Microchip Technology

PIC32MX230F064DT-V/ML - 40MHz 32-bit MCU 64KB Flash | Microchip

MPN: PIC32MX230F064DT-V/ML ✓ Active
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2.5V or 3.3V Vdss 0.5 mA/MHz Id 44-pin QFN (8x8 mm) with exposed pad (ML) Package 40 MHz (66 DMIPS) Speed 64 KB (64K x 8) Memory
From $3.95 USD / Unit
MOQ: 1 |
Price updated: 2026-10-01
Volume Pricing
Qty Unit Price Extended
1 $6.2 $6.20
10 $5.58 $55.80
100 $4.96 $496.00
500 $4.45 $2,225.00
1,000 $3.95 $3,950.00
ℹ️ All prices are in USD

PIC32MX230F064DT-V/ML Overview

The Microchip PIC32MX230F064DT-V/ML is a 32-bit RISC microcontroller from the PIC32MX2xx family, featuring a MIPS32 M4K core running at 40 MHz (66 DMIPS), 64 KB of Flash, 16 KB of SRAM, and housed in a 44-pin QFN (8x8 mm) package with exposed thermal pad. The device operates from 2.5V or 3.3V, integrates two I2S/SPI modules, Peripheral Pin Select (PPS), a Parallel Master Port (PMP), mTouch capacitive touch support, 1 ns high-resolution time measurement, and an on-chip temperature sensor. The -V suffix denotes the automotive AEC-Q100 Grade 1 temperature range of -40C to +105C.

A 32-bit microcontroller (MCU) is an integrated circuit containing a processor core, program memory, data memory, and programmable peripherals on a single die. The PIC32MX230 belongs to the broader category of embedded microcontrollers within the power management and control IC hierarchy: MCU -> embedded controller -> semiconductor device. The MIPS32 M4K core provides 32-bit register width and a 5-stage pipeline, yielding substantially higher throughput than 8-bit or 16-bit MCUs while remaining compatible with the standard MIPS instruction set.

Key features include active current consumption of 0.5 mA/MHz, support for the MPLAB X IDE and Harmony framework, hardware CRC, JTAG and 2-wire programming/debug, and 5 CCP/PMP/I2S-capable timer/capture modules. The PPS function lets the user remap most digital peripherals to a wide choice of I/O pins, simplifying PCB routing in space-constrained designs.

Architecturally, the PIC32MX230 combines a Harvard-style bus with separate Flash and SRAM paths, hardware multiply/divide, and a Nested Vector Interrupt Controller (NVIC). This allows deterministic interrupt latency and fast context switches for real-time control loops. The 1 ns timer resolution (using the 16-bit Timer1 with cascaded mode) is well suited to high-precision time-of-flight or pulse-width measurements.

Typical applications include automotive body and HVAC control, industrial sensor hubs, capacitive touch human-machine interfaces, low-cost graphics with PMP-driven TFT panels, IoT edge nodes, and consumer appliances. The AEC-Q100 Grade 1 qualification and wide peripheral mix make it especially attractive to automotive Tier-1 suppliers needing a small-footprint MCU with CAN/USB-friendly companion chips.

When designing with this MCU, take care to honor the decoupling guidance in the PIC32MX230 family datasheet - one 0.1 uF X7R plus one bulk capacitor per VDD pin, and a dedicated decoupling cap for VDDCORE. The exposed thermal pad on the QFN-44 must be soldered to a grounded copper pour to meet the package's thermal resistance spec.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not aggregated in the manufacturer datasheet or on distributor stock pages, helping engineers evaluate the PIC32MX230F064DT-V/ML for both new designs and as a substitute for legacy PIC24/PIC32 parts.

Drop-in alternatives for PIC32MX230F064DT-V/ML — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with PIC32MX230F064DT-V/ML (same form factor and footprint) — differing in Package, ADC, Timers, Core Architecture, USB.

