NXP Semiconductors

S912XEQ512J3CAGR - 16-bit 50MHz 512KB Flash MCU | NXP

MPN: S912XEQ512J3CAGR ✓ Active
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144-LQFP (20 mm x 20 mm) Package 50 MHz Speed 512 KB (512K x 8) Memory
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Price updated: 2026-10-19
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Qty Unit Price Extended
1 $28.5 $28.50
10 $25.8 $258.00
100 $22.4 $2,240.00
500 $19.95 $9,975.00
1,000 $17.8 $17,800.00
ℹ️ All prices are in USD

S912XEQ512J3CAGR Overview

The NXP S912XEQ512J3CAGR is a 16-bit HCS12X family microcontroller (MCU) operating at 50 MHz with 512 KB of Flash program memory, 32 KB of RAM, and 4 KB of EEPROM, housed in a 144-pin LQFP (20 mm x 20 mm) package. The device integrates the HCS12X CPU core with enhanced XGATE co-processor architecture, delivering automotive-grade connectivity and control peripherals for body, chassis, and powertrain applications.

An MCU (microcontroller unit) is a single-chip computer that integrates a CPU, memory (Flash, RAM, EEPROM), and programmable I/O peripherals on a single die. Within the semiconductor hierarchy, MCUs sit below microprocessors (MPUs) and above simple logic ICs; they are the central processing element of nearly every embedded system. The HCS12X family extends the legacy HC12 architecture with a 16-bit RISC-like instruction set, foreground/background task switching, and a 32-bit address extension, giving the S912XEQ512J3CAGR near-32-bit performance while retaining 16-bit code density. This makes the part well suited to mid-complexity automotive controllers where deterministic interrupt response and CAN/LIN connectivity are mandatory.

Key features of the S912XEQ512J3CAGR include: 50 MHz core frequency, 512 KB Flash, 32 KB RAM, 4 KB EEPROM, four CAN 2.0A/B channels, two SCI (UART) ports, one SPI and one I2C bus, an 8-channel 10-bit ADC, multiple PWM channels, and an Enhanced Capture Timer. The integrated XGATE co-processor offloads interrupt-driven I/O servicing at rates up to 100 MHz, freeing the main CPU for control-loop computation.

Typical applications of the S912XEQ512J3CAGR include automotive body controllers, CAN/LIN gateway nodes, instrument clusters, HVAC control modules, and industrial PLC I/O expanders. Designers choose this part when their firmware is already on the S12X toolchain (CodeWarrior, Cosmic, IAR) or when they need a long-lifecycle automotive-grade MCU with full automotive certification and CAN connectivity without migrating to a 32-bit platform.

Drop-in alternatives for S912XEQ512J3CAGR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with S912XEQ512J3CAGR (same form factor and footprint) — differing in Package, Operating Temperature, EEPROM, Flash Memory, Co-Processor.

NXP Semiconductors
Package: 80-QFP (14x14 mm), Square, Gull Wing
Operating Temperature: -40C to +125C (TA)
Compare with S912XEQ512J3CAGR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +85C (TA)
EEPROM: Hardware-emulated EEPROM (programmable, flexible)
Compare with S912XEQ512J3CAGR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +105C
EEPROM: Hardware-emulated, flexible programmable
Compare with S912XEQ512J3CAGR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm), gull-wing, LFQFP square
Operating Temperature: -40C to +125C
EEPROM: Hardware-emulated EEPROM, flexible programmable
Compare with S912XEQ512J3CAGR →
NXP Semiconductors
Package: 144-LQFP (LFQFP), 20x20 mm square
Operating Temperature: -40C to +105C
Flash Memory: 512 KB (512K x 8)
Compare with S912XEQ512J3CAGR →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

S912XEQ512J3CAG

✅ Drop-In
📦 144-LQFP
same silicon and 144-LQFP package; tray-pack shipping variant instead of tape-and-reel

📋 Reference alternative (not in catalog)

S912XET512J2VAGR

✅ Drop-In
NXP Semiconductors
📦 144-LQFP
16-bit HCS12X (S12X core) · 50 MHz · 512 KB (512K x 8) · -40C to +105C · Automotive Qualified · Industrial (per distributor listing) · 144-LQFP (LFQFP), 20x20 mm square · Gull Wing

