PIC32MX550F256L-50I/PT - 50MHz 256KB Flash MCU | Microchip
MPN: PIC32MX550F256L-50I/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.95 | $5.95 |
| 10 | $5.36 | $53.60 |
| 100 | $4.76 | $476.00 |
| 500 | $4.32 | $2,160.00 |
| 1,000 | $3.96 | $3,960.00 |
PIC32MX550F256L-50I/PT Overview
A microcontroller (MCU) is a single-chip computer containing a CPU core, volatile and non-volatile memory, and on-chip peripherals such as timers, communication controllers, and analog blocks. Within the broader semiconductor taxonomy, the PIC32MX550F256L belongs to 32-bit microcontroller -> RISC MCU -> embedded processor -> semiconductor. The MIPS M4K architecture is a Harvard-style RISC core widely used in cost-sensitive 32-bit embedded designs where deterministic interrupt latency, simple C/AVR-to-32-bit toolchain reuse, and broad peripheral integration reduce total BOM cost.
Key features include 50 MHz core frequency, 83 DMIPS performance, 16-channel 10-bit ADC at 1 Msps, five 16-bit timers/counters, two comparators, two UARTs, RTCC with calendar mode, CTMU for capacitive touch, and dedicated audio data paths via I²S. On-chip debug uses PGECx/PGEDx pairs supporting both ICSP programming and real-time trace through standard MPLAB tools, eliminating external emulator hardware on most designs.
The PIC32MX550F256L is fabricated on a low-leakage CMOS process and operates from 2.3 V to 5.5 V across the industrial -40 °C to +85 °C range. Internal DMA, dedicated context-switch shadow registers, and a configurable instruction cache support deterministic real-time response, while PMP and dual-buffered SPI allow direct TFT panel and serial-flash interfacing for HMI products.
Typical applications include USB Audio/Class-D amplifiers, segment-TFT HMI panels, CAN-bridge industrial nodes, capacitive-touch control panels, and low-power graphics instrumentation. The combination of USB OTG, CAN, and audio interfaces makes it well suited for audio/graphics HMI products where a single MCU drives display, touch, USB, and fieldbus functions.
When designing with this device, ensure all VDD/VSS pin pairs are decoupled with 100 nF + bulk capacitors placed within 5 mm of each pair. Decouple AVDD/AVSS separately for the ADC and use the internal bandgap reference with an external 10 µF+1 µF bypass network. Validate trace impedance on PMP and high-speed SPI lines to avoid display artifacts.
This page synthesizes verified distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping procurement and design engineers choose the right part with parametric confidence.
Drop-in alternatives for PIC32MX550F256L-50I/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX550F256L-50I/PT (same form factor and footprint) — differing in ADC, Package, USB, Core Architecture, Operating Temperature.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX550F256LT-50I/PT
✅ Drop-In✓ In Stock
$4.2 / Unit
View Datasheet →PIC32MX550F256L-I/PT
✅ Drop-In✓ In Stock
$3.78 / Unit
View Datasheet →PIC32MX270F512L-50I/PT
✅ Drop-In✓ In Stock
$4.65 / Unit
View Datasheet →PIC32MX570F512L-50I/PT
✅ Drop-In✓ In Stock
$5.3 / Unit
View Datasheet →PIC32MX460F512L-80I/PT
✅ Drop-In✓ In Stock
$6.05 / Unit
View Datasheet →PIC32MX550F256L-50I/PT Maximum Ratings & Electrical Characteristics
| Core | MIPS32 M4K 32-bit RISC |
| Maximum CPU Speed | 50 MHz |
| DMIPS | 83 DMIPS |
| Program Flash | 256 KB (256K x 8) |
| SRAM | 32 KB |
| Operating Voltage | 2.3 V to 5.5 V |
| Operating Temperature | -40 °C to +85 °C (Industrial) |
| Package | 100-pin TQFP (12x12 mm) |
| Mounting Type | Surface Mount |
| ADC | 10-bit, up to 1 Msps, 16 channels |
| USB | USB 2.0 Full-Speed Device/Host/OTG |
| CAN | CAN 2.0B |
| SPI | 4 modules |
| I²S | 2 modules |
| UART | 2 modules |
| Timers | 5 x 16-bit |
| Parallel Master Port (PMP) | Yes, dual read/write buffers |
| Peripheral Pin Select (PPS) | Yes |
| CTMU (Capacitive Touch) | Yes |
| RTCC | Yes (calendar mode) |
| RoHS Status | Compliant |
| MSL Level | 3 (168 hours) |
| Lead-Free / Halogen-Free | Yes / Yes |
PIC32MX550F256L-50I/PT 100-pin tqfp (12x12 mm) Pin Configuration Guide
Pin configuration for PIC32MX550F256L-50I/PT (100-pin tqfp (12x12 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX550F256L-50I/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX550F256L-50I/PT is suitable for 6 applications: USB Audio Class-D Amplifier, Segment-TFT HMI Control Panel, CAN-Bridge Industrial Sensor Node, Capacitive Touch Control Panel, Low-Power Graphics Instrumentation, USB-CDC Virtual COM Port Bridge.
