PIC24F08KL201-I/SO - 16-bit 32MHz 8KB Flash MCU | Microchip
MPN: PIC24F08KL201-I/SO ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.85 | $1.85 |
| 10 | $1.66 | $16.60 |
| 100 | $1.4 | $140.00 |
| 500 | $1.18 | $590.00 |
| 1,000 | $0.97 | $970.00 |
PIC24F08KL201-I/SO Overview
A microcontroller (MCU) is a single-chip computer containing a CPU core, program and data memory, peripherals, and I/O. The PIC24F family is a 16-bit modified-Harvard architecture positioned between 8-bit PIC18 and 32-bit PIC32MX devices, optimized for cost-sensitive embedded designs that need more performance than an 8-bit MCU but do not require a 32-bit core. Within the PIC24F family, the KL201 sub-family emphasizes minimum die size and lowest cost while retaining 16-bit throughput and XLP™ low-power operation.
Key features of the PIC24F08KL201-I/SO include 8 KB Flash, 1 KB SRAM, a 9-channel 10-bit ADC, two analog comparators, one MSSP peripheral (configurable for I²C or SPI), one UART, one CCP capture/compare/PWM module, and a 3-wire In-Circuit Serial Programming (ICSP) interface. The XLP™ technology provides sleep currents as low as hundreds of nanoamps, deep-sleep currents typically under 1 µA, and multiple power-managed operating modes ideal for battery and energy-harvesting designs.
The architecture combines a 16-bit instruction set with a 24-bit instruction word for compact code, supports C and assembly programming under MPLABX/MCC, and is pin-compatible with several PIC24F siblings, simplifying migration. The 20-pin SOIC package suits hand-soldered prototypes, cost-driven through-hole-replacement assemblies, and industrial environments that prefer wide-body SO packages.
Typical applications include low-cost sensor nodes, battery-powered thermostats and remote controls, portable health and fitness accessories, simple LED lighting controllers, and small industrial control modules. Choose the PIC24F08KL201-I/SO when 8-bit PIC18 performance is insufficient but a 32-bit PIC32 is over-spec or over-budget, and when low sleep current is required for years-of-life on a single battery.
Design consideration: place the ICSP PGECx/PGEDx pair near an accessible programming header, and respect the VDD/VSS decoupling layout recommended in the PIC24F08KL201 datasheet to ensure ADC accuracy and noise-free sleep/wake transitions.
This page synthesizes current distributor pricing, drop-in package alternatives in the same 20-pin SOIC footprint, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for PIC24F08KL201-I/SO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24F08KL201-I/SO (same form factor and footprint) — differing in Package, ADC, Core Architecture, Operating Temperature, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24F08KL200T-I/SO
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24F04KL101-I/SO
✅ Drop-In✓ In Stock
$1.05 / Unit
View Datasheet →PIC24F08KA102-I/SO
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24F04KA201-I/SO
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.78 / Unit
View Datasheet →PIC24F08KA102T-I/SO
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$1.94 / Unit
View Datasheet →PIC24F08KL201-I/SO Maximum Ratings & Electrical Characteristics
| Family | PIC® XLP™ 24F |
| Core | PIC24F 16-bit modified Harvard |
| Max CPU Frequency | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 8 KB (2.75K × 24 words) |
| RAM | 1 KB |
| Package | 20-SOIC (SO), 7.50 mm wide body |
| Pin Count | 20 |
| Supply Voltage (VDD) | 1.8 V to 3.6 V |
| ADC | 10-bit, 9 channels |
| Comparators | 2 |
| MSSP (I²C/SPI) | 1 |
| UART | 1 |
| CCP (Capture/Compare/PWM) | 1 |
| Operating Temperature | -40 °C to +85 °C (industrial) |
| Mounting Type | Surface Mount |
| MSL Level | 1 |
| RoHS Status | Compliant |
PIC24F08KL201-I/SO Pin Configuration
| Pin 1 | RA0 — Digital I/O; analog AN0 |
| Pin 2 | RA1 — Digital I/O; analog AN1 |
| Pin 3 | RA2 — Digital I/O; analog AN2; CVREF |
| Pin 4 | RA3 — Digital I/O; analog AN3 |
| Pin 5 | RA4 — Digital I/O; analog AN4 |
| Pin 6 | VDD — Positive supply (1.8 V to 3.6 V) |
| Pin 7 | VSS — Ground |
| Pin 8 | OSCI — Crystal/oscillator input (or RA7 digital I/O) |
| Pin 9 | OSCO — Crystal/oscillator output (or RA6 digital I/O) |
| Pin 10 | MCLR — Master Clear (reset) input; programming voltage |
| Pin 11 | RB0 — Digital I/O; PGED1 programming data |
| Pin 12 | RB1 — Digital I/O; PGEC1 programming clock |
| Pin 13 | RB2 — Digital I/O |
| Pin 14 | RB3 — Digital I/O |
| Pin 15 | RB4 — Digital I/O |
| Pin 16 | RB5 — Digital I/O |
| Pin 17 | RB6 — Digital I/O; ICSPCLK (PGEC2) |
| Pin 18 | RB7 — Digital I/O; ICSPDAT (PGED2) |
| Pin 19 | VDD — Positive supply (1.8 V to 3.6 V) |
| Pin 20 | VSS — Ground |
Typical Applications
PIC24F08KL201-I/SO is suitable for 6 applications: Battery-Powered Wireless Sensor Nodes, Portable Health and Fitness Wearables, Industrial Control and Sensor Modules, Low-Cost Smart Home and Appliance Controllers, Automotive Interior and Aftermarket Modules, Remote Controls and Human-Interface Devices.
