NXP Semiconductors

S912XEQ512J3CAGR - 16-bit 50MHz 512KB Flash MCU | NXP

Référence : S912XEQ512J3CAGR ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
144-LQFP (20 mm x 20 mm) Package 50 MHz Speed 512 KB (512K x 8) Memory
À partir de $17.8 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-19
Tarifs dégressifs
Qté Prix unitaire Total
1 $28.5 $28,50
10 $25.8 $258,00
100 $22.4 $2 240,00
500 $19.95 $9 975,00
1 000 $17.8 $17 800,00
ℹ️ Tous les prix sont en USD

S912XEQ512J3CAGR Présentation

The NXP S912XEQ512J3CAGR is a 16-bit HCS12X family microcontroller (MCU) operating at 50 MHz with 512 KB of Flash program memory, 32 KB of RAM, and 4 KB of EEPROM, housed in a 144-pin LQFP (20 mm x 20 mm) package. The device integrates the HCS12X CPU core with enhanced XGATE co-processor architecture, delivering automotive-grade connectivity and control peripherals for body, chassis, and powertrain applications.

An MCU (microcontroller unit) is a single-chip computer that integrates a CPU, memory (Flash, RAM, EEPROM), and programmable I/O peripherals on a single die. Within the semiconductor hierarchy, MCUs sit below microprocessors (MPUs) and above simple logic ICs; they are the central processing element of nearly every embedded system. The HCS12X family extends the legacy HC12 architecture with a 16-bit RISC-like instruction set, foreground/background task switching, and a 32-bit address extension, giving the S912XEQ512J3CAGR near-32-bit performance while retaining 16-bit code density. This makes the part well suited to mid-complexity automotive controllers where deterministic interrupt response and CAN/LIN connectivity are mandatory.

Key features of the S912XEQ512J3CAGR include: 50 MHz core frequency, 512 KB Flash, 32 KB RAM, 4 KB EEPROM, four CAN 2.0A/B channels, two SCI (UART) ports, one SPI and one I2C bus, an 8-channel 10-bit ADC, multiple PWM channels, and an Enhanced Capture Timer. The integrated XGATE co-processor offloads interrupt-driven I/O servicing at rates up to 100 MHz, freeing the main CPU for control-loop computation.

Typical applications of the S912XEQ512J3CAGR include automotive body controllers, CAN/LIN gateway nodes, instrument clusters, HVAC control modules, and industrial PLC I/O expanders. Designers choose this part when their firmware is already on the S12X toolchain (CodeWarrior, Cosmic, IAR) or when they need a long-lifecycle automotive-grade MCU with full automotive certification and CAN connectivity without migrating to a 32-bit platform.

Alternatives de remplacement direct pour S912XEQ512J3CAGR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Variantes de cette série

Modèles de la même série directement compatibles avec S912XEQ512J3CAGR (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, EEPROM, Flash Memory, Co-Processor.

NXP Semiconductors
Package: 80-QFP (14x14 mm), Square, Gull Wing
Operating Temperature: -40C to +125C (TA)
Comparer avec S912XEQ512J3CAGR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +85C (TA)
EEPROM: Hardware-emulated EEPROM (programmable, flexible)
Comparer avec S912XEQ512J3CAGR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm)
Operating Temperature: -40C to +105C
EEPROM: Hardware-emulated, flexible programmable
Comparer avec S912XEQ512J3CAGR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm), gull-wing, LFQFP square
Operating Temperature: -40C to +125C
EEPROM: Hardware-emulated EEPROM, flexible programmable
Comparer avec S912XEQ512J3CAGR →
NXP Semiconductors
Package: 144-LQFP (LFQFP), 20x20 mm square
Operating Temperature: -40C to +105C
Flash Memory: 512 KB (512K x 8)
Comparer avec S912XEQ512J3CAGR →

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

S912XEQ512J3CAG

✅ Remplacement direct
📦 144-LQFP
same silicon and 144-LQFP package; tray-pack shipping variant instead of tape-and-reel

📋 Alternative de référence (hors catalogue)

S912XET512J2VAGR

✅ Remplacement direct
NXP Semiconductors
📦 144-LQFP
16-bit HCS12X (S12X core) · 50 MHz · 512 KB (512K x 8) · -40C to +105C · Automotive Qualified · Industrial (per distributor listing) · 144-LQFP (LFQFP), 20x20 mm square · Gull Wing