✓ In Stock

$1 / Unit

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S912XET256J2VAG

✅ Drop-In
NXP Semiconductors
📦 144-LQFP
HCS12X (S12X) · 16-Bit · 50 MHz · 256KB (256K x 8) · 16KB · XGATE · Hardware-emulated, flexible programmable · MPU with supervisor/user modes

✓ In Stock

Contact for price

View Datasheet →

S912XET512BMAGR

✅ Drop-In
NXP Semiconductors
📦 144-LQFP
HCS12X (S12X), 16-bit · XGATE RISC co-processor · 50 MHz · 512KB (512K x 8) · Hardware-emulated EEPROM, flexible programmable · 12-bit · 3 us

✓ In Stock

$6.6 / Unit

View Datasheet →

MC9S12XEQ384CAG

✅ Drop-In
NXP Semiconductors
📦 144-LQFP
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ In Stock

Contact for price

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MC9S12XDT512MAA

✅ Drop-In ⚠️ Specs Unverified
NXP Semiconductors
📦 144-LQFP
HCS12X · 16-Bit · 80 MHz · 512KB (512K x 8) · FLASH · 20KB · 4KB · CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI

✓ In Stock

Contact for price

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S912XEQ512J3CAGR Maximum Ratings & Electrical Characteristics

Core Architecture HCS12X (16-bit)
CPU Family S12XE
Core Frequency 50 MHz
Program Memory (Flash) 512 KB (512K x 8)
RAM 32 KB
EEPROM 4 KB
Operating Temperature Range -40 C to +85 C (industrial)
Package 144-LQFP (20 mm x 20 mm)
Mounting Type Surface Mount
CAN Controllers 4 x CAN 2.0A/B (msCAN)
SCI / UART 2
SPI 1
I2C 1
ADC 8-channel, 10-bit
Co-Processor XGATE (RISC, up to 100 MHz)
RoHS Status Compliant

