PIC32MX230F064DT-V/ML - 40MHz 32-bit MCU 64KB Flash | Microchip
Référence : PIC32MX230F064DT-V/ML ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.2 | $6,20 |
| 10 | $5.58 | $55,80 |
| 100 | $4.96 | $496,00 |
| 500 | $4.45 | $2 225,00 |
| 1 000 | $3.95 | $3 950,00 |
PIC32MX230F064DT-V/ML Présentation
A 32-bit microcontroller (MCU) is an integrated circuit containing a processor core, program memory, data memory, and programmable peripherals on a single die. The PIC32MX230 belongs to the broader category of embedded microcontrollers within the power management and control IC hierarchy: MCU -> embedded controller -> semiconductor device. The MIPS32 M4K core provides 32-bit register width and a 5-stage pipeline, yielding substantially higher throughput than 8-bit or 16-bit MCUs while remaining compatible with the standard MIPS instruction set.
Key features include active current consumption of 0.5 mA/MHz, support for the MPLAB X IDE and Harmony framework, hardware CRC, JTAG and 2-wire programming/debug, and 5 CCP/PMP/I2S-capable timer/capture modules. The PPS function lets the user remap most digital peripherals to a wide choice of I/O pins, simplifying PCB routing in space-constrained designs.
Architecturally, the PIC32MX230 combines a Harvard-style bus with separate Flash and SRAM paths, hardware multiply/divide, and a Nested Vector Interrupt Controller (NVIC). This allows deterministic interrupt latency and fast context switches for real-time control loops. The 1 ns timer resolution (using the 16-bit Timer1 with cascaded mode) is well suited to high-precision time-of-flight or pulse-width measurements.
Typical applications include automotive body and HVAC control, industrial sensor hubs, capacitive touch human-machine interfaces, low-cost graphics with PMP-driven TFT panels, IoT edge nodes, and consumer appliances. The AEC-Q100 Grade 1 qualification and wide peripheral mix make it especially attractive to automotive Tier-1 suppliers needing a small-footprint MCU with CAN/USB-friendly companion chips.
When designing with this MCU, take care to honor the decoupling guidance in the PIC32MX230 family datasheet - one 0.1 uF X7R plus one bulk capacitor per VDD pin, and a dedicated decoupling cap for VDDCORE. The exposed thermal pad on the QFN-44 must be soldered to a grounded copper pour to meet the package's thermal resistance spec.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that are not aggregated in the manufacturer datasheet or on distributor stock pages, helping engineers evaluate the PIC32MX230F064DT-V/ML for both new designs and as a substitute for legacy PIC24/PIC32 parts.
Alternatives de remplacement direct pour PIC32MX230F064DT-V/ML — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC32MX230F064DT-V/ML (même facteur de forme et même empreinte) — différant par Package, ADC, Timers, Core Architecture, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC32MX230F064DT-I/ML
✅ Remplacement direct✓ En stock
$2.31 / unité
Voir la fiche technique →PIC32MX230F064BT-V/ML
✅ Remplacement direct✓ En stock
$2.13 / unité
Voir la fiche technique →PIC32MX230F064B-I/ML
✅ Remplacement direct✓ En stock
$2.46 / unité
Voir la fiche technique →PIC32MX130F064DT-V/ML
✅ Remplacement direct✓ En stock
$3.28 / unité
Voir la fiche technique →PIC32MX150F128DT-V/ML
✅ Remplacement direct✓ En stock
$2.31 / unité
Voir la fiche technique →PIC32MX170F256D-V/ML
✅ Remplacement direct✓ En stock
$2.65 / unité
Voir la fiche technique →PIC32MX230F064DT-V/ML Valeurs maximales et caractéristiques électriques
| Core Architecture | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 40 MHz (66 DMIPS) |
| Program Flash Memory | 64 KB (64K x 8) |
