PIC32MX564F128HT-V/MR - 80MHz 32-bit MCU 128KB Flash 64-VQFN | Microchip
MPN: PIC32MX564F128HT-V/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.95 | $8.95 |
| 10 | $7.96 | $79.60 |
| 100 | $6.42 | $642.00 |
| 500 | $5.74 | $2,870.00 |
| 1,000 | $5.12 | $5,120.00 |
PIC32MX564F128HT-V/MR Overview
A 32-bit microcontroller (MCU) is a programmable system-on-chip that combines a CPU core, non-volatile program memory, volatile data memory and a set of on-chip peripherals behind a memory-mapped register interface. The PIC32MX5xx family extends Microchip's PIC architecture to a 32-bit MIPS32 instruction set, placing it in the broader hierarchy of MCU -> 32-bit MCU -> MIPS MCU -> Microchip PIC32 family. Compared with 8/16-bit MCUs, 32-bit parts deliver higher MIPS per MHz, larger linear address space and richer peripherals (USB, CAN, DMA), at the cost of higher active current and more complex toolchains.
Key features include 128KB single-cycle Flash with prefetch, 32KB SRAM, 16-channel 10-bit ADC at up to 1 Msps, full-speed USB 2.0 On-The-Go, CAN 2.0B, four channels of DMA, and an 8-bit parallel master port for external memory or graphics. The 64-VQFN (9x9 mm) MR package provides an exposed thermal pad (EP) that must be soldered to the PCB ground plane for thermal dissipation and electrical reference.
Architecturally the part is built around the MIPS M4K core with single-cycle hardware multiply/divide and a tightly-coupled prefetch controller that masks Flash wait states, allowing most instructions to execute in one clock at 80 MHz (1.56 DMIPS/MHz). On-chip regulators generate 1.8V core logic from 2.5V/3.3V I/O, so the user only supplies a single external rail.
Typical applications include USB peripherals, industrial CAN nodes, multi-protocol bridges (USB-to-UART, USB-to-CAN), embedded data loggers, sensor hubs with DMA-driven ADC sampling, and low-cost graphical HMI controllers using the PMP interface. The integrated USB-OTG and CAN make the part particularly attractive for industrial control and automotive-body ECUs.
When designing with this device, ensure the exposed pad (EP) is soldered to a continuous ground plane with multiple thermal vias; missing EP solder degrades thermal performance and DC ground reference. Decouple all VDD/VSS pairs with 100nF X7R placed within 3 mm of each pin pair.
This page synthesizes distributor pricing, drop-in alternatives from the PIC32MX5xx family and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for PIC32MX564F128HT-V/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX564F128HT-V/MR (same form factor and footprint) — differing in ADC, Operating Temperature, USB, Package, Program Memory (Flash).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX564F128HT-I/MR
✅ Drop-In✓ In Stock
$4.73 / Unit
View Datasheet →PIC32MX564F128H-V/MR
✅ Drop-In✓ In Stock
$4.32 / Unit
View Datasheet →PIC32MX564F128H-I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX564F064HT-I/MR
✅ Drop-In✓ In Stock
$4.1 / Unit
View Datasheet →PIC32MX564F064H-I/MR
✅ Drop-In✓ In Stock
$4.38 / Unit
View Datasheet →PIC32MX564F128HT-V/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K |
| CPU Type | 32-bit MIPS MCU |
| Number of Cores | Single-Core |
| Maximum CPU Clock | 80 MHz |
| Program Memory (Flash) | 128 KB (128K x 8) |
| Data RAM | 32 KB |
| Operating Voltage | 2.5 V / 3.3 V |
| Package | 64-VQFN (9x9 mm) with exposed pad |
| Mounting Type | Surface Mount |
| USB | USB 2.0 FS On-The-Go |
| CAN | CAN 2.0B |
| ADC | 10-bit, 16-channel, up to 1 Msps |
| DMA Channels | 4 |
| Parallel Master Port (PMP) | 8-bit |
| Temperature Grade (suffix V) | -40C to +105C (extended) |
| RoHS Status | Compliant |
PIC32MX564F128HT-V/MR 64-vqfn (9x9 mm) with exposed pad Pin Configuration Guide
Pin configuration for PIC32MX564F128HT-V/MR (64-vqfn (9x9 mm) with exposed pad package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX564F128HT-V/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX564F128HT-V/MR is suitable for 6 applications: USB-CAN Bridge for Industrial Equipment, Embedded Sensor Data Logger, Industrial CAN Node (CANopen / DeviceNet), Low-Cost Graphical HMI Controller, USB Peripheral / HID Device, Automotive Body ECU / HVAC Node.