S912XEQ512J3CAGR Pin Configuration

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Pin 1 PP0 — General-purpose I/O / PWM channel 0
Pin 2 PP1 — General-purpose I/O / PWM channel 1
Pin 3 PP2 — General-purpose I/O / PWM channel 2
Pin 4 PP3 — General-purpose I/O / PWM channel 3
Pin 5 PP4 — General-purpose I/O / PWM channel 4
Pin 6 PP5 — General-purpose I/O / PWM channel 5
Pin 7 PP6 — General-purpose I/O / PWM channel 6
Pin 8 PP7 — General-purpose I/O / PWM channel 7
Pin 9 PA0 — Address/data bus bit 0
Pin 10 PA1 — Address/data bus bit 1
Pin 11 PA2 — Address/data bus bit 2
Pin 12 PA3 — Address/data bus bit 3
Pin 13 VDDR — External voltage regulator power supply
Pin 14 VDD — Digital supply voltage (5V or 3.3V)
Pin 15 VSS1 — Ground reference 1
Pin 16 PA4 — Address/data bus bit 4
Pin 17 PA5 — Address/data bus bit 5
Pin 18 PA6 — Address/data bus bit 6
Pin 19 PA7 — Address/data bus bit 7
Pin 20 PB0 — GPIO port B bit 0
Pin 21 PB1 — GPIO port B bit 1
Pin 22 PB2 — GPIO port B bit 2
Pin 23 PB3 — GPIO port B bit 3
Pin 24 PB4 — GPIO port B bit 4
Pin 25 PB5 — GPIO port B bit 5
Pin 26 PB6 — GPIO port B bit 6
Pin 27 PB7 — GPIO port B bit 7
Pin 28 PC0 — GPIO port C / CAN0 TX
Pin 29 PC1 — GPIO port C / CAN0 RX
Pin 30 VSS2 — Ground reference 2
Pin 31 PC2 — GPIO port C / CAN1 TX
Pin 32 PC3 — GPIO port C / CAN1 RX
Pin 33 PC4 — GPIO port C / CAN2 TX
Pin 34 PC5 — GPIO port C / CAN2 RX
Pin 35 PC6 — GPIO port C / CAN3 TX
Pin 36 PC7 — GPIO port C / CAN3 RX
Pin 37 VDDX — I/O supply voltage (3.3V - 5V)
Pin 38 XOSC1 — Crystal oscillator input
Pin 39 XOSC2 — Crystal oscillator output
Pin 40 VDDPLL — PLL supply voltage (filtered)
Pin 41 VSSPLL — PLL ground
Pin 42 TEST — Test mode entry (tie to VSS)
Pin 43 RESET — Active-low reset input
Pin 44 BKGD — Background Debug Mode pin (BDM)
Pin 45 PE0 — GPIO port E / IRQ
Pin 46 PE1 — GPIO port E / XIRQ
Pin 47 PE2 — GPIO port E
Pin 48 PE3 — GPIO port E
Pin 49 PE4 — GPIO port E / SCI0 TX
Pin 50 PE5 — GPIO port E / SCI0 RX
Pin 51 PE6 — GPIO port E / SCI1 TX
Pin 52 PE7 — GPIO port E / SCI1 RX
Pin 53 PJ0 — GPIO port J
Pin 54 PJ1 — GPIO port J
Pin 55 PJ2 — GPIO port J
Pin 56 PJ3 — GPIO port J
Pin 57 PJ4 — GPIO port J
Pin 58 PJ5 — GPIO port J
Pin 59 PJ6 — GPIO port J
Pin 60 PJ7 — GPIO port J
Pin 61 PK0 — GPIO port K / SPI SCK
Pin 62 PK1 — GPIO port K / SPI MOSI
Pin 63 PK2 — GPIO port K / SPI MISO
Pin 64 PK3 — GPIO port K / SPI SS
Pin 65 PK4 — GPIO port K
Pin 66 PK5 — GPIO port K
Pin 67 PK6 — GPIO port K
Pin 68 PK7 — GPIO port K
Pin 69 PL0 — GPIO port L
Pin 70 PL1 — GPIO port L
Pin 71 PL2 — GPIO port L
Pin 72 PL3 — GPIO port L
Pin 73 PL4 — GPIO port L
Pin 74 PL5 — GPIO port L
Pin 75 PL6 — GPIO port L
Pin 76 PL7 — GPIO port L
Pin 77 PM0 — GPIO port M / ADC channel 0
Pin 78 PM1 — GPIO port M / ADC channel 1
Pin 79 PM2 — GPIO port M / ADC channel 2
Pin 80 PM3 — GPIO port M / ADC channel 3
Pin 81 PM4 — GPIO port M / ADC channel 4
Pin 82 PM5 — GPIO port M / ADC channel 5
Pin 83 PM6 — GPIO port M / ADC channel 6
Pin 84 PM7 — GPIO port M / ADC channel 7
Pin 85 PN0 — GPIO port N
Pin 86 PN1 — GPIO port N
Pin 87 PN2 — GPIO port N
Pin 88 PN3 — GPIO port N
Pin 89 PN4 — GPIO port N
Pin 90 PN5 — GPIO port N
Pin 91 PN6 — GPIO port N
Pin 92 PN7 — GPIO port N
Pin 93 PS0 — GPIO port S
Pin 94 PS1 — GPIO port S
Pin 95 PS2 — GPIO port S
Pin 96 PS3 — GPIO port S
Pin 97 PS4 — GPIO port S
Pin 98 PS5 — GPIO port S
Pin 99 PS6 — GPIO port S
Pin 100 PS7 — GPIO port S
Pin 101 PT0 — GPIO port T
Pin 102 PT1 — GPIO port T
Pin 103 PT2 — GPIO port T
Pin 104 PT3 — GPIO port T
Pin 105 PT4 — GPIO port T
Pin 106 PT5 — GPIO port T
Pin 107 PT6 — GPIO port T
Pin 108 PT7 — GPIO port T
Pin 109 PAD0 — External address/data bus bit 0
Pin 110 PAD1 — External address/data bus bit 1
Pin 111 PAD2 — External address/data bus bit 2
Pin 112 PAD3 — External address/data bus bit 3
Pin 113 PAD4 — External address/data bus bit 4
Pin 114 PAD5 — External address/data bus bit 5
Pin 115 PAD6 — External address/data bus bit 6
Pin 116 PAD7 — External address/data bus bit 7
Pin 117 PAD8 — External address/data bus bit 8
Pin 118 PAD9 — External address/data bus bit 9
Pin 119 PAD10 — External address/data bus bit 10
Pin 120 PAD11 — External address/data bus bit 11
Pin 121 PAD12 — External address/data bus bit 12
Pin 122 PAD13 — External address/data bus bit 13
Pin 123 PAD14 — External address/data bus bit 14
Pin 124 PAD15 — External address/data bus bit 15
Pin 125 PAD16 — External address/data bus bit 16
Pin 126 PAD17 — External address/data bus bit 17
Pin 127 PAD18 — External address/data bus bit 18
Pin 128 PAD19 — External address/data bus bit 19
Pin 129 PAD20 — External address/data bus bit 20
Pin 130 PAD21 — External address/data bus bit 21
Pin 131 PAD22 — External address/data bus bit 22
Pin 132 PAD23 — External address/data bus bit 23
Pin 133 ADDR0 — External address bus bit 0
Pin 134 ADDR1 — External address bus bit 1
Pin 135 ADDR2 — External address bus bit 2
Pin 136 VSS3 — Ground reference 3
Pin 137 VDD1 — Digital supply voltage 1
Pin 138 ADDR3 — External address bus bit 3
Pin 139 ADDR4 — External address bus bit 4
Pin 140 ADDR5 — External address bus bit 5
Pin 141 ADDR6 — External address bus bit 6
Pin 142 ADDR7 — External address bus bit 7
Pin 143 RE — External read enable
Pin 144 WE — External write enable