✓ En stock

$1 / unité

Voir la fiche technique →

S912XET256J2VAG

✅ Remplacement direct
NXP Semiconductors
📦 144-LQFP
HCS12X (S12X) · 16-Bit · 50 MHz · 256KB (256K x 8) · 16KB · XGATE · Hardware-emulated, flexible programmable · MPU with supervisor/user modes

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

S912XET512BMAGR

✅ Remplacement direct
NXP Semiconductors
📦 144-LQFP
HCS12X (S12X), 16-bit · XGATE RISC co-processor · 50 MHz · 512KB (512K x 8) · Hardware-emulated EEPROM, flexible programmable · 12-bit · 3 us

✓ En stock

$6.6 / unité

Voir la fiche technique →

MC9S12XEQ384CAG

✅ Remplacement direct
NXP Semiconductors
📦 144-LQFP
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

MC9S12XDT512MAA

✅ Remplacement direct ⚠️ Spécifications non vérifiées
NXP Semiconductors
📦 144-LQFP
HCS12X · 16-Bit · 80 MHz · 512KB (512K x 8) · FLASH · 20KB · 4KB · CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI

✓ En stock

Contactez-nous pour le prix

Voir la fiche technique →

S912XEQ512J3CAGR Valeurs maximales et caractéristiques électriques

Core Architecture HCS12X (16-bit)
CPU Family S12XE
Core Frequency 50 MHz
Program Memory (Flash) 512 KB (512K x 8)
RAM 32 KB
EEPROM 4 KB
Plage de température de fonctionnement -40 C to +85 C (industrial)
Boîtier 144-LQFP (20 mm x 20 mm)
Type de montage Surface Mount
CAN Controllers 4 x CAN 2.0A/B (msCAN)
SCI / UART 2
SPI 1
I2C 1
ADC 8-channel, 10-bit
Co-Processor XGATE (RISC, up to 100 MHz)
Statut RoHS Compliant

