PIC24F08KL302-I/SP - 16-Bit 32MHz 8KB MCU | Microchip Technology
MPN: PIC24F08KL302-I/SP ✗ End of LifePIC24F08KL302-I/SP Overview
A microcontroller is a programmable semiconductor that combines a CPU core, memory, peripherals, and I/O in one integrated device. The PIC24F08KL302-I/SP is a low-cost, low-power MCU positioned within the broader hierarchy of embedded controllers and semiconductor devices. Its 16-bit architecture and 16 MIPS-class performance target embedded control, while its XLP characteristics make it suitable for battery-operated and energy-conscious products that need more control than a simple logic device can provide.
The verified manufacturer and distributor information identifies MSSP peripherals supporting I2C and SPI, along with CCP and ECCP peripherals for flexible signal generation, capture, compare, and PWM-related functions. These peripherals can reduce external component requirements in designs that need serial communication, motor or actuator control, measurement timing, or basic waveform generation. The 8 KB Flash capacity is suitable for compact control firmware, while 1 KB of RAM supports working variables and protocol or control state.
The device is offered in a 28-pin SPDIP package and is identified with the -I/SP industrial temperature and SPDIP ordering designation. Its through-hole package supports conventional prototyping, automated assembly, and designs where socketed or leaded components are preferred. The -I/SP designation should be retained when replacing the part because package, temperature grade, and ordering suffix are part of the device identity.
Typical applications include low-cost sensor controllers, compact industrial modules, battery-powered monitoring products, communication peripherals, and basic motor-control systems. The MSSP interfaces are particularly useful when a board must connect to a sensor, display, or external serial device, while CCP and ECCP can support timing-sensitive control functions. Firmware and peripheral configuration should be validated against the selected clock, I/O, and power-supply conditions rather than assuming that every PIC24F peripheral combination is identical across package variants.
For a new PCB, engineers should reserve the 28-pin SPDIP footprint, confirm the power, ground, programming, and decoupling connections against the manufacturer datasheet, and review the device's operating voltage limits. For a direct replacement, verify the exact package, temperature grade, Flash and RAM capacity, pin functions, oscillator requirements, and programming compatibility. This product page combines verified distributor and manufacturer information with practical replacement guidance, comparison notes, and application-oriented design context.
Drop-in alternatives for PIC24F08KL302-I/SP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24F08KL302-I/SP (same form factor and footprint) — differing in Package, Mounting Type, RoHS Status, Data RAM, I/O Pins.
PIC24F08KL302-E/SP
✅ Drop-In ⚠️ Specs UnverifiedContact for price
View Datasheet →PIC24F08KL302-I/SP
✅ Drop-In ⚠️ Specs UnverifiedContact for price
View Datasheet →PIC24F08KL302-I/SP Maximum Ratings & Electrical Characteristics
| Microcontroller Type | 16-bit PIC24F microcontroller |
| Maximum CPU Frequency | 32 MHz |
| Program Flash Memory | 8 KB |
| Flash Organization | 2.75K x 24 |
| RAM | 1 KB |
| EEPROM | 256 B |
| Architecture | PIC24F 16-bit RISC |
| Performance Class | 16 MIPS |
| Operating Supply | 3 V |
| Serial Interface | MSSP with I2C and SPI |
| Timer and Capture Peripherals | CCP and ECCP |
| Low-Power Feature | nanoWatt XLP |
| Package | 28-pin SPDIP |
| Mounting Type | Through-hole |
| Temperature Grade | Industrial |
| Programming and Debug | ICSP and in-circuit debugging |
| RoHS Status | unknown |
| REACH Status | unknown |
| AEC-Q100 Qualification | not_applicable |
PIC24F08KL302-I/SP 28-pin spdip Pin Configuration Guide
Pin configuration for PIC24F08KL302-I/SP (28-pin spdip package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC24F08KL302-I/SP.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC24F08KL302-I/SP is suitable for 6 applications: Battery-Powered Sensor Controller, Industrial Sensor Interface, SPI and I2C Communication Module, Basic Motor and Actuator Control, Cost-Sensitive Consumer Control, Timing and Pulse-Generation Module.
Battery-Powered Sensor Controller
The PIC24F08KL302-I/SP fits compact battery-powered sensor nodes because its 16-bit PIC24F architecture, 32 MHz maximum operating frequency, and nanoWatt XLP design support efficient control and low-power operation. The 8 KB Flash accommodates compact acquisition, threshold, and communication firmware, while 1 KB of RAM is suitable for bounded sensor state. MSSP provides I2C or SPI connectivity to digital sensors, and CCP or ECCP can time measurements or drive simple indicators. Low-power battery life still depends on the firmware sleep strategy, sensor duty cycle, and wake-up events, so the design should disable unused peripherals and use the lowest acceptable clock and operating mode.
Recommended
Industrial Sensor Interface
The PIC24F08KL302-I/SP is suitable for compact industrial sensor interfaces where a 3 V, 16-bit MCU can perform acquisition, filtering, thresholding, and data formatting without a large processor. Its 32 MHz maximum frequency provides more scheduling headroom than an 8 MHz-class basic controller, while MSSP allows connection to sensors through I2C or SPI. The industrial-temperature -I/SP ordering suffix identifies the verified grade for the application. Engineers should still verify operating limits, pin multiplexing, isolation strategy, and EMC requirements for the deployed environment, especially where the sensor bus sits near motors or switching power converters.
