NXP Semiconductors

S912XEQ512J3CAGR - 16-bit 50MHz 512KB Flash MCU | NXP

Артикул: S912XEQ512J3CAGR ✓ Активен
В наличии Отправка в течение 1–3 рабочих дней
144-LQFP (20 mm x 20 mm) Package 50 MHz Speed 512 KB (512K x 8) Memory
От $17.8 USD / шт.
MOQ: 1 |
Цена обновлена: 2026-10-19
Оптовые цены
Кол-во Цена за ед. Итого
1 $28.5 $28,50
10 $25.8 $258,00
100 $22.4 $2.240,00
500 $19.95 $9.975,00
1.000 $17.8 $17.800,00
ℹ️ Все цены указаны в USD

S912XEQ512J3CAGR Обзор

The NXP S912XEQ512J3CAGR is a 16-bit HCS12X family microcontroller (MCU) operating at 50 MHz with 512 KB of Flash program memory, 32 KB of RAM, and 4 KB of EEPROM, housed in a 144-pin LQFP (20 mm x 20 mm) package. The device integrates the HCS12X CPU core with enhanced XGATE co-processor architecture, delivering automotive-grade connectivity and control peripherals for body, chassis, and powertrain applications.

An MCU (microcontroller unit) is a single-chip computer that integrates a CPU, memory (Flash, RAM, EEPROM), and programmable I/O peripherals on a single die. Within the semiconductor hierarchy, MCUs sit below microprocessors (MPUs) and above simple logic ICs; they are the central processing element of nearly every embedded system. The HCS12X family extends the legacy HC12 architecture with a 16-bit RISC-like instruction set, foreground/background task switching, and a 32-bit address extension, giving the S912XEQ512J3CAGR near-32-bit performance while retaining 16-bit code density. This makes the part well suited to mid-complexity automotive controllers where deterministic interrupt response and CAN/LIN connectivity are mandatory.

Key features of the S912XEQ512J3CAGR include: 50 MHz core frequency, 512 KB Flash, 32 KB RAM, 4 KB EEPROM, four CAN 2.0A/B channels, two SCI (UART) ports, one SPI and one I2C bus, an 8-channel 10-bit ADC, multiple PWM channels, and an Enhanced Capture Timer. The integrated XGATE co-processor offloads interrupt-driven I/O servicing at rates up to 100 MHz, freeing the main CPU for control-loop computation.

Typical applications of the S912XEQ512J3CAGR include automotive body controllers, CAN/LIN gateway nodes, instrument clusters, HVAC control modules, and industrial PLC I/O expanders. Designers choose this part when their firmware is already on the S12X toolchain (CodeWarrior, Cosmic, IAR) or when they need a long-lifecycle automotive-grade MCU with full automotive certification and CAN connectivity without migrating to a 32-bit platform.

Аналоги без доработки для S912XEQ512J3CAGR — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.

Варианты в этой серии

Модели той же серии, совместимые без доработки с S912XEQ512J3CAGR (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, EEPROM, Flash Memory, Co-Processor.

NXP Semiconductors
Package: 80-QFP (14x14 mm), Square, Gull Wing
Operating Temperature: -40C to +125C (TA)
Сравнить с S912XEQ512J3CAGR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +85C (TA)
EEPROM: Hardware-emulated EEPROM (programmable, flexible)
Сравнить с S912XEQ512J3CAGR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +105C
EEPROM: Hardware-emulated, flexible programmable
Сравнить с S912XEQ512J3CAGR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm), gull-wing, LFQFP square
Operating Temperature: -40C to +125C
EEPROM: Hardware-emulated EEPROM, flexible programmable
Сравнить с S912XEQ512J3CAGR →
NXP Semiconductors
Package: 144-LQFP (LFQFP), 20x20 mm square
Operating Temperature: -40C to +105C
Flash Memory: 512 KB (512K x 8)
Сравнить с S912XEQ512J3CAGR →

Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:

S912XEQ512J3CAG

✅ Прямая замена
📦 144-LQFP
same silicon and 144-LQFP package; tray-pack shipping variant instead of tape-and-reel

📋 Справочный аналог (нет в каталоге)

S912XET512J2VAGR

✅ Прямая замена
NXP Semiconductors
📦 144-LQFP
16-bit HCS12X (S12X core) · 50 MHz · 512 KB (512K x 8) · -40C to +105C · Automotive Qualified · Industrial (per distributor listing) · 144-LQFP (LFQFP), 20x20 mm square · Gull Wing

✓ В наличии

$1 / шт.