USB Audio Class-D Amplifier
The PIC32MX550F256L-50I/PT's 50 MHz MIPS M4K core delivers 83 DMIPS of processing headroom for USB Audio Class 1.0/2.0 streaming at 24-bit/96 kHz, while the two I²S modules interface directly to a Class-D amplifier PWM controller. The integrated USB 2.0 Full-Speed OTG controller handles enumeration, sample-rate negotiation, and HID volume control without an external PHY. The 32 KB SRAM buffers 8 ms of stereo audio at 48 kHz, eliminating external RAM. PIC32MX550F256L-50I/PT fits USB-powered speakers, headphone amplifiers, and USB-DAC headphone dongles where low BOM cost and single-IC audio/USB integration drive selection.
Recommended
Segment-TFT HMI Control Panel
The PIC32MX550F256L-50I/PT integrates a Parallel Master Port (PMP) with dual read/write buffers that drive 8/16-bit TFT panels up to QVGA resolution without external bus multiplexers, reducing PCB cost and complexity. The CTMU peripheral implements reliable capacitive touch sensing through a single ADC channel, eliminating dedicated touch controllers. With 256 KB Flash and 32 KB SRAM, the MCU stores framebuffers, fonts, and UI state. PIC32MX550F256L-50I/PT suits appliance control panels, industrial HMIs, medical device front panels, and POS terminals where PMP and CTMU integration removes 2-3 discrete ICs.
Recommended
CAN-Bridge Industrial Sensor Node
The PIC32MX550F256L-50I/PT's CAN 2.0B controller supports up to 1 Mbps industrial fieldbus rates, while the 16-channel 10-bit ADC at 1 Msps handles multiple sensor inputs. The 50 MHz core executes CANopen or DeviceNet protocol stacks with sub-1 ms latency. The 100-pin TQFP package exposes 83 digital I/O for relay drivers and digital sensors. PIC32MX550F256L-50I/PT fits industrial sensor hubs, PLC remote I/O modules, and CAN-based motor control gateways where combined CAN+ADC+USB simplifies architecture and reduces BOM.
Recommended
Capacitive Touch Control Panel
The PIC32MX550F256L-50I/PT's CTMU peripheral implements high-accuracy capacitive touch sensing through a single ADC, supporting sliders, wheels, and matrix keypads up to 16 channels. The PPS remap routes touch acquisition timers and ADC channels to any physical pin, simplifying PCB routing for touch electrodes. At 50 MHz, the MCU completes a full 16-channel touch scan in under 1 ms, well under the 10 ms human-perception threshold. PIC32MX550F256L-50I/PT fits consumer appliances, smart-home control panels, automotive interior switches, and IoT devices where integrated CTMU eliminates dedicated touch ICs.
Recommended
Low-Power Graphics Instrumentation
The PIC32MX550F256L-50I/PT drives segment LCDs, character LCDs, and small TFT panels through PMP or SPI interfaces while running on a single 2.3-5.5 V supply, simplifying battery-powered designs. The RTCC with calendar mode tracks real-time events during sleep, and the internal DMA offloads display updates from the CPU, reducing active-mode current. With 50 DMIPS/MHz efficiency, the MCU delivers responsive graphics while spending most of its time in sleep modes below 50 µA. PIC32MX550F256L-50I/PT suits portable oscilloscopes, handheld multimeters, environmental data loggers, and field-test instruments where battery life and graphics are co-equal requirements.