Recommended
SPI and I2C Communication Module
The PIC24F08KL302-I/SP fits communication modules that need a protocol master or compact sensor gateway, because the verified manufacturer information identifies MSSP support for both I2C and SPI. An 8 KB Flash program area is practical for protocol framing, device discovery, status reporting, and configuration handling, while the 1 KB RAM buffer supports short packet processing. For connected equipment, the serial lines should be configured for the voltage and speed of the connected bus, with appropriate pull-ups or level translation where required. CCP and ECCP can support timing or status signalling, although exact peripheral routing must be checked in the 28-pin pinout.
Recommended
Basic Motor and Actuator Control
The PIC24F08KL302-I/SP can support basic motor or actuator control because its CCP and ECCP peripherals provide timing-oriented functions useful for PWM generation, edge capture, and event measurement. The 32 MHz maximum operating frequency and 16 MIPS-class performance allow the MCU to combine motor timing with serial diagnostics or sensor monitoring. The 8 KB Flash and 1 KB RAM are adequate for compact closed-loop or stepper-control firmware rather than complex motion algorithms. The design must account for inductive transients, separate driver circuitry, current sensing, and thermal performance; the MCU should not directly drive power-device current unless the specific pin limits and protection scheme allow it.
Recommended
Cost-Sensitive Consumer Control
The PIC24F08KL302-I/SP is appropriate for cost-sensitive consumer products that need programmable logic, serial connectivity, and low-power behavior without the cost of a high-end MCU. Its 8 KB Flash and 1 KB RAM can support compact feature logic for appliances, small accessories, or simple user-interface controllers, while the 28-pin SPDIP package is especially convenient for prototypes and leaded assembly. If the final product moves to a surface-mount package, pin mapping must be revalidated rather than transferred automatically. The MCP18-compatible peripheral approach can also simplify migration for designs built around familiar PIC control blocks.
Recommended
Timing and Pulse-Generation Module
The PIC24F08KL302-I/SP can serve as a dedicated timing or pulse-generation module because CCP and ECCP peripherals provide capture, compare, and PWM-related functions in a low-cost 16-bit MCU. Its 32 MHz maximum operating frequency offers a useful timing base for generating or measuring repetitive events, while MSSP allows remote configuration and status reporting. The 1 KB RAM is sufficient for counters, schedules, and compact status buffers, although complex waveform synthesis may exceed the available Flash. Verify timer prescaler, output-pin, and timing-tolerance details against the datasheet, and avoid relying on oscillator accuracy for long intervals without calibration.
Recommended
Recommended Products Summary
Engineering reference data for PIC24F08KL302-I/SP — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24F08KL302-E/SP | PIC24F08KL302-I/SP |
|---|---|---|---|
| Package | 28-pin SPDIP | 28-pin SPDIP | 28-pin SPDIP |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Microcontroller Architecture | 16-bit PIC24F | 16-bit PIC24F | 16-bit PIC24F |
Key Differentiators
- 16-bit control performance in a compact 28-pin SPDIP (vs ATTINY20-XUR)
- Dedicated MSSP connectivity (vs ATMEGA328P-MUR)
- Low-power XLP positioning (vs PIC24F08KL302-E/SP)
Design Notes
The PIC24F08KL302-I/SP is identified as a 3 V XLP device, so power design should use the manufacturer's complete operating-voltage and current limits from the datasheet. Place the required bypass capacitor close to VDD and VSS pins, keep the analog and digital return current path controlled, and avoid routing high-current switching returns through the MCU ground region. The XLP feature reduces active and sleep consumption only when firmware disables unused peripherals and selects suitable clock and operating modes.
Because this is a 28-pin SPDIP device, verify every socket or through-hole pad against the official package drawing before fabrication. The supplied records do not contain a complete pin table, so do not infer oscillator, programming, or I/O assignments from a generic PIC24F diagram. Preserve access to ICSP programming pins and check that the footprint, drill pattern, pin-1 orientation, and keep-clear areas match the actual ordering variant.
Use the MSSP I2C or SPI interface only with voltage levels and bus speeds allowed by the selected pin configuration and external transceiver requirements. I2C generally needs correct pull-up values and a clean bus rise time, while SPI benefits from short routing, a defined ground reference, and controlled clock edge rates. At 32 MHz maximum operation, inspect clock-routing and decoupling arrangements on the PCB rather than assuming that a slow prototype board represents final performance.
The most common design error is assuming that any MCU in the same DIP package is a drop-in replacement. For the PIC24F08KL302-I/SP, validate Flash and RAM capacity, MSSP and CCP pin mappings, oscillator configuration, programming interface, supply limits, and temperature qualification. The -I/SP suffix identifies an industrial ordering configuration, so do not substitute an E/SP device solely because it appears to use a similar package.
Compliance Information
The supplied manufacturer and distributor records do not explicitly provide RoHS, REACH, lead-free, halogen-free, or conflict-minerals statements. The device is an industrial-temperature microcontroller, but the supplied evidence does not establish AEC-Q100 qualification.