| Data SRAM | 16 KB |
| Operating Voltage | 2.5V or 3.3V |
| Température de fonctionnement | -40C to +105C (AEC-Q100 Grade 1) |
| Active Current Consumption | 0.5 mA/MHz |
| Communication Interfaces | 2x I2S/SPI, UART, I2C, PMP |
| Timers | 5x 16-bit Timer/Capture (1 ns resolution in cascaded mode) |
| Peripheral Pin Select (PPS) | Yes |
| Parallel Master Port (PMP) | Yes |
| Capacitive Touch (mTouch) | Supported |
| On-chip Temperature Sensor | Yes |
| ADC | 10-bit 1 Msps, up to 13 channels (family-level) |
| Boîtier | 44-pin QFN (8x8 mm) with exposed pad (ML) |
| Type de montage | Surface Mount |
| Programming/Debug | JTAG, 2-wire ICSP |
| Statut RoHS | Compliant |
| AEC-Q100 | Qualified (Grade 1, -V variant) |
Configuration des broches de PIC32MX230F064DT-V/ML
| Broche 1 | VDDCORE — Internal core voltage decoupling (1.8V LDO output) |
| Broche 2 | PGED1/RPG6 — Programming data / Remappable I/O |
| Broche 3 | PGEC1/RPG7 — Programming clock / Remappable I/O |
| Broche 4 | PGED2/RPG8 — Programming data / Remappable I/O |
| Broche 5 | PGEC2/RPG9 — Programming clock / Remappable I/O |
| Broche 6 | AN0/CVD0/RPB0 — Analog input / Remappable I/O |
| Broche 7 | AN1/CVD1/RPB1 — Analog input / Remappable I/O |
| Broche 8 | VDD — Positive supply (2.5V or 3.3V) |
| Broche 9 | VSS — Ground reference |
| Broche 10 | AN2/CVD2/RPB2 — Analog input / Remappable I/O |
| Broche 11 | AN3/CVD3/RPB3 — Analog input / Remappable I/O |
| Broche 12 | AN4/CVD4/RPB4 — Analog input / Remappable I/O |
| Broche 13 | AN5/CVD5/RPB5 — Analog input / Remappable I/O |
| Broche 14 | VREF-/CVREF-/RA9 — ADC negative reference / Remappable I/O |
| Broche 15 | VREF+/CVREF+/RA10 — ADC positive reference / Remappable I/O |
| Broche 16 | AVDD — Analog positive supply |
| Broche 17 | AVSS — Analog ground |
| Broche 18 | TCK/RPA7 — JTAG test clock / Remappable I/O |
| Broche 19 | TDO/RPA8 — JTAG test data out / Remappable I/O |
| Broche 20 | TDI/RPA9 — JTAG test data in / Remappable I/O |
| Broche 21 | TMS/RPA10 — JTAG test mode select / Remappable I/O |
| Broche 22 | AN6/RPC0 — Analog input / Remappable I/O |
| Broche 23 | AN7/RPC1 — Analog input / Remappable I/O |
| Broche 24 | AN8/RPC2 — Analog input / Remappable I/O |
| Broche 25 | AN9/RPC3 — Analog input / Remappable I/O |
| Broche 26 | AN10/CVD10/RPC4 — Analog input / Remappable I/O |
| Broche 27 | AN11/CVD11/RPC5 — Analog input / Remappable I/O |
| Broche 28 | AN12/CVD12/RPC6 — Analog input / Remappable I/O |
| Broche 29 | AN13/CVD13/RPC7 — Analog input / Remappable I/O |
| Broche 30 | OSC1/CLKI/RC12 — Crystal oscillator input / external clock |
| Broche 31 | OSC2/CLKO/RC15 — Crystal oscillator output |
| Broche 32 | SOSCI/RPC13 — Secondary oscillator input (32.768 kHz) |
| Broche 33 | SOSCO/RPC14 — Secondary oscillator output |
| Broche 34 | RTCC/RPB14 — Real-time clock alarm output |
| Broche 35 | VDD — Positive supply (2.5V or 3.3V) |
| Broche 36 | VSS — Ground reference |
| Broche 37 | RPD0/INT0 — Remappable I/O / External interrupt 0 |
| Broche 38 | RPD1/INT1 — Remappable I/O / External interrupt 1 |
| Broche 39 | RPD2/INT2 — Remappable I/O / External interrupt 2 |
| Broche 40 | RPD3/INT3 — Remappable I/O / External interrupt 3 |
| Broche 41 | RPD4/RTCC2 — Remappable I/O |
| Broche 42 | RPD5 — Remappable I/O |
| Broche 43 | RPD6 — Remappable I/O |
| Broche 44 | RPD7 — Remappable I/O |
| Broche 45 | EP — Exposed thermal pad (must be soldered to ground) |
Applications typiques
PIC32MX230F064DT-V/ML convient pour 7 applications: Automotive Body Electronics, Capacitive Touch HMI Panels, Industrial Sensor Hubs, Low-Cost Graphics Displays, IoT Edge Nodes, Precision Timing and Measurement, Consumer Appliance Control.
