PIC24FV32KA302T-I/ML - 32KB Flash 16-bit XLP MCU | Microchip
MPN: PIC24FV32KA302T-I/ML ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1.96 | $1.96 |
| 10 | $1.78 | $17.80 |
| 100 | $1.62 | $162.00 |
| 500 | $1.47 | $735.00 |
| 1,000 | $1.31 | $1,310.00 |
PIC24FV32KA302T-I/ML Overview
A 16-bit microcontroller (MCU) is a programmable processor with a 16-bit data path, sitting between 8-bit MCUs and 32-bit MCUs in the embedded hierarchy: microcontroller -> embedded processor -> system-on-chip (SoC) -> semiconductor. Microchip's PIC24F family uses a modified Harvard RISC architecture optimized for low-power, deterministic real-time control, with on-chip peripherals such as ADC, UART, SPI, I2C, timers, and CTMU integrated into a single chip.
Key differentiating features of the PIC24FV32KA302T-I/ML include eXtreme Low Power (XLP) technology with Deep Sleep mode currents in the nanoamp range, dedicated ultra-low-power peripherals (DSBOR, DSWDT, RTCC) that operate during Deep Sleep, a 12-bit ADC with up to 16 input channels, three 16-bit timers, two I2C, two SPI, and two UART modules. The CTMU (Charge Time Measurement Unit) enables touch sensing and precision time measurement.
The PIC24FV32KA302T-I/ML shares a peripheral library and toolchain with the broader PIC24F family, including the dsPIC33 compatible instruction set. With 17 usable I/O pins, it offers strong GPIO density for the 28-pin QFN package while preserving the small 6x6 mm footprint. The included RTCC with calendar mode and the deep-sleep-capable watchdog make it well suited for battery-backed applications requiring timekeeping during the lowest-power sleep state.
Typical applications include battery-powered IoT sensor nodes, portable medical monitoring devices, wearable fitness/health trackers, energy-harvesting wireless sensor nodes, ultra-low-power remote controls, and industrial data loggers with calendar time stamping. The wide 2V–5.5V supply range also permits direct 3.3V or 5V system operation.
When designing with this device, place the IC on a continuous ground pour that ties to the exposed pad (EP) for thermal and electrical performance, and bypass VDD/VSS pairs with at least one 0.1uF ceramic capacitor adjacent to the pins. The PPS (Peripheral Pin Select) feature permits remapping of digital peripherals to multiple I/O pins, which simplifies PCB routing but requires careful configuration to avoid conflicts.
This page synthesizes distributor pricing, XLP-specific power data, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet summary, helping engineers select and qualify the PIC24FV32KA302T-I/ML for low-power embedded designs.
Drop-in alternatives for PIC24FV32KA302T-I/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC24FV32KA302T-I/ML (same form factor and footprint) — differing in Package, Maximum CPU Speed, Operating Temperature, Program Memory (Flash), RTCC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC24FV32KA302-I/ML
✅ Drop-In✓ In Stock
$2.71 / Unit
View Datasheet →PIC24FV32KA302T-E/ML
✅ Drop-In📋 Reference alternative (not in catalog)
PIC24FV32KA302-I/SS
✅ Drop-In✓ In Stock
$2.18 / Unit
View Datasheet →PIC24FV32KA301T-I/SS
✅ Drop-In✓ In Stock
$2.2 / Unit
View Datasheet →PIC24FV16KA302T-I/ML
✅ Drop-In✓ In Stock
$2.2 / Unit
View Datasheet →PIC24FV16KM202T-I/ML
✅ Drop-In✓ In Stock
$1.92 / Unit
View Datasheet →PIC24FV32KA302T-I/ML Maximum Ratings & Electrical Characteristics
| Product Family | PIC® XLP™ 24F |
| Core Architecture | 16-bit Modified Harvard RISC |
| CPU Core | PIC24 |
| Maximum CPU Speed | 32 MHz (16 MIPS) |
| Program Memory (Flash) | 32 KB (11K x 24 instructions) |
| Data SRAM | 2 KB |
| Data EEPROM | 512 bytes |
| Supply Voltage (VDD) | 2V to 5.5V |
| I/O Pins | 17 |
| ADC | 12-bit, up to 16 channels |
| Timers | 3 x 16-bit |
| UART | 2 |
| SPI | 2 |
| I2C | 2 |
| CTMU | Yes (Charge Time Measurement Unit) |
| RTCC | Yes (Real-Time Clock/Calendar, runs in Deep Sleep) |
| Operating Temperature | -40°C to +85°C (Industrial, "-I") |
| Package | 28-QFN (6x6 mm) with exposed thermal pad |
| Mounting Type | Surface Mount |
