DSPIC33EP512MU810-E/PT - 16-bit DSC 60 MIPS USB TQFP-100 | Microchip
MPN: DSPIC33EP512MU810-E/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.42 | $8.42 |
| 10 | $7.66 | $76.60 |
| 100 | $6.95 | $695.00 |
| 500 | $6.31 | $3,155.00 |
| 1,000 | $5.74 | $5,740.00 |
DSPIC33EP512MU810-E/PT Overview
A digital signal controller combines the compute characteristics of a digital signal processor with the peripheral integration and control-oriented architecture of a microcontroller. Within the power-management hierarchy of embedded systems, the DSC sits between a general-purpose MCU and a dedicated DSP, making the dsPIC33E family a common choice for precision motor control, digital power conversion, and sensing applications that require both fast multiply-accumulate arithmetic and rich on-chip peripherals.
Key features of this part include the modified Harvard 16-bit core with DSP-enhanced instruction set (DSP engine with 17-bit x 17-bit multiplier, 40-bit accumulator), high-speed PWM modules suited to motor control and power supplies, 15 DMA channels for low-CPU-overhead data movement, USB OTG connectivity, and multiple serial interfaces for system expansion.
The dsPIC33EP MU810 family uses Microchip's 16-bit EP core architecture with linear program memory addressing up to 4M instruction words, hardware division support, and an interrupt structure designed for deterministic real-time response. The 512 KB Flash array supports self-programming for field firmware updates, and the 52 KB SRAM accommodates control-loop buffers, communication stacks, and USB endpoints without external memory.
Typical applications include brushless DC and PMSM motor drives (sensorless FOC), digital power supplies and solar inverters, USB-connected industrial instruments, and general-purpose sensing nodes requiring DSP filtering such as FFT or FIR computations on acquired signals.
A key design consideration is power supply integrity: the dsPIC33EP requires a 3.0V to 3.6V supply with proper decoupling on every VDD/VSS pair and a clean, stable AVDD rail for the on-chip analog peripherals, so plan a solid ground strategy on the TQFP-100 footprint from the first layout revision.
This page synthesizes distributor pricing, same-family drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for DSPIC33EP512MU810-E/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33EP512MU810-E/PT (same form factor and footprint) — differing in Package, Operating Temperature, Program Memory Size, Packaging, USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33EP512MU810-I/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
Contact for price
View Datasheet →DSPIC33EP256MU810T-I/PF
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$4.1 / Unit
View Datasheet →DSPIC33EP256MU810T-E/PT
✅ Drop-In✓ In Stock
$4.62 / Unit
View Datasheet →DSPIC33EP512MU810T-E/PT
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33EP512GM710T-I/PT
✅ Drop-In ⚠️ Specs Unverified✓ In Stock
$13.85 / Unit
View Datasheet →DSPIC33EP512MU810-E/PT Maximum Ratings & Electrical Characteristics
| Core Size | 16-bit |
| Core Type | dsPIC33E DSC core |
| Max Clock / Performance | 60 MIPS |
| Program Memory Size | 512 KB (170K x 24) Flash |
| RAM Size | 52 KB |
| Supply Voltage Range | 3.0 V to 3.6 V |
| USB | USB OTG (full-speed) |
| DMA Channels | 15 |
| Package | 100-TQFP (12x12 mm), /PT suffix |
| Operating Temperature | -40C to +125C (Extended, E suffix) |
| Mounting Type | Surface Mount |
| ROM / Program Memory Type | Flash |
| Timers | 9 timers (per Microchip USA product data) |
| Communication Interfaces | USB, UART, SPI, I2C (per family feature set) |
DSPIC33EP512MU810-E/PT 100-tqfp (12x12 mm), /pt suffix Pin Configuration Guide
Pin configuration for DSPIC33EP512MU810-E/PT (100-tqfp (12x12 mm), /pt suffix package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for DSPIC33EP512MU810-E/PT.
Refer to the datasheet for full pin configuration.
Typical Applications
DSPIC33EP512MU810-E/PT is suitable for 6 applications: Brushless DC / PMSM Motor Control, Digital Power Supplies and Inverters, USB-Connected Industrial Instruments, Audio Signal Processing Nodes, Industrial Sensing and Condition Monitoring, Robotics and Motion Subsystems.
Brushless DC / PMSM Motor Control
The DSPIC33EP512MU810-E/PT is purpose-built for precision motor control: its 60 MIPS DSP engine executes Clarke and Park transforms plus current-loop PID stages inside 10-20 kHz sensorless FOC interrupt windows with deterministic latency. The high-speed PWM module generates complementary outputs with dead-time insertion for three-phase inverters, while 15 DMA channels stream ADC current samples without CPU intervention. With 512 KB Flash, the part holds the FOC firmware, a fieldbus protocol stack (CAN/UART), and a bootloader with field-upgrade headroom. The -40C to +125C E-grade rating suits industrial drive enclosures, and USB enables drive commissioning and firmware updates from a PC.
Recommended
Digital Power Supplies and Inverters
In digital power conversion (LLC resonant supplies, PFC stages, solar micro-inverters), the DSPIC33EP512MU810-E/PT provides the fast control hardware that switching converters demand: high-resolution PWM with phase-shift and complementary modes, an ADC timed to PWM triggers for mid-rail current sampling, and a 60 MIPS core running voltage/current compensation loops at switching frequency. The 52 KB SRAM buffers telemetry and fault logs, while the DSP multiply-accumulate engine implements notch and harmonic-compensation filters efficiently. USB OTG allows in-system parameter tuning, and 512 KB Flash stores multiple converter profile images selectable at boot for multi-product hardware platforms.