Battery-Powered Wireless Sensor Nodes
The PIC24F08KL201-I/SO's XLP™ deep-sleep current (typically sub-µA) and 1.8 V minimum supply let a CR2032 or 2×AA node run for years when waking only on a periodic sensor sample. The 9-channel 10-bit ADC samples temperature, light, or analog sensors directly, while the MSSP drives an SPI/ I²C sensor frontend such as a sensor or external radio. The 32 MHz / 16 MIPS core handles on-node processing, threshold checks, and packet framing before handing off the radio TX burst. Designers keep the MCU in deep sleep for hundreds of milliseconds between samples, waking via RTCC or external interrupt. The 20-pin SOIC package is easy to hand-prototype and supports industrial temperature environments typical of metering and environmental sensing.
Recommended
Portable Health and Fitness Wearables
The PIC24F08KL201-I/SO fits wristbands and patch-style wearables that require low quiescent current, a small footprint, and 16-bit math for heart-rate averaging or step-count algorithms. Its XLP™ modes idle at hundreds of nanoamps between sensor conversions, while the 16 MIPS core runs DSP-style filtering on photoplethysmography (PPG) or accelerometer streams without saturating CPU headroom. The 8 KB Flash holds a small RTOS or state machine plus BLE stack glue, and the MSSP drives a SPI accelerometer or optical sensor frontend. The industrial -I temperature grade supports skin-contact and body-worn operation. Designers pair the MCU with a low-dropout regulator and a coin cell for multi-week run time between charges.
Recommended
Industrial Control and Sensor Modules
The PIC24F08KL201-I/SO is well-suited for cost-sensitive industrial PLC expansion modules, analog front-end cards, and signal-conditioning boards that need 16-bit throughput and low power in a wide-body SOIC. The 10-bit ADC scans 9 analog channels for transducer inputs such as 4–20 mA loops, thermistors, or strain gauges, while the MSSP talks to digital sensors or a host PLC over SPI/I²C. The 1.8 V to 3.6 V supply supports battery-backed or 3.3 V industrial rails. The 32 MHz core handles PID loops at sub-millisecond rates for tight process control, and the industrial -40 °C to +85 °C temperature grade is required for factory floor and outdoor cabinet environments. The wide-body SOIC simplifies hand rework during field service.
Recommended
Low-Cost Smart Home and Appliance Controllers
The PIC24F08KL201-I/SO powers small appliances such as coffee machines, fans, dehumidifiers, and simple smart plugs that need capacitive-touch or button input, PWM actuator control, and energy-aware sleep. Its 16-bit core drives the CCP/PWM channel for motor speed, valve, or LED control, while the MSSP drives an I²C keypad, display, or external EEPROM for user settings. XLP™ sleep currents below 1 µA help standby-mode designs meet Energy Star and EU ecodesign standby budgets. The 8 KB Flash holds the user interface state machine, fault handlers, and a small RF or Wi-Fi co-processor glue layer. The 20-pin SOIC package simplifies hand soldering during pilot runs and small-scale manufacturing.
Recommended
Automotive Interior and Aftermarket Modules
The PIC24F08KL201-I/SO can serve non-safety automotive interior functions such as ambient lighting controllers, climate sensor nodes, seat-occupancy indicators, and aftermarket telematics where AEC-Q100 is not strictly required. Its industrial -40 °C to +85 °C range survives under-the-trunk interiors and door modules, while the 10-bit ADC reads potentiometers, NTC thermistors, or photodiodes for cabin sensing. The MSSP drives SPI/ I²C peripherals such as RGB LED drivers or digital temperature sensors, and the UART links to a Bluetooth or CAN bridge for aftermarket connectivity. Designers use XLP™ sleep to keep quiescent draw under 100 µA on accessory circuits, preserving battery during long parking. The 20-pin SOIC supports hand rework on prototype boards.