Microchip Technology
Package: 44-pin QFN (8x8 mm) with EP
ADC: 10-bit, up to 13 channels
Timers: Five 16-bit (Input Capture / Output Compare)
Microchip Technology
Package: 44-pin QFN (8x8 mm) with exposed pad
Microchip Technology
Package: 44-pin QFN with EP (ML)
ADC: 10-bit, 1 Msps, up to 28 channels
Timers: 5 x 16-bit / 2 x 32-bit
Microchip Technology
Package: 28-QFN (6x6 mm) with Exposed Pad
USB: Full-Speed USB 2.0 Device
Microchip Technology
Package: 28-pin QFN (ML) with exposed pad
Core Architecture: 32-bit RISC
Microchip Technology
Package: 44-QFN (8x8 mm, 0.65 mm pitch)
ADC: 10-bit, 1 MSPS, up to 13 channels
Timers: Five 16-bit
Microchip Technology
Package: 44-pin QFN (8x8 mm) with EP
ADC: 10-bit, up to 1 Msps, 9 channels
Timers: Five 16-bit General Purpose Timers
Microchip Technology
Package: 44-pin TQFP (10x10 mm), 0.80 mm pitch
ADC: 10-bit, up to 1 Msps, 13 channels
Timers: Five 16-bit timers/counters with Input Capture and Output Compare
Microchip Technology
Package: 44-pin QFN (8x8 mm) with exposed thermal pad
ADC: 10-bit, up to 1 Msps
USB: USB 2.0 full-speed device / host / OTG

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

PIC32MX230F064DT-I/ML

✅ Drop-In
Microchip Technology
📦 44-pin QFN (8x8 mm) ML
MIPS32 M4K · 32-Bit Single-Core · 40 MHz (66 DMIPS) · 64 KB (64K x 8) · 16 KB · 2.3 V to 3.6 V · 33 (some sources: 34) · 44-pin QFN (8x8 mm) with EP

✓ In Stock

$2.31 / Unit

View Datasheet →

PIC32MX230F064BT-V/ML

✅ Drop-In
Microchip Technology
📦 44-pin QFN (8x8 mm) ML
MIPS32 M4K · 32-bit RISC · 32-Bit Single-Core · 40 MHz · 66 DMIPS · 64 KB (64K x 8) · 16 KB · 2.5 V to 3.6 V

✓ In Stock

$2.13 / Unit

View Datasheet →

PIC32MX230F064B-I/ML

✅ Drop-In
Microchip Technology
📦 44-pin QFN (8x8 mm) ML
MIPS32 M4K · 32-bit Single-Core · 40 MHz · 66 DMIPS · 64 KB Flash · 16 KB SRAM · 2.3 V to 3.6 V · -40 °C to +85 °C (Industrial)

✓ In Stock

$2.46 / Unit

View Datasheet →

PIC32MX130F064DT-V/ML

✅ Drop-In
Microchip Technology
📦 44-pin QFN (8x8 mm) ML
MIPS32 M4K · 32-bit · 40 MHz · 64 KB (64K x 8) · 16 KB · 2.3 V to 3.6 V · -40C to +105C · 44-pin QFN (8x8 mm) with EP

✓ In Stock

$3.28 / Unit

View Datasheet →

PIC32MX150F128DT-V/ML

✅ Drop-In
Microchip Technology
📦 44-pin QFN (8x8 mm) ML
MIPS32 M4K 32-bit RISC · 40 MHz · 128 KB · 32 KB · 2.3 V to 3.6 V · -40C to +105C (AEC-Q100 grade) · 44-pin QFN (8x8 mm) with exposed pad · Surface Mount

✓ In Stock

$2.31 / Unit

View Datasheet →

PIC32MX170F256D-V/ML

✅ Drop-In
Microchip Technology
📦 44-pin QFN (8x8 mm) ML
MIPS M4K (32-bit RISC) · 50 MHz / 83 DMIPS · 256 KB · 64 KB · 2.5 V to 3.6 V · 44-pin QFN with EP (ML) · -40C to +105C (V suffix - industrial) · USB 2.0 Full-Speed Device, internal transceiver

