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NXP Semiconductors

S912XDT256F1CAL - 16-bit S12X MCU 256KB 80MHz | NXP

MPN: S912XDT256F1CAL ✗ End of Life
In Stock Ships in 1-3 business days
2.5 V / 5 V Vdss 112-LQFP (20x20 mm) Package 80 MHz Speed 256KB (256K x 8) Flash Memory
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Price updated: 2026-10-18
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S912XDT256F1CAL Overview

The NXP S912XDT256F1CAL is a 16-bit automotive-qualified HCS12X (S12X core) microcontroller delivering 80 MHz bus performance, 256KB of on-chip Flash memory, and integrated XGATE co-processor functionality in a 112-pin LQFP (20x20 mm) surface-mount package, rated for -40C to +85C operation.

A 16-bit microcontroller is a single-chip computing device whose CPU processes 16-bit-wide instructions and data, sitting between entry-level 8-bit MCUs and 32-bit MCUs in the embedded hierarchy. The HCS12X family from NXP (originally Freescale Semiconductor) is an upward-compatible evolution of the widely adopted HCS12 architecture, retaining the same interrupt stacking and programmer model while adding an instruction queue, enhanced indexed addressing, and an expanded instruction set.

Key features of the S912XDT256F1CAL include the 16-bit S12X CISC CPU operating at 80 MHz, 256KB (256K x 8) of Flash program memory, automotive-grade qualification, and industrial temperature coverage to +85C. The device is pin-compatible within the S12XD family, allowing Flash-size migration between variants on the same PCB. Peripherals in the S12XD family (such as CAN, SCI, SPI, and PWM modules) support typical automotive and industrial networking workloads.

The S12X core uses a CISC architecture with an instruction queue that improves bus utilization, and the enhanced indexed addressing modes reduce code size in control loops. The XGATE peripheral co-processor available on S12XD devices offloads interrupt servicing and communication handling from the main CPU, effectively boosting real-time throughput without raising core frequency.

Typical applications include automotive body control modules, gateway nodes, HVAC controllers, and industrial automation systems where a proven, qualified 16-bit platform with CAN connectivity is required. The -40C to +85C industrial range suits under-hood adjacent and factory-floor environments.

Design consideration: this part is marked End of Life by NXP, so new designs should plan a migration path to the S12XE/S12XS families or NXP 32-bit parts, while existing designs can secure last-time-buy stock.

This page synthesizes distributor availability data, drop-in family alternatives, lifecycle status, and practical design notes not found in a single manufacturer source.

Drop-in alternatives for S912XDT256F1CAL — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with S912XDT256F1CAL (same form factor and footprint) — differing in Operating Temperature, Package, Core Processor, EEPROM, Flash Memory.

NXP Semiconductors
Package: 144-pin LQFP (20x20 mm)
EEPROM: 4 KB
Compare with S912XDT256F1CAL →
NXP Semiconductors
Operating Temperature: -40C to +125C (TA)
Package: 80-QFP (14x14 mm), Square, Gull Wing
Core Processor: HCS12X
Compare with S912XDT256F1CAL →
NXP Semiconductors
Operating Temperature: -40C to +85C (TA)
Package: 144-LQFP (20x20 mm)
Core Processor: HCS12X (16-bit CISC)
Compare with S912XDT256F1CAL →
NXP Semiconductors
Operating Temperature: -40 C to +125 C
Package: 112-LQFP (20 x 20 mm)
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NXP Semiconductors
Operating Temperature: -40C to +105C
Package: 144-LQFP (20x20 mm)
Core Processor: HCS12X (S12X)
Compare with S912XDT256F1CAL →
NXP Semiconductors
Operating Temperature: -40C to +125C
Package: 144-LQFP (20x20 mm), gull-wing, LFQFP square
EEPROM: Hardware-emulated EEPROM, flexible programmable
Compare with S912XDT256F1CAL →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

S912XET256J2VAG

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X (S12X) · 16-Bit · 50 MHz · 256KB (256K x 8) · 16KB · XGATE · Hardware-emulated, flexible programmable · MPU with supervisor/user modes

✓ In Stock

Contact for price

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MC9S12XDT256CAG

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X (16-bit CISC with XGATE co-processor) · 256 KB Flash · 16 KB · 4 KB · 80 MHz · 2.35 V to 2.75 V · 4.5 V to 5.5 V · 119

✓ In Stock

$17.4 / Unit

View Datasheet →

MC9S12XDT512MAA

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X · 16-Bit · 80 MHz · 512KB (512K x 8) · FLASH · 20KB · 4KB · CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI

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Contact for price

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S912XDP512J1MAL

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
Microcontroller (MCU) · HCS12X (S12X) · 16-bit CISC · 512 KB Flash · 80 MHz · 2.5 V / 5 V

✓ In Stock

$18.5 / Unit

View Datasheet →

S912XET512BMAGR

✅ Drop-In
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X (S12X), 16-bit · XGATE RISC co-processor · 50 MHz · 512KB (512K x 8) · Hardware-emulated EEPROM, flexible programmable · 12-bit · 3 us

✓ In Stock

$6.6 / Unit

View Datasheet →

MC9S12XEQ384CAG

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 112-LQFP (20x20)
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ In Stock

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S912XDT256F1CAL Maximum Ratings & Electrical Characteristics

Core Processor HCS12X (S12X core), 16-bit
Core Size 16-bit
Speed 80 MHz
Program Memory 256KB (256K x 8) Flash
Supply Voltage 2.5 V / 5 V
Operating Temperature -40C to +85C
Package 112-LQFP (20x20 mm)
Mounting Type Surface Mount
Terminal Form Gull Wing
Number of Terminals 112
Package Shape Square (LQFP)
Qualification Automotive Qualified
Architecture CISC, upward compatible with HCS12
Peripherals Enhanced indexed addressing, instruction queue, enhanced instruction set
RoHS Status unknown
Lifecycle Status End of Life (per NXP product page)

S912XDT256F1CAL square (lqfp) Pin Configuration Guide

Pin configuration for S912XDT256F1CAL (square (lqfp) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

square (lqfp) package pinout diagram for S912XDT256F1CAL

No detailed pinout data available for S912XDT256F1CAL.

Refer to the datasheet for full pin configuration.

Typical Applications

S912XDT256F1CAL is suitable for 6 applications: Automotive Body Control Modules, Automotive Gateway Nodes, HVAC Control Units, Industrial Automation and Factory Control, EOL Sustainment and Obsolescence Management, Telematics and Fleet Tracking Units.

🚗

Automotive Body Control Modules

Body control modules (BCMs) coordinate lighting, door locks, wipers, and seat functions over CAN and LIN networks, a workload the S912XDT256F1CAL was explicitly qualified for. Its automotive qualification and -40C to +85C range cover the environmental envelope of in-cabin and near-engine-bay electronics, while the 80 MHz S12X core provides ample headroom for network stacking and scheduling. The XGATE co-processor architecture of the S12XD family offloads CAN frame handling from the main CPU, keeping interrupt latency predictable. Placed as the central node with the MSCAN modules wired to the vehicle bus and PWM outputs driving lamp loads, the 256KB Flash accommodates a full BCM application. Because the part is End of Life, BCM programs should secure last-time-buy inventory or plan S12XE migration.

🌐

Automotive Gateway Nodes

Gateway modules translate and route messages between CAN, LIN, and diagnostic networks in a vehicle. The S912XDT256F1CAL fits this role because its S12X core at 80 MHz can sustain message filtering and forwarding while the enhanced indexed addressing modes shrink routing-table code. The 256KB Flash holds protocol stacks plus diagnostics, and the 112-LQFP 20x20 mm package provides enough I/O for multi-bus wiring without a large PCB footprint. Automotive qualification and the industrial -40C to +85C range satisfy gateway mounting locations near the cabin bulkhead. Designers should confirm the exact number of MSCAN channels in the S12XD data sheet before fixing the bus topology. Given EOL status, new gateway programs should evaluate the S12XE family as the qualified successor with the same software ecosystem.

🧩

HVAC Control Units

Automotive and industrial HVAC controllers blend sensor acquisition (temperature, pressure), PWM-driven blower motors and damper actuators, and network communication. The S912XDT256F1CAL addresses this mix directly: 80 MHz execution handles control-loop math, PWM peripherals drive motor and damper outputs, and CAN/LIN support integrates the unit into the vehicle network. The 256KB Flash is sufficient for PID control, actuator diagnostics, and network stacks, and the -40C to +85C rating covers under-dash thermal environments. Implementation typically uses the MCU's ADC channels to sample NTC sensors and timer modules to generate synchronized PWM outputs; verifying the ADC channel count in the S12XD data sheet is recommended. As the part is EOL, HVAC programs should either stock spare inventory or port to the S12XE family with minimal code change.

