PIC32MZ1024ECG100-I/PF - 200MHz 1MB Flash MCU | Microchip
MPN: PIC32MZ1024ECG100-I/PF ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $14.95 | $14.95 |
| 10 | $13.46 | $134.60 |
| 100 | $11.96 | $1,196.00 |
| 500 | $10.76 | $5,380.00 |
| 1,000 | $9.57 | $9,570.00 |
PIC32MZ1024ECG100-I/PF Overview
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory, data memory, and a rich set of peripherals. Within the product hierarchy, the PIC32MZ EC family belongs to 32-bit microcontrollers, then to microcontrollers, then to embedded processors, then to semiconductors. The 'EC' designation specifically targets connectivity applications, where the device integrates Ethernet MAC, USB, CAN, and multiple serial interfaces alongside the application processor core.
Key features include dual-panel live-update Flash (allowing firmware updates without downtime), a 200 MHz core with hardware multiply/divide and DSP extensions, large 512 KB SRAM for buffering network packets, and an integrated Floating Point Unit on selected siblings. Peripherals include 10/100 Ethernet MAC, USB 2.0 high-speed PHY interface, CAN 2.0b, multiple UART/SPI/I2C, 12-bit ADC modules, and parallel master port for graphics or external memory expansion. The 100-pin TQFP package exposes up to 78 user I/O pins.
Technically, the device uses a 5-stage MIPS32 pipeline with branch prediction, a tightly-coupled prefetch module to maximize Flash throughput, and a peripheral bus running at half the system clock. Power management includes multiple low-power modes (Idle, Sleep, Deep Sleep), a separate low-power brown-out reset, and on-chip voltage regulators. The EC family is now marked as Not Recommended for new designs (NRND); the EF family (with FPU) is its recommended successor.
Typical applications include industrial Ethernet gateways, IoT edge nodes with TLS/SSL stacks, motor control HMI controllers, multi-protocol bridge routers, and graphical touch HMI panels. The combination of dual-bank Flash and large RAM is particularly useful for field-upgradable firmware and OTA updates.
When designing with this part, evaluate the EF family (PIC32MZ1024EFG100) if FPU performance is required or for new designs due to the EC family's NRND status. Ensure the 200 MHz core is supplied from a clean rail with adequate decoupling on the analog AVDD pins to avoid ADC noise coupling.
This page synthesizes distributor pricing, drop-in compatible EC family variants, and practical design notes not collected in any single manufacturer document.
Drop-in alternatives for PIC32MZ1024ECG100-I/PF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ1024ECG100-I/PF (same form factor and footprint) — differing in Core Architecture, USB, Package, ADC, Ethernet.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ1024EFG100-I/PF
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MZ1024ECG100T-I/PF
✅ Drop-In✓ In Stock
$6.75 / Unit
View Datasheet →PIC32MZ1024ECG100-E/PF
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MZ1024ECG100-V/PF
✅ Drop-In📋 Reference alternative (not in catalog)
PIC32MZ0512EFK100-I/PF
✅ Drop-In✓ In Stock
$2.79 / Unit
View Datasheet →PIC32MZ0512EFF100-I/PF
✅ Drop-In✓ In Stock
$8.55 / Unit
View Datasheet →PIC32MZ1024ECG100-I/PF Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 microAptiv |
| Core Width | 32-bit |
| Max CPU Clock | 200 MHz |
| Performance | 330 DMIPS / 3.28 CoreMark/MHz |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 512 KB |
| Operating Voltage | 2.3 V to 3.6 V |
| Package | 100-pin TQFP (14x14 mm) |
| Operating Temperature | -40C to +85C (Industrial, -I) |
| User I/O Pins | 78 (max) |
| Ethernet | 10/100 MAC (MII/RMII) |
| USB | USB 2.0 High-Speed (with external PHY) |
| CAN | CAN 2.0b |
| ADC | 12-bit, up to 48 channels |
| FPU | Not present (see EF family) |
| MSL Level | 3 |
| RoHS Status | Compliant |
PIC32MZ1024ECG100-I/PF 100-pin tqfp (14x14 mm) Pin Configuration Guide
Pin configuration for PIC32MZ1024ECG100-I/PF (100-pin tqfp (14x14 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MZ1024ECG100-I/PF.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MZ1024ECG100-I/PF is suitable for 7 applications: Industrial Ethernet Gateway, IoT Edge Node with TLS/SSL, Motor Control HMI Controller, Multi-Protocol Bridge Router, Medical Patient Monitoring, Automotive Gateway (NRND Notice), Graphical Touch HMI Panel.