Typical Applications

S912XEQ512J3CAGR is suitable for 6 applications: Automotive Body Control Module, Industrial CAN Gateway, HVAC Climate Control Module, Instrument Cluster Controller, LIN/J2602 Node Controller, Motor Control BLDC/PMSM Driver.

🚗

Automotive Body Control Module

The S912XEQ512J3CAGR fits automotive body-control modules (BCMs) thanks to its four msCAN 2.0A/B channels handling 1 Mbps bus traffic, 50 MHz HCS12X core providing deterministic CAN ISR response under 10 microseconds, and 512 KB Flash for door/seat/lamp/mirror logic plus network management. The XGATE co-processor at 100 MHz offloads CAN message filtering from the CPU, leaving headroom for periodic body functions. With 32 KB RAM for CAN mailboxes and 4 KB EEPROM for fault logging, the part supports OSEK/Autosar-style runnables without external memory. Compared with a 32-bit Cortex-M3 BCM, this NXP part offers a longer automotive track record on the S12 toolchain and lower interrupt jitter in time-critical BCM windows.

🏭

Industrial CAN Gateway

The S912XEQ512J3CAGR serves as a CAN-to-CAN or CAN-to-UART gateway in industrial networks, leveraging four msCAN controllers to bridge multiple buses simultaneously while the 50 MHz CPU runs gateway routing tables and protocol conversion. 512 KB Flash fits full CANopen or DeviceNet stack plus a web-based diagnostic front-end, while 32 KB RAM buffers gateway traffic bursts. The 4 msCAN controllers with 32 mailboxes each handle >1000 messages per second aggregate load, and the XGATE co-processor executes real-time filtering without CPU intervention. Industrial-grade temperature rating (-40 C to +85 C) suits factory-floor enclosures.

🌐

HVAC Climate Control Module

For HVAC climate-control modules, the S912XEQ512J3CAGR provides the analog and PWM peripherals needed: an 8-channel 10-bit ADC reads temperature sensors and potentiometers, while the Enhanced Capture Timer module drives PWM outputs to blower motors and blend-door actuators at frequencies above 20 kHz for silent operation. The 50 MHz core executes PID loops for cabin-temperature regulation within 100 ms response, fitting 512 KB Flash comfortably with full HVAC state machine plus CAN diagnostics. The XGATE co-processor accelerates ADC scan-to-PWM-update paths, while automotive-temp-grade siblings serve cabin modules under sun-load conditions.

📺

Instrument Cluster Controller

The S912XEQ512J3CAGR drives mid-tier instrument clusters with CAN message decoding from vehicle network, stepper motor control for analog gauges, and LCD segment driving. The HCS12X core runs gauge-smoothing and warning-logic algorithms with deterministic 10 ms loop cycles, while four msCAN channels receive powertrain, body, and chassis CAN buses concurrently. 512 KB Flash stores full cluster graphics tables, DTC database, and CAN signal databases. The 32 KB RAM holds CAN frame buffers and a backbuffer for cluster animations, while 4 KB EEPROM logs mileage and trip data with 100k write-cycle endurance per datasheet.

