PIC24F08KL402-E/ML - 16-bit 32MHz MCU, 8KB Flash, 28-QFN | Microchip
MPN: PIC24F08KL402-E/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $2.4 | $2.40 |
| 10 | $2.16 | $21.60 |
| 100 | $1.92 | $192.00 |
| 500 | $1.71 | $855.00 |
| 1,000 | $1.52 | $1,520.00 |
PIC24F08KL402-E/ML Overview
What is a 16-bit microcontroller? A microcontroller (MCU) is a single-chip computer integrating a CPU, memory (Flash for program code, RAM for data, EEPROM for non-volatile storage), and peripherals on one die. A 16-bit MCU like the PIC24F processes data 16 bits at a time, sitting between 8-bit MCUs (PIC10/12/16/18) and 32-bit MCUs (PIC32, ARM Cortex-M) in both price and performance. The PIC24F family is optimized for low power consumption while delivering computational headroom above 8-bit parts.
Key features of the PIC24F08KL402 include nanoWatt XLP technology for sleep currents in the nanoampere range, 12-channel 10-bit ADC for sensor acquisition, dual op-amps and comparators for analog signal conditioning, plus MSSP (I2C/SPI) and CCP/ECCP peripherals borrowed from the PIC18 family to ease migration. The 28-QFN package with exposed thermal pad offers a compact 6x6 mm footprint suitable for space-constrained designs.
Technically, the part runs from a wide 1.8V to 3.6V supply, supports up to 16 MIPS throughput, and provides multiple low-power modes (Sleep, Deep Sleep, Retention) controlled via the on-chip RTCC and deep-draw hardware. The peripheral set is intentionally minimalist but flexible, allowing developers to scale functionality without jumping to larger flash densities.
Typical applications include battery-powered sensor nodes, wearable health monitors, consumer remote controls, home automation endpoints, and low-cost industrial control front-ends. Its combination of PIC18-compatible peripherals with PIC24-class CPU throughput makes it well suited as a migration target from 8-bit designs that have outgrown their original MCU. When designing with this part, plan pin assignments carefully since the 28-QFN variant has fewer I/O pins than 28-SOIC/SPDIP equivalents - verify your I/O budget against the datasheet pin table before committing to the PCB layout.
Drop-in alternatives for PIC24F08KL402-E/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24F08KL402-E/ML (same form factor and footprint) — differing in ADC, Package, Operating Temperature, Core Architecture, Data SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24F08KL402-I/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.25 / Unit
View Datasheet →PIC24F08KL401-E/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC24F08KL302-I/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.45 / Unit
View Datasheet →PIC24F08KA102-E/ML
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$0.76 / Unit
View Datasheet →PIC24F08KL200-E/ML
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
PIC24F08KL402-E/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC24F (16-bit modified Harvard) |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Flash Memory | 8 KB (2.75K x 24 words) |
| Data SRAM | 1 KB |
| Data EEPROM | 512 B |
| Operating Voltage Range | 1.8 V to 3.6 V |
| ADC | 10-bit, 12 channels |
| Op-Amps / Comparators | Yes (on-chip) |
| Communication Peripherals | MSSP (I2C/SPI), UART |
| Capture/Compare/PWM | CCP/ECCP |
| Low-Power Technology | nanoWatt XLP |
| Package | 28-QFN (6x6 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +125C (E suffix, extended) |
| RoHS Status | Compliant |
PIC24F08KL402-E/ML Pin Configuration
| Pin 1 | RA0 — I/O / analog input |
| Pin 2 | RA1 — I/O / analog input |
| Pin 3 | RA2 — I/O / analog input |
| Pin 4 | RA3 — I/O / analog input |
| Pin 5 | VDD — Positive supply voltage |
| Pin 6 | VSS — Ground reference |
| Pin 7 | OSCI — Crystal oscillator input |
| Pin 8 | OSCO — Crystal oscillator output |
| Pin 9 | RB0 — I/O port B bit 0 |
| Pin 10 | RB1 — I/O port B bit 1 |
| Pin 11 | RB2 — I/O port B bit 2 |
| Pin 12 | RB3 — I/O port B bit 3 |
| Pin 13 | RB4 — I/O port B bit 4 / SDA |
| Pin 14 | RB5 — I/O port B bit 5 / SCL |
| Pin 15 | RB6 — I/O port B bit 6 / PGC |
| Pin 16 | RB7 — I/O port B bit 7 / PGD |
| Pin 17 | RC0 — I/O port C bit 0 |
| Pin 18 | RC1 — I/O port C bit 1 |
| Pin 19 | RC2 — I/O port C bit 2 |
| Pin 20 | RC3 — I/O port C bit 3 |
| Pin 21 | RC4 — I/O port C bit 4 |
| Pin 22 | RC5 — I/O port C bit 5 |
| Pin 23 | RC6 — I/O port C bit 6 / TX |
| Pin 24 | RC7 — I/O port C bit 7 / RX |
| Pin 25 | MCLR — Master clear / reset (active low) |
| Pin 26 | RA4 — I/O / analog input |
| Pin 27 | RA5 — I/O / analog input |
| Pin 28 | EP — Exposed thermal pad (connect to VSS) |
Typical Applications
PIC24F08KL402-E/ML is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Wearable Health and Fitness Devices, Consumer Remote Controls and HID Devices, Home Automation and Smart Home Endpoints, Low-Cost Industrial Control Front-Ends, Migration from PIC18 Designs.
Battery-Powered IoT Sensor Nodes
The PIC24F08KL402-E/ML is ideal for battery-powered IoT sensor nodes thanks to its nanoWatt XLP technology, which delivers deep-sleep currents in the nanoampere range and extends coin-cell battery life to multi-year durations. The wide 1.8 V to 3.6 V supply range supports direct connection to single-cell lithium or two-AA alkaline battery stacks without external regulation. The integrated 10-bit 12-channel ADC and on-chip op-amps simplify direct sensor interfacing for temperature, humidity, and analog front-end signals, reducing external component count and PCB area in space-constrained wireless sensor designs.
