Microchip Technology

PIC24FV16KA302T-I/ML - 16-bit XLP MCU, 32MHz, 16KB Flash | Microchip

MPN: PIC24FV16KA302T-I/ML ✓ Active
In Stock Ships in 1-3 business days
1.8 V to 3.6 V Vdss 28-QFN (6x6 mm), ML suffix Package 32 MHz (16 MIPS) Speed 16 KB (5.5K x 24) Memory
From $2.2 USD / Unit
MOQ: 1 |
Price updated: 2026-09-30
Volume Pricing
Qty Unit Price Extended
1 $3.45 $3.45
10 $3.1 $31.00
100 $2.78 $278.00
500 $2.45 $1,225.00
1,000 $2.2 $2,200.00
ℹ️ All prices are in USD

PIC24FV16KA302T-I/ML Overview

The Microchip Technology PIC24FV16KA302T-I/ML is a 16-bit PIC® XLP™ (eXtreme Low Power) microcontroller running at up to 32 MHz (16 MIPS) from a 1.8 V to 3.6 V supply, integrating 16 KB Flash program memory, 2 KB SRAM, and 512 B EEPROM into a 28-pin QFN package (6x6 mm). It is part of the PIC24FV16KA304 family of 20/28/44/48-pin general-purpose 16-bit Flash microcontrollers featuring XLP Technology. The 'FV' in the part number designates the wide 1.8 V to 3.6 V supply variant, ideal for battery-powered applications.

What is a Microcontroller (MCU)? A microcontroller is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (RAM and EEPROM), and programmable peripherals on one die. An MCU hierarchy looks like: 16-bit MCU -> microcontroller -> embedded controller -> semiconductor -> integrated circuit. The 16-bit MCU class typically delivers 10-100 MIPS with deterministic interrupt response, sitting between 8-bit MCUs (lower cost, lower performance) and 32-bit ARM Cortex-M MCUs (higher performance, larger code). The PIC24F family is renowned for ultra-low-power XLP technology with sub-uA deep-sleep current.

Key differentiating features include eXtreme Low Power (XLP) technology with sub-uA Deep Sleep current, 12-bit ADC with up to 16 channels, Charge Time Measurement Unit (CTMU) for capacitive touch sensing, Real-Time Clock and Calendar (RTCC) that runs even in Deep Sleep mode, plus DSBOR and DSWDT (Deep Sleep Brown-Out Reset and Deep Sleep Watchdog Timer). The 'T' suffix denotes tape-and-reel packaging; the 'I' indicates the industrial -40 °C to +85 °C operating temperature range.

The device is built on a Harvard-architecture PIC24F CPU core with 16-bit instructions, allowing compact code density. The CTMU peripheral enables touch buttons, sliders, and proximity sensing. The integrated RTCC eliminates external clock chips for time-stamped data logging in low-power products. With 17 user I/O pins in the 28-QFN variant, the device provides flexible mixed-signal design.

Typical applications include IoT sensor nodes, wearable fitness devices, handheld instrumentation, low-power wireless sensor networks, capacitive touch user interfaces, and battery-powered industrial data loggers. The Deep Sleep modes with running RTCC enable years of operation from a single coin cell.

When designing with this MCU, choose the device's integrated RTCC over external RTC chips when PCB real estate and BOM cost matter. Always characterize sleep-mode entry/exit timing against worst-case Wake-from-Sleep scenarios. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

Drop-in alternatives for PIC24FV16KA302T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC24FV16KA302T-I/ML (same form factor and footprint) — differing in Package, Operating Temperature, Core Architecture, Timers, ADC.

Microchip Technology
Package: 28-pin QFN (6x6 mm)
Operating Temperature: -40C to +85C (Industrial)
Core Architecture: PIC24F 16-bit modified Harvard
Microchip Technology
Package: 28-QFN (6x6 mm), code ML
Operating Temperature: -40 °C to +85 °C (industrial, "I")
Core Architecture: PIC24F (16-bit modified Harvard)
Microchip Technology
Package: 28-pin SOIC (7.50 mm)
Operating Temperature: -40 C to +85 C (Industrial)
Core Architecture: PIC24F 16-bit RISC (Harvard)
Microchip Technology
Package: 44-QFN (8x8 mm) with exposed pad
ADC: 12-bit, 16 channels
Microchip Technology
Package: 28-pin QFN (6x6 mm) with exposed pad
Operating Temperature: -40C to +85C (industrial)
Core Architecture: PIC24F 16-bit RISC
Microchip Technology
Package: 28-QFN (6x6 mm) with exposed thermal pad
Operating Temperature: -40°C to +85°C (Industrial, "-I")
Core Architecture: 16-bit Modified Harvard RISC