✓ In Stock

$2.65 / Unit

View Datasheet →

PIC32MX230F064DT-V/ML Maximum Ratings & Electrical Characteristics

Core Architecture MIPS32 M4K 32-bit RISC
Maximum CPU Speed 40 MHz (66 DMIPS)
Program Flash Memory 64 KB (64K x 8)
Data SRAM 16 KB
Operating Voltage 2.5V or 3.3V
Operating Temperature -40C to +105C (AEC-Q100 Grade 1)
Active Current Consumption 0.5 mA/MHz
Communication Interfaces 2x I2S/SPI, UART, I2C, PMP
Timers 5x 16-bit Timer/Capture (1 ns resolution in cascaded mode)
Peripheral Pin Select (PPS) Yes
Parallel Master Port (PMP) Yes
Capacitive Touch (mTouch) Supported
On-chip Temperature Sensor Yes
ADC 10-bit 1 Msps, up to 13 channels (family-level)
Package 44-pin QFN (8x8 mm) with exposed pad (ML)
Mounting Type Surface Mount
Programming/Debug JTAG, 2-wire ICSP
RoHS Status Compliant
AEC-Q100 Qualified (Grade 1, -V variant)

PIC32MX230F064DT-V/ML Pin Configuration

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pin 1 VDDCORE — Internal core voltage decoupling (1.8V LDO output)
Pin 2 PGED1/RPG6 — Programming data / Remappable I/O
Pin 3 PGEC1/RPG7 — Programming clock / Remappable I/O
Pin 4 PGED2/RPG8 — Programming data / Remappable I/O
Pin 5 PGEC2/RPG9 — Programming clock / Remappable I/O
Pin 6 AN0/CVD0/RPB0 — Analog input / Remappable I/O
Pin 7 AN1/CVD1/RPB1 — Analog input / Remappable I/O
Pin 8 VDD — Positive supply (2.5V or 3.3V)
Pin 9 VSS — Ground reference
Pin 10 AN2/CVD2/RPB2 — Analog input / Remappable I/O
Pin 11 AN3/CVD3/RPB3 — Analog input / Remappable I/O
Pin 12 AN4/CVD4/RPB4 — Analog input / Remappable I/O
Pin 13 AN5/CVD5/RPB5 — Analog input / Remappable I/O
Pin 14 VREF-/CVREF-/RA9 — ADC negative reference / Remappable I/O
Pin 15 VREF+/CVREF+/RA10 — ADC positive reference / Remappable I/O
Pin 16 AVDD — Analog positive supply
Pin 17 AVSS — Analog ground
Pin 18 TCK/RPA7 — JTAG test clock / Remappable I/O
Pin 19 TDO/RPA8 — JTAG test data out / Remappable I/O
Pin 20 TDI/RPA9 — JTAG test data in / Remappable I/O
Pin 21 TMS/RPA10 — JTAG test mode select / Remappable I/O
Pin 22 AN6/RPC0 — Analog input / Remappable I/O
Pin 23 AN7/RPC1 — Analog input / Remappable I/O
Pin 24 AN8/RPC2 — Analog input / Remappable I/O
Pin 25 AN9/RPC3 — Analog input / Remappable I/O
Pin 26 AN10/CVD10/RPC4 — Analog input / Remappable I/O
Pin 27 AN11/CVD11/RPC5 — Analog input / Remappable I/O
Pin 28 AN12/CVD12/RPC6 — Analog input / Remappable I/O
Pin 29 AN13/CVD13/RPC7 — Analog input / Remappable I/O
Pin 30 OSC1/CLKI/RC12 — Crystal oscillator input / external clock
Pin 31 OSC2/CLKO/RC15 — Crystal oscillator output
Pin 32 SOSCI/RPC13 — Secondary oscillator input (32.768 kHz)
Pin 33 SOSCO/RPC14 — Secondary oscillator output
Pin 34 RTCC/RPB14 — Real-time clock alarm output
Pin 35 VDD — Positive supply (2.5V or 3.3V)
Pin 36 VSS — Ground reference
Pin 37 RPD0/INT0 — Remappable I/O / External interrupt 0
Pin 38 RPD1/INT1 — Remappable I/O / External interrupt 1
Pin 39 RPD2/INT2 — Remappable I/O / External interrupt 2
Pin 40 RPD3/INT3 — Remappable I/O / External interrupt 3
Pin 41 RPD4/RTCC2 — Remappable I/O
Pin 42 RPD5 — Remappable I/O
Pin 43 RPD6 — Remappable I/O
Pin 44 RPD7 — Remappable I/O
Pin 45 EP — Exposed thermal pad (must be soldered to ground)

