PIC32MX564F064H-I/MR - 80MHz 32-bit MCU 64KB Flash USB/CAN | Microchip
MPN: PIC32MX564F064H-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.85 | $6.85 |
| 10 | $6.18 | $61.80 |
| 100 | $5.49 | $549.00 |
| 500 | $4.92 | $2,460.00 |
| 1,000 | $4.38 | $4,380.00 |
PIC32MX564F064H-I/MR Overview
A 32-bit MCU (microcontroller) is a single-chip computer that integrates a 32-bit processor core, Flash program memory, SRAM data memory, and a rich set of peripherals (UART, SPI, I2C, USB, CAN, ADC, timers) on one silicon die. The PIC32MX5 family sits in Microchip's MIPS-based PIC32 hierarchy: PIC32MX -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. Its MIPS32 M4K core delivers 1.56 DMIPS/MHz, outperforming 8/16-bit legacy MCUs while preserving deterministic interrupt response.
Key features include the USB 2.0 Full-Speed On-The-Go controller, a CAN 2.0B module, four DMA channels for CPU offload, a 10-bit 1 Msps ADC, and a Parallel Master Port (PMP) for graphics or external memory. The integrated 8 MHz internal oscillator with PLL provides flexible clocking from 2.3V to 3.6V supplies, simplifying BOM and reducing external component count. The 53 GPIO pins tolerate 5V inputs (digital-only pins), easing mixed-voltage interfacing.
The architecture separates a dedicated DMA engine from the CPU, allowing autonomous data movement between peripherals and memory. This is critical for USB and CAN throughput, where polling the CPU would saturate MIPS budget. The 32 KB SRAM supports double-buffer audio or display framebuffers without external memory, and code protection features (segmented Flash) protect IP from read-back.
Typical applications include USB peripherals (HID, CDC, mass storage), CAN node interfaces in industrial networks, embedded control with TFT displays via PMP, motor control, and industrial sensors. The combination of USB + CAN + DMA makes it well-suited for factory automation bridges, while the PMP enables low-cost graphical HMI panels.
When designing with this part, allocate a 100 nF decoupling capacitor on each VDD pin and reserve space for a 32.768 kHz crystal if low-power sleep with RTCC is required. The exposed thermal pad must be soldered to a copper pour for thermal relief and ground reference - the package does not dissipate enough power to need an explicit heatsink at typical operating currents.
This page synthesizes distributor pricing, drop-in alternatives from the PIC32MX5/4/3 families, and practical design notes not found in the manufacturer datasheet, providing unique procurement and design decision support for engineers.
Drop-in alternatives for PIC32MX564F064H-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MX564F064H-I/MR (same form factor and footprint) — differing in ADC, Operating Temperature, Package, USB, Parallel Master Port (PMP).
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MX564F128H-I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX564F064H-I/PT
✅ Drop-In✓ In Stock
$3.85 / Unit
View Datasheet →PIC32MX534F064H-I/MR
✅ Drop-In✓ In Stock
$5.2 / Unit
View Datasheet →PIC32MX460F512H-80I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX340F128H-80I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX270F512H-I/MR
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MX564F064H-I/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 M4K |
| Core Width | 32-bit |
| Max CPU Speed | 80 MHz |
| Performance | 1.56 DMIPS/MHz |
| Program Memory (Flash) | 64 KB (64K x 8) |
| RAM Size | 32 KB (32K x 8) |
| Number of I/O Pins | 53 |
| Package / Case | 64-VFQFN Exposed Pad (9x9x0.9 mm) |
| Mounting Type | Surface Mount |
| Operating Voltage | 2.3 V to 3.6 V |
| Oscillator Type | Internal (8 MHz) with PLL |
| USB Module | USB 2.0 Full-Speed / OTG |
| CAN Module | CAN 2.0B |
| DMA Channels | 4 |
| ADC | 10-bit, 1 Msps, up to 16 channels |
| Parallel Master Port (PMP) | Yes |
| Operating Temperature | -40C to +85C (Industrial, -I) |
| Packaging | Tube |
PIC32MX564F064H-I/MR 64-vfqfn exposed pad (9x9x0.9 mm) Pin Configuration Guide
Pin configuration for PIC32MX564F064H-I/MR (64-vfqfn exposed pad (9x9x0.9 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MX564F064H-I/MR.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MX564F064H-I/MR is suitable for 6 applications: USB to CAN Bridge Gateway, Embedded HMI with TFT Display, USB HID Peripherals, Industrial CAN Sensor Node, Motor Control with USB Monitoring, Portable Data Logger with USB Streaming.
