DSPIC33EP64GP502-E/SP - 16-bit DSC 60 MIPS 64KB Flash | Microchip
MPN: DSPIC33EP64GP502-E/SP ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.62 | $5.62 |
| 10 | $5.06 | $50.60 |
| 100 | $4.36 | $436.00 |
| 500 | $3.89 | $1,945.00 |
| 1,000 | $3.51 | $3,510.00 |
DSPIC33EP64GP502-E/SP Overview
A Digital Signal Controller combines the deterministic architecture of a microcontroller with DSP-grade multiply-accumulate capability in a single core. In the power-management hierarchy of embedded systems, the DSC sits between general-purpose MCUs and dedicated DSPs, making it the preferred choice when an application needs both control-loop code and math-intensive signal processing without a two-chip solution.
Key features include the 60 MIPS dsPIC33E core, High-Speed PWM peripherals for digital power conversion, CAN 2.0B communication, three integrated op amps, four comparators, a Peripheral Trigger Generator (PTG) and a Charge Time Measurement Unit (CTMU). Integrating op amps and comparators on-chip reduces external analog component count in current-sense and protection circuits.
The dsPIC33EP series architecture pairs a 16-bit pipelined core with a single-cycle 16x16 MAC/DC DSP engine, supporting fractional and integer arithmetic. The 64 KB of self-programmable Flash supports field firmware updates, while 8 KB of SRAM handles control-loop state and communication buffers. Supply voltage is 3.0 V to 3.6 V.
Typical applications include digital power supplies, battery chargers, PFC stages, motor control (BLDC/PMSM/stepper), and industrial sensing systems that exploit the CTMU for capacitive or time-domain measurements.
Design consideration: the /SP SPDIP package is ideal for prototyping and low-volume through-hole assemblies; for mass-production SMT, pin-function-equivalent SOIC-28 (/SO) and QFN-U28 (/MM) siblings use the same die but different footprints.
This page synthesizes distributor availability, drop-in family alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP64GP502-E/SP — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP64GP502-E/SP (same form factor and footprint) — differing in Operating Temperature, Package, CPU Speed, Communication Interfaces, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP64GP502-I/SP
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.55 / Unit
View Datasheet →DSPIC33EP64GP504-I/SP
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
DSPIC33EP32GP502-I/SP
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$3.62 / Unit
View Datasheet →DSPIC33EP64GP502-E/SP Maximum Ratings & Electrical Characteristics
| Core | dsPIC33E 16-bit DSC |
| CPU Speed | 60 MIPS / 60 MHz |
| Program Memory (Flash) | 64 KB (22K x 24) |
| SRAM | 8 KB |
| Supply Voltage | 3 V to 3.6 V |
| Operating Temperature | -40C to +125C (extended, E suffix) |
| Package | 28-pin SPDIP |
| Mounting Type | Through Hole |
| CAN | 1x CAN 2.0B |
| Op Amps (on-chip) | 3 |
| Comparators | 4 |
| Peripheral Trigger Generator | Yes (PTG) |
| Charge Time Measurement Unit | Yes (CTMU) |
| High-Speed PWM | Yes |
| Life Cycle Stage | Active (In Production) |
DSPIC33EP64GP502-E/SP 28-pin spdip Pin Configuration Guide
Pin configuration for DSPIC33EP64GP502-E/SP (28-pin spdip package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP64GP502-E/SP.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP64GP502-E/SP is suitable for 6 applications: Digital Power Supplies and PFC, BLDC/PMSM Motor Control, Industrial Sensing and CTMU Measurement, CAN Networking Nodes, Battery Chargers and Power Management, Prototype and Educational Embedded Platforms.
Digital Power Supplies and PFC
The DSPIC33EP64GP502-E/SP fits digital AC-DC and DC-DC power conversion because its High-Speed PWM peripheral provides complementary outputs, programmable dead time, and high resolution, while the 60 MIPS DSP core executes voltage- and current-loop compensators with deterministic latency. The three on-chip op amps buffer shunt and divider signals without external amplifier ICs, and the four comparators implement cycle-by-cycle overcurrent limiting independent of software. The extended -40C to +125C rating suits sealed PSU enclosures. In a typical PFC stage, the DSC closes the loop between the input bridge and MOSFET gate driver, achieving tightly regulated output with low component count; trade-off is firmware development effort versus a fixed-function analog controller.
Recommended
BLDC/PMSM Motor Control
For brushless DC and permanent-magnet synchronous motor drives, the DSPIC33EP64GP502-E/SP offers the High-Speed PWM for six-step or field-oriented-control gating, the on-chip op amps to amplify shunt-resistor phase currents, and comparators for hardware overcurrent trip that reacts faster than any software loop. The 60 MIPS 16-bit DSP engine executes the Park/Clarke transforms and PI compensators of FOC within the PWM period. The -40C to +125C E-grade covers motor-attached electronics where ambient near the controller rises above 85C. The 28-pin SPDIP also eases prototype revisions of drive boards; in volume, the same-die /MM QFN variant shrinks the layout without firmware changes.