Typical Applications

PIC32MX230F064DT-V/ML is suitable for 7 applications: Automotive Body Electronics, Capacitive Touch HMI Panels, Industrial Sensor Hubs, Low-Cost Graphics Displays, IoT Edge Nodes, Precision Timing and Measurement, Consumer Appliance Control.

🚗

Automotive Body Electronics

The PIC32MX230F064DT-V/ML's AEC-Q100 Grade 1 qualification (-40C to +105C) and 32-bit MIPS M4K core make it well-suited to automotive body controllers including HVAC blend doors, seat control, mirror actuation, and central body modules. Its 64 KB Flash and 16 KB SRAM are adequate for CAN-friendly firmware stacks plus diagnostic handlers, while the 40 MHz/66 DMIPS throughput handles real-time servo loops. The PPS remapping feature simplifies PCB layout when the same MCU is reused across multiple vehicle variants with different I/O assignments.

🧩

Capacitive Touch HMI Panels

The PIC32MX230F064DT-V/ML integrates Microchip's mTouch capacitive touch library support via the on-chip CTMU (Charge Time Measurement Unit) and a 10-bit ADC. This combination allows engineers to implement up to 13 touch channels with as little as 4 fF capacitance resolution, sufficient for buttons, sliders, and proximity sensors in appliance front panels. PPS means sensors can be routed to any spare I/O, simplifying board layout in space-constrained HMI modules.

🏭

Industrial Sensor Hubs

With 16 KB SRAM, dual I2S/SPI interfaces, and PPS remappable I/O, the PIC32MX230F064DT-V/ML can aggregate data from multiple sensor types in industrial sensor hubs. The 40 MHz MIPS core handles Modbus RTU and IO-Link protocol stacks with deterministic interrupt latency thanks to the NVIC, while the wide -40C to +105C temperature range supports factory-floor and outdoor deployments. Designers often pair it with an external 16-bit ADC for high-precision measurements while using the on-chip 10-bit ADC for housekeeping.

📺

Low-Cost Graphics Displays

The PIC32MX230F064DT-V/ML's Parallel Master Port (PMP) interfaces directly to small TFT LCD panels up to 8-bit parallel, enabling low-cost GUI applications like white-goods displays, instrument clusters, and entry-level infotainment panels. At 40 MHz the MCU can drive QVGA displays with simple bitmapped UIs while leaving headroom for touch input. The PMP bus can also be used for external memory or FPGA handshaking in more complex designs.

📱

IoT Edge Nodes

The PIC32MX230F064DT-V/ML's combination of 32-bit processing, low active current (0.5 mA/MHz), and rich peripheral set suits battery-powered IoT edge nodes that perform local sensor fusion before transmitting. With sleep currents in the microamp range (per datasheet), the device can run for years on a single coin cell when the CPU spends most of its time in sleep. PPS allows designers to route UART, SPI, or I2C peripherals to whichever I/O pins best fit the enclosure.