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC24FV16KA302-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (6x6 mm)
PIC24F (16-bit modified Harvard) · PIC® XLP™ 24F · FV (1.8 V to 3.6 V wide-supply) · 32 MHz (16 MIPS) · 16 KB (5.5K x 24 instruction words) · 2 KB · 512 bytes · 1.8 V to 3.6 V

✓ In Stock

$2.04 / Unit

View Datasheet →

PIC24FV32KA302-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (6x6 mm)
PIC24F 16-bit RISC · PIC24FV32KA304 family (XLP) · 32 KB (11K x 24 instructions) · 2 KB · 512 bytes · 32 MHz (16 MIPS at 3.3V) · 2.0V to 5.5V (FV wide-voltage variant) · 17

✓ In Stock

$2.71 / Unit

View Datasheet →

PIC24F16KA302-I/ML

✅ Drop-In
Microchip Technology
📦 28-QFN (6x6 mm)
PIC24F 16-bit modified Harvard · 32 MHz (16 MIPS) · 16 KB (5.5K x 24 instructions) · 2 KB · 512 B · 1.8 V to 3.6 V · -40C to +85C (Industrial) · 17 (varies by package)

✓ In Stock

$1.95 / Unit

View Datasheet →

PIC24FV16KA302T-I/SO

✅ Drop-In
Microchip Technology
📦 SOIC-28
PIC24F 16-bit RISC (Harvard) · 16 KB (5.5K x 24) · 2 KB · 512 B · 32 MHz (16 MIPS at 3.3V, 32 MHz operation) · 1.8 V to 3.6 V · 5 V tolerant · 17

✓ In Stock

$2.44 / Unit

View Datasheet →

PIC24FV16KA302T-I/MLVAO

✅ Drop-In
📦 28-QFN (6x6 mm)
VAO suffix = Automotive variant (different screening level), same die/package

📋 Reference alternative (not in catalog)

PIC24FV16KA302T-I/ML Maximum Ratings & Electrical Characteristics

Core PIC24F 16-bit RISC
CPU Family PIC® XLP™ 24F
Maximum CPU Speed 32 MHz (16 MIPS)
Program Memory (Flash) 16 KB (5.5K x 24)
SRAM 2 KB
EEPROM 512 B
Supply Voltage 1.8 V to 3.6 V
I/O Pins 17
ADC 12-bit, up to 16 channels
CTMU Yes (Charge Time Measurement Unit)
RTCC Yes (runs in Deep Sleep)
DSBOR / DSWDT Yes (Deep Sleep BOR + WDT)
Package 28-QFN (6x6 mm), ML suffix
Mounting Type Surface Mount
Operating Temperature -40 °C to +85 °C (Industrial)
Lead-Free / RoHS Lead-Free, RoHS Compliant
XLP Technology Yes (eXtreme Low Power)

PIC24FV16KA302T-I/ML Pin Configuration

QFN-28 Package Pinout Diagram QFN-28 5x5mm, P0.5mm, EP 3.1x3.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 QFN-28
Pin 1 OSCI/CLKI/RA3 — Oscillator crystal input or digital I/O
Pin 2 OSCO/CLKO/RA2 — Oscillator crystal output or digital I/O
Pin 3 RA1 — Digital I/O
Pin 4 RA0 — Digital I/O
Pin 5 VSS — Ground reference
Pin 6 VDD — Positive supply voltage (1.8-3.6 V)
Pin 7 RB15 — Digital I/O
Pin 8 RB14 — Digital I/O
Pin 9 RB13 — Digital I/O / AN13
Pin 10 RB12 — Digital I/O / AN12
Pin 11 RB11 — Digital I/O / AN11
Pin 12 RB10 — Digital I/O / AN10
Pin 13 RB9 — Digital I/O / AN9
Pin 14 RB8 — Digital I/O / AN8
Pin 15 RB7 — Digital I/O / AN7
Pin 16 RB6 — Digital I/O / AN6
Pin 17 RB5 — Digital I/O / AN5
Pin 18 RB4 — Digital I/O / AN4
Pin 19 RB3 — Digital I/O / AN3
Pin 20 RB2 — Digital I/O / AN2
Pin 21 RB1 — Digital I/O / AN1
Pin 22 RB0 — Digital I/O / AN0
Pin 23 RA9 — Digital I/O
Pin 24 RA10 — Digital I/O
Pin 25 RA4 — Digital I/O
Pin 26 RA7 — Digital I/O
Pin 27 RA6 — Digital I/O
Pin 28 RA5 — Digital I/O

Typical Applications

PIC24FV16KA302T-I/ML is suitable for 6 applications: IoT Wireless Sensor Node, Wearable Fitness Tracker, Capacitive Touch User Interface, Battery-Powered Industrial Data Logger, Handheld Medical Monitoring Device, Low-Power Wireless Sensor Network Endpoint.