Recommended
USB-Connected Industrial Instruments
Data acquisition pods, bench instruments, and industrial sensors benefit from this DSC's combination of full-speed USB OTG (12 Mbps), 15 DMA channels, and DSP filtering capability. Acquired signals can be FIR/FFT-filtered on-chip at 60 MIPS before streaming over USB, offloading the host PC entirely. The 512 KB Flash accommodates USB device stacks (CDC/HID/MSC) alongside the measurement firmware and a bootloader for field updates without a programmer. The TQFP-100 pin count supplies enough remappable RPn I/O for multi-channel front ends, and the -40C to +125C extended range supports instruments used on factory floors and outdoor test points.
Recommended
Audio Signal Processing Nodes
The dsPIC33E DSP engine (17x17-bit multiplier, dual 40-bit accumulators, modulo and bit-reversed addressing) makes the DSPIC33EP512MU810-E/PT effective for embedded audio: active crossovers, room-correction filters, echo cancellation, and tone-control processing at audio sample rates within the 60 MIPS budget. The remappable SPI/I2S-style serial ports interface to external audio codecs, and USB OTG provides a device-class audio or HID path to host systems. With 512 KB Flash, multiple filter coefficient sets and a boot-time calibration routine fit on-chip, while 52 KB SRAM holds delay lines for reverberation or loudspeaker time-alignment processing.
Recommended
Industrial Sensing and Condition Monitoring
Vibration monitors, predictive-maintenance sensors, and smart transmitters exploit the DSC's ability to sample, window, and FFT-analyze signals on-chip. The DSP engine performs spectral feature extraction locally so only reduced feature vectors travel over USB, UART, or CAN - reducing bandwidth and enabling edge decisions. 512 KB Flash holds multiple sensor profiles and logging firmware, and the extended -40C to +125C temperature rating matches cabinet and machine-mount environments. The 15 DMA channels sustain multi-channel sampling into double buffers without CPU stalls, keeping measurement jitter low and determinism high across long unattended acquisition sessions.
Recommended
Robotics and Motion Subsystems
Multi-axis motion controllers use the DSPIC33EP512MU810-E/PT to close position, velocity, and current loops per axis while coordinating trajectory execution: the 60 MIPS core runs cascaded control at kHz rates, the high-speed PWM drives H-bridges or BLDC stages, quadrature/encoder inputs track position, and DMA-fed ADCs sample phase currents. USB or UART links handle host commands and diagnostics, while 512 KB Flash stores motion profiles, S-curve generators, and safety-limit logic. The remappable peripheral pin architecture simplifies routing on dense TQFP-100 boards, and the E-grade temperature spec supports robot arm joints and mobile-platform drive units.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33EP512MU810-E/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33EP512MU810-I/PT | DSPIC33EP256MU810T-I/PF | DSPIC33EP256MU810T-E/PT | DSPIC33EP512MU810T-E/PT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TQFP (12x12 mm) | 100-TQFP (12x12 mm) - same | 100-TQFP (same pinout family) | 100-TQFP (12x12 mm) - same | 100-TQFP (12x12 mm) - same |
| Core Performance | 16-bit, 60 MIPS | 16-bit, 60 MIPS | 16-bit, 60 MIPS | 16-bit, 60 MIPS | 16-bit, 60 MIPS |
| Flash Memory | 512 KB (170K x 24) | 512 KB (170K x 24) | 256 KB | 256 KB | 512 KB (170K x 24) |
| SRAM | 52 KB | 52 KB | 52 KB | 52 KB | 52 KB |
| USB | Full-speed USB OTG | Full-speed USB OTG | Full-speed USB OTG | Full-speed USB OTG | Full-speed USB OTG |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| Operating Temperature | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| Packaging | Tray (/PT) | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
Key Differentiators
- Maximum Flash density in the MU810 family (vs DSPIC33EP256MU810T-E/PT)
- Extended temperature rating for harsh environments (vs DSPIC33EP512MU810-I/PT)
- Tray packaging suits prototyping and low-volume assembly (vs DSPIC33EP512MU810T-E/PT)
Design Notes
Supply the DSPIC33EP512MU810-E/PT from a clean 3.3V rail within its 3.0V-3.6V window. Every VDD/VSS pair on the TQFP-100 must be connected and decoupled with 100 nF ceramic capacitors placed within 3-5 mm of the pins, plus bulk capacitance near the package. Derive AVDD through an RC or ferrite-bead filter from the digital rail to protect ADC accuracy; digital switching noise on AVDD shows up directly as ADC code noise.
For motor-control and digital-power layouts, route PWM outputs as short, matched groups to gate drivers and keep the high-current inverter loop away from the controller ground region. Use a solid ground plane under the TQFP and return analog signals to a single-point analog ground tied to the plane at the AVSS pin. Place the USB D+/D- pair as a 90-ohm differential pair with length matching if the host connector is more than ~50 mm away.
Do not confuse temperature/packaging suffixes when ordering: -E is -40C to +125C, -I is -40C to +85C, /PT is tray and /PF is a 14x14 mm TQFP-100 footprint option of the same pinout family - the PF footprint differs and will not drop onto a PT land pattern without verification. Also confirm Flash density (256 vs 512 KB) against your final firmware size plus bootloader and field-update image before choosing the 256 KB alternatives.
Compliance Information
Compliance data was not present in the verified web data; Microchip generally ships current dsPIC33EP parts as RoHS-compliant lead-free, but verify on the official Microchip product page before relying on it.
