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NXP Semiconductors

S912XDG128F2MAL - 16-bit 80MHz 128KB MCU | NXP | Automotive

MPN: S912XDG128F2MAL ✗ End of Life
In Stock Ships in 1-3 business days
2.5 V / 5 V Vdss 112-LQFP (20x20 mm) Package 80 MHz Speed 128 KB (128K x 8) Flash Memory
From $7.95 USD / Unit
MOQ: 1 |
Price updated: 2026-10-18
Volume Pricing
Qty Unit Price Extended
1 $12.5 $12.50
10 $11.25 $112.50
100 $9.8 $980.00
500 $8.75 $4,375.00
1,000 $7.95 $7,950.00
ℹ️ All prices are in USD

S912XDG128F2MAL Overview

The NXP Semiconductors S912XDG128F2MAL is a 16-bit HCS12X automotive microcontroller with a 128KB (128K x 8) Flash, 12KB RAM, 80MHz bus performance, and 91 general-purpose I/O lines, housed in a 112-pin LQFP (20x20 mm) surface-mount package.

A microcontroller unit (MCU) is a single integrated circuit that combines a processor core, program memory (Flash), data memory (RAM), and peripherals such as timers, serial interfaces, and ADCs into one chip. Within the powertrain and body-electronics hierarchy, the MCU sits at the center of the electronic control unit (ECU), orchestrating sensors, actuators, and communication buses. The HCS12X family extends NXP's (formerly Freescale Semiconductor) widely adopted HCS12 architecture with an enhanced instruction set and a co-processor (XGATE) concept for concurrent I/O processing.

Key features of the S912XDG128F2MAL include the 16-bit HCS12X CISC CPU that is upward compatible with the HCS12 instruction set, identical interrupt stacking and programmer's model, an instruction queue, enhanced indexed addressing, and an enhanced instruction set. Automotive qualification (AEC-Q100), a -40 to +125 degC operating range, and a 2.5V/5V supply regime make it suitable for harsh vehicle environments.

Architecturally, the device belongs to the S12X DG sub-family, pairing 128KB of on-chip Flash with 12KB of RAM. The enhanced core executes from a queue that smooths bus bandwidth, while upward HCS12 compatibility allows existing code bases to migrate with minimal changes - an important benefit for long-lifecycle automotive platforms.

Typical applications include automotive body control modules, gateway nodes, instrument clusters, HVAC controllers, and industrial control systems that require a proven 16-bit core with Flash-based reprogrammability and robust EMC behavior.

When designing with this part, plan for Flash programming voltage and oscillator configuration early, and verify errata against your mask-set, since the device is now marked End of Life by NXP.

This page synthesizes distributor pricing tiers, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.

Drop-in alternatives for S912XDG128F2MAL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with S912XDG128F2MAL (same form factor and footprint) — differing in Supply Voltage, Package, Core Processor, Operating Temperature, Qualification.

NXP Semiconductors
Supply Voltage: 2.5V / 5V
Core Processor: HCS12
Compare with S912XDG128F2MAL →
NXP Semiconductors
Supply Voltage: 2.35 V to 2.75 V (core); 5 V I/O per distributor data
Package: 80-QFP (14x14 mm), LQFP-80
Core Processor: HCS12 (16-bit CISC)
Compare with S912XDG128F2MAL →
NXP Semiconductors
Package: 144-pin LQFP (20x20 mm)
Operating Temperature: -40C to +85C
Compare with S912XDG128F2MAL →
NXP Semiconductors
Supply Voltage: 5 V (typical automotive)
Package: 112-LQFP (20x20 mm)
Compare with S912XDG128F2MAL →
NXP Semiconductors
Supply Voltage: 1.8V (per distributor listing)
Package: 144-LQFP (20x20 mm), gull-wing, LFQFP square
Operating Temperature: -40C to +125C
Compare with S912XDG128F2MAL →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

S912XET512BMAGR

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 112-LQFP
HCS12X (S12X), 16-bit · XGATE RISC co-processor · 50 MHz · 512KB (512K x 8) · Hardware-emulated EEPROM, flexible programmable · 12-bit · 3 us

✓ In Stock

$6.6 / Unit

View Datasheet →

S912XDG128F1MAL

✅ Drop-In ⚠️ Specs Unverified
📦 112-LQFP
same DG128 sub-family, lower speed grade (40 MHz vs 80 MHz, -50%), pin-to-pin compatible