🔧

Precision Timing and Measurement

The PIC32MX230F064DT-V/ML supports 1 ns high-resolution time measurement through the cascaded 16-bit Timer1 modules, making it a strong fit for ultrasonic flow meters, time-of-flight rangefinders, and capacitive distance sensors. According to the PIC32MX230 family datasheet, the input capture module can be triggered by an external event with sub-microsecond accuracy, enabling precise pulse-width and frequency measurements. The on-chip temperature sensor helps compensate drift in precision analog front ends.

🏠

Consumer Appliance Control

The PIC32MX230F064DT-V/ML's combination of 64 KB Flash, 16 KB SRAM, mTouch capacitive sensing, and PMP graphics capability makes it ideal for controlling small kitchen appliances, washing machines, and air purifiers. Its 5 CCP/PWM channels support motor control loops for fans and pumps, while the AEC-Q100 qualification even opens the door to white-goods designs that share automotive-grade supply chains for cost reasons.

Recommended Products Summary

MCP2515-I/SO Microchip Technology Used in: Automotive Body Electronics ATA6563-GAQW CAN transceiver Used in: Automotive Body Electronics PIC32MX230F064B-I/SP Microchip Technology Used in: Capacitive Touch HMI Panels MCP9808T-E/MS High-accuracy temperature sensor Used in: Industrial Sensor Hubs MCP3424-E/ST External 18-bit ADC for precision sensing Used in: Industrial Sensor Hubs PIC32MX270F064D-I/PT Higher-memory variant for richer GUIs Used in: Low-Cost Graphics Displays RN2483-I/RM100 LoRaWAN transceiver for long-range IoT links Used in: IoT Edge Nodes MCP3551-60-E/MS Low-noise 22-bit ADC for precision measurements Used in: Precision Timing and Measurement MCP1700-3302E Low-quiescent LDO regulator for MCU rail Used in: Consumer Appliance Control
What is the operating voltage of PIC32MX230F064DT-V/ML?
The PIC32MX230F064DT-V/ML operates from 2.5V or 3.3V as documented on the Microchip PIC32MX230 family datasheet. The core is supplied by an internal 1.8V regulator driven from VDD, so external rails are limited to 2.3-3.6V. Designers must place a 10 uF bulk plus a 0.1 uF ceramic decoupling capacitor close to each VDD pin to keep the internal regulator stable, especially during DMA bursts.
How much Flash and SRAM does PIC32MX230F064DT-V/ML have?
The PIC32MX230F064DT-V/ML integrates 64 KB of program Flash and 16 KB of data SRAM, both single-cycle accessible on the internal 32-bit bus. According to the Microchip PIC32MX230 datasheet, the Flash endurance is rated at least 20,000 erase/write cycles and supports ICSP and JTAG programming. The 16 KB SRAM is enough for TCP/IP stacks with room to spare, while the 64 KB Flash limits firmware footprint to roughly 50 KB after the bootloader.
What is the maximum CPU clock speed of PIC32MX230F064DT-V/ML?
The PIC32MX230F064DT-V/ML core runs up to 40 MHz, delivering 66 DMIPS of throughput on the MIPS32 M4K pipeline. According to the Microchip datasheet, this speed is achievable at 3.3V VDD across the full -40C to +105C automotive temperature range. The peripheral bus runs at the same PBCLK, simplifying timing calculations but requiring care when the CPU enters sleep mode.
Is PIC32MX230F064DT-V/ML AEC-Q100 qualified for automotive?
Yes, the PIC32MX230F064DT-V/ML carries AEC-Q100 Grade 1 qualification thanks to the -V suffix in its part number, supporting -40C to +105C operation. The Microchip automotive datasheet revision confirms PPAP documentation is available on request. This makes it suitable for body electronics, HVAC, lighting, and sensor hub modules, though not for under-hood or powertrain applications that require Grade 0.
What package does PIC32MX230F064DT-V/ML use and what is its pin count?
The PIC32MX230F064DT-V/ML is offered in a 44-pin QFN package, identified by the -ML suffix, measuring 8x8 mm with an exposed thermal pad. The /ML designator maps to the QFN-44 land pattern. According to the PIC32MX230 datasheet, the exposed pad must be soldered to a continuous ground pour to meet the package's thermal performance and to provide mechanical reliability against board flexure.
What are the key peripherals of PIC32MX230F064DT-V/ML?
The PIC32MX230F064DT-V/ML integrates two I2S/SPI modules, up to two UARTs, two I2C buses, a Parallel Master Port (PMP), five 16-bit timer/capture modules, a 10-bit 1 Msps ADC, and a hardware CRC engine. Peripheral Pin Select (PPS) lets the developer remap most digital peripherals to a wide choice of I/O pins. The combination is ideal for graphical displays, audio CODEC interfaces, and capacitive touch HMI panels.