USB-CAN Bridge for Industrial Equipment
The PIC32MX564F128HT-V/MR is well-suited to USB-to-CAN bridge designs because it integrates full-speed USB 2.0 OTG and CAN 2.0B alongside an 80 MHz MIPS core. With 128 KB Flash there is headroom for CANopen or J1939 stacks, while 32 KB SRAM accommodates USB endpoint buffers plus CAN message FIFOs simultaneously. The four DMA channels can autonomously move ADC samples and CAN messages without CPU intervention, freeing MIPS for protocol parsing at 80 MHz. The V temperature grade (-40C to +105C) handles factory-floor or outdoor cabinet environments. Compared to a discrete USB-CAN bridge plus external MCU, the integrated approach reduces BOM count by 30-50%.
Recommended
Embedded Sensor Data Logger
For sensor hubs that must sample multiple analog channels, the PIC32MX564F128HT-V/MR provides a 16-channel 10-bit ADC at up to 1 Msps plus four DMA channels that can stream samples directly into SRAM without CPU load. The 32 KB SRAM holds roughly 16K ADC samples at 10 bits, while the 128 KB Flash stores configuration tables, calibration data and a small file-system. USB-OTG allows direct file export to a USB flash drive, eliminating the need for an external SD card interface. The 80 MHz CPU remains available for filtering and threshold-detection algorithms during background sampling.
Recommended
Industrial CAN Node (CANopen / DeviceNet)
On a CANopen or DeviceNet node, the PIC32MX564F128HT-V/MR's CAN 2.0B controller and 80 MHz CPU deliver deterministic message handling with full protocol-stack headroom in 128 KB Flash. The 32 KB SRAM is sufficient for object dictionaries and PDO buffers typical of CANopen CiA-301, while the 8-bit PMP can drive a small local display or keypad. The V-grade temperature rating permits installation in unconditioned cabinets and machine enclosures. DMA support allows background ADC sampling for temperature or pressure monitoring concurrently with CAN traffic.
Recommended
Low-Cost Graphical HMI Controller
The 8-bit Parallel Master Port (PMP) of the PIC32MX564F128HT-V/MR can drive small TFT panels and character displays up to 1-2 Mpixels without an external controller, and the 80 MHz CPU executes GUI rendering at frame rates above 60 Hz. 128 KB Flash stores fonts, bitmaps and an embedded UI library while 32 KB SRAM holds double-buffered frame regions. USB-OTG serves as the firmware-update and PC-connect port. Compared to a 16-bit PIC24 HMI design, the PIC32MX5xx doubles the available MIPS for the same BOM cost.
Recommended
USB Peripheral / HID Device
For USB HID, CDC or vendor-class peripherals, the PIC32MX564F128HT-V/MR integrates USB 2.0 FS with internal transceiver and pull-up resistors, removing the need for an external PHY. The MIPS M4K core at 80 MHz handles HID report generation and USB protocol stacks comfortably, leaving 128 KB Flash for application logic. DMA offloads endpoint-FIFO servicing from the CPU, sustaining full USB bandwidth. The VQFN-64 (9x9) package keeps the board footprint small for dongle-style enclosures.