🧩

IoT Wireless Sensor Node

The PIC24FV16KA302T-I/ML is a great fit for IoT sensor nodes: its 1.8-3.6 V wide VDD range accepts single-cell Li-ion or 2xAA battery stacks directly without an LDO. The 32 MHz / 16 MIPS core handles sensor fusion, encryption, and radio protocol stacks in real time. XLP Deep Sleep current in the nano-amp range combined with the always-on RTCC enables multi-year battery life. Typical design uses 17 user I/O to drive SPI/IO2 sensors, a UART radio module, and status indicators. Holtek power design tip: duty-cycle the radio transmit at less than 1 percent to maximize battery life. Per the PIC24FV16KA304 family datasheet, integrating the CTMU allows capacitive moisture and proximity sensing without extra analog front-end ICs, reducing BOM cost by approximately $0.50 per node.

📱

Wearable Fitness Tracker

The PIC24FV16KA302T-I/ML fits wearable fitness trackers because of its XLP sub-uA Deep Sleep current and wide 1.8-3.6 V supply that pairs with coin-cell and Li-Po batteries. The 12-bit ADC with up to 16 channels reads heart-rate, motion, and skin-temperature sensors simultaneously. The CTMU enables capacitive touch buttons and gesture sensing on the wristband without mechanical switches. With 17 user I/O, the MCU can drive an SPI OLED display, an IO2 accelerometer, and a Bluetooth Low Energy radio. The integrated RTCC keeps accurate timestamps in sleep logs. Trade-off: a 32-bit Cortex-M0+ might offer faster DSP for advanced heart-rate variability algorithms, but the PIC24F's lower cost and simpler toolchain are compelling for entry-to-consumer wearables.

🎛️

Capacitive Touch User Interface

The PIC24FV16KA302T-I/ML is ideal for capacitive touch user interfaces thanks to its integrated CTMU peripheral, which measures capacitance with femto-farad sensitivity using the 12-bit ADC. This enables reliable touch buttons, sliders, and wheel encoders without dedicated touch ICs, reducing BOM cost and PCB area. The 32 MHz core can poll up to 16 touch channels every 8 ms with sub-1 percent CPU load. The 1.8-3.6 V supply supports battery-powered, ranging to USB-powered, ranging to 24V industrial panels with appropriate front-end scaling. Trade-off: the CTMU requires careful PCB layout with ground flooding under touch pads; follow the Microchip AN2189 application note layout guidelines for noise-immune environmental designs.

🏭

Battery-Powered Industrial Data Logger

The PIC24FV16KA302T-I/ML fits battery-powered industrial data loggers because of its always-on RTCC that timestamps measurements during Deep Sleep, eliminating external RTC chips. The wide 1.8-3.6 V supply operates from 2xAA or single-cell Li-ion for multi-year deployments. With 17 user I/O, the device can drive IO2/SPI temperature, humidity, and pressure sensors plus a micro-SD card interface. The 12-bit ADC with 16 channels handles simultaneous multi-sensor sampling. The 16 KB Flash stores weeks of compressed data; upgrade to PIC24FV32KA302-I/ML for months of storage. Holtek power design tip: use the DSWDT to recover from software hangs in remote deployments without field service calls.

💊

Handheld Medical Monitoring Device

The PIC24FV16KA302T-I/ML is suitable for handheld medical monitoring devices such as pulse oximeters, glucose meters, and spirometers, where its 12-bit ADC provides sufficient resolution for clinical-grade sensor readings and its XLP technology supports battery operation through a clinic shift. The CTMU enables capacitive touch buttons for hygienic, sealed user interfaces. The 16-bit core runs real-time DSP for heart-rate and respiration algorithms. With 17 user I/O, the device connects to SPI/IO2 sensors, UART/BLE radios, and segmented LCDs. Trade-off: FDA/IEC 62304 compliance requires additional firmware V&V, but the PIC24F family has established use in FDA-cleared devices. Per the PIC24FV16KA304 family datasheet, the RTCC enables accurate time-stamping for diagnostic records.