Recommended
Wearable Health and Fitness Devices
Wearable health monitors benefit from the PIC24F08KL402-E/ML's combination of low power, 16 MIPS throughput, and on-chip analog peripherals. The 10-bit ADC captures heart-rate and motion sensor data while the on-chip op-amps condition photoplethysmography (PPG) signals directly, eliminating external amplifier stages. Sleep currents in the nanoampere range mean a small Li-ion battery can sustain weeks of continuous monitoring. The 6x6 mm 28-QFN footprint fits comfortably inside wristband and patch form factors where PCB area is at a premium.
Recommended
Consumer Remote Controls and HID Devices
The PIC24F08KL402-E/ML suits consumer remote control and Human Interface Device (HID) designs where battery life, low BOM cost, and reliable IR/RF communication are priorities. Its MSSP (I2C/SPI) peripheral interfaces directly with low-power RF transceivers, while the UART supports IR or BLE link layers. nanoWatt XLP allows the device to spend >99 percent of its time in deep sleep, waking only on a button interrupt - extending AAA battery life to several years and reducing end-user battery replacement frequency.
Recommended
Home Automation and Smart Home Endpoints
Smart home endpoints such as battery-powered door/window sensors, smart thermostats, and occupancy detectors use the PIC24F08KL402-E/ML to balance low-power sleep operation with enough CPU throughput to run communication stacks. The 1.8 V to 3.6 V supply range supports direct battery operation, while the on-chip 10-bit ADC reads temperature, light, and motion sensors without external components. CCP/ECCP peripherals can drive PWM-controlled LED indicators or simple buzzer alarms for local user feedback in residential automation systems.
Recommended
Low-Cost Industrial Control Front-Ends
Industrial sensor interfaces and small PLC-style front-end modules use the PIC24F08KL402-E/ML to provide analog signal conditioning and digital I/O in a single chip. The on-chip op-amps and comparators handle 4-20 mA current loop inputs or thermistor/resistive sensor bridges, while MSSP interfaces to digital isolators or local HMI displays. The -40C to +125C extended temperature rating allows deployment in factory environments without additional thermal management. The 32 MHz core executes deterministic control loops within tight timing margins.
Recommended
Migration from PIC18 Designs
Engineers migrating from 8-bit PIC18 designs to 16-bit benefit from the PIC24F08KL402-E/ML because it retains PIC18-compatible MSSP (I2C/SPI) and CCP/ECCP peripherals while doubling CPU throughput at the same clock frequency. This allows existing firmware to be ported with minimal peripheral driver rework while gaining access to 16-bit arithmetic, larger addressing space, and nanoWatt XLP low-power modes. The 28-QFN package drop-in compatibility with several PIC18F and PIC24F variants simplifies PCB reuse during product family transitions.
Recommended
Recommended Products Summary
Engineering reference data for PIC24F08KL402-E/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24F08KL402-I/ML | PIC24F08KL401-E/ML | PIC24F08KL302-I/ML | PIC24F08KA102-E/ML | PIC24F08KL200-E/ML |
|---|---|---|---|---|---|---|
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | PIC24F 16-bit | PIC24F 16-bit | PIC24F 16-bit | PIC24F 16-bit | PIC24F 16-bit | PIC24F 16-bit |
| Flash Memory | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| RAM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| EEPROM | 512 B | 512 B | 512 B | 512 B | 512 B | 512 B |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) |
Key Differentiators
- Extended temperature range up to +125C (vs PIC24F08KL402-I/ML)
- Larger 28-QFN package with maximum I/O count (vs PIC24F08KL401-E/ML)
- Balanced 8 KB Flash + 1 KB RAM + 512 B EEPROM partition (vs PIC24F08KL200-E/ML)
Design Notes
The 28-QFN (6x6 mm) package has an exposed thermal pad (EP) on pin 28 that must be soldered to a PCB land pattern and connected to VSS for proper thermal and electrical performance. Failing to solder the EP can result in higher junction temperatures and reduced electrical reliability. Provide at least 4 thermal vias in the EP land pattern to dissipate heat into internal ground planes, especially in applications with sustained ADC or op-amp operation.
Decouple VDD with a 100 nF ceramic capacitor placed within 5 mm of the VDD pin and a bulk 1-10 uF capacitor nearby. For nanoWatt XLP sleep current measurements, the bulk capacitor must be sized so its leakage does not exceed the MCU sleep current budget (typically a few hundred nA). Use low-leakage ceramic capacitors (C0G/NP0) for best sleep performance.
Route the crystal oscillator traces (OSCI/OSCO) as short as possible, keep them away from switching signals, and surround them with a ground pour. If using an external clock source instead of a crystal, drive OSCI and leave OSCO floating per datasheet. The MCLR pin requires a 10 kohm pull-up to VDD for normal operation; do not leave MCLR floating or the MCU may enter unintended reset states.
Do not exceed the absolute maximum VDD rating of 4.0 V (per datasheet) or the device may suffer permanent damage. When programming in low-voltage (LVP) mode, ensure the PGC/PGD pins (RB6/RB7) are not loaded by external circuitry that prevents proper ICSP communication. Always read the device ID before issuing bulk erase to avoid accidentally erasing a different MCU sharing the same ICSP bus.
Compliance Information
RoHS compliant per Microchip product page. Industrial/consumer grade - not AEC-Q100 qualified; for automotive applications select a PIC24F part with the -VAO suffix or consult Microchip's automotive-grade portfolio.