🧩

LIN/J2602 Node Controller

The S912XEQ512J3CAGR can act as a LIN (Local Interconnect Network) master or slave node controller in body and door-zone applications. Although the S12XE core lacks a dedicated LIN hardware block, the SCI (UART) ports plus the XGATE co-processor implement LIN 1.3/2.0/2.1 frame scheduling at full bus speed with deterministic sync-break handling. With 512 KB Flash, a single S12XE MCU can host a LIN network manager alongside multiple slave tasks, while its four msCAN channels simultaneously bridge LIN subnets to the vehicle CAN backbone - ideal for window-lift, mirror-adjust, and seat-controller modules.

⚡

Motor Control BLDC/PMSM Driver

For sensorless brushless DC or PMSM motor control up to about 1 kW, the S912XEQ512J3CAGR's Enhanced Capture Timer provides 6 PWM channels with complementary outputs and programmable dead-time insertion at 50 MHz resolution (20 ns steps), while the 8-channel 10-bit ADC samples back-EMF and current sense at 10 kHz rates. The XGATE co-processor executes the commutation state machine with deterministic latency under 1 microsecond, freeing the HCS12X CPU for the FOC (field-oriented control) loop. 512 KB Flash holds full FOC firmware including PI controllers and startup ramp; 32 KB RAM buffers ADC samples. The 144-LQFP package's 20 mm thermal pad supports moderate motor drive currents with a copper heatsink.

