Q100 status for OEM automotive programs, but the part's CIP set is functionally identical to higher-tier PIC18 K40 automotive derivatives. Its compact UQFN footprint fits sealed modules where 40-pin DIP would be impractical.
Recommended
Recommended Products Summary
Engineering reference data for PIC18F47K40-E/MV — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC18F47K40-I/MV | PIC18F47K40T-I/MV | PIC18F46K40-E/MV | PIC18F46K40-I/ML | PIC18F46K42-E/P |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 40-pin UQFN (MV) | 40-pin UQFN (MV) | 40-pin UQFN (MV) | 40-pin UQFN (MV) | 44-pin QFN (ML) | 40-pin PDIP (P) |
| Flash Memory | 128 KB | 128 KB | 128 KB | 64 KB (-50%) | 64 KB (-50%) | 64 KB (-50%) |
| SRAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| EEPROM | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes | 256 bytes |
| Maximum CPU Clock | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +85C | -40C to +125C |
| Peripheral Pin Select | Yes | Yes | Yes | Yes | Yes | Yes |
| Hardware CVD / Touch | Yes | Yes | Yes | Yes | Yes | Yes |
Key Differentiators
- Maximum memory density in the MV package (vs PIC18F46K40-E/MV)
- Extended temperature rating as standard (vs PIC18F47K40-I/MV)
- Core Independent Peripherals (CIP) integration (vs PIC18F47K40T-I/MV)
Design Notes
Estimated: for a 64 MHz HFINTOSC active current budget, place a 0.1 uF ceramic decoupling capacitor within 2 mm of every VDD pin (pins 11, 21 and 31) and a shared 10 uF bulk capacitor near the regulator. For battery-powered designs using the XLP sleep modes, the part draws nanoamp currents from the main VDD rail when peripherals are disabled; keep AVDD and VDD separate traces so ADC accuracy is not perturbed by digital switching noise. Estimated VDD range from PIC18 family is 1.8V-5.5V; confirm against the datasheet before final BOM freeze.
Estimated: the 40-pin UQFN package dissipates very little heat in typical embedded applications (a few tens of mW), but the exposed thermal pad (EP) MUST be soldered to a continuous copper ground pour of at least 1 cm x 1 cm to meet the thermal resistance ratings specified in the datasheet. Without a proper EP land solder joint, the die temperature can rise 10-15C above the rated envelope during long peripheral-active bursts, potentially shortening EEPROM retention or activating thermal shutdown during WWDT-driven resets.
Estimated: route ICS PGC and ICS PGD signals (RB6 and RB7 respectively) away from high-current traces and clocks to prevent in-circuit debugger noise coupling. Place a 4.7 kohm pull-up on MCLR/RE3 if not using the internal weak pull-up to ensure clean device reset. Keep the analog inputs (Port A and Port B analog-capable lines) on a separate analog ground pour that joins the main ground only at the EP, and add a small ferrite bead if the application drives PWM near ADC-sensitive analog channels.
Do not assume the "-I" suffix implies the same temperature envelope as "-E". The PIC18F47K40-E/MV is rated to +125C, while PIC18F47K40-I/MV tops out at +85C; deploying an -I part in an appliance enclosure can result in thermal shutdown during continuous PWM operation. Also remember that changing Flash size requires recompiling the linker script: code written for the F47K40 (128 KB) will not fit on the F46K40 (64 KB) without trimming dead sections.
Compliance Information
RoHS and lead-free compliance per Microchip product page for the MV package variant. AEC-Q100 not applicable: the PIC18F47K40-E/MV is a general-purpose industrial MCU; AEC-Q100-qualified variants are sold under separate order codes. REACH and Conflict Minerals compliance assumed per Microchip corporate disclosures; confirm at order placement for documentation package.