📋 Reference alternative (not in catalog)

MC9S12XDT256CAG

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 112-LQFP
HCS12X (16-bit CISC with XGATE co-processor) · 256 KB Flash · 16 KB · 4 KB · 80 MHz · 2.35 V to 2.75 V · 4.5 V to 5.5 V · 119

✓ In Stock

$17.4 / Unit

View Datasheet →

MC9S12DG128MPV

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 112-LQFP
HCS12 · 16-Bit · CISC · 25 MHz · 128KB (128K x 8) · FLASH · 8K x 8 · 2K x 8

✓ In Stock

Contact for price

View Datasheet →

MC9S12DG128VFUE

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 112-LQFP
HCS12 (16-bit CISC) · 16-bit · 25 MHz · 128KB (128K x 8) · FLASH · 8K x 8 · 2K x 8 · CANbus, I2C, SCI, SPI

✓ In Stock

Contact for price

View Datasheet →

S912XDG128F2MAL Maximum Ratings & Electrical Characteristics

Core Processor HCS12X (16-bit CISC)
Core Size 16-bit
Speed 80 MHz
Program Memory Size 128 KB (128K x 8) Flash
RAM Size 12K x 8
Number of I/O 91
Supply Voltage 2.5 V / 5 V
Package / Case 112-LQFP (20x20 mm)
Mounting Type Surface Mount
Terminal Form Gull Wing
Operating Temperature -40 degC to +125 degC
Industry Application Automotive
Qualification AEC-Q100
Architecture Compatibility Upward compatible with HCS12 instruction set
Packaging Tray

S912XDG128F2MAL 112-lqfp (20x20 mm) Pin Configuration Guide

Pin configuration for S912XDG128F2MAL (112-lqfp (20x20 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

112-lqfp (20x20 mm) package pinout diagram for S912XDG128F2MAL

No detailed pinout data available for S912XDG128F2MAL.

Refer to the datasheet for full pin configuration.

Typical Applications

S912XDG128F2MAL is suitable for 6 applications: Automotive Body Control Module, Vehicle Gateway Node, Instrument Cluster, HVAC Controller, Industrial Control Systems, Powertrain Auxiliary ECUs.

🚗

Automotive Body Control Module

The S912XDG128F2MAL fits body control modules (BCM) because its 16-bit HCS12X core at 80 MHz with 91 I/O lines can directly drive relays, lamps, door locks, and wiper motors while monitoring switch matrices and diagnostic feedback. AEC-Q100 qualification and the -40 to +125 degC range cover under-dash and engine-bay-adjacent environments. The 128KB Flash accommodates full BCM firmware including LIN/CAN stacks and fault diagnostics, and the HCS12-upward instruction set lets OEMs reuse validated driver layers. Placed on the vehicle CAN backbone, the MCU balances deterministic polling of load switches with communication handling, and Flash-based reprogrammability supports end-of-line configuration without changing hardware.

🌐

Vehicle Gateway Node

As a gateway, the S912XDG128F2MAL bridges multiple in-vehicle network segments using its on-chip CAN and serial peripherals, while the enhanced HCS12X instruction queue sustains message routing at 80 MHz. The 91 I/O lines handle wake-up inputs and mode control, and the 12KB RAM buffers message queues for multi-bus traffic. Automotive AEC-Q100 qualification and the 2.5V/5V supply architecture integrate cleanly with 5V transceivers. Because gateway firmware grows over vehicle programs, the EOL status of this DG128 part should prompt last-time-buy planning or a footprint-compatible S12X upgrade such as the 512KB XET variant, preserving the same 112-LQFP PCB and CAN transceiver topology.

📺

Instrument Cluster

In instrument clusters, the S912XDG128F2MAL drives stepper-motor gauges, warning lamps, and LCD segments while multiplexing button inputs and processing speed/fuel signals through its ADC and timer peripherals. The 80 MHz HCS12X core provides headroom for odometer accounting, display refresh, and CAN communication of vehicle parameters, and the 128KB Flash retains calibration and immobilization data. The -40 to +125 degC automotive range and gull-wing 112-LQFP assembly suit dashboard environments with high vibration. Its HCS12-compatible programming model allows long-running cluster platforms to carry forward validated display drivers and network stacks when migrating between S12X memory variants on the same footprint.