Configuration des broches de S912XEQ512J3CAGR

LQFP-144 Package Pinout Diagram LQFP-144 20x20mm, P0.5mm, JEDEC MS-026. 1 36 LQFP-144
Broche 1 PP0 — General-purpose I/O / PWM channel 0
Broche 2 PP1 — General-purpose I/O / PWM channel 1
Broche 3 PP2 — General-purpose I/O / PWM channel 2
Broche 4 PP3 — General-purpose I/O / PWM channel 3
Broche 5 PP4 — General-purpose I/O / PWM channel 4
Broche 6 PP5 — General-purpose I/O / PWM channel 5
Broche 7 PP6 — General-purpose I/O / PWM channel 6
Broche 8 PP7 — General-purpose I/O / PWM channel 7
Broche 9 PA0 — Address/data bus bit 0
Broche 10 PA1 — Address/data bus bit 1
Broche 11 PA2 — Address/data bus bit 2
Broche 12 PA3 — Address/data bus bit 3
Broche 13 VDDR — External voltage regulator power supply
Broche 14 VDD — Digital supply voltage (5V or 3.3V)
Broche 15 VSS1 — Ground reference 1
Broche 16 PA4 — Address/data bus bit 4
Broche 17 PA5 — Address/data bus bit 5
Broche 18 PA6 — Address/data bus bit 6
Broche 19 PA7 — Address/data bus bit 7
Broche 20 PB0 — GPIO port B bit 0
Broche 21 PB1 — GPIO port B bit 1
Broche 22 PB2 — GPIO port B bit 2
Broche 23 PB3 — GPIO port B bit 3
Broche 24 PB4 — GPIO port B bit 4
Broche 25 PB5 — GPIO port B bit 5
Broche 26 PB6 — GPIO port B bit 6
Broche 27 PB7 — GPIO port B bit 7
Broche 28 PC0 — GPIO port C / CAN0 TX
Broche 29 PC1 — GPIO port C / CAN0 RX
Broche 30 VSS2 — Ground reference 2
Broche 31 PC2 — GPIO port C / CAN1 TX
Broche 32 PC3 — GPIO port C / CAN1 RX
Broche 33 PC4 — GPIO port C / CAN2 TX
Broche 34 PC5 — GPIO port C / CAN2 RX
Broche 35 PC6 — GPIO port C / CAN3 TX
Broche 36 PC7 — GPIO port C / CAN3 RX
Broche 37 VDDX — I/O supply voltage (3.3V - 5V)
Broche 38 XOSC1 — Crystal oscillator input
Broche 39 XOSC2 — Crystal oscillator output
Broche 40 VDDPLL — PLL supply voltage (filtered)
Broche 41 VSSPLL — PLL ground
Broche 42 TEST — Test mode entry (tie to VSS)
Broche 43 RESET — Active-low reset input
Broche 44 BKGD — Background Debug Mode pin (BDM)
Broche 45 PE0 — GPIO port E / IRQ
Broche 46 PE1 — GPIO port E / XIRQ
Broche 47 PE2 — GPIO port E
Broche 48 PE3 — GPIO port E
Broche 49 PE4 — GPIO port E / SCI0 TX
Broche 50 PE5 — GPIO port E / SCI0 RX
Broche 51 PE6 — GPIO port E / SCI1 TX
Broche 52 PE7 — GPIO port E / SCI1 RX
Broche 53 PJ0 — GPIO port J
Broche 54 PJ1 — GPIO port J
Broche 55 PJ2 — GPIO port J
Broche 56 PJ3 — GPIO port J
Broche 57 PJ4 — GPIO port J
Broche 58 PJ5 — GPIO port J
Broche 59 PJ6 — GPIO port J
Broche 60 PJ7 — GPIO port J
Broche 61 PK0 — GPIO port K / SPI SCK
Broche 62 PK1 — GPIO port K / SPI MOSI
Broche 63 PK2 — GPIO port K / SPI MISO
Broche 64 PK3 — GPIO port K / SPI SS
Broche 65 PK4 — GPIO port K
Broche 66 PK5 — GPIO port K
Broche 67 PK6 — GPIO port K
Broche 68 PK7 — GPIO port K
Broche 69 PL0 — GPIO port L
Broche 70 PL1 — GPIO port L
Broche 71 PL2 — GPIO port L
Broche 72 PL3 — GPIO port L
Broche 73 PL4 — GPIO port L
Broche 74 PL5 — GPIO port L
Broche 75 PL6 — GPIO port L
Broche 76 PL7 — GPIO port L
Broche 77 PM0 — GPIO port M / ADC channel 0
Broche 78 PM1 — GPIO port M / ADC channel 1
Broche 79 PM2 — GPIO port M / ADC channel 2
Broche 80 PM3 — GPIO port M / ADC channel 3
Broche 81 PM4 — GPIO port M / ADC channel 4
Broche 82 PM5 — GPIO port M / ADC channel 5
Broche 83 PM6 — GPIO port M / ADC channel 6
Broche 84 PM7 — GPIO port M / ADC channel 7
Broche 85 PN0 — GPIO port N
Broche 86 PN1 — GPIO port N
Broche 87 PN2 — GPIO port N
Broche 88 PN3 — GPIO port N
Broche 89 PN4 — GPIO port N
Broche 90 PN5 — GPIO port N
Broche 91 PN6 — GPIO port N
Broche 92 PN7 — GPIO port N
Broche 93 PS0 — GPIO port S
Broche 94 PS1 — GPIO port S
Broche 95 PS2 — GPIO port S
Broche 96 PS3 — GPIO port S
Broche 97 PS4 — GPIO port S
Broche 98 PS5 — GPIO port S
Broche 99 PS6 — GPIO port S
Broche 100 PS7 — GPIO port S
Broche 101 PT0 — GPIO port T
Broche 102 PT1 — GPIO port T
Broche 103 PT2 — GPIO port T
Broche 104 PT3 — GPIO port T
Broche 105 PT4 — GPIO port T
Broche 106 PT5 — GPIO port T
Broche 107 PT6 — GPIO port T
Broche 108 PT7 — GPIO port T
Broche 109 PAD0 — External address/data bus bit 0
Broche 110 PAD1 — External address/data bus bit 1
Broche 111 PAD2 — External address/data bus bit 2
Broche 112 PAD3 — External address/data bus bit 3
Broche 113 PAD4 — External address/data bus bit 4
Broche 114 PAD5 — External address/data bus bit 5
Broche 115 PAD6 — External address/data bus bit 6
Broche 116 PAD7 — External address/data bus bit 7
Broche 117 PAD8 — External address/data bus bit 8
Broche 118 PAD9 — External address/data bus bit 9
Broche 119 PAD10 — External address/data bus bit 10
Broche 120 PAD11 — External address/data bus bit 11
Broche 121 PAD12 — External address/data bus bit 12
Broche 122 PAD13 — External address/data bus bit 13
Broche 123 PAD14 — External address/data bus bit 14
Broche 124 PAD15 — External address/data bus bit 15
Broche 125 PAD16 — External address/data bus bit 16
Broche 126 PAD17 — External address/data bus bit 17
Broche 127 PAD18 — External address/data bus bit 18
Broche 128 PAD19 — External address/data bus bit 19
Broche 129 PAD20 — External address/data bus bit 20
Broche 130 PAD21 — External address/data bus bit 21
Broche 131 PAD22 — External address/data bus bit 22
Broche 132 PAD23 — External address/data bus bit 23
Broche 133 ADDR0 — External address bus bit 0
Broche 134 ADDR1 — External address bus bit 1
Broche 135 ADDR2 — External address bus bit 2
Broche 136 VSS3 — Ground reference 3
Broche 137 VDD1 — Digital supply voltage 1
Broche 138 ADDR3 — External address bus bit 3
Broche 139 ADDR4 — External address bus bit 4
Broche 140 ADDR5 — External address bus bit 5
Broche 141 ADDR6 — External address bus bit 6
Broche 142 ADDR7 — External address bus bit 7
Broche 143 RE — External read enable
Broche 144 WE — External write enable