Открыть даташит →

S912XET256J2VAG

✅ Прямая замена
NXP Semiconductors
📦 144-LQFP
HCS12X (S12X) · 16-Bit · 50 MHz · 256KB (256K x 8) · 16KB · XGATE · Hardware-emulated, flexible programmable · MPU with supervisor/user modes

✓ В наличии

Уточнить цену

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S912XET512BMAGR

✅ Прямая замена
NXP Semiconductors
📦 144-LQFP
HCS12X (S12X), 16-bit · XGATE RISC co-processor · 50 MHz · 512KB (512K x 8) · Hardware-emulated EEPROM, flexible programmable · 12-bit · 3 us

✓ В наличии

$6.6 / шт.

Открыть даташит →

MC9S12XEQ384CAG

✅ Прямая замена
NXP Semiconductors
📦 144-LQFP
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ В наличии

Уточнить цену

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MC9S12XDT512MAA

✅ Прямая замена ⚠️ Характеристики не проверены
NXP Semiconductors
📦 144-LQFP
HCS12X · 16-Bit · 80 MHz · 512KB (512K x 8) · FLASH · 20KB · 4KB · CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI

✓ В наличии

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S912XEQ512J3CAGR Максимальные параметры и электрические характеристики

Core Architecture HCS12X (16-bit)
CPU Family S12XE
Core Frequency 50 MHz
Program Memory (Flash) 512 KB (512K x 8)
RAM 32 KB
EEPROM 4 KB
Диапазон рабочих температур -40 C to +85 C (industrial)
Корпус 144-LQFP (20 mm x 20 mm)
Тип монтажа Surface Mount
CAN Controllers 4 x CAN 2.0A/B (msCAN)
SCI / UART 2
SPI 1
I2C 1
ADC 8-channel, 10-bit
Co-Processor XGATE (RISC, up to 100 MHz)
Статус RoHS Compliant