🏭

Industrial Automation and Factory Control

Industrial control nodes such as PLC peripheral cards, motor-control panels, and sensor hubs benefit from the S912XDT256F1CAL's deterministic 16-bit CISC core, 80 MHz bus speed, and rich timer infrastructure. The -40C to +85C industrial rating and the rugged HCS12X architecture - proven across two decades of deployed systems - make it reliable in electrically noisy factory environments. The 256KB Flash accommodates ladder-logic interpreters or dedicated control firmware, while CAN connectivity links the node to plant networks. Systems engineers typically pair the MCU with isolated CAN transceivers and solid-state relay drivers at the I/O boundary. Because NXP has discontinued the part, industrial equipment makers should assess broker stock for service spares and design the next hardware revision around the active S12XE or SPC5 families.

🔧

EOL Sustainment and Obsolescence Management

A distinctive use case for the S912XDT256F1CAL is lifecycle sustainment of existing vehicle and industrial platforms that already use the S12XD family. Procurement teams use this MPN when executing last-time-buys, validating broker stock against date codes, and qualifying pin-compatible family variants (256KB/384KB/512KB options in matching 112-LQFP footprints) as authorized substitutions. The S12XD family's upward HCS12 compatibility means firmware written for the original part runs unmodified on same-family higher-memory variants, enabling a zero-software-change mitigation for Flash-constrained field failures. Any substitute must be verified pin-to-pin against the 112-pin LQFP footprint using the S12XD data sheet before release. This page's alternatives table is structured specifically to support that engineering change-order workflow.

✈️

Telematics and Fleet Tracking Units

Aftermarket and embedded telematics boxes combine MCU control with cellular or GNSS modems, and the S912XDT256F1CAL serves as the local controller handling sensor polling, geofence logic, power management, and modem supervision over SCI/SPI links. The 80 MHz S12X core delivers enough throughput for message framing and watchdog supervision, while 256KB Flash stores application logic and buffering. The 112-LQFP 20x20 mm package keeps the telematics PCB compact for DIN-rail or behind-dash mounting, and the -40C to +85C range covers windshield and engine-bay-adjacent placements. Designers should implement the modem interface on SCI with hardware flow control and verify peripheral counts in the S12XD data sheet. For new telematics designs, the active S12XE family is the recommended drop-in architectural successor.