Applications typiques

S912XEQ512J3CAGR convient pour 6 applications: Automotive Body Control Module, Industrial CAN Gateway, HVAC Climate Control Module, Instrument Cluster Controller, LIN/J2602 Node Controller, Motor Control BLDC/PMSM Driver.

🚗

Automotive Body Control Module

The S912XEQ512J3CAGR fits automotive body-control modules (BCMs) thanks to its four msCAN 2.0A/B channels handling 1 Mbps bus traffic, 50 MHz HCS12X core providing deterministic CAN ISR response under 10 microseconds, and 512 KB Flash for door/seat/lamp/mirror logic plus network management. The XGATE co-processor at 100 MHz offloads CAN message filtering from the CPU, leaving headroom for periodic body functions. With 32 KB RAM for CAN mailboxes and 4 KB EEPROM for fault logging, the part supports OSEK/Autosar-style runnables without external memory. Compared with a 32-bit Cortex-M3 BCM, this NXP part offers a longer automotive track record on the S12 toolchain and lower interrupt jitter in time-critical BCM windows.

🏭

Industrial CAN Gateway

The S912XEQ512J3CAGR serves as a CAN-to-CAN or CAN-to-UART gateway in industrial networks, leveraging four msCAN controllers to bridge multiple buses simultaneously while the 50 MHz CPU runs gateway routing tables and protocol conversion. 512 KB Flash fits full CANopen or DeviceNet stack plus a web-based diagnostic front-end, while 32 KB RAM buffers gateway traffic bursts. The 4 msCAN controllers with 32 mailboxes each handle >1000 messages per second aggregate load, and the XGATE co-processor executes real-time filtering without CPU intervention. Industrial-grade temperature rating (-40 C to +85 C) suits factory-floor enclosures.

🌐

HVAC Climate Control Module

For HVAC climate-control modules, the S912XEQ512J3CAGR provides the analog and PWM peripherals needed: an 8-channel 10-bit ADC reads temperature sensors and potentiometers, while the Enhanced Capture Timer module drives PWM outputs to blower motors and blend-door actuators at frequencies above 20 kHz for silent operation. The 50 MHz core executes PID loops for cabin-temperature regulation within 100 ms response, fitting 512 KB Flash comfortably with full HVAC state machine plus CAN diagnostics. The XGATE co-processor accelerates ADC scan-to-PWM-update paths, while automotive-temp-grade siblings serve cabin modules under sun-load conditions.