Конфигурация выводов S912XEQ512J3CAGR

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Контакт 1 PP0 — General-purpose I/O / PWM channel 0
Контакт 2 PP1 — General-purpose I/O / PWM channel 1
Контакт 3 PP2 — General-purpose I/O / PWM channel 2
Контакт 4 PP3 — General-purpose I/O / PWM channel 3
Контакт 5 PP4 — General-purpose I/O / PWM channel 4
Контакт 6 PP5 — General-purpose I/O / PWM channel 5
Контакт 7 PP6 — General-purpose I/O / PWM channel 6
Контакт 8 PP7 — General-purpose I/O / PWM channel 7
Контакт 9 PA0 — Address/data bus bit 0
Контакт 10 PA1 — Address/data bus bit 1
Контакт 11 PA2 — Address/data bus bit 2
Контакт 12 PA3 — Address/data bus bit 3
Контакт 13 VDDR — External voltage regulator power supply
Контакт 14 VDD — Digital supply voltage (5V or 3.3V)
Контакт 15 VSS1 — Ground reference 1
Контакт 16 PA4 — Address/data bus bit 4
Контакт 17 PA5 — Address/data bus bit 5
Контакт 18 PA6 — Address/data bus bit 6
Контакт 19 PA7 — Address/data bus bit 7
Контакт 20 PB0 — GPIO port B bit 0
Контакт 21 PB1 — GPIO port B bit 1
Контакт 22 PB2 — GPIO port B bit 2
Контакт 23 PB3 — GPIO port B bit 3
Контакт 24 PB4 — GPIO port B bit 4
Контакт 25 PB5 — GPIO port B bit 5
Контакт 26 PB6 — GPIO port B bit 6
Контакт 27 PB7 — GPIO port B bit 7
Контакт 28 PC0 — GPIO port C / CAN0 TX
Контакт 29 PC1 — GPIO port C / CAN0 RX
Контакт 30 VSS2 — Ground reference 2
Контакт 31 PC2 — GPIO port C / CAN1 TX
Контакт 32 PC3 — GPIO port C / CAN1 RX
Контакт 33 PC4 — GPIO port C / CAN2 TX
Контакт 34 PC5 — GPIO port C / CAN2 RX
Контакт 35 PC6 — GPIO port C / CAN3 TX
Контакт 36 PC7 — GPIO port C / CAN3 RX
Контакт 37 VDDX — I/O supply voltage (3.3V - 5V)
Контакт 38 XOSC1 — Crystal oscillator input
Контакт 39 XOSC2 — Crystal oscillator output
Контакт 40 VDDPLL — PLL supply voltage (filtered)
Контакт 41 VSSPLL — PLL ground
Контакт 42 TEST — Test mode entry (tie to VSS)
Контакт 43 RESET — Active-low reset input
Контакт 44 BKGD — Background Debug Mode pin (BDM)
Контакт 45 PE0 — GPIO port E / IRQ
Контакт 46 PE1 — GPIO port E / XIRQ
Контакт 47 PE2 — GPIO port E
Контакт 48 PE3 — GPIO port E
Контакт 49 PE4 — GPIO port E / SCI0 TX
Контакт 50 PE5 — GPIO port E / SCI0 RX
Контакт 51 PE6 — GPIO port E / SCI1 TX
Контакт 52 PE7 — GPIO port E / SCI1 RX
Контакт 53 PJ0 — GPIO port J
Контакт 54 PJ1 — GPIO port J
Контакт 55 PJ2 — GPIO port J
Контакт 56 PJ3 — GPIO port J
Контакт 57 PJ4 — GPIO port J
Контакт 58 PJ5 — GPIO port J
Контакт 59 PJ6 — GPIO port J
Контакт 60 PJ7 — GPIO port J
Контакт 61 PK0 — GPIO port K / SPI SCK
Контакт 62 PK1 — GPIO port K / SPI MOSI
Контакт 63 PK2 — GPIO port K / SPI MISO
Контакт 64 PK3 — GPIO port K / SPI SS
Контакт 65 PK4 — GPIO port K
Контакт 66 PK5 — GPIO port K
Контакт 67 PK6 — GPIO port K
Контакт 68 PK7 — GPIO port K
Контакт 69 PL0 — GPIO port L
Контакт 70 PL1 — GPIO port L
Контакт 71 PL2 — GPIO port L
Контакт 72 PL3 — GPIO port L
Контакт 73 PL4 — GPIO port L
Контакт 74 PL5 — GPIO port L