🧩

HVAC Controller

The S912XDG128F2MAL suits automotive HVAC controllers by combining enough I/O (91 lines) for blower stages, flap-position feedback, and button panels with ADC inputs for temperature sensors. Its 80 MHz core executes PID control loops for blower regulation alongside LIN/CAN communication with the BCM, and 12KB RAM comfortably holds state machines and fault logs. AEC-Q100 qualification addresses cabin-bay temperature swings, and Flash reprogrammability supports variant calibration (single/dual-zone) on one PCB. Designers should budget the 5V rail for sensor excitation and verify oscillator accuracy for CAN timing; the EOL designation makes footprint-compatible S12X alternatives a prudent second-source strategy for long-running HVAC platforms.

🏭

Industrial Control Systems

Beyond vehicles, the S912XDG128F2MAL serves industrial control applications - pump sequencers, gate controllers, and process I/O nodes - where a proven 16-bit CISC core, 5V noise immunity, and 91 I/O lines reduce external logic. The 80 MHz HCS12X core handles control loops and Modbus/CAN-style serial protocols within 128KB Flash, and the wide -40 to +125 degC range tolerates unconditioned cabinets. Gull-wing 112-LQFP assembly supports standard reflow processes. Upward HCS12 compatibility is especially valuable in industrial retrofit programs that carried HCS12 code bases for decades; those programs should now map their firmware onto remaining S12X family stock or the higher-memory XET/XDT variants sharing the same footprint.

⚡

Powertrain Auxiliary ECUs

Auxiliary powertrain ECUs - throttle-adjacent controllers, fuel-pump modules, and cooling-fan controllers - benefit from the S912XDG128F2MAL's deterministic 16-bit core, timer-heavy peripheral set, and 91 I/O for driving FET pre-drivers and reading position sensors. AEC-Q100 qualification and +125 degC operation fit engine-compartment mounting positions, while the 2.5V/5V dual supply supports precision analog front ends. The 80 MHz bus and instruction queue keep ISR latency low for time-critical crank-synced tasks, and 128KB Flash holds the full control and diagnostic firmware. Given NXP's End-of-Life declaration, powertrain teams should secure last-time-buy inventory or qualify the pin-compatible S912XET512BMAGR with firmware regression testing.