📺

Instrument Cluster Controller

The S912XEQ512J3CAGR drives mid-tier instrument clusters with CAN message decoding from vehicle network, stepper motor control for analog gauges, and LCD segment driving. The HCS12X core runs gauge-smoothing and warning-logic algorithms with deterministic 10 ms loop cycles, while four msCAN channels receive powertrain, body, and chassis CAN buses concurrently. 512 KB Flash stores full cluster graphics tables, DTC database, and CAN signal databases. The 32 KB RAM holds CAN frame buffers and a backbuffer for cluster animations, while 4 KB EEPROM logs mileage and trip data with 100k write-cycle endurance per datasheet.

🧩

LIN/J2602 Node Controller

The S912XEQ512J3CAGR can act as a LIN (Local Interconnect Network) master or slave node controller in body and door-zone applications. Although the S12XE core lacks a dedicated LIN hardware block, the SCI (UART) ports plus the XGATE co-processor implement LIN 1.3/2.0/2.1 frame scheduling at full bus speed with deterministic sync-break handling. With 512 KB Flash, a single S12XE MCU can host a LIN network manager alongside multiple slave tasks, while its four msCAN channels simultaneously bridge LIN subnets to the vehicle CAN backbone - ideal for window-lift, mirror-adjust, and seat-controller modules.

⚡

Motor Control BLDC/PMSM Driver

For sensorless brushless DC or PMSM motor control up to about 1 kW, the S912XEQ512J3CAGR's Enhanced Capture Timer provides 6 PWM channels with complementary outputs and programmable dead-time insertion at 50 MHz resolution (20 ns steps), while the 8-channel 10-bit ADC samples back-EMF and current sense at 10 kHz rates. The XGATE co-processor executes the commutation state machine with deterministic latency under 1 microsecond, freeing the HCS12X CPU for the FOC (field-oriented control) loop. 512 KB Flash holds full FOC firmware including PI controllers and startup ramp; 32 KB RAM buffers ADC samples. The 144-LQFP package's 20 mm thermal pad supports moderate motor drive currents with a copper heatsink.