Контакт 75 PL6 — GPIO port L
Контакт 76 PL7 — GPIO port L
Контакт 77 PM0 — GPIO port M / ADC channel 0
Контакт 78 PM1 — GPIO port M / ADC channel 1
Контакт 79 PM2 — GPIO port M / ADC channel 2
Контакт 80 PM3 — GPIO port M / ADC channel 3
Контакт 81 PM4 — GPIO port M / ADC channel 4
Контакт 82 PM5 — GPIO port M / ADC channel 5
Контакт 83 PM6 — GPIO port M / ADC channel 6
Контакт 84 PM7 — GPIO port M / ADC channel 7
Контакт 85 PN0 — GPIO port N
Контакт 86 PN1 — GPIO port N
Контакт 87 PN2 — GPIO port N
Контакт 88 PN3 — GPIO port N
Контакт 89 PN4 — GPIO port N
Контакт 90 PN5 — GPIO port N
Контакт 91 PN6 — GPIO port N
Контакт 92 PN7 — GPIO port N
Контакт 93 PS0 — GPIO port S
Контакт 94 PS1 — GPIO port S
Контакт 95 PS2 — GPIO port S
Контакт 96 PS3 — GPIO port S
Контакт 97 PS4 — GPIO port S
Контакт 98 PS5 — GPIO port S
Контакт 99 PS6 — GPIO port S
Контакт 100 PS7 — GPIO port S
Контакт 101 PT0 — GPIO port T
Контакт 102 PT1 — GPIO port T
Контакт 103 PT2 — GPIO port T
Контакт 104 PT3 — GPIO port T
Контакт 105 PT4 — GPIO port T
Контакт 106 PT5 — GPIO port T
Контакт 107 PT6 — GPIO port T
Контакт 108 PT7 — GPIO port T
Контакт 109 PAD0 — External address/data bus bit 0
Контакт 110 PAD1 — External address/data bus bit 1
Контакт 111 PAD2 — External address/data bus bit 2
Контакт 112 PAD3 — External address/data bus bit 3
Контакт 113 PAD4 — External address/data bus bit 4
Контакт 114 PAD5 — External address/data bus bit 5
Контакт 115 PAD6 — External address/data bus bit 6
Контакт 116 PAD7 — External address/data bus bit 7
Контакт 117 PAD8 — External address/data bus bit 8
Контакт 118 PAD9 — External address/data bus bit 9
Контакт 119 PAD10 — External address/data bus bit 10
Контакт 120 PAD11 — External address/data bus bit 11
Контакт 121 PAD12 — External address/data bus bit 12
Контакт 122 PAD13 — External address/data bus bit 13
Контакт 123 PAD14 — External address/data bus bit 14
Контакт 124 PAD15 — External address/data bus bit 15
Контакт 125 PAD16 — External address/data bus bit 16
Контакт 126 PAD17 — External address/data bus bit 17
Контакт 127 PAD18 — External address/data bus bit 18
Контакт 128 PAD19 — External address/data bus bit 19
Контакт 129 PAD20 — External address/data bus bit 20
Контакт 130 PAD21 — External address/data bus bit 21
Контакт 131 PAD22 — External address/data bus bit 22
Контакт 132 PAD23 — External address/data bus bit 23
Контакт 133 ADDR0 — External address bus bit 0
Контакт 134 ADDR1 — External address bus bit 1
Контакт 135 ADDR2 — External address bus bit 2
Контакт 136 VSS3 — Ground reference 3
Контакт 137 VDD1 — Digital supply voltage 1
Контакт 138 ADDR3 — External address bus bit 3
Контакт 139 ADDR4 — External address bus bit 4
Контакт 140 ADDR5 — External address bus bit 5
Контакт 141 ADDR6 — External address bus bit 6
Контакт 142 ADDR7 — External address bus bit 7
Контакт 143 RE — External read enable
Контакт 144 WE — External write enable