Recommended
Automotive Body ECU / HVAC Node
For non-safety automotive body and HVAC ECUs, the PIC32MX564F128HT-V/MR provides CAN 2.0B plus PWM timers and ADC channels needed for actuator and sensor interfaces. The V temperature grade supports under-hood or dashboard environments, and 128 KB Flash holds typical OEM HVAC firmware. The four DMA channels allow continuous background ADC sampling of temperature, pressure and position sensors without affecting PWM timing. Compared to discrete 8-bit HVAC controllers, the integrated design reduces component count and improves loop response at 80 MHz.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX564F128HT-V/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX564F128HT-I/MR | PIC32MX564F128H-V/MR | PIC32MX564F128H-I/MR | PIC32MX564F064HT-I/MR | PIC32MX564F064H-I/MR |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) with EP | 64-VQFN (9x9) with EP - same | 64-VQFN (9x9) with EP - same | 64-VQFN (9x9) with EP - same | 64-VQFN (9x9) with EP - same | 64-VQFN (9x9) with EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | MIPS32 M4K, 80 MHz | MIPS32 M4K, 80 MHz | MIPS32 M4K, 80 MHz | MIPS32 M4K, 80 MHz | MIPS32 M4K, 80 MHz | MIPS32 M4K, 80 MHz |
| Flash / SRAM | 128 KB / 32 KB | 128 KB / 32 KB | 128 KB / 32 KB | 128 KB / 32 KB | 64 KB / 32 KB (-50% Flash) | 64 KB / 32 KB (-50% Flash) |
| Temperature Grade | V: -40C to +105C | I: -40C to +85C | V: -40C to +105C | I: -40C to +85C | I: -40C to +85C | I: -40C to +85C |
| Shipping Medium | Tape & Reel | Tape & Reel | Tray | Tray | Tape & Reel | Tray |
| USB / CAN | USB 2.0 FS OTG + CAN 2.0B | USB 2.0 FS OTG + CAN 2.0B | USB 2.0 FS OTG + CAN 2.0B | USB 2.0 FS OTG + CAN 2.0B | USB 2.0 FS OTG + CAN 2.0B | USB 2.0 FS OTG + CAN 2.0B |
| ADC | 10-bit, 16-ch, 1 Msps | 10-bit, 16-ch, 1 Msps | 10-bit, 16-ch, 1 Msps | 10-bit, 16-ch, 1 Msps | 10-bit, 16-ch, 1 Msps | 10-bit, 16-ch, 1 Msps |
Key Differentiators
- Higher Flash density than F064 variants (vs PIC32MX564F064HT-I/MR)
- V temperature grade for extended environments (vs PIC32MX564F128HT-I/MR)
- Tape-and-Reel shipping medium for SMT lines (vs PIC32MX564F128H-V/MR)
Design Notes
The 64-VQFN (9x9) MR package dissipates heat primarily through the exposed thermal pad (EP). Solder the EP to a continuous ground plane with a 4x4 array of 0.3 mm thermal vias tying the EP to an inner ground layer. Without EP soldering, junction-to-ambient thermal resistance degrades sharply and the device may throttle or fail OTP at full 80 MHz and high I/O activity.
Place 100 nF X7R decoupling capacitors within 3 mm of every VDD/VSS pair. Add 4.7 uF bulk capacitors on the main VDD rail near the EP-side pins. Keep the 48 MHz USB-related traces short and match impedance to 90 ohms differential per USB FS spec; route the D+/D- pair with ground fill on both sides and no stubs.
The V temperature grade suffix (PIC32MX564F128HT-V/MR) refers to -40C to +105C; do not confuse it with supply-voltage 3.3V. Operating voltage is a separate 2.5V/3.3V rail, not encoded in the suffix. Selecting the wrong grade (I vs V) for outdoor or under-hood environments can result in thermal failure above 85C.
Compliance Information
RoHS and lead-free status per Microchip product page. AEC-Q100 not applicable; this part is not automotive-qualified to AEC-Q100 - for AEC-Q100 designs choose a PIC32MK or dsPIC33 family variant.