Recommended
Remote Controls and Human-Interface Devices
The PIC24F08KL201-I/SO is an excellent fit for IR/RF remote controls, presentation clickers, and small human-interface devices that demand long battery life and a compact BOM. XLP™ sleep currents under 1 µA extend coin-cell runtime over years of standby, and a single key-press interrupt wakes the MCU within microseconds to send the keystroke. The MSSP drives SPI displays or LED indicators, while the 10-bit ADC reads joystick pots or a rotary encoder. The 8 KB Flash holds debouncing, IR protocols (RC5/ NEC), and small BLE/RF glue code. The 32 MHz core runs IR carrier generation at 38 kHz without additional timers, simplifying BOM. The wide-body SOIC supports hand-rework and rugged field enclosures.
Recommended
Recommended Products Summary
Engineering reference data for PIC24F08KL201-I/SO — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24F08KL200T-I/SO | PIC24F04KL101-I/SO | PIC24F08KA102-I/SO | PIC24F04KA201-I/SO | PIC24F08KA102T-I/SO |
|---|---|---|---|---|---|---|
| Package | 20-SOIC (SO) | 20-SOIC (SO) - same | 20-SOIC (SO) - same | 20-SOIC (SO) - same | 20-SOIC (SO) - same | 20-SOIC (SO) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 8 KB | 4 KB (-50%) | 4 KB (-50%) | 8 KB (same) | 4 KB (-50%) | 8 KB (same) |
| Max CPU Frequency | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS | 32 MHz / 16 MIPS |
| ADC | 10-bit, 9 channels | 10-bit, 9 channels | 10-bit, 9 channels | 10-bit, 9 channels + CTMU | 10-bit, 9 channels + CTMU | 10-bit, 9 channels + CTMU |
| MSSP (I²C/SPI) | 1 | 1 | 1 | 2 | 2 | 2 |
| CCP/PWM Channels | 1 | 1 | 1 | 5 | 5 | 5 |
| XLP™ Low Power | Yes (deep sleep sub-µA) | Yes (deep sleep sub-µA) | Yes (deep sleep sub-µA) | Yes (deep sleep sub-µA) | Yes (deep sleep sub-µA) | Yes (deep sleep sub-µA) |
| Operating Temperature | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
Key Differentiators
- Lowest-cost PIC24F 16-bit MCU in 20-SOIC footprint (vs PIC24F08KA102-I/SO)
- Higher Flash density than KL200 in same 20-SOIC (vs PIC24F08KL200T-I/SO)
- Single-MSSP to dual-MSSP migration in same footprint (vs PIC24F08KL101-I/SO)
Design Notes
Use the PIC24F08KL201's deep-sleep mode for battery applications. According to the Microchip datasheet, deep-sleep current is typically in the hundreds of nanoamps with RTCC active, and under 1 µA in most configurations. Wake on RTCC, external interrupt, or peripheral trigger, then return to deep sleep immediately after sampling. Use a clean LDO such as MCP1700 upstream to keep the MCU noise floor minimal during ADC conversions.
Place a 100 nF decoupling capacitor as close as possible between each VDD/VSS pair (pins 6/7 and 19/20) and add a bulk 1 µF to 10 µF tantalum or ceramic on the supply rail. Keep ADC analog traces short and away from switching nodes such as PWM outputs and clock lines. For ADC inputs above ~2 kΩ source impedance, add an external buffer or longer sample time to mitigate settling errors per the datasheet ADC section.
Do not assume any PGECx/PGEDx pair is automatically assigned: the ICSP programmer uses a paired pin selection, so PGEC1 must pair with PGED1, PGEC2 with PGED2, etc. MCLR must be pulled up via a 10 kΩ resistor and a capacitor to ground for proper reset; omitting MCLR capacitance may cause brown-out resets. Respect the 1.8 V to 3.6 V supply window - over-voltage on VDD damages the MCU and under-voltage during Flash programming aborts writes silently.
Route the ICSP pins (PGECx, PGEDx, MCLR, VDD, VSS) to a 5-pin header accessible from the PCB edge for factory programming and field firmware updates. Keep MCLR trace short and away from noisy sources to avoid spurious resets. Use a ground plane under the MCU and place the analog reference capacitor within 5 mm of the AVSS/AVDD pins (when present) to minimize ADC reference noise.
Compliance Information
RoHS and REACH compliance per Microchip product page. Not AEC-Q100 qualified - the PIC24F08KL201-I/SO is intended for industrial and consumer applications; for AEC-Q100 automotive designs, source a PIC24F Q1-grade alternative from Microchip. Operating temperature -40 °C to +85 °C is industrial grade.