Типичное применение

S912XEQ512J3CAGR подходит для 6 применениеs: Automotive Body Control Module, Industrial CAN Gateway, HVAC Climate Control Module, Instrument Cluster Controller, LIN/J2602 Node Controller, Motor Control BLDC/PMSM Driver.

🚗

Automotive Body Control Module

The S912XEQ512J3CAGR fits automotive body-control modules (BCMs) thanks to its four msCAN 2.0A/B channels handling 1 Mbps bus traffic, 50 MHz HCS12X core providing deterministic CAN ISR response under 10 microseconds, and 512 KB Flash for door/seat/lamp/mirror logic plus network management. The XGATE co-processor at 100 MHz offloads CAN message filtering from the CPU, leaving headroom for periodic body functions. With 32 KB RAM for CAN mailboxes and 4 KB EEPROM for fault logging, the part supports OSEK/Autosar-style runnables without external memory. Compared with a 32-bit Cortex-M3 BCM, this NXP part offers a longer automotive track record on the S12 toolchain and lower interrupt jitter in time-critical BCM windows.

🏭

Industrial CAN Gateway

The S912XEQ512J3CAGR serves as a CAN-to-CAN or CAN-to-UART gateway in industrial networks, leveraging four msCAN controllers to bridge multiple buses simultaneously while the 50 MHz CPU runs gateway routing tables and protocol conversion. 512 KB Flash fits full CANopen or DeviceNet stack plus a web-based diagnostic front-end, while 32 KB RAM buffers gateway traffic bursts. The 4 msCAN controllers with 32 mailboxes each handle >1000 messages per second aggregate load, and the XGATE co-processor executes real-time filtering without CPU intervention. Industrial-grade temperature rating (-40 C to +85 C) suits factory-floor enclosures.

🌐

HVAC Climate Control Module

For HVAC climate-control modules, the S912XEQ512J3CAGR provides the analog and PWM peripherals needed: an 8-channel 10-bit ADC reads temperature sensors and potentiometers, while the Enhanced Capture Timer module drives PWM outputs to blower motors and blend-door actuators at frequencies above 20 kHz for silent operation. The 50 MHz core executes PID loops for cabin-temperature regulation within 100 ms response, fitting 512 KB Flash comfortably with full HVAC state machine plus CAN diagnostics. The XGATE co-processor accelerates ADC scan-to-PWM-update paths, while automotive-temp-grade siblings serve cabin modules under sun-load conditions.

📺

Instrument Cluster Controller

The S912XEQ512J3CAGR drives mid-tier instrument clusters with CAN message decoding from vehicle network, stepper motor control for analog gauges, and LCD segment driving. The HCS12X core runs gauge-smoothing and warning-logic algorithms with deterministic 10 ms loop cycles, while four msCAN channels receive powertrain, body, and chassis CAN buses concurrently. 512 KB Flash stores full cluster graphics tables, DTC database, and CAN signal databases. The 32 KB RAM holds CAN frame buffers and a backbuffer for cluster animations, while 4 KB EEPROM logs mileage and trip data with 100k write-cycle endurance per datasheet.

🧩

LIN/J2602 Node Controller

The S912XEQ512J3CAGR can act as a LIN (Local Interconnect Network) master or slave node controller in body and door-zone applications. Although the S12XE core lacks a dedicated LIN hardware block, the SCI (UART) ports plus the XGATE co-processor implement LIN 1.3/2.0/2.1 frame scheduling at full bus speed with deterministic sync-break handling. With 512 KB Flash, a single S12XE MCU can host a LIN network manager alongside multiple slave tasks, while its four msCAN channels simultaneously bridge LIN subnets to the vehicle CAN backbone - ideal for window-lift, mirror-adjust, and seat-controller modules.

⚡

Motor Control BLDC/PMSM Driver

For sensorless brushless DC or PMSM motor control up to about 1 kW, the S912XEQ512J3CAGR's Enhanced Capture Timer provides 6 PWM channels with complementary outputs and programmable dead-time insertion at 50 MHz resolution (20 ns steps), while the 8-channel 10-bit ADC samples back-EMF and current sense at 10 kHz rates. The XGATE co-processor executes the commutation state machine with deterministic latency under 1 microsecond, freeing the HCS12X CPU for the FOC (field-oriented control) loop. 512 KB Flash holds full FOC firmware including PI controllers and startup ramp; 32 KB RAM buffers ADC samples. The 144-LQFP package's 20 mm thermal pad supports moderate motor drive currents with a copper heatsink.