What is the S912XDG128F2MAL microcontroller?
The S912XDG128F2MAL is an NXP (formerly Freescale) 16-bit HCS12X automotive microcontroller running at up to 80 MHz with 128KB Flash, 12KB RAM, and 91 I/O lines. It is supplied in a 112-pin LQFP (20x20 mm) package, is AEC-Q100 automotive qualified, and operates from -40 to +125 degC. According to the NXP product page, the part is now designated End of Life, so new designs should evaluate second-source or successor options.
Is the S912XDG128F2MAL still in production?
No. According to the official NXP product page, the S912XDG128F2MAL is marked End of Life (EOL). Remaining stock is available through authorized distributors such as DigiKey and Mouser, and through authorized aftermarket sources like Rochester Electronics. For production continuity, engineers should secure last-time-buy quantities or qualify a drop-in alternative from the same S12X family, since pin-compatible family members share the 112-LQFP footprint.
What is the price of S912XDG128F2MAL?
Indicative unit pricing for the S912XDG128F2MAL starts at approximately $12.50 for quantity 1, stepping down to roughly $11.25 at 10 pieces, $9.80 at 100 pieces, and $7.95 at 1000 pieces (pricing as of 2026-10-18, indicative of distributor levels). Because the part is EOL, availability is fragmented and prices vary by stock holder; request a formal quote for current pricing and lead time.
Where can I buy S912XDG128F2MAL online?
You can buy the S912XDG128F2MAL from DigiKey (listed under NXP USA Inc. and Rochester Electronics / Freescale Semiconductor), Mouser (listed under NXP Semiconductors), and aftermarket stocking distributors such as ExcessChip. Since NXP has declared the part End of Life, check multiple distributors for remaining stock and confirm date codes and traceability, especially for automotive projects requiring full production-traceable parts.
What is the difference between S912XDG128F2MAL and MC9S12XDT256CAG?
The main difference is program memory: the S912XDG128F2MAL has 128KB Flash with 12KB RAM, while the MC9S12XDT256CAG belongs to the S12XD-T family with 256KB Flash. Both use 16-bit HCS12X cores and come in 112-pin LQFP packages with automotive-grade temperature ranges, making the XDT256 a candidate when more code space is needed in the same footprint, subject to a pin-compatibility review against your board.
What is the best drop-in replacement for S912XDG128F2MAL?
The closest drop-in options are same-family S12X devices in the 112-LQFP package, such as the S912XET512BMAGR (512KB Flash) for designs needing more memory, or the S912XDG128F1MAL, a speed-variant of the same DG128 sub-family. All share the HCS12X core architecture and HCS12-upward-compatible instruction set. Verify pinout, peripheral set, and oscillator configuration against the datasheet before qualifying any replacement on an existing PCB.
Can S912XET512BMAGR replace S912XDG128F2MAL?
The S912XET512BMAGR can often replace the S912XDG128F2MAL when more Flash is acceptable: it offers 512KB Flash versus 128KB, both use the 16-bit HCS12X core in 112-pin LQFP packages. However, drop-in suitability depends on peripheral-set equivalence (EG vs DG sub-family peripheral mapping) and your PCB land pattern, so confirm pin assignments in both datasheets and run firmware validation before switching.
What are the key specifications of S912XDG128F2MAL that engineers should know?
Key facts: 16-bit HCS12X CISC core at 80 MHz; 128KB Flash and 12KB RAM; 91 I/O lines; 2.5V/5V supply regime; 112-pin LQFP (20x20 mm) gull-wing package; AEC-Q100 automotive qualified; -40 to +125 degC operation; tray packaging; instruction set upward compatible with HCS12 with instruction queue and enhanced indexed addressing. Per NXP, the part is End of Life, so lifecycle planning is a mandatory design input.
Where can I download the S912XDG128F2MAL datasheet PDF?
The S912XDG128F2MAL datasheet PDF is available from the official NXP product page at nxp.com/part/S912XDG128F2MAL, and mirrored on aggregator sites such as datasheets.com (file size approximately 7771KB). Always prefer the NXP official download to ensure you have the latest revision, including errata and the device user guide covering the S12X DG sub-family register map and electrical characteristics.
Is the S912XDG128F2MAL AEC-Q100 qualified for automotive use?
Yes. Distributor and manufacturer data consistently list the S912XDG128F2MAL as an automotive-qualified MCU with AEC-Q100 compliance and a -40 to +125 degC temperature range (Grade 1-type range). This qualification, combined with the 2.5V/5V supply architecture and the proven HCS12X core, is why the device was widely adopted in body electronics, gateway, and powertrain-adjacent ECU designs.
How many I/O pins does the S912XDG128F2MAL have?
The S912XDG128F2MAL provides 91 general-purpose I/O lines out of its 112-pin LQFP package. The remaining pins are allocated to power supply (2.5V and 5V domains), ground, oscillator, reset, background debug, and programming signals. Pin multiplexing maps peripherals such as SCI, SPI, CAN, timers, and ADC inputs onto the 91 I/O; consult the S12X DG sub-family datasheet for the exact port-to-pin mapping table.
What is a good cross-brand equivalent for S912XDG128F2MAL?
A commonly compared cross-brand candidate is the Fujitsu/Spansion MB90F931PMC-GE1, a 16-bit automotive Flash MCU that appears in published part comparisons; however, it does not share the 112-pin LQFP pinout, so it is a functional alternative, not a drop-in replacement. For true drop-in compatibility within the same footprint, stay within the NXP/Freescale S12X family, where the HCS12X instruction set and peripheral architecture are preserved.
When should I choose S912XDG128F2MAL over S912XET512BMAGR?
Choose the S912XDG128F2MAL when your firmware fits in 128KB Flash and 12KB RAM and you want the lowest cost and smallest die of the pair; it was the standard choice for compact body and gateway nodes. Choose the S912XET512BMAGR when you need up to 512KB Flash for larger application stacks, more lookup tables, or OTA headroom. Both share the HCS12X core and automotive qualification; verify package footprint before swapping.
Is the S912XDG128F2MAL the same as MC9S12DG128MPV?
No. The S912XDG128F2MAL is an S12X (X-gate-enhanced) 80 MHz device, while the MC9S12DG128MPV is an earlier S12DG128 device from the non-X HCS12 family with a lower bus speed. Although both offer 128KB Flash and come in 112-lead QFP-style packages, the peripheral sets, instruction extensions, and pin functions differ, so they are not drop-in interchangeable without board and firmware re-qualification.
What can replace S912XDG128F2MAL after EOL?
Replacement options are: (1) same-family NXP S12X parts in 112-LQFP such as S912XET512BMAGR or MC9S12XDT256CAG with more Flash; (2) authorized-aftermarket production of the identical part, e.g. Rochester Electronics listings on DigiKey; (3) excess/new-old-stock from brokers like ExcessChip with appropriate incoming inspection. For new PCBs, NXP automotive successors should also be evaluated. Always re-verify pinout and firmware compatibility before qualifying a replacement.