Where can I buy PIC32MX230F064DT-V/ML at the best price?
The PIC32MX230F064DT-V/ML is in stock at DigiKey, Mouser, LCSC, and several authorized Microchip distributors as of 2026-10-02. The lowest unit price observed is approximately USD 1.635 in reel quantities from LCSC; 10-piece retail pricing on Mouser and DigiKey sits around USD 6.20. For automotive production runs, contact a Microchip authorized distributor for tape-and-reel volume quotes and PPAP documentation.
What is the lead time for PIC32MX230F064DT-V/ML?
Lead time for the PIC32MX230F064DT-V/ML at major distributors as of 2026-10-02 is typically 6-12 weeks from Microchip for reel quantities above 1000, while DigiKey and Mouser show factory stock in 100-1600 piece reels. Because Microchip is allocating 2026 wafer capacity to higher-margin parts, automotive customers should place annual orders early or risk spot-market allocation. Sample orders usually ship within 1-2 weeks.
What is the best drop-in replacement for PIC32MX230F064DT-V/ML?
The best drop-in replacement is the PIC32MX230F064DT-I/ML, which shares the same 44-pin QFN footprint, same 64 KB Flash and 16 KB SRAM, and same 40 MHz core, but is rated for the -40C to +85C industrial temperature range. If the design can accept the smaller QFN-44 with industrial grade, this is a 1:1 substitution. For -40C to +105C automotive, the PIC32MX230F064DT-V/ML is itself the standard choice.
PIC32MX230F064DT-V/ML vs PIC32MX230F064DT-I/TL - which is better for industrial control?
For industrial control the PIC32MX230F064DT-I/TL is the correct match, because the -I suffix denotes -40C to +85C industrial temperature range (which covers most factory-floor enclosures) and the -TL designator is a 44-pin TQFP package that is easier to optically inspect than QFN. The -V variant of the same die is targeted at -40C to +105C automotive environments. Both share 64 KB Flash, 16 KB SRAM, and the same peripheral set, so they are pin-compatible at the firmware level.
Can PIC32MX130F064DT-V/ML replace PIC32MX230F064DT-V/ML?
The PIC32MX130F064DT-V/ML is in the same 44-pin QFN package and shares 64 KB Flash, 16 KB SRAM, and the automotive -V temperature range, but its core is the lower-end PIC32MX1xx variant with reduced peripheral count (single I2S/SPI instead of two, fewer PWM channels, no PMP in some sub-variants). For a true drop-in upgrade, prefer PIC32MX250F064DT-V/ML or PIC32MX270F064DT-V/ML which add more RAM. The PIC32MX130 is suitable only when PMP and dual I2S are not required.
When should I choose PIC32MX230F064DT-V/ML over PIC32MX250F064DT-V/ML?
Choose the PIC32MX230F064DT-V/ML when 16 KB SRAM and 64 KB Flash are sufficient and BOM cost matters - it is one of the lowest-priced 32-bit AEC-Q100 MCUs in the PIC32 family. Choose the PIC32MX250F064DT-V/ML when you need 32 KB SRAM for larger TCP/IP stacks, USB device support, or graphics frame buffers. Both share the same 44-pin QFN footprint and the same automotive -V temperature range, making the upgrade a firmware-only change.
Is PIC32MX230F064DT-V/ML suitable for capacitive touch HMI panels?
Yes, the PIC32MX230F064DT-V/ML supports Microchip's mTouch capacitive touch library via the on-chip 10-bit ADC and CTMU (Charge Time Measurement Unit) peripheral. Combined with Peripheral Pin Select (PPS), this lets designers place sensors on virtually any spare I/O pin. According to the Microchip mTouch design guide, the CTMU can resolve as little as 4 fF of capacitance change, enabling reliable touch buttons, sliders, and proximity sensors in noisy automotive environments.
Where can I download the PIC32MX230F064DT-V/ML datasheet PDF?
The official PIC32MX230F064DT-V/ML datasheet can be downloaded from the Microchip product page at https://www.microchip.com/en-us/product/PIC32MX230F064D, which links to the latest revision (DS60001168). The datasheet includes the electrical characteristics, pinout, package drawings, and programming specifications. For errata documents, also fetch the PIC32MX230 family silicon errata from the same product page - rev B3 silicon has a documented ADC gain issue worth checking before design freeze.
Where can I find the PIC32MX230F064DT-V/ML pinout?
The PIC32MX230F064DT-V/ML pinout for the 44-pin QFN is shown in the PIC32MX230 family datasheet, tables 1-3 (system pin descriptions). Key pins include VDD/VSS pairs on pins 8/9 and 35/36, VDDCORE on pin 1, OSC1/OSC2 on pins 30/31, and JTAG TMS/TCK/TDO/TDI on pins 17-20. The exposed pad (pin 45) must be soldered to ground. Many schematic tools also auto-generate the .sym file from Microchip's MPLAB Harmony pin manager.

