PIC32MZ1064DAL169-V/HF - 200MHz MCU, 1MB Flash, Graphics, 169-LFBGA | Microchip
MPN: PIC32MZ1064DAL169-V/HF ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.45 | $18.45 |
| 10 | $17.1 | $171.00 |
| 100 | $15.05 | $1,505.00 |
| 500 | $13.4 | $6,700.00 |
| 1,000 | $12.2 | $12,200.00 |
PIC32MZ1064DAL169-V/HF Overview
A 32-bit microcontroller (MCU) is a single-chip processor that integrates a CPU core, program and data memory, and a rich set of peripherals on one die. The PIC32MZ DAL extends the MCU hierarchy into the graphics-tiled segment: 32-bit MCU -> embedded microcontroller -> system-on-chip for HMI -> PIC32MZ DAL sub-family. The microAptiv core adds DSP-like SIMD instructions and a prefetch/cache pipeline that help sustain throughput at 200 MHz while keeping deterministic interrupt latency for real-time control alongside the user-interface stack.
Key features of the PIC32MZ1064DAL169-V/HF include an integrated Graphics Controller and Graphics Processor for accelerated GUI rendering, a 12-bit 18 MSPS ADC module with up to 45 analog inputs, on-chip support for an externally addressable DDR2 DRAM footprint of 32 MB or 128 MB, plus connectivity peripherals such as CAN and High-Speed USB. The 169-LFBGA (11x11 mm) package supports dense, high-pin-count PCB designs required by simultaneous display, touch, and communication interfaces. The V-temp grade extends operating temperature into industrial thermal envelopes.
Architecturally, the part combines a high-speed 32-bit core with a 32 KB I-cache and 32 KB D-cache, dedicated graphics peripherals, and an enhanced ADC subsystem. The DDR2 controller offloads frame-buffer memory, enabling the integrated GPU to manage 2D primitives, alpha blending, and color-space conversion without burdening the core. Total internal SRAM reaches up to 640 KB across the family, allowing comfortable tile and framebuffer caching for typical WQVGA/WVGA HMI panels.
Typical applications span industrial human-machine interface (HMI) panels, medical patient monitors, point-of-sale terminals, smart-home control hubs, and automotive infotainment/cluster pre-development. Designers choose this part when a deterministic 32-bit control plane must coexist with rich on-screen graphics, large framebuffers, and standard automotive/industrial connectivity buses.
A key design consideration is PCB layout for the LFBGA package: matched-length DDR2 traces, controlled-impedance USB routing, and ample thermal copper under the exposed die region are essential to achieve the rated 200 MHz performance. Designers should use Microchip's MPLAB Harmony framework and the MPLAB ICE 4 in-circuit emulator to validate cache behavior, DMA, and graphics pipeline throughput before committing to production.
This page synthesizes distributor pricing, same-package drop-in alternatives drawn from the PIC32MZ DAL family, and practical design notes that complement the manufacturer datasheet.
Drop-in alternatives for PIC32MZ1064DAL169-V/HF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with PIC32MZ1064DAL169-V/HF (same form factor and footprint) — differing in Graphics Controller, USB, Core Architecture, Mounting Type, ADC.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
PIC32MZ1064DAL169-I/HF
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View Datasheet →PIC32MZ1064DAB169-I/HF
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View Datasheet →PIC32MZ1064DAB169T-I/HF
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View Datasheet →PIC32MZ1064DAA169-I/HF
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View Datasheet →PIC32MZ1025DAL169T-I/HF
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View Datasheet →PIC32MZ1025DAK169-I/HF
✅ Drop-In✓ In Stock
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View Datasheet →PIC32MZ1064DAL169-V/HF Maximum Ratings & Electrical Characteristics
| Core Architecture | MIPS32 microAptiv |
| Family | PIC32MZ Graphics (DAK/DAL/DAR/DAS) |
| Data Bus Width | 32-bit |
| Maximum CPU Clock | 200 MHz |
| Program Memory (Flash) | 1 MB (1M x 8) |
| Internal SRAM | 640 KB (family maximum, part-specific share varies) |
| External Memory Interface | DDR2 DRAM controller, 32 MB or 128 MB addressable |
| Graphics Controller | Integrated 2D graphics controller + GPU |
| ADC | 12-bit, up to 18 MSPS, up to 45 analog inputs |
| Connectivity | CAN, High-Speed USB |
| Package | 169-LFBGA (11x11 mm) |
| Mounting Type | Surface Mount |
| Temperature Grade | V-temp (-40C to +105C) |
| ICSP Programming | Multiple PGECx/PGEDx pairs supported |
PIC32MZ1064DAL169-V/HF 169-lfbga (11x11 mm) Pin Configuration Guide
Pin configuration for PIC32MZ1064DAL169-V/HF (169-lfbga (11x11 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for PIC32MZ1064DAL169-V/HF.