Recommended
Industrial Sensing and CTMU Measurement
The DSPIC33EP64GP502-E/SP suits industrial sensing nodes through its Charge Time Measurement Unit (CTMU), which enables precise capacitive-touch, time-of-flight, and resistance measurements, and the Peripheral Trigger Generator (PTG), which automates measurement sequences with minimal CPU intervention. On-chip op amps condition sensor outputs such as bridge or pH probes, and the 12-class analog front end feeds the DSP core for filtering and linearization at 60 MIPS. The extended -40C to +125C rating permits mounting in outdoor cabinets and near heat sources. CAN 2.0B connectivity links the node into factory buses; the result is a single-chip sensor frontend and fieldbus interface with fewer board-level components.
Recommended
CAN Networking Nodes
With an integrated CAN 2.0B controller, the DSPIC33EP64GP502-E/SP serves as a compact fieldbus node for industrial and vehicular networks, requiring only an external CAN transceiver at the pins. The 60 MIPS core manages protocol stacks, message filtering, and application logic concurrently, while 8 KB SRAM buffers CAN traffic plus control state. The -40C to +125C E-grade rating is critical for under-hood and factory-floor installations where enclosures exceed industrial temperature limits. The 28-pin SPDIP through-hole format benefits serviceable industrial control panels where boards are socketed for field replacement; pair the DSC with a suitable CAN transceiver and 5 V-to-3.3 V supply regulation for a complete node.
Recommended
Battery Chargers and Power Management
Smart battery chargers benefit from the DSPIC33EP64GP502-E/SP combination of High-Speed PWM for buck/boost power stages, on-chip op amps for precise charge-current sensing, and comparators for termination and fault thresholds implemented in hardware. The 60 MIPS DSP core runs charge algorithms (CC/CV, Li-ion safety timers, coulomb counting) with ample processing margin, and CTMU supports battery impedance estimation. The -40C to +125C range covers chargers integrated into engine bays and outdoor equipment. Firmware-programmable charging profiles let one hardware design serve multiple battery chemistries, reducing SKU count; the trade-off versus dedicated charger ICs is the need for validated firmware and safety review.
Recommended
Prototype and Educational Embedded Platforms
The 28-pin SPDIP package of the DSPIC33EP64GP502-E/SP makes it a natural choice for breadboards, socketed prototype boards, university labs, and hobbyist DSP/motor-control platforms: through-hole pins accept direct socketing and hand soldering, while the extended E-grade silicon matches what ships in production. Users program it via ICSP with PICkit-class tools in MPLAB X with the XC16 compiler. The 60 MIPS core, 64 KB Flash, and integrated op amps/comparators let students implement real DSP filtering and closed-loop control without analog design overhead. When the prototype graduates to volume SMT manufacturing, the same-die /SO SOIC and /MM QFN variants allow a layout change without firmware rework.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP64GP502-E/SP — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP64GP502-I/SP | DSPIC33EP64GP504-I/SP | DSPIC33EP32GP502-I/SP |
|---|---|---|---|---|
| Package | 28-pin SPDIP | 28-pin SPDIP - same | 28-pin SPDIP - same | 28-pin SPDIP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Flash Memory | 64 KB | 64 KB | 128 KB | 32 KB |
| SRAM | 8 KB | 8 KB | 16 KB | 4 KB |
| On-chip Op Amps | 3 | 3 | 0 (GP family without op amps) | 3 |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
| CAN | Yes (CAN 2.0B) | Yes | Yes | Yes |
Key Differentiators
- Extended -40C to +125C temperature grade in through-hole SPDIP (vs DSPIC33EP64GP502-I/SP)
- Integrated analog (3 op amps, 4 comparators) reduces BOM (vs DSPIC33EP64GP504-I/SP)
- Full 64 KB program space on cost-optimized 28-pin footprint (vs DSPIC33EP32GP502-I/SP)
Design Notes
The DSPIC33EP64GP502-E/SP requires a single 3.0 V to 3.6 V supply with a VCAP/VDDCORE pin that must have the specified low-ESR capacitor to the internal core regulator. Never omit or substitute the VCAP capacitor value - the internal LDO becomes unstable and can cause sporadic resets that are difficult to diagnose. Decouple each VDD pin with 0.1 uF ceramic placed within 5 mm of the pin, plus one bulk 10 uF per supply rail.
In the SPDIP package, keep the MCLR/ICSP routing (MCLR, PGD, PGC on RB5/RB6) short and route it to a standard 5-pin ICSP header even in production boards; the cost is negligible and enables field firmware updates via the self-programmable 64 KB Flash. Avoid loading PGD/PGC with pull-downs stronger than 10k during programming, and place a 10k pull-up plus 100 ohm series resistor on MCLR for robust in-circuit programming.
A frequent substitution error is swapping the E-grade (-40C to +125C) part for the cheaper I-grade (-40C to +85C) sibling DSPIC33EP64GP502-I/SP in enclosures that reach 90C+; the part will run but reliability derates outside the rated range. Also verify Flash sizing before downgrading to DSPIC33EP32GP502: XC16 compiled images with CAN stacks and DSP libraries routinely exceed 32 KB. Check the errata document on the Microchip product page for the silicon revision on your date code before finalizing analog calibration constants.
Compliance Information
RoHS/lead-free per Microchip standard commercial packaging for current In Production catalog parts. REACH, halogen-free, and conflict-minerals declarations should be confirmed via the certificate of compliance on the Microchip product page for your date code.