What is the NXP S912XDT256F1CAL microcontroller?
The S912XDT256F1CAL is a 16-bit HCS12X microcontroller from NXP Semiconductors with an S12X core running at 80 MHz, 256KB (256K x 8) of Flash program memory, automotive qualification, and a -40C to +85C operating range. According to the NXP product page, it is housed in a 112-pin LQFP (20x20 mm) package and is currently listed as End of Life.
What is the price of S912XDT256F1CAL?
Pricing for the S912XDT256F1CAL is quote-based because the part is End of Life and stock is distributed through surplus and broker channels rather than standard catalog pricing. Distributor price breaks cannot be verified as of 2026-10-18 from the provided data. Contact authorized distributors such as TrustedParts-listed brokers or XAIPART sales for a current quotation tied to stock on hand.
Where can I buy S912XDT256F1CAL online?
The S912XDT256F1CAL can be purchased through broker and excess-inventory channels listed on TrustedParts, Xecor, Hotenda, IC-Components, and Veswin, several of which advertise stock as of 2026-10-18. Because NXP has placed this part on End of Life status, new-standard stock is limited; verify date codes, authenticity screening, and warranty terms with the seller before ordering, since EOL automotive MCUs are a common counterfeit target.
Is S912XDT256F1CAL in stock and what is the lead time?
Multiple distributors including Hotenda, Y-IC, and brokers on TrustedParts advertise S912XDT256F1CAL in stock as of 2026-10-18, with some offering same-day shipment. However, lead time is not guaranteed for EOL parts - advertised stock may deplete without replenishment because NXP no longer manufactures it. Request written confirmation of available quantity and lead time at order placement.
Is S912XDT256F1CAL still being manufactured?
No. According to the official NXP product page, the S912XDT256F1CAL is marked End of Life. Lifecycle risk for the part is rated low-to-medium by supply-chain trackers, but the manufacturer has ceased production, so designs using it should implement a last-time-buy strategy or plan migration to S12XE/S12XS successors or NXP 32-bit automotive MCUs such as the SPC5 family.
What is the difference between S912XDT256F1CAL and S912XET256W1MAA?
Both are 16-bit S12X-core NXP microcontrollers with 256KB Flash, but they belong to different family branches: the S912XDT256F1CAL is an S12XD-family part in a 112-pin LQFP (F1 package code, 20x20 mm), while the S912XET256W1MAA is an S12XE-family part in a different package suffix (MAA). The S12XE family is the newer, active evolution of the same core, making it the recommended migration target from the EOL S12XD part.
What is the difference between S912XDT256F1CAL and S912XDP512J1MAL?
The main difference is program memory size: the S912XDT256F1CAL provides 256KB of Flash while the S912XDP512J1MAL provides 512KB of Flash on the same S12XD architecture. Both are 80 MHz S12X parts from NXP/Freescale in 112-pin square LQFP-style packages (package codes F1 vs J1 should be verified against the S12XD datasheet), which keeps migration between them largely a code-size decision rather than a hardware redesign.
When should I choose the S912XDT256F1CAL over its family alternatives?
Choose the S912XDT256F1CAL when you need the smallest Flash footprint (256KB) within the S12XD family on the 112-pin LQFP footprint for an existing, cost-optimized design, or for repair/spares of fielded automotive modules. Choose higher-memory variants such as the 512KB S912XDP512 when code or data growth is expected. For all new designs, prefer the active S12XE/S12XS families because the S912XDT256F1CAL is End of Life and supply is broker-sourced only.
Is S912XDT256F1CAL suitable for automotive applications?
Yes. The S912XDT256F1CAL is explicitly automotive qualified according to both the NXP product page and the TrustedParts listing, with a -40C to +85C operating range and the HCS12X family's proven use in body electronics, gateways, and HVAC control. Designers should note, however, that its End of Life status makes it unsuitable for new long-lifetime automotive programs unless a last-time-buy or approved migration path is secured.
What is the best drop-in replacement for S912XDT256F1CAL?
The closest drop-in candidates are other 256KB S12XD-family members sharing the 112-pin LQFP footprint, such as the S912XDT256 variants listed in the alternatives table on this page, which are pin-to-pin compatible and differ only in ordering details or minor ratings. For a forward-compatible path, the S12XE-family S912XET256 parts match the Flash size but require package-code verification before assuming a pin-identical footprint.
Can the S912XET512BMAGR replace the S912XDT256F1CAL?
Not automatically. The S912XET512BMAGR is a 512KB S12XE-family part in a 144-pin MAPBGA (MAG) package, so it is not pin-compatible with the 112-LQFP S912XDT256F1CAL and would require PCB redesign. It is a functional upgrade path rather than a drop-in replacement - suitable when redesign effort is acceptable and the added Flash and newer family lifetime justify the change.
Where can I download the S912XDT256F1CAL datasheet PDF?
The authoritative source is the NXP product page at nxp.com/part/S912XDT256F1CAL, which links the current data sheet under its Documentation section. The historical Freescale document, titled MC9S12XDP512 Data Sheet, is a 1348-page PDF also mirrored on datasheet aggregators such as Alldatasheet and Y-IC. For design work, always use the NXP-controlled copy because archived mirrors may not reflect product change notices.
What are the key specifications of S912XDT256F1CAL that engineers should know?
The S912XDT256F1CAL is a 16-bit HCS12X (S12X core) CISC microcontroller running at 80 MHz with 256KB (256K x 8) Flash, supplied from 2.5 V and 5 V rails, in a 112-pin LQFP (20x20 mm) gull-wing surface-mount package rated -40C to +85C and automotive qualified. It is upward compatible with the HCS12 instruction set and is End of Life per NXP - all four headline parameters (core, Flash, package, qualification) should be confirmed against the 1348-page S12XD data sheet.
What can replace the S912XDT256F1CAL?
Replacement options fall into two tiers. Pin-compatible tier: other S12XD-family 112-LQFP variants with the same footprint (see the alternatives list), including higher-Flash options like the 512KB S912XDP512 family. Redesign tier: S12XE-family parts such as the S912XET256 (newer core, active lifecycle) or NXP 32-bit SPC5 series such as the SPC5644A. Because this part is EOL, cross-check package code and pinout against the S12XD datasheet before committing to any substitute.
What is the best NXP equivalent for the S912XDT256F1CAL for new designs?
For new designs, the best NXP equivalent is a member of the active S12XE or S12XS families, such as the S912XET256 with matching Flash size, because the S912XDT256F1CAL itself is End of Life. If a full architecture modernization is acceptable, the SPC56xx 32-bit automotive MCUs (e.g., SPC5644AF0MLU2) provide longer lifecycle, higher performance, and active NXP support, at the cost of porting software from the HCS12X instruction set.
Does the S912XDT256F1CAL support CAN networking?
Yes - CAN connectivity is a standard capability of the S12XD family and is the primary reason HCS12X parts are used in automotive body and gateway modules; however, the exact number of MSCAN channels on this specific variant is not stated in the summary data provided and should be confirmed in the S12XD data sheet. For system design, verify the channel count, number of SCI/SPI ports, and PWM channels in the peripheral chapter of the 1348-page manufacturer document before finalizing the communication architecture.