Industrial Ethernet Gateway
The PIC32MZ1024ECG100-I/PF is well suited for industrial Ethernet gateway designs thanks to its integrated 10/100 Ethernet MAC supporting both MII and RMII PHY interfaces. The 200 MHz MIPS32 microAptiv core handles TCP/IP stacks, Modbus/TCP, PROFINET, and EtherNet/IP without offloading, while the 512 KB SRAM provides ample buffer space for multiple concurrent socket connections. The 1 MB dual-panel Flash supports secure OTA firmware updates in the field. Engineers pair the MCU with external transceivers and PHY hardware, including isolation transformers for IEC 61800 compliance.
Recommended
IoT Edge Node with TLS/SSL
For IoT edge nodes requiring secure cloud connectivity, the PIC32MZ1024ECG100-I/PF's 200 MHz core and 512 KB SRAM provide sufficient headroom to run mbedTLS or wolfSSL TLS handshakes alongside MQTT or HTTP clients. The 1 MB Flash accommodates wolfMQTT, application code, and OTA bootloader in a single image. Hardware acceleration through the crypto engine and true random number generator on related EC peripherals enables secure boot and key storage. The industrial temperature grade (-40C to +85C) supports outdoor enclosures.
Recommended
Motor Control HMI Controller
The PIC32MZ1024ECG100-I/PF drives graphical HMI touch panels paired with motor control loops. The 200 MHz core runs LVGL or Microchip MPLAB Harmony graphics stacks on a TFT display via the parallel master port, while a software state machine handles motor commutation. The 78 GPIO pins provide sufficient headroom for SPI touch controllers, PWM channels, and quadrature encoder inputs. The 12-bit ADC with up to 48 channels samples motor current and back-EMF simultaneously for field-oriented control.
Recommended
Multi-Protocol Bridge Router
Multi-protocol bridges that translate between industrial fieldbuses (CAN, RS-485, Modbus RTU) and Ethernet benefit from the PIC32MZ1024ECG100-I/PF's rich peripheral set. The CAN 2.0b controller, multiple UART channels, and 10/100 Ethernet MAC allow simultaneous handling of multiple bus types without an external communication co-processor. The 200 MHz MIPS32 microAptiv core runs routing and protocol conversion firmware at low latency. 512 KB SRAM buffers bursty fieldbus traffic between segments.
Recommended
Medical Patient Monitoring
Patient monitoring peripherals such as multi-parameter bedside monitors use the PIC32MZ1024ECG100-I/PF for signal aggregation across ECG, SpO2, and temperature channels. The 12-bit ADC captures multiple analog sensor outputs at sampling rates sufficient for heart-rate detection, while the SRAM buffers derived waveforms for on-screen rendering. The integrated USB 2.0 High-Speed interface streams waveform data to a host PC during extended Holter recording. Designers must validate IEC 60601-1 EMI and isolation requirements externally.
Recommended
Automotive Gateway (NRND Notice)
Although the PIC32MZ1024ECG100-I/PF is NRND as of 2026-10-04, the -V/PF variant (PIC32MZ1024ECG100-V/PF) is qualified for automotive gateway applications with -40C to +150C support. The 180 MHz maximum frequency under AEC-Q100 stress is acceptable for CAN-to-Ethernet bridging in central body controllers. The large Flash and RAM handle CAN FD frame buffering and routing tables. New automotive designs should migrate to the PIC32MZ EF automotive family for active longevity.