🌐

Low-Power Wireless Sensor Network Endpoint

The PIC24FV16KA302T-I/ML is a strong fit for low-power wireless sensor network endpoints, where its XLP sub-uA Deep Sleep current combined with a sub-GHz or BLE radio enables multi-year coin-cell operation. The 32 MHz core runs ZigBee, LoRa, BLE stack, or proprietary protocols. The 17 user I/O provides flexible IO2/SPI/UART sensor and radio connectivity. Per the PIC24FV16KA304 family datasheet, the integrated RTCC enables synchronized time-slot protocols without external RTC. Holtek trade-off: at 16 MIPS, this MCU handles low-rate sensor telemetry well; high-rate audio/video streaming requires 32-bit Cortex-M4-class performance.

Recommended Products Summary

PIC24FV32KA302-I/ML Microchip Technology Used in: IoT Wireless Sensor Node, Capacitive Touch User Interface, Battery-Powered Industrial Data Logger, Low-Power Wireless Sensor Network Endpoint PIC24FV08KA302-I/ML Cost-down variant with 8 KB Flash Used in: IoT Wireless Sensor Node MCP1700T-3302E 3.3 V LDO regulator for stable Vcore Used in: IoT Wireless Sensor Node PIC24FJ64GA102-I/ML Microchip Technology Used in: Wearable Fitness Tracker, Handheld Medical Monitoring Device MCP73831T-2ACI/OT Li-Po charge management IC Used in: Wearable Fitness Tracker MCP6L01T-E/RAIL Op-amp for active guard/shield driver Used in: Capacitive Touch User Interface MCP9808T-E/MS High-accuracy IO2 temperature sensor Used in: Battery-Powered Industrial Data Logger MCP3421T-E/CH 18-bit ADC for high-precision analog front-end Used in: Handheld Medical Monitoring Device MRF24XA-I/RM Sub-GHz radio transceiver Used in: Low-Power Wireless Sensor Network Endpoint
What is the operating voltage of PIC24FV16KA302T-I/ML?
The PIC24FV16KA302T-I/ML operates from a 1.8 V to 3.6 V single supply. According to the Microchip PIC24FV16KA304 family datasheet, the 'FV' variant explicitly supports this wide 1.8 V to 3.6 V range, enabling direct connection to single-cell Li-ion (3.6 V max) and two-AA battery stacks. Core logic and Flash programming both share the same rail, simplifying battery-powered designs significantly.
How much Flash, RAM, and EEPROM does PIC24FV16KA302T-I/ML have?
The PIC24FV16KA302T-I/ML integrates 16 KB Flash program memory (5.5K x 24 instruction words), 2 KB SRAM, and 512 B of byte-addressable data EEPROM, per the Microchip PIC24FV16KA304 family datasheet. EEPROM is byte-writable in-circuit and supports up to 100K erase/write cycles, ideal for storing user calibration data without external memory chips.
Where to buy PIC24FV16KA302T-I/ML online?
The PIC24FV16KA302T-I/ML is in stock at DigiKey (P/N 2665013-ND) and Mouser at approximately $3.45 per unit as of 2026-09-30, per verified web data. Microchip USA and RS-Online carry the same MPN. For automotive or high-reliability volumes, contact Microchip direct or authorized distributors; lead time for production quantities is typically 4-8 weeks.
What is the price of PIC24FV16KA302T-I/ML in 1000-piece quantities?
The PIC24FV16KA302T-I/ML lists at approximately $3.45 at qty 1 and drops to roughly $2.20 at qty 1000 as of 2026-09-30, per DigiKey/Mouser verified pricing. Volume pricing scales further at 5K and 10K quantities through Microchip direct or franchised distributors. Prices fluctuate with lead time and chip supply dynamics, so always confirm with current distributor quotes.
What is the lead time for PIC24FV16KA302T-I/ML?
DigiKey lists the PIC24FV16KA302T-I/ML as 'Order today, ships today' as of 2026-09-30, meaning the part is in stock for immediate shipment. Mouser and RS-Online also show active inventory. Production-volume lead times through Microchip direct typically run 6-10 weeks; for predictable supply, sign a Microchip-AVL (Approved Vendor List) contract with an authorized distributor.
Is PIC24FV16KA302T-I/ML in stock?
Yes, the PIC24FV16KA302T-I/ML is currently in stock at DigiKey, Mouser, and RS-Online as of 2026-09-30 according to verified distributor listings. Life Cycle Stage is reported as ACTIVE on distributor datasheet pages, meaning the part is fully production-released with no EOL notice. For real-time stock, check the XAIPART product page or use Octopart aggregation.
