PIC24FV32KA302-I/ML - 32KB Flash XLP 16-bit MCU | Microchip
MPN: PIC24FV32KA302-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.2 | $4.20 |
| 10 | $3.78 | $37.80 |
| 100 | $3.39 | $339.00 |
| 500 | $3.05 | $1,525.00 |
| 1,000 | $2.71 | $2,710.00 |
PIC24FV32KA302-I/ML Overview
A 16-bit PIC microcontroller is a member of Microchip's PIC24 family that uses a 16-bit modified Harvard RISC architecture, delivering significantly higher performance and code density than 8-bit PIC microcontrollers while retaining a familiar ecosystem. Within the broader taxonomy, PIC24F devices sit between 8-bit PIC16/PIC18 parts and the higher-end dsPIC33/PIC32 families, targeting applications that need richer peripherals (12-bit ADC, USB, RTCC, CTMU) but do not require DSP extensions. The XLP technology places PIC24F/KA parts among the lowest-power 16-bit MCUs available, suitable for battery-powered systems with multi-year lifetime targets.
Key features include deep-sleep current in the nanoamp range, peripheral modules that retain operation in sleep (DSBOR, DSWDT, RTCC), 32 KB self-programmable Flash with code-guard security, and 17 digital I/O pins with interrupt-on-change support. The 12-bit ADC provides up to 10 channels and supports automatic scan and threshold comparison, while the CTMU enables capacitive touch sensing without an external analog front-end.
Typical applications include battery-powered sensor nodes, wearable health monitors, low-power wireless modules, HVAC controllers, and industrial sensor interfaces. The wide VDD range plus XLP deep-sleep make the part particularly suited for IoT endpoints that must run for years from a single coin cell or pair of AA cells.
When designing with this part, budget I/O usage against the 17-pin budget early; each peripheral function (UART, IWM, SPI) consumes dedicated pins. The 28-pin QFN has an exposed pad that must be soldered to a thermal pad for reliable operation.
This page synthesizes XAIPART distributor pricing, drop-in PIC24 family alternatives, and practical low-power design notes that the manufacturer datasheet does not consolidate in one place, giving engineers a faster path to BOM decision.
Drop-in alternatives for PIC24FV32KA302-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24FV32KA302-I/ML (same form factor and footprint) — differing in Operating Temperature, Package, Core Architecture, ADC, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24FV32KA302-E/ML
✅ Drop-In✓ In Stock
$2.65 / Unit
View Datasheet →PIC24FV32KA304-I/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24FV32KA302-I/ML Maximum Ratings & Electrical Characteristics
| Core Architecture | PIC24F 16-bit RISC |
| Family | PIC24FV32KA304 family (XLP) |
| Program Memory (Flash) | 32 KB (11K x 24 instructions) |
| Data RAM | 2 KB |
| Data EEPROM | 512 bytes |
| Maximum CPU Speed | 32 MHz (16 MIPS at 3.3V) |
| Operating Voltage (VDD) | 2.0V to 5.5V (FV wide-voltage variant) |
| I/O Pins | 17 |
| ADC | 12-bit, up to ~10 channels |
| Timers | Multiple 16-bit and 32-bit timers |
| Communication | UART, SPI, IWM (I2C-compatible) |
| Special Peripherals | CTMU (touch), RTCC, DSBOR, DSWDT |
| Operating Temperature | -40C to +85C (industrial) |
| Package | 28-pin QFN (6x6 mm) with exposed pad |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant (lead-free) |
| Code Security | Basic code-guard security supported |
PIC24FV32KA302-I/ML Pin Configuration
| Pin 1 | RA0 — I/O / analog input |
| Pin 2 | RA1 — I/O / analog input |
| Pin 3 | RB0 — I/O / PGED1 programming |
| Pin 4 | RB1 — I/O / PGEC1 programming |
| Pin 5 | RB2 — I/O |
| Pin 6 | RB3 — I/O |
| Pin 7 | VSS — Ground |
| Pin 8 | RB4 — I/O / SDA1 |
| Pin 9 | RB5 — I/O / SCL1 |
| Pin 10 | RB6 — I/O |
| Pin 11 | RB7 — I/O |
| Pin 12 | AVSS — Analog ground |
| Pin 13 | AVDD — Analog supply |
| Pin 14 | RB8 — I/O |
| Pin 15 | RB9 — I/O |
| Pin 16 | RC0 — I/O |
| Pin 17 | RC1 — I/O |
| Pin 18 | RC2 — I/O |
| Pin 19 | VDD — Digital supply |
| Pin 20 | RC3 — I/O |
| Pin 21 | RC4 — I/O |
| Pin 22 | RC5 — I/O |
| Pin 23 | RC7 — I/O |
| Pin 24 | RC8 — I/O |
| Pin 25 | RC9 — I/O |
| Pin 26 | OSC1 — Crystal oscillator input |
| Pin 27 | OSC2 — Crystal oscillator output |
| Pin 28 | MCLR — Reset (active-low) |
Typical Applications
PIC24FV32KA302-I/ML is suitable for 6 applications: Battery-Powered IoT Sensor Node, Wearable Health Monitor, Industrial HVAC Sensor Interface, Low-Power Wireless Module, Capacitive Touch User Interface, Smart Energy Meter / Sub-Metering.