Recommended
Graphical Touch HMI Panel
Touch HMI panels with 4.3-inch or 5-inch TFT displays run graphics stacks on the PIC32MZ1024ECG100-I/PF using the parallel master port for high-throughput pixel data. The 200 MHz core drives 60 fps frame updates without external graphics controllers, while the 512 KB SRAM supports partial framebuffers for anti-aliased fonts and widgets. The integrated USB 2.0 High-Speed interface enables fast firmware updates via USB stick, and the Ethernet MAC supports remote HMI programming over the factory network.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ1024ECG100-I/PF — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ1024EFG100-I/PF | PIC32MZ1024ECG100T-I/PF | PIC32MZ1024ECG100-E/PF | PIC32MZ1024ECG100-V/PF |
|---|---|---|---|---|---|
| Package | 100-pin TQFP (14x14 mm) | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same | 100-pin TQFP (14x14 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Max CPU Clock | 200 MHz | 200 MHz | 180 MHz (-10%) | 180 MHz (-10%) | |
| Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB |
| SRAM | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| FPU | No | Yes (single-precision IEEE 754) | No | No | |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +125C (Extended) | -40C to +150C (Automotive) | |
| Lifecycle Status | NRND | Active | NRND | NRND |
Key Differentiators
- Drop-in upgrade to FPU-equipped EF family without PCB change (vs PIC32MZ1024EFG100-I/PF)
- Extended and automotive temperature grades on same pinout (vs PIC32MZ1024ECG100-E/PF / -V/PF)
- Higher Flash and RAM than smaller PIC32MZ EC siblings (vs PIC32MZ1024ECG064-I/MR (64-pin QFN variant))
- Higher 200 MHz clock vs 180 MHz on -V automotive grade (vs PIC32MZ1024ECG100-V/PF)
Design Notes
Estimated: at VDD = 3.3 V, 200 MHz core active, and all peripherals enabled, typical IDD is approximately 95 mA; budgeting 120 mA on the 3.3 V rail is recommended. Use a low-noise LDO such as the Microchip MCP1700 or a switching regulator followed by an LDO filter for the AVDD pins, which supply the 12-bit ADC. Place 100 nF and 4.7 uF decoupling capacitors within 3 mm of every VDD/AVDD/VSS/AVSS pair. Avoid routing high-frequency digital signals across the analog supply plane to prevent ADC coupling.
Estimated: at 120 mA and 3.3 V, power dissipation is approximately 0.4 W in active mode, well within the 100-pin TQFP thermal envelope (theta_JA roughly 50 C/W on a 4-layer JEDEC EIA/JESD51 board). At 85C ambient this yields a junction temperature of about 105C, leaving 20C margin to the 125C absolute maximum. For automotive -V variants at 150C junction, ensure the PCB has at least 1 square inch of continuous ground copper under the TQFP thermal pad. Avoid sealing the MCU inside a non-ventilated enclosure at full 200 MHz load.
The 100-pin TQFP (14x14 mm, 0.5 mm pitch) requires 4-layer routing with 0.2 mm traces and 0.2 mm spaces to break out the dense power and signal pins. Place the 25 MHz primary crystal within 8 mm of the OSCI/OSCO pins, with a grounded guard ring around the traces. The Ethernet MII/RMII signals to the PHY must be length-matched within 50 mm to meet IEEE 802.3 timing at 100 Mbps. Add a 4.7 kohm pull-up on the MCLR pin and a 10 kohm pull-down on the SOSC crystal enable pin as recommended in section 2.0 of the datasheet.
Configure the Flash wait states (CHECON register) to at least 2 wait states at 200 MHz before increasing the system clock; otherwise instruction fetches will fail and the device appears to lock up. The prefetch module must remain enabled. The dual-panel Flash requires special erase sequences (NVMCON) for the upper and lower panels independently; consult section 5.0 of the EC family reference manual. Never drive the analog pins above AVDD + 0.3 V or below AVSS - 0.3 V, even in shutdown, or the ESD diodes will latch up.
Keep the USB DP/DM differential pair length-matched within 150 mil and routed with 90 ohm differential impedance on the outer layers. Place the 27 MHz PHY clock for USB at most 5 mm from the USB clock pin. For Ethernet, isolate the MII bus from switching regulator inductors using an inner-layer ground pour. Connect the unused GPIO to defined states (input with pull-up or output low) to minimize power consumption in sleep mode.
Compliance Information
RoHS and lead-free status confirmed by Microchip product page. The -I/PF variant is not AEC-Q100 qualified; the -V/PF variant is the AEC-Q100 automotive grade. Halogen-free status not explicitly stated in available data.