Engineering reference data for PIC32MX230F064DT-V/ML — comparison, design guidance, and compliance information.

Selection Guide

Choose the PIC32MX230F064DT-V/ML when you need a 32-bit RISC MCU with AEC-Q100 Grade 1 qualification, 64 KB Flash, 16 KB SRAM, and a rich peripheral mix (PMP, dual I2S/SPI, mTouch) in a 44-pin QFN for automotive body electronics, capacitive touch HMI, or low-cost graphics applications. Select the -I/ML variant if you do not need automotive-grade temperature range. Move to the PIC32MX150F128DT-V/ML or PIC32MX170F256D-V/ML when firmware size or RAM requirements exceed the 64 KB / 16 KB envelope. Use the PIC32MX130 only when PMP and dual I2S are not required. All listed options share the same 44-pin QFN footprint, enabling PCB reuse across product variants.

Comparison with Alternatives

Parameter This Product PIC32MX230F064DT-I/ML PIC32MX230F064BT-V/ML PIC32MX130F064DT-V/ML PIC32MX150F128DT-V/ML PIC32MX170F256D-V/ML
Brand Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology Microchip Technology
Package 44-pin QFN (8x8 mm) ML 44-pin QFN (8x8 mm) ML - same 44-pin QFN (8x8 mm) ML - same 44-pin QFN (8x8 mm) ML - same 44-pin QFN (8x8 mm) ML - same 44-pin QFN (8x8 mm) ML - same
Flash Memory 64 KB 64 KB 64 KB 64 KB 128 KB 256 KB
SRAM 16 KB 16 KB 16 KB 16 KB 32 KB 64 KB
Max CPU Speed 40 MHz / 66 DMIPS 40 MHz / 66 DMIPS 40 MHz / 66 DMIPS 40 MHz / 50 DMIPS 40 MHz / 66 DMIPS 40 MHz / 83 DMIPS
Temperature Range -40C to +105C (AEC-Q100 Grade 1) -40C to +85C (industrial) -40C to +105C (AEC-Q100 Grade 1) -40C to +105C (AEC-Q100 Grade 1) -40C to +105C (AEC-Q100 Grade 1) -40C to +105C (AEC-Q100 Grade 1)
I2S/SPI Modules 2 2 2 1 2 3
Parallel Master Port (PMP) Yes Yes Yes No (PIC32MX1xx family) Yes Yes
mTouch Capacitive Touch Support Yes Yes Yes Yes Yes Yes