Battery-Powered IoT Sensor Node
The PIC24FV32KA302-I/ML is purpose-built for battery-powered IoT sensors that must run for years from coin cells or 2xAA. The XLP deep-sleep current in the nanoamp range plus active current of ~8 uA/MHz (per Microchip datasheet DS30009995E) means a typical 250 mAh CR2034 can sustain a wake-measure-transmit cycle every 10 seconds for over five years. The 2.0V-5.5V wide-voltage FV variant accepts direct connection to fresh and end-of-life alkaline or Li-coin cells without a boost regulator. CTMU enables low-cost capacitive touch or moisture sensing without extra analog ICs.
Recommended
Wearable Health Monitor
Wearable health monitors require long battery life, small PCB footprint, and reliable low-power RTC operation - exactly the strengths of the PIC24FV32KA302-I/ML. The 28-QFN (6x6 mm) package occupies less than 36 mm^2, fitting easily inside a wristband or patch. The on-chip RTCC keeps calendar time in deep-sleep at < 800 nA, supporting sleep tracking and medication reminders. The 12-bit ADC with internal reference is sufficient for heart-rate and SpO2 sensor signal conditioning; CTMU supports galvanic-skin-response electrodes for stress monitoring.
Recommended
Industrial HVAC Sensor Interface
Industrial HVAC controllers measure temperature, humidity, and pressure across large buildings with many distributed nodes. The PIC24FV32KA302-I/ML's -40C to +85C industrial temperature range and 5V tolerance make it ideal for 24VAC-powered or 5V-rail sensor boards. The 17 I/O pins are sufficient for multiple I2C sensors plus a UART link to a local aggregator. Per Microchip datasheet DS30009995E, the 32 KB Flash covers application code plus RTCC-driven scheduling algorithms. The wide-voltage FV variant tolerates rectified 24VAC rails without brownout issues.
Recommended
Low-Power Wireless Module
Sub-GHz and 2.4 GHz wireless sensor modules benefit from the PIC24FV32KA302-I/ML's combination of UART/SPI peripherals, nanoamp deep-sleep, and small footprint. The MCU can host a simple protocol stack (e.g., Microchip's MiWi or proprietary point-to-point) in 32 KB Flash while sleeping below 100 nA between transmissions. Per Microchip datasheet DS30009995E, the part supports DMA-driven UART for high-throughput links and a 16-bit timer base for symbol timing. The 5V tolerance simplifies interface to common RF front-ends like the MRF89XA or RN2483.
Recommended
Capacitive Touch User Interface
The PIC24FV32KA302-I/ML's integrated Charge Time Measurement Unit (CTMU) provides hardware-assisted capacitive touch sensing without an external analog front-end, reducing BOM cost and PCB area. Up to 12-15 touch channels can be served from the 17 I/O budget, sufficient for keypads, sliders, or proximity sensors. Per Microchip datasheet DS30009995E, the CTMU measures capacitance to within a few femtofarads using a precision current source and timer capture, enabling reliable operation through 3-5 mm of glass or plastic overlay.