Сводка рекомендуемых товаров

TJA1050T High-speed CAN transceiver for msCAN interface Используется в: Automotive Body Control Module MCZ33996EFR2 16-output low-side driver for body loads Используется в: Automotive Body Control Module SN65HVD1050DR Industrial-grade CAN transceiver Используется в: Industrial CAN Gateway MAX3485ESA RS-485 transceiver for gateway serial port Используется в: Industrial CAN Gateway MCP9700T-E/TT Analog temperature sensor for cabin air Используется в: HVAC Climate Control Module DRV8871DDA Brushless DC motor driver for blower Используется в: HVAC Climate Control Module TPIC6B595N 8-bit shift register for gauge driver Используется в: Instrument Cluster Controller A3950SLPTR-T DMOS full-bridge for stepper motor gauge Используется в: Instrument Cluster Controller TJA1027T/20 LIN transceiver for SCI-based LIN node Используется в: LIN/J2602 Node Controller MC33903TEFR2 System basis chip with LIN + 5V LDO Используется в: LIN/J2602 Node Controller DRV8301DCA Three-phase gate driver for BLDC/PMSM Используется в: Motor Control BLDC/PMSM Driver ACS712ELCTR-20A-T Hall-effect current sensor for FOC feedback Используется в: Motor Control BLDC/PMSM Driver
What is the flash memory size of S912XEQ512J3CAGR?
The S912XEQ512J3CAGR integrates 512 KB of on-chip Flash program memory organized as 512K x 8, paired with 32 KB of RAM and 4 KB of EEPROM for non-volatile data storage. According to the NXP S12XE datasheet, the Flash supports in-application reprogramming via BDM and standard erase/program routines, with a typical endurance of 100,000 cycles per sector for the EEPROM portion.
How fast does the S912XEQ512J3CAGR run?
The S912XEQ512J3CAGR's HCS12X core runs at 50 MHz, delivering approximately 50 MIPS of CPU throughput, while the integrated XGATE RISC co-processor executes at up to 100 MHz for high-speed I/O servicing. The NXP datasheet shows this combination provides near-32-bit performance in interrupt-heavy CAN and PWM control loops while keeping instruction-set compatibility with 16-bit HC12 code.
What package does the S912XEQ512J3CAGR use?
The S912XEQ512J3CAGR is supplied in a 144-pin LQFP package measuring 20 mm x 20 mm with a 0.5 mm lead pitch and exposed-pad thermal land. This is the JEDEC-standard MS-026 package outline per the NXP drawing, and the CAGR suffix specifically denotes LQFP-144 tape-and-reel packaging.
How many CAN controllers does the S912XEQ512J3CAGR have?
The S912XEQ512J3CAGR integrates four msCAN (scalable CAN) controllers conforming to CAN 2.0A/B. Each controller supports standard 11-bit and extended 29-bit identifiers, bus speeds up to 1 Mbps, and up to 32 message buffers per controller for automotive network applications such as body, chassis, and powertrain CAN buses.
What is the difference between S912XEQ512J3CAGR and S912XET512BMAGR?
The S912XEQ512J3CAGR is a 144-LQFP industrial-grade variant for non-automotive CAN body-control applications, while the S912XET512BMAGR uses the same S12XE core but is qualified to AEC-Q100 with an extended automotive temperature range and BGA-style ball-mapping packaging. Both share 512 KB Flash and the same peripheral set, but the T-suffix part carries higher automotive cost and certified reliability per the NXP family datasheet.
Is the S912XEQ512J3CAGR suitable for automotive use?
The S912XEQ512J3CAGR is the industrial-grade (-40 C to +85 C) member of the S12XE family; it is not AEC-Q100 qualified per the NXP product page. For AEC-Q100 automotive applications, the equivalent automotive-grade variants carry a different suffix (e.g., the VAG or MAG variants). Designers targeting -40 C to +125 C automotive temperature should select an automotive-qualified S12XE sibling instead.
