PIC32MZ1064DAL169-I/HF - 200MHz MIPS MCU, 1MB Flash, 169-LFBGA | Microchip
MPN: PIC32MZ1064DAL169-I/HF ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.42 | $7.42 |
| 10 | $6.88 | $68.80 |
| 100 | $6.13 | $613.00 |
| 500 | $5.61 | $2,805.00 |
| 1,000 | $5.05 | $5,050.00 |
PIC32MZ1064DAL169-I/HF Overview
What is a microcontroller (MCU)? A microcontroller is a single-chip computer that integrates a CPU core, program memory (Flash), data memory (SRAM), and peripheral interfaces (ADC, USB, timers, I/O). Within that hierarchy, this part belongs to the 32-bit MCU category, then to the MIPS32 microAptiv core family, then to the PIC32MZ DA graphics series, and finally to the broader PIC® microcontroller portfolio. PIC32MZ DA parts bridge MCU simplicity with MPU-class graphics performance, often replacing higher-cost application processors in human-machine interface (HMI) designs.
Key features include an integrated graphics pipeline with up to 24-bit color, support for external DDR2 DRAM up to 128 MB, a 12-bit 18 MSPS ADC module, and HS USB 2.0 with on-chip transceiver. PPS (Peripheral Pin Select) allows flexible I/O function placement, while Class B safety library (IEC 60730) support simplifies functional-safety designs. Five-volt-tolerant I/O with up to 32 mA source/sink provides robust interfacing, and selectable slew rate control mitigates EMI on high-speed lines.
The architecture pairs a 200 MHz MIPS32 microAptiv core with a tightly-coupled instruction cache and a dedicated graphics engine, enabling smooth rendering of TFT-LCD panels without an external GPU. Hardware crypto accelerators, parallel camera interface, and audio I²S expand its role into industrial IoT and connected UI designs. Industrial temperature range (-40C to +85C) and AEC-Q100 variants exist in the family for automotive dashboards.
Typical applications include industrial HMI panels, automotive infotainment, graphical medical device interfaces, and smart-home control hubs. The graphics peripherals make it well-suited to drive 4.3"-7" WVGA TFT-LCDs with low BOM cost. With HS USB, CAN, and Ethernet MAC, it can serve as a host MCU in factory automation nodes. The 45 analog input capability also enables sensor aggregation in multi-channel data-acquisition panels.
Design considerations: the LFBGA-169 package requires a 4-layer (or more) PCB with microvia or via-in-pad technology for reliable assembly; ensure DDR2 trace length matching per JEDEC specifications. The external DRAM interface consumes many pins and increases complexity versus lower-pin PIC32MX variants.
This page synthesizes distributor pricing, same-brand drop-in alternatives from the PIC32MZ DA family, and PCB-layout design notes that complement the manufacturer datasheet without restating it.
Drop-in alternatives for PIC32MZ1064DAL169-I/HF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ1064DAL169-I/HF (same form factor and footprint) — differing in Graphics Controller, USB, CAN, ADC, Mounting Type.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ1064DAB169-I/HF
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View Datasheet →PIC32MZ1064DAA169-I/HF
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View Datasheet →PIC32MZ1064DAB169T-I/HF
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View Datasheet →PIC32MZ1064DAL169-V/HF
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View Datasheet →PIC32MZ1025DAL169T-I/HF
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View Datasheet →PIC32MZ1025DAB169-I/HF
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View Datasheet →PIC32MZ1064DAL169-I/HF Maximum Ratings & Electrical Characteristics
| Family | PIC32MZ DA (Graphics) |
| Core Architecture | MIPS32 microAptiv |
| CPU Bit Width | 32-bit |
| Maximum CPU Speed | 200 MHz |
| Program Flash | 1 MB (1M x 8) |
| SRAM | 640 KB |
| Package | 169-LFBGA (11x11 mm) |
| Supply Voltage | 1.8 V (core) / 3.3 V (I/O) |
| ADC | 12-bit, up to 18 MSPS, up to 45 analog inputs |
| Graphics Controller | Integrated (GPU + LCD controller) |
| External Memory Bus | Up to 128 MB DDR2 DRAM addressable |
| USB | HS USB 2.0 with on-chip transceiver |
| CAN | 2x CAN 2.0B |
| Operating Temperature | -40C to +85C (Industrial) |
| Mounting Type | Surface Mount (BGA) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Safety Library | Class B Safety Library, IEC 60730 |
PIC32MZ1064DAL169-I/HF 169-lfbga (11x11 mm) Pin Configuration Guide
Pin configuration for PIC32MZ1064DAL169-I/HF (169-lfbga (11x11 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MZ1064DAL169-I/HF.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MZ1064DAL169-I/HF is suitable for 6 applications: Industrial HMI Panel, Automotive Infotainment / Cluster, Medical Device Interface, Smart-Home Control Hub, Point-of-Sale / Kiosk Terminal, Industrial Sensor Aggregation Module.
Industrial HMI Panel
The PIC32MZ1064DAL169-I/HF drives industrial TFT-LCD HMI panels in factory automation and machine-control equipment. Its 200 MHz MIPS32 microAptiv core, integrated Graphics Controller, and up to 128 MB DDR2 addressability deliver smooth rendering of 4.3"-7" WVGA (800x480) panels at 24-bit color depth without an external GPU. The 12-bit 18 MSPS ADC with up to 45 analog inputs lets the same MCU aggregate analog sensors (temperature, pressure, current) alongside the GUI, shrinking BOM cost. Hardware Class B safety library support (IEC 60730) eases functional-safety compliance for industrial equipment certification.