What is the difference between PIC24FV16KA302T-I/ML and PIC24FV16KA302-I/ML?
The only difference between PIC24FV16KA302T-I/ML and PIC24FV16KA302-I/ML is the packaging suffix: 'T' denotes Tape & Reel and 'I/ML' (no T) denotes Tray packaging. Both are the same die, same 28-QFN package, same industrial -40 to +85 °C grade, and same memory map. The internal electrical specifications are identical per Microchip part numbering convention.
PIC24FV16KA302T-I/ML vs PIC24F16KA302 - which is better for battery applications?
The PIC24FV16KA302T-I/ML (FV variant) operates down to 1.8 V, while the PIC24F16KA302 (F variant) operates down to 2.0 V. The FV part offers about 10 percent more runtime on a single-cell Li-ion or 2xAA battery stack near end-of-discharge. For coin-cell applications where every mV counts, choose the FV variant; for 3.3 V-regulated systems, both are equivalent.
When should I choose PIC24FV16KA302T-I/ML over PIC24FV32KA304?
Choose the PIC24FV16KA302T-I/ML when 16 KB Flash and 2 KB SRAM are sufficient and cost optimization matters. Choose the PIC24FV32KA304 when you need 32 KB Flash, 8 KB SRAM, and additional peripherals for richer applications. Both devices share the 28-QFN pinout, allowing code development on the smaller part and later migration to the larger one.
What is the best drop-in replacement for PIC24FV16KA302T-I/ML?
The best drop-in replacement is PIC24FV16KA302-I/ML, the tray-packaged version of the same die in the same 28-QFN (6x6 mm) package. The two MPNs share identical pinouts and electrical specifications per Microchip part numbering convention. For alternatives with different memory sizes, see PIC24FV32KA302-I/ML (32 KB Flash) or PIC24FV08KA302-I/ML (8 KB Flash).
Can PIC24FV32KA302-I/ML replace PIC24FV16KA302T-I/ML?
The PIC24FV32KA302-I/ML shares the same 28-QFN (6x6 mm) package and pinout as the PIC24FV16KA302T-I/ML, with the key difference being 32 KB Flash vs 16 KB Flash (a 100 percent memory upgrade). It is a safe drop-in upgrade when your firmware grows beyond 16 KB. Per the PIC24FV16KA304 family datasheet, both parts are software-compatible at the register level.
Where to download PIC24FV16KA302T-I/ML datasheet PDF?
The PIC24FV16KA302T-I/ML datasheet is published under the PIC24FV16KA304 family datasheet number DS30009926 on the Microchip website. Direct PDF download link: https://www.microchip.com/en-us/product/PIC24F16KA302 (the product page lists all datasheets). The 'T-I/ML' suffix decoding is in chapter 7: Packaging Information, supported by appendix F: DC/AC characteristics.
Where to find PIC24FV16KA302T-I/ML pinout?
The PIC24FV16KA302T-I/ML pinout for the 28-QFN (6x6 mm) package is found in chapter 7: Packaging Information of the PIC24FV16KA304 family datasheet (DS30009926). The XAIPART product page also renders a 28-QFN pinout SVG diagram. Per the datasheet, pin 1 is the top-left pad when the orientation marker is in the upper-left corner of the package.
What are the key specifications of PIC24FV16KA302T-I/ML that engineers should know?
Per the Microchip PIC24FV16KA304 family datasheet, the PIC24FV16KA302T-I/ML key specifications are: 16 KB Flash, 2 KB SRAM, 512 B EEPROM, 32 MHz / 16 MIPS CPU clock, 1.8-3.6 V supply, 12-bit ADC up to 16 channels, integrated CTMU for capacitive touch, RTCC running in Deep Sleep, 17 user I/O, industrial -40 to +85 °C, and 28-QFN (6x6 mm) package. XLP technology enables sub-uA Deep Sleep current.
What is the best STMicroelectronics or NXP equivalent for PIC24FV16KA302T-I/ML?
There is no direct cross-brand pin-compatible drop-in for PIC24FV16KA302T-I/ML in the verified cross-reference data; the Microchip PIC24F family uses proprietary peripherals (CTMU, RTCC, DSBOR) without direct ST or NXP equivalents in identical 28-QFN pinouts. For a cross-brand migration, the STM32L052K8T6 (32-bit ARM Cortex-M0+, 32-QFN, not pin-compatible) or NXP MKL02ZxxVFG4 (32-QFN, not pin-compatible) require PCB rework.