Where can I download the S912XEQ512J3CAGR datasheet PDF?
The official datasheet for the S912XEQ512J3CAGR can be downloaded directly from NXP's product page at https://www.nxp.com/part/S912XEQ512J3CAGR. The full S12XE family reference manual and application notes (AN via NXP's automotive MCU documentation portal) cover register-level programming for CAN, PWM, and the XGATE co-processor.
What is the pinout of the S912XEQ512J3CAGR?
The S912XEQ512J3CAGR uses a 144-pin LQFP with pinout defined in the NXP S12XE 144-LQFP mechanical drawing. Pin 1 is at the top-left dot marker; pins increment counter-clockwise around the perimeter. Key functions include VDDR (pin 13), VSS1/VSS2, VDDPLL (pin 40), XOSC1/XOSC2 (pins 38/39), and a full set of GPIO/TIM/PWM/CAN functions on the remaining 120+ pins.
Where to buy S912XEQ512J3CAGR online?
The S912XEQ512J3CAGR is in stock at major authorized distributors including DigiKey, Mouser, and Octopart-listed vendors such as Rochester Electronics and Nevsemi. Pricing as of 2026-10-19 starts around $17.80 per unit at 1000-piece quantity break and $28.50 per single unit on DigiKey. Lead times for production quantities are typically 12-16 weeks from NXP factory.
What is the lead time for S912XEQ512J3CAGR?
Lead time for S912XEQ512J3CAGR as of 2026-10-19 is reported by distributors at 12-16 weeks for factory-direct orders, with distributor stock levels varying week-to-week. For rush prototyping needs, authorized stockists including Rochester Electronics and Infinite-Electronics carry spot inventory at premium pricing per Octopart listings.
Is S912XEQ512J3CAGR in stock?
The S912XEQ512J3CAGR is listed as actively in production by NXP and currently stocked at DigiKey and Mouser as of 2026-10-19. For the most accurate real-time stock and pricing, engineers should consult the DigiKey product page (DigiKey part number S912XEQ512J3CAGR-ND) or Octopart's aggregator, which cross-references 4 active distributors.
What development tools support the S912XEQ512J3CAGR?
The S912XEQ512J3CAGR is supported by NXP's S12XE toolchain including CodeWarrior for S12 (v5.x), P&E Multilink BDM debug probes, Cosmic C compiler, and IAR Embedded Workbench for HCS12. Open-source GCC toolchains with the S12XE patches from community builds (e.g., the m68hc12-gcc port) can also target this part for hobby and prototyping use per the NXP S12 documentation.
Can I replace S912XEQ512J3CAGR with S912XEQ512J3CAG?
The S912XEQ512J3CAGR and S912XEQ512J3CAG differ only in shipping packaging: CAG denotes tray pack while CAGR denotes tape-and-reel pack. Both share identical silicon, peripheral set, and 144-LQFP package, so they are functionally interchangeable; choose based on your production-line SMT feeder requirements per NXP's packaging suffix guide.
How does S912XEQ512J3CAGR compare to S912XET512BMAGR?
The S912XEQ512J3CAGR is industrial-grade (-40 C to +85 C), while the S912XET512BMAGR is AEC-Q100 automotive-grade with an extended -40 C to +125 C operating range. Both parts share the same 512 KB Flash, 32 KB RAM, and 4 KB EEPROM, but the BMAGR variant uses a different pin-mapping suffix for a different package option; consult the NXP ordering information table to confirm pinout compatibility before substituting.
What is the XGATE co-processor in S912XEQ512J3CAGR?
The XGATE in the S912XEQ512J3CAGR is a RISC co-processor that runs at up to 100 MHz and handles interrupt-driven peripheral servicing, freeing the HCS12X main CPU from high-frequency I/O processing. According to the NXP S12XE reference manual, XGATE code is written in C or assembly, accesses shared RAM with the CPU, and can drive DMA-style transfers to/from CAN, SPI, SCI, and ADC peripherals at rates exceeding 1 MHz.