Engineering reference data for S912XDG128F2MAL — comparison, design guidance, and compliance information.

Selection Guide

Choose the S912XDG128F2MAL when you are sustaining an existing HCS12X-based automotive design with 128KB-class firmware and want the lowest-cost, pin-proven 112-LQFP member of the S12X DG family - but note its End-of-Life status, so plan a last-time-buy or aftermarket sourcing via Rochester Electronics listings. Choose the S912XET512BMAGR when firmware needs more than 128KB or OTA headroom matters; it shares the HCS12X architecture and 112-pin class footprint. Choose the MC9S12XDT256CAG for a mid-step 256KB in the same package. Avoid the legacy MC9S12DG128MPV for new designs: despite the same Flash size and similar package, it lacks the X-core enhancements and lower speed makes it only a parametric, not functional, substitute. Cross-brand 16-bit automotive MCUs (e.g., Fujitsu MB90F) require complete hardware and software requalification and are functional alternatives only.

Comparison with Alternatives

Parameter This Product S912XET512BMAGR MC9S12XDT256CAG MC9S12DG128MPV
Package 112-LQFP (20x20 mm) 112-LQFP - same 112-LQFP - same 112-LQFP - same
Brand NXP Semiconductors (originally Freescale) NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core 16-bit HCS12X CISC 16-bit HCS12X CISC 16-bit HCS12X CISC 16-bit HCS12 (non-X)
Speed 80 MHz 80 MHz 80 MHz Lower speed grade
Flash Memory 128 KB 512 KB 256 KB 128 KB
Automotive Qualification AEC-Q100, -40 to +125 degC Automotive qualified Automotive qualified Automotive qualified

Key Differentiators

  • Enhanced S12X core with HCS12 code compatibility (vs MC9S12DG128MPV)
  • Memory scalability in the same footprint (vs S912XET512BMAGR)
  • Automotive qualification breadth (vs MB90F931PMC-GE1 (Fujitsu/Spansion))

Design Notes

NXP marks the S912XDG128F2MAL as End of Life. Before committing the part to new or continuing builds, verify mask-set errata against your firmware, confirm date codes on incoming stock, and execute a last-time-buy sized to your remaining production horizon. If a redesign is required, prefer footprint-compatible S12X family members in 112-LQFP so the PCB land pattern and most driver code carry forward unchanged.

The device operates from a 2.5V/5V supply regime: decouple both domains with 100 nF ceramic capacitors at each supply pin pair plus one bulk capacitor per rail. Ensure the 5V rail tolerates load-dump-adjacent transients through upstream protection (TVS + series element) in automotive applications, and verify brown-out/reset behavior at the minimum operating voltage before releasing the design.

The 112-LQFP (20x20 mm) package with 91 I/O requires careful breakout: use at least a 4-layer PCB with a solid ground plane, keep CAN and oscillator traces short and away from switching loads, and fan out the gull-wing leads with 0.5 mm pitch routing rules. Place the crystal and its load capacitors close to the OSC pins and guard them with ground pour to limit jitter and EMC emissions.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Qualified
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Data confirms automotive qualification (AEC-Q100) and -40/+125 degC range. RoHS/REACH/lead-free status per the verified data was not stated for this MPN and is marked unknown; confirm on the NXP product page's Environmental Quality section.

Data verified on: 2026-10-18 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

NXP Semiconductors Freescale Semiconductor S912XDG128F2MAL S912XET512BMAGR MC9S12XDT256CAG MC9S12DG128MPV HCS12X S12X DG sub-family 16-bit CISC microcontroller microcontroller (MCU) AEC-Q100 112-LQFP QFP package family surface mount CAN bus body control module automotive ECU instrument cluster Flash memory instruction queue
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