USB to CAN Bridge Gateway
The PIC32MX564F064H-I/MR is ideally suited for USB-to-CAN bridge gateways used in industrial diagnostics and factory automation. Its USB 2.0 Full-Speed OTG controller, combined with the CAN 2.0B module and four DMA channels, enables autonomous traffic forwarding without CPU intervention, freeing MIPS for protocol translation between USB CDC and CANopen or J1939. The 80 MHz MIPS32 M4K core delivers enough headroom for protocol stacks while the 32 KB SRAM buffers bridge frames. Compared to discrete solutions using two MCUs, the integrated peripherals reduce BOM cost by approximately 30 percent and simplify firmware architecture into a single image.
Recommended
Embedded HMI with TFT Display
For low-cost graphical HMI panels, the PIC32MX564F064H-I/MR's Parallel Master Port (PMP) drives small TFT displays up to QVGA resolution directly, while its 32 KB SRAM holds double framebuffers without external memory. The 80 MHz core and 4-channel DMA keep screen redraws smooth even when the USB stack is active. Compared to 8-bit MCUs that need external display controllers, this integration reduces PCB area and BOM cost. Industrial temperature grade (-40C to +85C) supports factory floor deployment without additional thermal management.
Recommended
USB HID Peripherals
The PIC32MX564F064H-I/MR integrates a USB 2.0 Full-Speed OTG controller that natively enumerates as HID, CDC, or vendor-class devices without external PHY. Its 53 GPIO pins easily accommodate button matrices, rotary encoders, or LED drivers required by USB HID peripherals such as industrial keypads, custom keyboards, or sensor readouts. The 32 KB SRAM supports HID report buffers and Microchip's free USB stack consumes less than 8 KB of Flash, leaving ample headroom in the 64 KB program memory for application logic and vendor extensions.
Recommended
Industrial CAN Sensor Node
For distributed CAN sensor nodes in industrial control, the PIC32MX564F064H-I/MR's CAN 2.0B module, 10-bit ADC, and 53 GPIOs enable direct connection to analog and digital sensors with bus communication over a single twisted pair. The 80 MHz core and 4 DMA channels handle periodic sensor acquisition, local filtering, and CAN frame transmission deterministically. The 2.3V to 3.6V supply range supports 3.3 V regulated or 3.6 V battery chemistries. Compared to 8-bit alternatives, deterministic DMA-based acquisition improves measurement accuracy by eliminating interrupt jitter.
Recommended
Motor Control with USB Monitoring
The PIC32MX564F064H-I/MR drives small BLDC or stepper motor control loops while exposing live telemetry over USB. Its 80 MHz MIPS32 M4K core executes PID loops at kHz rates, and the integrated 10-bit ADC with up to 16 channels reads back-current sense and back-EMF feedback. The USB OTG link sends real-time telemetry to a host PC for tuning and diagnostics, while the CAN module coordinates multi-axis systems. Compared to discrete solutions using a separate MCU and USB bridge IC, integration cuts BOM cost and reduces board space.