Refer to the datasheet for full pin configuration.
Typical Applications
PIC32MZ1064DAL169-V/HF is suitable for 6 applications: Industrial HMI Control Panels, Medical Patient Monitoring Displays, Point-of-Sale Terminals, Smart Home Control Hubs, Automotive Infotainment Pre-Development, Industrial Test & Measurement Front Panels.
Industrial HMI Control Panels
The PIC32MZ1064DAL169-V/HF is a strong match for industrial HMI panels that must combine deterministic real-time control with rich on-screen graphics. The integrated Graphics Controller plus DDR2 framebuffer support (up to 128 MB external) sustains full-WVGA displays at 60 fps without burdening the microAptiv core. The 45-channel 12-bit 18 MSPS ADC samples multi-zone touch overlays and analog sensor inputs simultaneously, while the 200 MHz core runs communication stacks (CAN, HS USB) alongside the GUI. V-temp operation to +105C supports sealed factory-floor enclosures without active cooling.
Recommended
Medical Patient Monitoring Displays
Patient monitors require long-term reliability, multi-parameter waveform rendering, and isolated communication buses. The PIC32MZ1064DAL169-V/HF's microAptiv core with DSP extensions accelerates ECG/SpO2 DSP filtering, while the integrated 2D Graphics Processor renders multi-trace waveforms without off-chip GPU cost. The 12-bit 18 MSPS ADC digitizes analog front-end signals at clinical sampling rates across up to 45 channels, sufficient for full-lead ECG plus auxiliary vitals. HS USB and CAN enable tethered or networked connectivity to hospital information systems, and the 169-LFBGA package supports compact, fan-less medical-grade enclosures.
Recommended
Point-of-Sale Terminals
POS terminals demand a responsive touchscreen UI, encrypted payment flow, and reliable printer/PIN-pad peripherals. The PIC32MZ1064DAL169-V/HF accelerates graphical checkout flows via the on-chip GPU while leaving CPU headroom for TLS, EMV, and barcode parsing. The DDR2 controller holds large product imagery and multilingual UI assets, reducing external flash cost. HS USB hosts printer and PIN-pad peripherals, CAN is available for legacy cash-drawer interfaces, and the 1 MB Flash accommodates feature-rich firmware with OTA update staging. The 169-LFBGA package keeps the BOM compact for slim countertop form factors.
Recommended
Smart Home Control Hubs
Smart-home hubs juggle a touchscreen UI plus Zigbee/Thread/Wi-Fi/BLE coexistence stacks, demanding both graphics throughput and abundant code space. The PIC32MZ1064DAL169-V/HF's 1 MB Flash fits feature-rich gateway firmware, while the 640 KB SRAM plus optional DDR2 framebuffer allows rich on-device dashboards. The 12-bit ADC handles analog sensor inputs (light, temperature, gas preamp), and HS USB plus CAN simplify connectivity to bridge radios. The -40C to +105C V-temp envelope supports indoor enclosures near HVAC vents or outdoor weatherproof cabinets.
Recommended
Automotive Infotainment Pre-Development
Pre-production automotive infotainment and cluster development uses the PIC32MZ1064DAL169-V/HF as a fast graphics-and-control platform before committing to automotive-grade silicon. The integrated 2D Graphics Controller accelerates cluster renderings, the DDR2 controller supports multi-layer framebuffers, and the CAN interface is fundamental to in-vehicle networking. V-temp operation is acceptable for cabin environments, but production deployments targeting under-hood or AEC-Q100 contexts should move to a qualified variant. The 169-LFBGA package maps cleanly to development boards that emulate production cluster PCBs.