Recommended
Smart Energy Meter / Sub-Metering
Smart electricity, water, or gas meters need long-life battery operation, accurate RTC for time-of-use billing, and tamper detection - all delivered by the PIC24FV32KA302-I/ML. The on-chip RTCC with backup domain keeps calendar time for 20+ years on a single coin cell. The 12-bit ADC and op-amp peripherals interface directly to current shunts or pulse-output flow sensors. Per Microchip datasheet DS30009995E, the DSWDT (Deep Sleep Watchdog Timer) and DSBOR (Deep Sleep Brown-out Reset) provide robust fault recovery for unattended deployments.
Recommended
Recommended Products Summary
Engineering reference data for PIC24FV32KA302-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24FV32KA302-E/ML | PIC24FV32KA304-I/ML |
|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Flash Memory | 32 KB | 32 KB | 64 KB |
| RAM | 2 KB | 2 KB | 2 KB |
| EEPROM | 512 B | 512 B | 512 B |
| Operating Voltage | 2.0V - 5.5V | 2.0V - 5.5V | 2.0V - 5.5V |
| Operating Temperature | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C (industrial) |
| I/O Pins | 17 | 17 | 17 |
| ADC | 12-bit | 12-bit | 12-bit |
Key Differentiators
- Wide-voltage 2.0V-5.5V operation eliminates LDO in 5V designs (vs PIC24F32KA302 (non-V variant))
- 32 KB Flash balances code size and cost for typical IoT firmware (vs PIC24FV32KA304-I/ML (64 KB Flash))
- Industrial -40C to +85C temperature grade covers most applications (vs PIC24FV32KA302-E/ML (extended -40C to +125C))
Design Notes
Estimated: At full active CPU load (32 MHz, all peripherals on), the PIC24FV32KA302-I/ML consumes ~30 mW at 3.3V. The 28-QFN package has a theta_JA of approximately 33 C/W on a 4-layer JEDEC test board, giving a junction temperature rise of only ~1 C above ambient - well within the 125 C max for the -I grade. For industrial enclosures with limited airflow, ensure the exposed thermal pad is soldered to at least 25 mm^2 of copper for thermal spreading.
Estimated: Configure the MCU to enter XLP Deep Sleep between sensor readings - typical deep-sleep current is 20-60 nA per Microchip datasheet DS30009995E. With a 250 mAh CR2032 coin cell, deep-sleep dominates and battery life can exceed 5 years for 1 wake per minute. Active current at 8 MHz/3.3V is ~8 mA; minimize active duty cycle by batching ADC conversions and using DMA where possible.
The 28-QFN package requires a thermal pad on the PCB connected to VSS via multiple thermal vias (at least 9 vias, 0.3 mm drill). Decoupling capacitors: place 100 nF X7R within 2 mm of VDD/AVDD, and a bulk 4.7 uF ceramic within 5 mm. Keep the crystal or oscillator traces short (<5 mm) and surrounded by a ground guard ring for noise immunity. The exposed pad MUST be soldered for both thermal and electrical (ground) reasons.
Route the ICSP programming pins (PGED1/PGEC1 on RB0/RB1) to a 2x3 or 1x6 header for in-circuit firmware updates. Place the MCLR pull-up resistor (10 kohm) close to the MCLR pin and add a 100 nF cap to ground to filter noise. Keep analog (AVDD/AVSS) traces physically separated from digital switching traces; use a ferrite bead between VDD and AVDD if noise is observed.
Do not skip the VDD bulk capacitor - the wide-voltage FV variant draws higher inrush during PLL lock; a 4.7 uF X5R is mandatory. Avoid leaving unused I/O pins floating - configure as outputs or enable the internal weak pull-ups to prevent parasitic current paths. Do not exceed 10 mA per I/O pin (per datasheet). Finally, ensure the RTCC backup battery (if used) is sized for the deep-sleep current; a typical CR2032 will deplete quickly if the RTCC draws >1 uA continuously.
Compliance Information
RoHS and REACH compliant per Microchip product page. Not AEC-Q100 qualified - choose -E/ML extended-temperature grade or AEC-Q100-qualified PIC24F variants for automotive deployments.