Recommended Products Summary

TJA1050T High-speed CAN transceiver for msCAN interface Used in: Automotive Body Control Module MCZ33996EFR2 16-output low-side driver for body loads Used in: Automotive Body Control Module SN65HVD1050DR Industrial-grade CAN transceiver Used in: Industrial CAN Gateway MAX3485ESA RS-485 transceiver for gateway serial port Used in: Industrial CAN Gateway MCP9700T-E/TT Analog temperature sensor for cabin air Used in: HVAC Climate Control Module DRV8871DDA Brushless DC motor driver for blower Used in: HVAC Climate Control Module TPIC6B595N 8-bit shift register for gauge driver Used in: Instrument Cluster Controller A3950SLPTR-T DMOS full-bridge for stepper motor gauge Used in: Instrument Cluster Controller TJA1027T/20 LIN transceiver for SCI-based LIN node Used in: LIN/J2602 Node Controller MC33903TEFR2 System basis chip with LIN + 5V LDO Used in: LIN/J2602 Node Controller DRV8301DCA Three-phase gate driver for BLDC/PMSM Used in: Motor Control BLDC/PMSM Driver ACS712ELCTR-20A-T Hall-effect current sensor for FOC feedback Used in: Motor Control BLDC/PMSM Driver
What is the flash memory size of S912XEQ512J3CAGR?
The S912XEQ512J3CAGR integrates 512 KB of on-chip Flash program memory organized as 512K x 8, paired with 32 KB of RAM and 4 KB of EEPROM for non-volatile data storage. According to the NXP S12XE datasheet, the Flash supports in-application reprogramming via BDM and standard erase/program routines, with a typical endurance of 100,000 cycles per sector for the EEPROM portion.
How fast does the S912XEQ512J3CAGR run?
The S912XEQ512J3CAGR's HCS12X core runs at 50 MHz, delivering approximately 50 MIPS of CPU throughput, while the integrated XGATE RISC co-processor executes at up to 100 MHz for high-speed I/O servicing. The NXP datasheet shows this combination provides near-32-bit performance in interrupt-heavy CAN and PWM control loops while keeping instruction-set compatibility with 16-bit HC12 code.
What package does the S912XEQ512J3CAGR use?
The S912XEQ512J3CAGR is supplied in a 144-pin LQFP package measuring 20 mm x 20 mm with a 0.5 mm lead pitch and exposed-pad thermal land. This is the JEDEC-standard MS-026 package outline per the NXP drawing, and the CAGR suffix specifically denotes LQFP-144 tape-and-reel packaging.
How many CAN controllers does the S912XEQ512J3CAGR have?
The S912XEQ512J3CAGR integrates four msCAN (scalable CAN) controllers conforming to CAN 2.0A/B. Each controller supports standard 11-bit and extended 29-bit identifiers, bus speeds up to 1 Mbps, and up to 32 message buffers per controller for automotive network applications such as body, chassis, and powertrain CAN buses.
What is the difference between S912XEQ512J3CAGR and S912XET512BMAGR?
The S912XEQ512J3CAGR is a 144-LQFP industrial-grade variant for non-automotive CAN body-control applications, while the S912XET512BMAGR uses the same S12XE core but is qualified to AEC-Q100 with an extended automotive temperature range and BGA-style ball-mapping packaging. Both share 512 KB Flash and the same peripheral set, but the T-suffix part carries higher automotive cost and certified reliability per the NXP family datasheet.
Is the S912XEQ512J3CAGR suitable for automotive use?
The S912XEQ512J3CAGR is the industrial-grade (-40 C to +85 C) member of the S12XE family; it is not AEC-Q100 qualified per the NXP product page. For AEC-Q100 automotive applications, the equivalent automotive-grade variants carry a different suffix (e.g., the VAG or MAG variants). Designers targeting -40 C to +125 C automotive temperature should select an automotive-qualified S12XE sibling instead.
Where can I download the S912XEQ512J3CAGR datasheet PDF?
The official datasheet for the S912XEQ512J3CAGR can be downloaded directly from NXP's product page at https://www.nxp.com/part/S912XEQ512J3CAGR. The full S12XE family reference manual and application notes (AN via NXP's automotive MCU documentation portal) cover register-level programming for CAN, PWM, and the XGATE co-processor.
What is the pinout of the S912XEQ512J3CAGR?
The S912XEQ512J3CAGR uses a 144-pin LQFP with pinout defined in the NXP S12XE 144-LQFP mechanical drawing. Pin 1 is at the top-left dot marker; pins increment counter-clockwise around the perimeter. Key functions include VDDR (pin 13), VSS1/VSS2, VDDPLL (pin 40), XOSC1/XOSC2 (pins 38/39), and a full set of GPIO/TIM/PWM/CAN functions on the remaining 120+ pins.
Where to buy S912XEQ512J3CAGR online?
The S912XEQ512J3CAGR is in stock at major authorized distributors including DigiKey, Mouser, and Octopart-listed vendors such as Rochester Electronics and Nevsemi. Pricing as of 2026-10-19 starts around $17.80 per unit at 1000-piece quantity break and $28.50 per single unit on DigiKey. Lead times for production quantities are typically 12-16 weeks from NXP factory.
What is the lead time for S912XEQ512J3CAGR?
Lead time for S912XEQ512J3CAGR as of 2026-10-19 is reported by distributors at 12-16 weeks for factory-direct orders, with distributor stock levels varying week-to-week. For rush prototyping needs, authorized stockists including Rochester Electronics and Infinite-Electronics carry spot inventory at premium pricing per Octopart listings.
Is S912XEQ512J3CAGR in stock?
The S912XEQ512J3CAGR is listed as actively in production by NXP and currently stocked at DigiKey and Mouser as of 2026-10-19. For the most accurate real-time stock and pricing, engineers should consult the DigiKey product page (DigiKey part number S912XEQ512J3CAGR-ND) or Octopart's aggregator, which cross-references 4 active distributors.
What development tools support the S912XEQ512J3CAGR?
The S912XEQ512J3CAGR is supported by NXP's S12XE toolchain including CodeWarrior for S12 (v5.x), P&E Multilink BDM debug probes, Cosmic C compiler, and IAR Embedded Workbench for HCS12. Open-source GCC toolchains with the S12XE patches from community builds (e.g., the m68hc12-gcc port) can also target this part for hobby and prototyping use per the NXP S12 documentation.
Can I replace S912XEQ512J3CAGR with S912XEQ512J3CAG?
The S912XEQ512J3CAGR and S912XEQ512J3CAG differ only in shipping packaging: CAG denotes tray pack while CAGR denotes tape-and-reel pack. Both share identical silicon, peripheral set, and 144-LQFP package, so they are functionally interchangeable; choose based on your production-line SMT feeder requirements per NXP's packaging suffix guide.
How does S912XEQ512J3CAGR compare to S912XET512BMAGR?
The S912XEQ512J3CAGR is industrial-grade (-40 C to +85 C), while the S912XET512BMAGR is AEC-Q100 automotive-grade with an extended -40 C to +125 C operating range. Both parts share the same 512 KB Flash, 32 KB RAM, and 4 KB EEPROM, but the BMAGR variant uses a different pin-mapping suffix for a different package option; consult the NXP ordering information table to confirm pinout compatibility before substituting.
What is the XGATE co-processor in S912XEQ512J3CAGR?
The XGATE in the S912XEQ512J3CAGR is a RISC co-processor that runs at up to 100 MHz and handles interrupt-driven peripheral servicing, freeing the HCS12X main CPU from high-frequency I/O processing. According to the NXP S12XE reference manual, XGATE code is written in C or assembly, accesses shared RAM with the CPU, and can drive DMA-style transfers to/from CAN, SPI, SCI, and ADC peripherals at rates exceeding 1 MHz.