Recommended
USB-CDC Virtual COM Port Bridge
The PIC32MX550F256L-50I/PT's USB 2.0 Full-Speed OTG controller implements USB-CDC class for transparent UART-over-USB bridging, eliminating external FTDI-style bridge ICs. The two integrated UARTs handle RS-232/RS-485 transceivers at up to 20 Mbps, while the 50 MHz core runs protocol converters and command parsers in real time. The 256 KB Flash stores bootloader, application, and USB descriptors with room for OTA update staging. PIC32MX550F256L-50I/PT fits industrial debug probes, configuration tools, RS-485-to-USB gateways, and test equipment where integrated USB saves $1-2 per unit versus external bridge ICs.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX550F256L-50I/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX550F256LT-50I/PT | PIC32MX550F256L-I/PT | PIC32MX550F256H-50I/PT | PIC32MX270F512L-50I/PT | PIC32MX570F512L-50I/PT | PIC32MX460F512L-80I/PT |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-pin TQFP (12x12 mm) | 100-pin TQFP - same | 100-pin TQFP - same | TQFP-64 - different | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same |
| Core Frequency | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 40 MHz / 66 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 50 MHz / 83 DMIPS | 80 MHz / 124 DMIPS |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 32 KB | 32 KB | 32 KB | 32 KB | 64 KB | 64 KB | 32 KB |
| USB | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG |
| CAN Modules | 1 (CAN 2.0B) | 1 | 1 | 1 | 1 | 2 | 1 |
| Operating Voltage | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V | 2.3 V to 5.5 V |
| Temperature Range | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C | -40 °C to +85 °C |
Key Differentiators
- Higher Flash and RAM at same package footprint (vs PIC32MX270F512L-50I/PT)
- Second CAN module for multi-bus industrial nodes (vs PIC32MX570F512L-50I/PT)
- Faster 80 MHz core with same pinout (vs PIC32MX460F512L-80I/PT)
Design Notes
Each VDD/VSS pin pair must be decoupled with a 100 nF ceramic placed within 5 mm of the pin. According to Microchip's PIC32MX5xx/6xx/7xx family datasheet, AVDD/AVSS for the ADC require a separate filtered supply or ferrite bead from the digital VDD rail to keep digital switching noise below 5 mVpp at the analog supply. Bulk decoupling of at least 10 µF near the package further reduces core-current transients during USB and PMP activity.
The 100-pin TQFP (12x12 mm) has a thermal pad that must be soldered to a ground copper pour of at least 1 square inch for thermal dissipation. Estimated: at 50 MHz active core current of approximately 30 mA, theta_JA is approximately 35 °C/W, yielding ~3 °C junction rise above ambient for typical USB-connected use. For USB and PMP continuously active designs, the thermal pad plus 4-layer PCB keeps junction temperature below 70 °C at 25 °C ambient.
Always confirm PGECx/PGEDx pin selection during PCB layout. PIC32MX550F256L has multiple PGECx/PGEDx pairs and using mixed pairs (e.g. PGEC2 with PGED3) prevents ICSP from connecting. Also ensure all unused I/O pins are configured as outputs or inputs with internal pull-ups to avoid floating-pin current draw above 10 µA per pin in sleep modes, which can prevent the MCU from reaching datasheet sleep currents.
USB D+/D- traces must be 90-ohm differential with no stubs, and the 48 MHz USB PLL requires a clean power supply with ferrite bead isolation. PMP bus traces to TFT panels should be matched in length within 5 mm to avoid skew on parallel-data latching. Per Microchip's recommended layout, place the USB ESD protection diode within 5 mm of the USB connector, with the trace between diode and connector shorter than 3 mm.
Compliance Information
RoHS and REACH compliance per Microchip product environmental compliance documentation. Industrial temperature grade (-40 to +85 °C) is not AEC-Q100 qualified; AEC-Q100 qualified variants are available in the PIC32MX family with V automotive grade designations.