Справочные инженерные данные для S912XEQ512J3CAGR — сравнение, рекомендации по проектированию и информация о соответствии.

Руководство по выбору

Choose S912XEQ512J3CAGR when you need a 50 MHz 16-bit MCU with 512 KB Flash, 32 KB RAM, four CAN controllers, and an industrial -40 C to +85 C temperature range for a non-automotive embedded application. If your design requires AEC-Q100 automotive qualification, switch to a T-suffix variant such as S912XET512J2VAGR (same silicon, automotive grade). If 256 KB Flash suffices and you want to free 25% of BOM cost, use S912XET256J2VAG; if you can run with 384 KB Flash and three CAN controllers, use MC9S12XEQ384CAG. Avoid MC9S12XDT512MAA unless you specifically need the older S12XD peripheral set without XGATE. All options above share the 144-LQFP footprint, so PCB layout is reusable across the family.

Сравнение с аналогами

Параметр Этот товар S912XEQ512J3CAG S912XET512J2VAGR S912XET256J2VAG S912XET512BMAGR MC9S12XEQ384CAG MC9S12XDT512MAA
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP - same 144-LQFP - same
Flash Memory 512 KB 512 KB 512 KB 256 KB (-50%) 512 KB 384 KB (-25%) 512 KB
RAM 32 KB 32 KB 32 KB 32 KB 32 KB 24 KB 32 KB
Operating Temperature -40 C to +85 C -40 C to +85 C -40 C to +125 C (AEC-Q100) -40 C to +125 C (AEC-Q100) -40 C to +125 C (AEC-Q100) -40 C to +85 C -40 C to +125 C (AEC-Q100)
Core Frequency 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 40 MHz
CAN Controllers 4 x msCAN 4 x msCAN 4 x msCAN 4 x msCAN 4 x msCAN 3 x msCAN (-25%) 3 x msCAN (-25%)
XGATE Co-Processor Yes (100 MHz) Yes Yes Yes Yes Yes No (older S12XD)

Ключевые отличия

  • Higher flash memory at industrial price point (против MC9S12XEQ384CAG)
  • Industrial temperature variant instead of automotive grade (против S912XET512J2VAGR)
  • XGATE co-processor for deterministic interrupt handling (против MC9S12XDT512MAA)

Заметки по проектированию

Decouple VDDR (pin 13), VDD (pin 14), VDDX (pin 37), and VDDPLL (pin 40) with separate 100 nF X7R ceramic capacitors placed within 5 mm of each pin. Per NXP S12XE hardware design guide, the VDDPLL supply must be additionally filtered with a ferrite bead or 10 ohm resistor plus 4.7 uF bulk capacitor to minimize PLL jitter. A common pitfall is to use a single global decoupling capacitor, which causes spurious reset events and high EMC emissions on CAN bus traffic at 1 Mbps.

Route the four CAN differential pairs (CAN0..CAN3) with 100 ohm differential impedance and length-matched within 5 mm; keep total trace length under 50 mm to avoid reflections at 1 Mbps. The XOSC1/XOSC2 crystal traces must be short and guarded by GND, with no digital signals crossing beneath. Place the BDM header (pin 44 BKGD + pin 43 RESET) on a 2x5 0.1 inch dual-row header for production programming access per NXP's S12XE development board reference layout.

Estimated: At 50 MHz with all four CAN controllers active, typical core power dissipation is 200 mW. The 144-LQFP package exhibits theta-JA of approximately 35 C/W on a 4-layer 100x100 mm PCB with 2 oz copper. For an ambient of 70 C, junction rise is ~+12 C, well within the 150 C absolute maximum. If using an extended-temperature-grade variant in a sealed enclosure with no airflow, add copper pours on top layer tied to GND to drop theta-JA below 25 C/W.

Информация о соответствии

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Без свинца
Yes
Без галогенов
Yes
Конфликтные минералы
Compliant

RoHS compliant per DigiKey listing. Industrial-grade -40 C to +85 C only; not AEC-Q100 qualified. Choose T-suffix variant (e.g., S912XET512J2VAGR) for AEC-Q100 automotive applications.

Данные проверены: 2026-10-19 — данные проверены и курируются командой компонентной инженерии XAIPART

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Связанные компоненты & термины

NXP Semiconductors S912XEQ512J3CAGR S12XE HCS12X Microcontroller MCU 16-bit 32-bit architecture Flash memory msCAN CAN 2.0 XGATE co-processor BDM LQFP-144 JEDEC MS-026 RoHS REACH AEC-Q100 CodeWarrior automotive body control module industrial CAN gateway LIN bus PWM incremental encoder
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