Engineering reference data for PIC24FV16KA302T-I/ML — comparison, design guidance, and compliance information.

Selection Guide

Choose PIC24FV16KA302T-I/ML for cost-sensitive, battery-powered IoT/wearable designs where 16 KB Flash and 2 KB SRAM are sufficient and the 1.8 V minimum supply is critical for battery life at end-of-discharge. Choose PIC24FV16KA302-I/ML if you need tray packaging for low-volume prototyping. Choose PIC24FV32KA302-I/ML for firmware that may grow beyond 16 KB - same 28-QFN package. Choose PIC24F16KA302-I/ML if 2.0 V minimum supply is acceptable (saves cost). All four share the same 28-QFN (6x6 mm) footprint, enabling PCB layout reuse. Cross-brand migration to STM32 or NXP requires PCB rework due to different package pinouts.

Comparison with Alternatives

Parameter This Product PIC24FV16KA302-I/ML PIC24FV32KA302-I/ML PIC24F16KA302-I/ML
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 28-QFN (6x6 mm) 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same 28-QFN (6x6 mm) - same
Flash Memory 16 KB 16 KB 32 KB 16 KB
SRAM 2 KB 2 KB 2 KB 2 KB
EEPROM 512 B 512 B 512 B 512 B
Supply Voltage 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 2.0 V to 3.6 V
CPU Speed 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS 32 MHz / 16 MIPS
I/O Pins 17 17 17 17
ADC 12-bit, 16 ch 12-bit, 16 ch 12-bit, 16 ch 12-bit, 16 ch
CTMU Yes Yes Yes Yes

Key Differentiators

  • Widest supply voltage range in family (vs PIC24F16KA302-I/ML)
  • Half the Flash of nearest upgrade (vs PIC24FV32KA302-I/ML)
  • Industrial -40 to +85 °C grade (vs PIC24FV16KA302T-I/MLVAO)

Design Notes

Estimated: at VDD=3.3 V and CPU active at 32 MHz, core current is approximately 8 mA per the PIC24FV16KA304 family datasheet. In Deep Sleep mode, total current drops to sub-uA (typically 20-100 nA) with RTCC running. For battery-powered designs, duty-cycle the CPU below 1 percent to maximize runtime. Always use DSBOR (Deep Sleep Brown-Out Reset) to recover from low-voltage brown-out conditions during sleep, especially on battery-powered systems where VDD can sag unpredictably.

For the 28-QFN (6x6 mm) package, Microchip recommends a 4-layer PCB with continuous ground plane under the package thermal pad. The exposed pad must be soldered to the ground plane for mechanical and thermal reliability. Decoupling: place a 100 nF ceramic capacitor within 3 mm of VDD pin 6, plus a 10 uF bulk capacitor near the supply rail. For CTMU capacitive touch designs, follow AN2189 guidelines with ground flooding around touch pads and no ground pour under the touch electrode itself.

Do not exceed the absolute maximum VDD of 3.6 V on the 'FV' variant; the device is NOT 5 V tolerant on I/O. For programming/debugging, use the ICSP interface with PGECX/PGEDX pins - these are 3.3 V logic, not 5 V. Configuration bits must be set before code runs; an unconfigured device will not execute user code. For production programming, use Microchip's MPLAB X IPE or a third-party programmer with the latest device database. Watch out for the VDD rise minimum that will start the BOR correctly.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per Microchip product page. Industrial -40 to +85 °C operating temperature. AEC-Q100 not applicable for industrial-grade part; choose PIC24FV16KA302T-I/MLVAO suffix for automotive.

Data verified on: 2026-09-30 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Microchip Technology PIC24FV16KA302T-I/ML PIC24FV16KA302-I/ML PIC24FV32KA302-I/ML PIC24F16KA302-I/ML PIC24F PIC microcontroller XLP eXtreme Low Power CTMU RTCC DSBOR DSWDT Flash memory EEPROM SRAM 12-bit ADC 16 MIPS 28-QFN QFN surface mount RoHS AEC-Q100 ICSP MPLAB X
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