Automotive Body Electronics
The PIC32MX230F064DT-V/ML's AEC-Q100 Grade 1 qualification (-40C to +105C) and 32-bit MIPS M4K core make it well-suited to automotive body controllers including HVAC blend doors, seat control, mirror actuation, and central body modules. Its 64 KB Flash and 16 KB SRAM are adequate for CAN-friendly firmware stacks plus diagnostic handlers, while the 40 MHz/66 DMIPS throughput handles real-time servo loops. The PPS remapping feature simplifies PCB layout when the same MCU is reused across multiple vehicle variants with different I/O assignments.
Recommandé
Capacitive Touch HMI Panels
The PIC32MX230F064DT-V/ML integrates Microchip's mTouch capacitive touch library support via the on-chip CTMU (Charge Time Measurement Unit) and a 10-bit ADC. This combination allows engineers to implement up to 13 touch channels with as little as 4 fF capacitance resolution, sufficient for buttons, sliders, and proximity sensors in appliance front panels. PPS means sensors can be routed to any spare I/O, simplifying board layout in space-constrained HMI modules.
Recommandé
Industrial Sensor Hubs
With 16 KB SRAM, dual I2S/SPI interfaces, and PPS remappable I/O, the PIC32MX230F064DT-V/ML can aggregate data from multiple sensor types in industrial sensor hubs. The 40 MHz MIPS core handles Modbus RTU and IO-Link protocol stacks with deterministic interrupt latency thanks to the NVIC, while the wide -40C to +105C temperature range supports factory-floor and outdoor deployments. Designers often pair it with an external 16-bit ADC for high-precision measurements while using the on-chip 10-bit ADC for housekeeping.
Recommandé
Low-Cost Graphics Displays
The PIC32MX230F064DT-V/ML's Parallel Master Port (PMP) interfaces directly to small TFT LCD panels up to 8-bit parallel, enabling low-cost GUI applications like white-goods displays, instrument clusters, and entry-level infotainment panels. At 40 MHz the MCU can drive QVGA displays with simple bitmapped UIs while leaving headroom for touch input. The PMP bus can also be used for external memory or FPGA handshaking in more complex designs.
Recommandé
IoT Edge Nodes
The PIC32MX230F064DT-V/ML's combination of 32-bit processing, low active current (0.5 mA/MHz), and rich peripheral set suits battery-powered IoT edge nodes that perform local sensor fusion before transmitting. With sleep currents in the microamp range (per datasheet), the device can run for years on a single coin cell when the CPU spends most of its time in sleep. PPS allows designers to route UART, SPI, or I2C peripherals to whichever I/O pins best fit the enclosure.
Recommandé
Precision Timing and Measurement
The PIC32MX230F064DT-V/ML supports 1 ns high-resolution time measurement through the cascaded 16-bit Timer1 modules, making it a strong fit for ultrasonic flow meters, time-of-flight rangefinders, and capacitive distance sensors. According to the PIC32MX230 family datasheet, the input capture module can be triggered by an external event with sub-microsecond accuracy, enabling precise pulse-width and frequency measurements. The on-chip temperature sensor helps compensate drift in precision analog front ends.