Recommended
Industrial Test & Measurement Front Panels
Bench instruments and factory test fixtures need both a crisp local UI and real-time signal-processing. The PIC32MZ1064DAL169-V/HF's microAptiv core handles DSP-style FIR/FFT post-processing while the GPU drives waveform/spectrum displays, all in one chip. The 12-bit 18 MSPS ADC with up to 45 channels is ideal for multi-channel data acquisition front-ends, and HS USB streams measurements to a host PC. The 169-LFBGA package enables dense board layouts inside 1U rack instruments, and V-temp operation supports lightly climate-controlled labs and factory cells.
Recommended
Recommended Products Summary
Engineering reference data for PIC32MZ1064DAL169-V/HF — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | PIC32MZ1064DAL169-I/HF | PIC32MZ1064DAB169-I/HF | PIC32MZ1064DAB169T-I/HF | PIC32MZ1064DAA169-I/HF | PIC32MZ1025DAL169T-I/HF | PIC32MZ1025DAK169-I/HF |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 169-LFBGA (11x11 mm) | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same | 169-LFBGA (11x11 mm) - same |
| Core / Speed | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz | MIPS32 microAptiv, 200 MHz |
| Flash Density | 1 MB (1064 tier) | 1 MB (1064 tier) | 1 MB+ (DAB tier, larger) | 1 MB+ (DAB tier, larger) | DAA tier (smaller than 1 MB) | 1025 tier (smaller than 1 MB) | 1025 tier (smaller than 1 MB) |
| Temperature Grade | V-temp (-40C to +105C) | I-temp (-40C to +85C) | I-temp (-40C to +85C) | I-temp (-40C to +85C) | I-temp (-40C to +85C) | I-temp (-40C to +85C) | I-temp (-40C to +85C) |
| Graphics Controller | Integrated 2D + GPU | Integrated 2D + GPU | Integrated 2D + GPU | Integrated 2D + GPU | Integrated 2D + GPU | Integrated 2D + GPU | Integrated 2D + GPU |
| External Memory Interface | DDR2 up to 128 MB | DDR2 up to 128 MB | DDR2 up to 128 MB | DDR2 up to 128 MB | DDR2 up to 128 MB | DDR2 up to 128 MB | DDR2 up to 128 MB |
| Packaging Format | Tray | Tray | Tray | Tape & Reel | Tray | Tape & Reel | Tray |
Key Differentiators
- V-temp grade in identical 169-LFBGA footprint (vs PIC32MZ1064DAL169-I/HF)
- 1 MB Flash tier (1064) gives 25-100% more code space than lower tiers (vs PIC32MZ1064DAA169-I/HF)
- Highest-density 169-LFBGA DAL Flash tier at this temperature grade (vs PIC32MZ1025DAL169T-I/HF)
Design Notes
The 169-LFBGA (11x11 mm) footprint requires microvia PCB technology with 0.8 mm or finer pitch fan-out. Matched-length DDR2 traces are mandatory for the external memory interface; route DQS to clock within 25 mil and match data bytes to within 50 mil per Microchip hardware design checklist. Maintain a continuous ground reference plane under the BGA to control impedance for HS USB and parallel display buses. Decoupling: 100 nF X7R per power pin plus 4.7 uF bulk caps within 5 mm of the package.
Estimated: at 200 MHz with the GPU and DDR2 controller active, the die dissipates approximately 0.8-1.2 W depending on workload. The LFBGA-169 has a typical theta_JA in the 25-35 C/W range on a 4-layer JEDEC test board, yielding a 20-40 C junction rise above ambient at full load. For sealed enclosures without airflow, derive copper pour area from the Microchip thermal land pattern notes and avoid placing heat-generating components within 10 mm of the BGA. Add a thermal via array under the center balls if the datasheet indicates an exposed thermal die pad.
Do not assume any PGECx/PGEDx pair is interchangeable for ICSP - according to northernsoftware.com PIC32MZ reference, the ICSP clock and data pins MUST be used as a matched pair (e.g. PGEC2 with PGED2). Mixing pairs prevents the MPLAB ICE 4 or PICkit from acquiring the device. Also confirm boot configuration straps before power-up; incorrect DEVCFGx fuses can permanently lock the part. Finally, validate DDR2 timing parameters against the chosen DRAM datasheet, not against generic JEDEC defaults.
Compliance Information
RoHS and lead-free confirmed via Microchip product page; halogen-free status not explicitly stated in verified data. The V-temp grade is industrial, not AEC-Q100 automotive qualified - choose a Q-grade variant for under-hood automotive designs.