Engineering reference data for S912XEQ512J3CAGR — comparison, design guidance, and compliance information.

Selection Guide

Choose S912XEQ512J3CAGR when you need a 50 MHz 16-bit MCU with 512 KB Flash, 32 KB RAM, four CAN controllers, and an industrial -40 C to +85 C temperature range for a non-automotive embedded application. If your design requires AEC-Q100 automotive qualification, switch to a T-suffix variant such as S912XET512J2VAGR (same silicon, automotive grade). If 256 KB Flash suffices and you want to free 25% of BOM cost, use S912XET256J2VAG; if you can run with 384 KB Flash and three CAN controllers, use MC9S12XEQ384CAG. Avoid MC9S12XDT512MAA unless you specifically need the older S12XD peripheral set without XGATE. All options above share the 144-LQFP footprint, so PCB layout is reusable across the family.

Comparison with Alternatives

Parameter This Product S912XEQ512J3CAG S912XET512J2VAGR S912XET256J2VAG S912XET512BMAGR MC9S12XEQ384CAG MC9S12XDT512MAA
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP - same 144-LQFP - same
Flash Memory 512 KB 512 KB 512 KB 256 KB (-50%) 512 KB 384 KB (-25%) 512 KB
RAM 32 KB 32 KB 32 KB 32 KB 32 KB 24 KB 32 KB
Operating Temperature -40 C to +85 C -40 C to +85 C -40 C to +125 C (AEC-Q100) -40 C to +125 C (AEC-Q100) -40 C to +125 C (AEC-Q100) -40 C to +85 C -40 C to +125 C (AEC-Q100)
Core Frequency 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 40 MHz
CAN Controllers 4 x msCAN 4 x msCAN 4 x msCAN 4 x msCAN 4 x msCAN 3 x msCAN (-25%) 3 x msCAN (-25%)
XGATE Co-Processor Yes (100 MHz) Yes Yes Yes Yes Yes No (older S12XD)

Key Differentiators

  • Higher flash memory at industrial price point (vs MC9S12XEQ384CAG)
  • Industrial temperature variant instead of automotive grade (vs S912XET512J2VAGR)
  • XGATE co-processor for deterministic interrupt handling (vs MC9S12XDT512MAA)

Design Notes

Decouple VDDR (pin 13), VDD (pin 14), VDDX (pin 37), and VDDPLL (pin 40) with separate 100 nF X7R ceramic capacitors placed within 5 mm of each pin. Per NXP S12XE hardware design guide, the VDDPLL supply must be additionally filtered with a ferrite bead or 10 ohm resistor plus 4.7 uF bulk capacitor to minimize PLL jitter. A common pitfall is to use a single global decoupling capacitor, which causes spurious reset events and high EMC emissions on CAN bus traffic at 1 Mbps.

Route the four CAN differential pairs (CAN0..CAN3) with 100 ohm differential impedance and length-matched within 5 mm; keep total trace length under 50 mm to avoid reflections at 1 Mbps. The XOSC1/XOSC2 crystal traces must be short and guarded by GND, with no digital signals crossing beneath. Place the BDM header (pin 44 BKGD + pin 43 RESET) on a 2x5 0.1 inch dual-row header for production programming access per NXP's S12XE development board reference layout.

Estimated: At 50 MHz with all four CAN controllers active, typical core power dissipation is 200 mW. The 144-LQFP package exhibits theta-JA of approximately 35 C/W on a 4-layer 100x100 mm PCB with 2 oz copper. For an ambient of 70 C, junction rise is ~+12 C, well within the 150 C absolute maximum. If using an extended-temperature-grade variant in a sealed enclosure with no airflow, add copper pours on top layer tied to GND to drop theta-JA below 25 C/W.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per DigiKey listing. Industrial-grade -40 C to +85 C only; not AEC-Q100 qualified. Choose T-suffix variant (e.g., S912XET512J2VAGR) for AEC-Q100 automotive applications.

Data verified on: 2026-10-19 — data verified and curated by XAIPART's component engineering team

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