Recommended
Automotive Infotainment / Cluster
The DAL169-I/HF serves as the host MCU in low- to mid-tier automotive infotainment and instrument-cluster designs where it integrates graphics rendering, CAN bus connectivity, and HS USB. With dual CAN 2.0B controllers, body-network gateways, and HS USB for smartphone projection or media streaming, the part replaces multi-chip solutions. The 5V-tolerant I/O with 32 mA source/sink drives automotive-grade LEDs and backlight drivers directly. For full AEC-Q100 compliance up to +125C, designers select the V-suffix variants; the I-temp DAL is widely used for non-safety-critical HMI sub-modules.
Recommended
Medical Device Interface
The PIC32MZ1064DAL169-I/HF's MIPS32 microAptiv core at 200 MHz, 640 KB SRAM, and integrated graphics pipeline are well-suited to graphical medical device interfaces such as patient monitors, infusion pumps, and diagnostic analyzers. The 12-bit 18 MSPS ADC supports up to 45 analog inputs for multi-parameter vital-sign acquisition (ECG, SpO2, temperature). PPS allows flexible mapping of I²S audio paths for beep/voice prompts. Class B IEC 60730 safety library support aids compliance for medical electrical equipment under IEC 60601, though full medical certification requires system-level qualification beyond the MCU itself.
Recommended
Smart-Home Control Hub
In smart-home gateways, the PIC32MZ1064DAL169-I/HF provides local HMI rendering on a touchscreen, plus HS USB for Wi-Fi/BLE dongles and dual CAN for HVAC and energy-bus integration. The DDR2 interface and graphics controller enable a responsive dashboard for energy monitoring and device control. PPS remapping simplifies routing between USB, Ethernet MAC, and multiple UART peripherals. With 1 MB Flash and 640 KB SRAM, the part supports full TCP/IP stacks plus a local web server for setup and diagnostics, eliminating the need for an external application processor.
Recommended
Point-of-Sale / Kiosk Terminal
The PIC32MZ1064DAL169-I/HF serves as the controller for graphical POS terminals and self-service kiosks, driving a TFT-LCD for the customer-facing UI while handling barcode scanner input, HS USB peripherals (printer, NFC reader), and Ethernet MAC for payment networking. The integrated graphics engine removes the need for a separate display controller, lowering BOM cost. Industrial temperature range (-40C to +85C) supports semi-outdoor deployments, and 5V-tolerant I/O simplifies interfacing with legacy printer drivers. The 169-LFBGA footprint fits within a compact mainboard layout.
Recommended
Industrial Sensor Aggregation Module
With up to 45 analog inputs on the 12-bit 18 MSPS ADC, the PIC32MZ1064DAL169-I/HF acts as a multi-channel data-acquisition front-end for industrial sensor nodes (load cells, RTDs, thermocouples via external amplifiers). The 200 MHz core runs filtering and FFT processing locally, while the HS USB or Ethernet MAC uploads aggregated data to a host. DDR2 expansion handles large capture buffers for vibration or power-quality analysis. PPS allows flexible mapping of SPI/I²C interfaces to multiple sensor clusters, and Class B safety library support aids industrial machinery compliance.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ1064DAL169-I/HF — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ1064DAB169-I/HF | PIC32MZ1064DAA169-I/HF | PIC32MZ1064DAB169T-I/HF | PIC32MZ1064DAL169-V/HF | PIC32MZ1025DAL169T-I/HF | PIC32MZ1025DAB169-I/HF |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) | 169-LFBGA (11x11) |
| Core Architecture | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv | MIPS32 microAptiv |
| Maximum CPU Speed | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz | 200 MHz |
| Program Flash | 1 MB | 1 MB | 1 MB | 1 MB | 1 MB | 2 MB | 2 MB |
| SRAM | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB | 640 KB |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +105C/+125C (Automotive V-temp) | -40C to +85C | -40C to +85C |
| AEC-Q100 Qualified | No | No | No | No | Yes | No | No |
Key Differentiators
- Integrated Graphics Controller + GPU without external processor (vs PIC32MX795F512L-80I/PF)
- Automotive-grade drop-in path via V-suffix family member (vs PIC32MZ1064DAL169-V/HF)
- 1 MB Flash / 640 KB SRAM tier with scalable upgrade paths (vs PIC32MZ1025DAL169T-I/HF)
Design Notes
The 169-LFBGA (11x11 mm) package has a fine-pitch ball array that typically requires a 4-layer (or more) PCB with microvia or via-in-pad technology for reliable assembly. Per Microchip package guidelines, a 1 oz copper outer layer with 0.5 oz inner layers and controlled-impedance routing for the DDR2 interface is recommended. Thermal vias under the exposed center balls improve theta-JA performance for high-utilization industrial HMI designs.
DDR2 trace length matching must follow JEDEC specifications for the PIC32MZ DA family. Data, address, and control signals should be matched within the tolerance specified in the PIC32MZ DA datasheet, with proper termination and reference plane continuity. Place decoupling capacitors as close as possible to each power pin pair, using a mix of 0.1 uF and 4.7 uF ceramics to handle both high-frequency transients and bulk current demand of the graphics engine.
Do not confuse the PIC32MZ1064DAL169 (industrial temp, 1MB Flash / 640KB SRAM, LFBGA-169) with the PIC32MZ1024DAK169 (different memory mix, LQFP package) when ordering. The -HF suffix denotes LFBGA-169; -2J denotes LQFP-176; -/PT denotes TQFP. Always verify the package designator against your PCB footprint before committing to a layout. Pin-compatibility is only guaranteed within the same package code suffix and same memory tier.
Compliance Information
RoHS compliant per Microchip product page. The -I/HF industrial variant is not AEC-Q100 qualified; for AEC-Q100 compliance use the -V/HF automotive variant. Class B Safety Library (IEC 60730) is supported in firmware.