| MSL Level | 3 |
| RoHS Status | Compliant |
PIC24FV32KA302T-I/ML Pin Configuration
| Pin 1 | RA0 — Analog/Digital I/O; AN0; RP5 |
| Pin 2 | RA1 — Analog/Digital I/O; AN1; RP6 |
| Pin 3 | RA2 — Analog/Digital I/O; AN2; VREF- |
| Pin 4 | RA3 — Analog/Digital I/O; AN3; VREF+ |
| Pin 5 | RA4 — Analog/Digital I/O; AN4 |
| Pin 6 | AVDD — Analog supply voltage |
| Pin 7 | AVSS — Analog ground |
| Pin 8 | RA5 — Analog/Digital I/O; AN5; RP7 |
| Pin 9 | RA6 — Digital I/O; RP8; OSCO |
| Pin 10 | RA7 — Digital I/O; RP9; OSCI |
| Pin 11 | RB0 — Digital I/O; PGED1; AN6 |
| Pin 12 | RB1 — Digital I/O; PGEC1; AN7 |
| Pin 13 | RB2 — Digital I/O; AN8; RP2 |
| Pin 14 | RB3 — Digital I/O; AN9; RP3 |
| Pin 15 | VBUS — USB VBUS sense; if unused tie to VDD |
| Pin 16 | VDD — Digital supply voltage |
| Pin 17 | VSS — Digital ground |
| Pin 18 | RB4 — Digital I/O; AN10; SDA10 |
| Pin 19 | RB5 — Digital I/O; AN11; RP4 |
| Pin 20 | RB6 — Digital I/O; AN12; RP13 |
| Pin 21 | RB7 — Digital I/O; AN13; RP14 |
| Pin 22 | RB8 — Digital I/O; AN14; RP15 |
| Pin 23 | RB9 — Digital I/O; AN15; RP16 |
| Pin 24 | RC0 — Digital I/O; RP17; SOSCO |
| Pin 25 | RC1 — Digital I/O; RP18; SOSCI |
| Pin 26 | RC2 — Digital I/O; RP19 |
| Pin 27 | RC3 — Digital I/O; RP20 |
| Pin 28 | RC4 — Digital I/O; RP21 |
Typical Applications
PIC24FV32KA302T-I/ML is suitable for 6 applications: Battery-Powered IoT Sensor Nodes, Wearable Health and Fitness Trackers, Portable Medical Monitoring Devices, Energy-Harvesting Wireless Sensor Nodes, Ultra-Low-Power Remote Controls, Industrial Data Loggers with Calendar Timestamps.
Battery-Powered IoT Sensor Nodes
The PIC24FV32KA302T-I/ML's XLP technology with nanoamp Deep Sleep currents and 2V–5.5V operation makes it ideal for IoT sensor nodes powered by a single CR2032 coin cell or two AA batteries. Its RTCC and DSBOR peripherals remain active during Deep Sleep, allowing the MCU to wake periodically, take a sensor reading via the 12-bit ADC, transmit, and return to sub-uA sleep. The 32KB Flash is sufficient for over-the-air (OTA) update stacks like LoRaWAN or BLE beacons. The CTMU enables precise timing for ultrasonic or capacitive sensors, while PPS lets designers remap UART/SPI/I2C to any digital pin for flexible PCB layout.
Recommended
Wearable Health and Fitness Trackers
Wearables require multi-day battery life and small PCB area — both delivered by the PIC24FV32KA302T-I/ML's 6x6 mm QFN package and XLP Deep Sleep. The 12-bit ADC samples bioelectric signals (heart rate, SpO2), the CTMU provides capacitive touch for UI buttons, and the RTCC drives calendar/time logging during sleep. The 2KB SRAM supports small BLE or ANT+ protocol stacks. The -40°C to +85°C industrial range covers body-worn thermal stress, and the 2V–5.5V supply simplifies direct Li-ion or Li-poly battery connection without a separate LDO.
Recommended
Portable Medical Monitoring Devices
Portable medical devices demand ultra-low standby current, predictable real-time response, and IEC 62304-grade firmware support — all delivered by the PIC24FV32KA302T-I/ML. The 32 MHz / 16 MIPS core runs compression and signal-processing algorithms on low-bandwidth sensor data. The 12-bit ADC at 200 ksps handles ECG, pulse-oximeter, and glucose-monitor front-ends. The CTMU measures impedance for body-composition meters. Deep Sleep currents under 100 nA extend battery life in between patient measurements, and the QFN package fits inside handheld enclosures.
Recommended
Energy-Harvesting Wireless Sensor Nodes
Energy-harvesting designs operate from milliwatts of harvested energy, so the MCU's quiescent current and wake-up time dominate system feasibility. The PIC24FV32KA302T-I/ML's nanoamp Deep Sleep and sub-microsecond wake time make it ideal for solar, vibration, or thermal-gradient harvesters driving a supercap. Its 2V–5.5V range tolerates the variable supercap voltage without a pre-regulator, and the 32KB Flash holds small MQTT-SN or proprietary RF protocol stacks. The RTCC with calendar wake-up enables periodic transmissions synchronized to daily or hourly intervals.