Engineering reference data for S912XDT256F1CAL — comparison, design guidance, and compliance information.

Selection Guide

Choose the S912XDT256F1CAL only for sustainment of existing S12XD-based automotive or industrial designs, field-repair stock, or last-time-buy programs where software compatibility is worth more than lifecycle certainty. Its 256KB Flash is the smallest S12XD option on the 112-pin LQFP, minimizing cost for fixed firmware. If you need more memory on the same platform, select the S912XDP512 family (512KB) after verifying package-code pin parity. For new hardware designs, do not start on this EOL part: choose the S12XE family (e.g., S912XET256J2VAG) for a nearly identical 16-bit software ecosystem with active lifecycle, or the SPC5 32-bit family (e.g., SPC5644AF0MLU2) for long-term automotive programs requiring modern performance and NXP security roadmap support. Always verify pinout against the S12XD data sheet before committing any footprint reuse.

Comparison with Alternatives

Parameter This Product S912XET256J2VAG MC9S12XDT256CAG S912XDP512J1MAL S912XET512BMAGR
Package 112-LQFP (20x20 mm) 112-LQFP (20x20 mm) - same 112-LQFP (20x20 mm) - same 112-pin QFP (verify code J1) 112-LQFP (verify - MAG suffix may indicate MAPBGA)
Brand NXP Semiconductors (Freescale) NXP Semiconductors NXP Semiconductors NXP Semiconductors (Freescale) NXP Semiconductors
Core / Architecture HCS12X (S12X), 16-bit CISC S12XE, 16-bit HCS12X (S12X), 16-bit CISC HCS12X (S12XD), 16-bit S12XE, 16-bit
Max Speed 80 MHz 80 MHz 80 MHz 80 MHz 80 MHz
Flash Memory 256KB 256KB 256KB 512KB 512KB
Lifecycle Status End of Life (per NXP) Active (S12XE family) Same S12XD EOL exposure EOL (S12XD family) Active (S12XE family)

Key Differentiators

  • Smallest 256KB Flash footprint in the S12XD 80 MHz family (vs MC9S12XDT512MAA)
  • Automotive qualified with industrial temperature range (vs MC9S12XDT256CAG)
  • Honest trade-off: EOL status vs S12XE successors (vs S912XET256J2VAG)

Design Notes

The S912XDT256F1CAL is End of Life per the NXP product page. Before starting any new board design, execute a last-time-buy analysis: sum lifetime field-service requirements plus yield margin, then compare against available broker stock on TrustedParts-listed distributors. EOL automotive MCUs are a frequent counterfeit target, so require certificates of conformance and, where possible, date-code traceability to Freescale/NXP original production rather than remarked parts.

The 112-LQFP (20x20 mm) gull-wing package requires a standard LQFP-112 land pattern with approximately 0.5 mm pitch. Place 100 nF ceramic decoupling capacitors at each VDD pin pair, positioned within 2-3 mm of the supply pins, plus one bulk capacitor (4.7-10 uF) near the regulator. For in-cabin automotive environments, keep the crystal and its load capacitors close to the oscillator pins and guard them with ground pour to reduce EMI susceptibility. Verify the exact power-pin map against the S12XD data sheet (1348 pages) rather than copying from smaller S12 variants.

The device operates from 2.5 V (core) and 5 V (I/O) supply domains per distributor data. When migrating between same-family variants (256KB/384KB/512KB), supply requirements are shared, but always confirm the supply sequencing and voltage-tolerance table in the S12XD data sheet for the specific ordering grade. In automotive designs, protect the 5 V rail with load-dump-rated transient suppression ahead of the local regulator, since the MCU's absolute maximum ratings do not account for vehicle transients on their own.

Compliance Information

RoHS
Unknown
REACH
Unknown
AEC-Q100
Qualified
Lead Free
Unknown
Halogen Free
Unknown
Conflict Minerals
Unknown

Listed as Automotive Qualified on the NXP product page and TrustedParts. RoHS/REACH/lead-free status was not stated in the retrieved data - check the NXP product page Environmental Quality section.

Data verified on: 2026-10-18 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors Freescale Semiconductor S912XDT256F1CAL MC9S12XDT256CAG S912XET256J2VAG S912XET512BMAGR S912XDP512J1MAL HCS12X S12X core 16-bit microcontroller embedded microcontroller CISC architecture XGATE co-processor 112-LQFP LQFP package family surface mount AEC-Q100 (automotive qualified) RoHS MSCAN CAN bus automotive body control module Flash memory -40C to +85C
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