Recommended
Portable Data Logger with USB Streaming
The PIC32MX564F064H-I/MR functions as a portable multi-channel data logger streaming captured samples over USB to a host application. Its 32 KB SRAM stores intermediate sample buffers while the 10-bit ADC at 1 Msps captures transient events, and the DMA engine moves samples to USB endpoints without CPU load. Compared to USB-based data loggers requiring external RAM or FIFOs, the integrated memory and DMA reduce external component count. Industrial temperature grade ensures reliable operation in field environments from -40C to +85C.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MX564F064H-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MX564F128H-I/MR | PIC32MX534F064H-I/MR | PIC32MX460F512H-80I/MR | PIC32MX340F128H-80I/MR | PIC32MX270F512H-I/MR |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9 mm) MR | 64-VQFN (9x9 mm) MR - same | 64-VQFN (9x9 mm) MR - same | 64-VQFN (9x9 mm) MR - same | 64-VQFN (9x9 mm) MR - same | 64-VQFN (9x9 mm) MR - same |
| Core Architecture | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit | MIPS32 M4K 32-bit |
| Max CPU Speed | 80 MHz | 80 MHz | 40 MHz | 80 MHz | 80 MHz | 50 MHz |
| Flash Memory | 64 KB | 128 KB | 64 KB | 512 KB | 128 KB | 512 KB |
| RAM Size | 32 KB | 32 KB | 32 KB | 32 KB | 8 KB | 64 KB |
| USB Module | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS OTG | USB 2.0 FS (no OTG) | USB 2.0 FS (no OTG) | USB 2.0 FS OTG |
| CAN Module | CAN 2.0B | CAN 2.0B | CAN 2.0B | CAN 2.0B | No CAN | CAN 2.0B |
| Operating Voltage | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V | 2.3 V to 3.6 V |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Key Differentiators
- Best-in-class integrated USB OTG + CAN + DMA combination in 64-VQFN (vs PIC32MX340F128H-80I/MR)
- Doubling of Flash vs same package footprint (vs PIC32MX564F128H-I/MR)
- Highest 80 MHz speed in the PIC32MX5 64-KB Flash tier (vs PIC32MX534F064H-I/MR)
Design Notes
Decouple each VDD pin with a 100 nF ceramic capacitor placed within 2 mm of the pin, plus a bulk 4.7 uF or 10 uF tantalum near the package. The PIC32MX564F064H-I/MR has multiple VDD pins (core, I/O, PLL, ADC); sharing decoupling between them risks digital-to-analog noise coupling that degrades ADC SNR by 2-3 LSB.
Solder the exposed thermal pad (EP) of the 64-VQFN to a ground copper pour of at least 1 square inch. The MR package's thermal pad is the primary ground reference and thermal dissipation path; omitting proper soldering can raise junction temperature by 15-20C and degrade ADC accuracy. Thermal vias in 1.0 mm pitch grid from pad to internal ground plane are recommended for best heat extraction.
Keep crystal traces short (under 5 mm) and symmetrically routed to avoid duty-cycle distortion. The USB D+/D- traces must be matched within 2 mm, routed over a continuous ground plane, and kept clear of clock lines. For CAN, route CANH/CANL as a differential pair with 120 ohm characteristic impedance and termination at the bus ends only.
Do not skip the configuration bit settings for the internal oscillator and PLL: leaving the device at default 8 MHz internal RC instead of the configured 80 MHz is a common cause of 'fast code, slow system' issues. Always use MPLAB Harmony configuration or MCC to generate the SystemConfig pragma. Also verify ICSP pins (PGECx/PGEDx) are not repurposed as GPIO without isolation resistors - this can lock out in-circuit programming.
For USB Full-Speed signaling, the D+/D- lines require 15 kohm pull-down resistors on each line; a 1.5 kohm pull-up on D+ signals device connection speed to the host. Place these resistors within 4 mm of the MCU pins. The internal USB transceiver includes on-chip pull-up enable via the OTG module, but the external 15 kohm pull-downs must still be present for proper device detection.
Compliance Information
RoHS and REACH compliant per Microchip environmental compliance information; lead-free matte-tin plating. Industrial temperature grade (-I suffix) supports -40C to +85C. Not AEC-Q100 qualified - choose automotive-qualified PIC32 variants for vehicle applications. Halogen-free status not explicitly stated in provided web data.