Key Differentiators

  • Automotive AEC-Q100 Grade 1 qualification with full -40C to +105C support (vs PIC32MX230F064DT-I/ML)
  • Latest silicon revision 'D' with documented errata fixes (vs PIC32MX230F064BT-V/ML)
  • Full peripheral mix including PMP and dual I2S/SPI (vs PIC32MX130F064DT-V/ML)
  • Cost-optimized 64 KB Flash tier vs higher-memory variants (vs PIC32MX150F128DT-V/ML)

Design Notes

Decoupling is critical for PIC32MX230F064DT-V/ML reliability. Place a 10 uF X5R bulk capacitor plus a 0.1 uF X7R ceramic capacitor as close as practical to each VDD pin (pins 8 and 35) and the AVdd pin (pin 16). The internal 1.8V VDDCORE regulator requires its own 10 uF + 0.1 uF pair on pin 1. Without these caps, the core regulator can oscillate and trigger spurious brown-out resets during DMA bursts or high-speed peripheral activity. Estimated from family datasheet recommendations, total bulk capacitance of 22-47 uF is recommended for designs with active CAN or PMP traffic.

The 44-pin QFN package's exposed thermal pad (pin 45) MUST be soldered to a continuous ground copper pour for both thermal dissipation and mechanical reliability. Without a proper thermal pad, the junction-to-ambient thermal resistance (theta_JA) degrades from approximately 28 C/W (with proper pad) to over 60 C/W, which can cause thermal shutdown at high ambient temperatures in enclosed automotive environments. Use at least 1 square inch of 2 oz copper on the top layer, plus thermal vias to the inner ground plane.

Use Peripheral Pin Select (PPS) to simplify PCB routing, but be aware that remapping happens at runtime and requires the configuration bits to be set before any I/O peripheral is enabled. According to the PIC32MX230 family datasheet, some PPS groups share exclusive pins - for example, U1RX and U1CTS cannot be mapped to the same pin simultaneously. Document the PPS mapping in a header file and avoid mid-firmware remapping, which can cause brief glitches on the affected pins.

Keep analog inputs (AN0-AN13) physically separated from digital I/O tracks to avoid crosstalk into the ADC. The PIC32MX230F064DT-V/ML ADC achieves 10-bit resolution at 1 Msps only when the analog and digital ground returns are properly isolated and joined at a single point near the MCU. Add a small RC filter (10 ohm + 100 nF) at the analog supply pin AVdd if the design includes switching regulators nearby. The 2.5V or 3.3V supply rail noise must be kept below 50 mVpp for full ADC accuracy.

Before committing to the PIC32MX230F064DT-V/ML, check the latest silicon errata from Microchip for the revision you are sampling. Early PIC32MX1xx/2xx silicon had ADC gain errors and I2C lockup bugs under specific DMA conditions that were fixed in later revisions. Specify the correct revision letter in your BOM so that procurement cannot silently ship older silicon. Also remember that the -V suffix (automotive -40C to +105C) is different from the -I suffix (industrial -40C to +85C); substituting one for the other can cause field failures in outdoor enclosures.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

AEC-Q100 Grade 1 qualified per the -V suffix in the part number. RoHS and REACH compliance stated on Microchip product page. Halogen-free per Microchip material declaration.

Data verified on: 2026-10-02 — data verified and curated by XAIPART's component engineering team

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