Recommended
Ultra-Low-Power Remote Controls
Remote controls for TVs, smart-home devices, and industrial key fobs spend 99.9% of their life in sleep, waking only on a button press. The PIC24FV32KA302T-I/ML's XLP Deep Sleep (under 60 nA typical) and CTMU-based capacitive touch wake enable multi-year battery life from a single CR2032. The 32KB Flash supports proprietary IR/RF protocols and encryption, while the PPS feature lets designers assign UART, SPI, or PWM to any pin for flexible PCB layout in slim enclosures.
Recommended
Industrial Data Loggers with Calendar Timestamps
Industrial data loggers require accurate time-stamping of measurements even when the main MCU is asleep. The PIC24FV32KA302T-I/ML's RTCC (Real-Time Clock/Calendar) operates independently during Deep Sleep, maintaining seconds-to-year timekeeping with on-chip 32 kHz crystal. The 512-byte EEPROM provides non-volatile storage for small log entries, and the 12-bit ADC at up to 200 ksps captures process variables (temperature, pressure, flow). The 2V–5.5V range handles 3.3V industrial rails or 24V bus systems via a pre-regulator.
Recommended
Recommended Products Summary
Engineering reference data for PIC24FV32KA302T-I/ML — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC24FV32KA302-I/ML | PIC24FV32KA302T-E/ML | PIC24FV32KA301T-I/SS | PIC24FV16KA302T-I/ML | PIC24FV16KM202T-I/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN (6x6 mm) | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same | 28-QFN (6x6 mm) - same |
| Program Flash | 32 KB | 32 KB | 32 KB | 32 KB | 16 KB | 16 KB |
| Data SRAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| Data EEPROM | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 512 bytes | 512 bytes |
| Supply Voltage | 2V to 5.5V | 2V to 5.5V | 2V to 5.5V | 2V to 5.5V | 2V to 5.5V | 2V to 5.5V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +125C (Extended) | -40C to +85C | -40C to +85C | -40C to +85C |
| Packaging | Tape & Reel | Tray | Tape & Reel | Tape & Reel (SS suffix) | Tape & Reel | Tape & Reel |
Key Differentiators
- Wide-voltage 2V-5.5V operation covers both 3.3V and 5V rails with single part (vs PIC24F32KA302-I/ML (PIC24F 1.8V-3.6V))
- Extended temperature grade option in identical package (vs PIC24FV32KA302T-E/ML (PIC24FV -40C to +125C extended))
- Higher Flash density in identical 28-QFN package (vs PIC24FV16KA302T-I/ML (16 KB Flash))
- Tray vs tape-and-reel interchangeable for prototype or production (vs PIC24FV32KA302-I/ML (tray variant))
Design Notes
The 28-QFN package has an exposed thermal pad (EP) on its underside that MUST be soldered to a copper pour tied to ground for both thermal dissipation and electrical reference. Use at least 4 thermal vias (0.3 mm drill) inside the EP land pattern to stitch the top ground pour to inner/ground planes. The 6x6 mm footprint requires 0.4 mm pitch traces — keep adjacent traces at least 0.2 mm from QFN pads to avoid solder bridges during reflow.
Place a 0.1 uF ceramic decoupling capacitor adjacent to each VDD/VSS pair, plus a bulk 1 uF–10 uF capacitor on the main VDD rail. The PIC24FV32KA302T-I/ML draws up to ~30 mA at full 32 MHz operation, so the supply trace should be at least 0.3 mm wide. The exposed pad (EP) MUST also be connected to ground — never leave it floating, as it serves as the primary current return path.
Do not confuse PIC24FV (wide voltage 2V–5.5V) with PIC24F (low voltage 1.8V–3.6V). They are NOT pin-compatible across the KA302 family — pin numbers in bold in the datasheet indicate function differences between FV and F variants. Always verify the pinout by silicon revision when migrating. Also note the PPS (Peripheral Pin Select) feature must be unlocked via OSCCON before remapping — failing to do so locks out the peripheral.
For I2C buses, place 2.2 kohm–10 kohm pull-ups on SDA/SCL close to the MCU. The PIC24FV32KA302T-I/ML's I2C supports up to 400 kHz Fast mode; for longer buses use 2.2 kohm. For SPI, keep clock trace under 50 mm and use 22–33 ohm series damping resistors if the slave is more than 25 mm away. PPS remapping does not change electrical characteristics, so the same signal-integrity rules apply regardless of pin assignment.
Estimated: At 32 MHz and 5V supply with all peripherals active, the PIC24FV32KA302T-I/ML draws approximately 15 mA, dissipating ~75 mW into the QFN package. With a 4-layer PCB and 1 sq inch ground pour on the top layer under the EP, theta_JA is approximately 35 C/W, giving a 2.6 C rise above ambient — well within industrial -40C to +85C operating range. Avoid blocking the EP with traces or via-in-pad without thermal relief.
Compliance Information
RoHS compliance confirmed by Microchip product page and JLCPCB stock listings. Lead-free per DigChip "LEAD FREE" descriptor. Not AEC-Q100 qualified (industrial grade only); for AEC-Q100, contact Microchip for automotive part numbers.