Recommandé
Consumer Appliance Control
The PIC32MX230F064DT-V/ML's combination of 64 KB Flash, 16 KB SRAM, mTouch capacitive sensing, and PMP graphics capability makes it ideal for controlling small kitchen appliances, washing machines, and air purifiers. Its 5 CCP/PWM channels support motor control loops for fans and pumps, while the AEC-Q100 qualification even opens the door to white-goods designs that share automotive-grade supply chains for cost reasons.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC32MX230F064DT-V/ML — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC32MX230F064DT-I/ML | PIC32MX230F064BT-V/ML | PIC32MX130F064DT-V/ML | PIC32MX150F128DT-V/ML | PIC32MX170F256D-V/ML |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 44-pin QFN (8x8 mm) ML | 44-pin QFN (8x8 mm) ML - same | 44-pin QFN (8x8 mm) ML - same | 44-pin QFN (8x8 mm) ML - same | 44-pin QFN (8x8 mm) ML - same | 44-pin QFN (8x8 mm) ML - same |
| Flash Memory | 64 KB | 64 KB | 64 KB | 64 KB | 128 KB | 256 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 32 KB | 64 KB |
| Max CPU Speed | 40 MHz / 66 DMIPS | 40 MHz / 66 DMIPS | 40 MHz / 66 DMIPS | 40 MHz / 50 DMIPS | 40 MHz / 66 DMIPS | 40 MHz / 83 DMIPS |
| Temperature Range | -40C to +105C (AEC-Q100 Grade 1) | -40C to +85C (industrial) | -40C to +105C (AEC-Q100 Grade 1) | -40C to +105C (AEC-Q100 Grade 1) | -40C to +105C (AEC-Q100 Grade 1) | -40C to +105C (AEC-Q100 Grade 1) |
| I2S/SPI Modules | 2 | 2 | 2 | 1 | 2 | 3 |
| Parallel Master Port (PMP) | Yes | Yes | Yes | No (PIC32MX1xx family) | Yes | Yes |
| mTouch Capacitive Touch Support | Yes | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Automotive AEC-Q100 Grade 1 qualification with full -40C to +105C support (vs PIC32MX230F064DT-I/ML)
- Latest silicon revision 'D' with documented errata fixes (vs PIC32MX230F064BT-V/ML)
- Full peripheral mix including PMP and dual I2S/SPI (vs PIC32MX130F064DT-V/ML)
- Cost-optimized 64 KB Flash tier vs higher-memory variants (vs PIC32MX150F128DT-V/ML)
Notes de conception
Decoupling is critical for PIC32MX230F064DT-V/ML reliability. Place a 10 uF X5R bulk capacitor plus a 0.1 uF X7R ceramic capacitor as close as practical to each VDD pin (pins 8 and 35) and the AVdd pin (pin 16). The internal 1.8V VDDCORE regulator requires its own 10 uF + 0.1 uF pair on pin 1. Without these caps, the core regulator can oscillate and trigger spurious brown-out resets during DMA bursts or high-speed peripheral activity. Estimated from family datasheet recommendations, total bulk capacitance of 22-47 uF is recommended for designs with active CAN or PMP traffic.
The 44-pin QFN package's exposed thermal pad (pin 45) MUST be soldered to a continuous ground copper pour for both thermal dissipation and mechanical reliability. Without a proper thermal pad, the junction-to-ambient thermal resistance (theta_JA) degrades from approximately 28 C/W (with proper pad) to over 60 C/W, which can cause thermal shutdown at high ambient temperatures in enclosed automotive environments. Use at least 1 square inch of 2 oz copper on the top layer, plus thermal vias to the inner ground plane.
Use Peripheral Pin Select (PPS) to simplify PCB routing, but be aware that remapping happens at runtime and requires the configuration bits to be set before any I/O peripheral is enabled. According to the PIC32MX230 family datasheet, some PPS groups share exclusive pins - for example, U1RX and U1CTS cannot be mapped to the same pin simultaneously. Document the PPS mapping in a header file and avoid mid-firmware remapping, which can cause brief glitches on the affected pins.
Keep analog inputs (AN0-AN13) physically separated from digital I/O tracks to avoid crosstalk into the ADC. The PIC32MX230F064DT-V/ML ADC achieves 10-bit resolution at 1 Msps only when the analog and digital ground returns are properly isolated and joined at a single point near the MCU. Add a small RC filter (10 ohm + 100 nF) at the analog supply pin AVdd if the design includes switching regulators nearby. The 2.5V or 3.3V supply rail noise must be kept below 50 mVpp for full ADC accuracy.
Before committing to the PIC32MX230F064DT-V/ML, check the latest silicon errata from Microchip for the revision you are sampling. Early PIC32MX1xx/2xx silicon had ADC gain errors and I2C lockup bugs under specific DMA conditions that were fixed in later revisions. Specify the correct revision letter in your BOM so that procurement cannot silently ship older silicon. Also remember that the -V suffix (automotive -40C to +105C) is different from the -I suffix (industrial -40C to +85C); substituting one for the other can cause field failures in outdoor enclosures.
Informations de conformité
AEC-Q100 Grade 1 qualified per the -V suffix in the part number. RoHS and REACH compliance stated on Microchip product page. Halogen-free per Microchip material declaration.