Récapitulatif des produits recommandés

TJA1050T High-speed CAN transceiver for msCAN interface Utilisé dans : Automotive Body Control Module MCZ33996EFR2 16-output low-side driver for body loads Utilisé dans : Automotive Body Control Module SN65HVD1050DR Industrial-grade CAN transceiver Utilisé dans : Industrial CAN Gateway MAX3485ESA RS-485 transceiver for gateway serial port Utilisé dans : Industrial CAN Gateway MCP9700T-E/TT Analog temperature sensor for cabin air Utilisé dans : HVAC Climate Control Module DRV8871DDA Brushless DC motor driver for blower Utilisé dans : HVAC Climate Control Module TPIC6B595N 8-bit shift register for gauge driver Utilisé dans : Instrument Cluster Controller A3950SLPTR-T DMOS full-bridge for stepper motor gauge Utilisé dans : Instrument Cluster Controller TJA1027T/20 LIN transceiver for SCI-based LIN node Utilisé dans : LIN/J2602 Node Controller MC33903TEFR2 System basis chip with LIN + 5V LDO Utilisé dans : LIN/J2602 Node Controller DRV8301DCA Three-phase gate driver for BLDC/PMSM Utilisé dans : Motor Control BLDC/PMSM Driver ACS712ELCTR-20A-T Hall-effect current sensor for FOC feedback Utilisé dans : Motor Control BLDC/PMSM Driver
What is the flash memory size of S912XEQ512J3CAGR?
The S912XEQ512J3CAGR integrates 512 KB of on-chip Flash program memory organized as 512K x 8, paired with 32 KB of RAM and 4 KB of EEPROM for non-volatile data storage. According to the NXP S12XE datasheet, the Flash supports in-application reprogramming via BDM and standard erase/program routines, with a typical endurance of 100,000 cycles per sector for the EEPROM portion.
How fast does the S912XEQ512J3CAGR run?
The S912XEQ512J3CAGR's HCS12X core runs at 50 MHz, delivering approximately 50 MIPS of CPU throughput, while the integrated XGATE RISC co-processor executes at up to 100 MHz for high-speed I/O servicing. The NXP datasheet shows this combination provides near-32-bit performance in interrupt-heavy CAN and PWM control loops while keeping instruction-set compatibility with 16-bit HC12 code.
What package does the S912XEQ512J3CAGR use?
The S912XEQ512J3CAGR is supplied in a 144-pin LQFP package measuring 20 mm x 20 mm with a 0.5 mm lead pitch and exposed-pad thermal land. This is the JEDEC-standard MS-026 package outline per the NXP drawing, and the CAGR suffix specifically denotes LQFP-144 tape-and-reel packaging.
How many CAN controllers does the S912XEQ512J3CAGR have?
The S912XEQ512J3CAGR integrates four msCAN (scalable CAN) controllers conforming to CAN 2.0A/B. Each controller supports standard 11-bit and extended 29-bit identifiers, bus speeds up to 1 Mbps, and up to 32 message buffers per controller for automotive network applications such as body, chassis, and powertrain CAN buses.
What is the difference between S912XEQ512J3CAGR and S912XET512BMAGR?
The S912XEQ512J3CAGR is a 144-LQFP industrial-grade variant for non-automotive CAN body-control applications, while the S912XET512BMAGR uses the same S12XE core but is qualified to AEC-Q100 with an extended automotive temperature range and BGA-style ball-mapping packaging. Both share 512 KB Flash and the same peripheral set, but the T-suffix part carries higher automotive cost and certified reliability per the NXP family datasheet.
Is the S912XEQ512J3CAGR suitable for automotive use?
The S912XEQ512J3CAGR is the industrial-grade (-40 C to +85 C) member of the S12XE family; it is not AEC-Q100 qualified per the NXP product page. For AEC-Q100 automotive applications, the equivalent automotive-grade variants carry a different suffix (e.g., the VAG or MAG variants). Designers targeting -40 C to +125 C automotive temperature should select an automotive-qualified S12XE sibling instead.
Where can I download the S912XEQ512J3CAGR datasheet PDF?
The official datasheet for the S912XEQ512J3CAGR can be downloaded directly from NXP's product page at https://www.nxp.com/part/S912XEQ512J3CAGR. The full S12XE family reference manual and application notes (AN via NXP's automotive MCU documentation portal) cover register-level programming for CAN, PWM, and the XGATE co-processor.
What is the pinout of the S912XEQ512J3CAGR?
The S912XEQ512J3CAGR uses a 144-pin LQFP with pinout defined in the NXP S12XE 144-LQFP mechanical drawing. Pin 1 is at the top-left dot marker; pins increment counter-clockwise around the perimeter. Key functions include VDDR (pin 13), VSS1/VSS2, VDDPLL (pin 40), XOSC1/XOSC2 (pins 38/39), and a full set of GPIO/TIM/PWM/CAN functions on the remaining 120+ pins.
Where to buy S912XEQ512J3CAGR online?
The S912XEQ512J3CAGR is in stock at major authorized distributors including DigiKey, Mouser, and Octopart-listed vendors such as Rochester Electronics and Nevsemi. Pricing as of 2026-10-19 starts around $17.80 per unit at 1000-piece quantity break and $28.50 per single unit on DigiKey. Lead times for production quantities are typically 12-16 weeks from NXP factory.
What is the lead time for S912XEQ512J3CAGR?
Lead time for S912XEQ512J3CAGR as of 2026-10-19 is reported by distributors at 12-16 weeks for factory-direct orders, with distributor stock levels varying week-to-week. For rush prototyping needs, authorized stockists including Rochester Electronics and Infinite-Electronics carry spot inventory at premium pricing per Octopart listings.
Is S912XEQ512J3CAGR in stock?
The S912XEQ512J3CAGR is listed as actively in production by NXP and currently stocked at DigiKey and Mouser as of 2026-10-19. For the most accurate real-time stock and pricing, engineers should consult the DigiKey product page (DigiKey part number S912XEQ512J3CAGR-ND) or Octopart's aggregator, which cross-references 4 active distributors.
What development tools support the S912XEQ512J3CAGR?
The S912XEQ512J3CAGR is supported by NXP's S12XE toolchain including CodeWarrior for S12 (v5.x), P&E Multilink BDM debug probes, Cosmic C compiler, and IAR Embedded Workbench for HCS12. Open-source GCC toolchains with the S12XE patches from community builds (e.g., the m68hc12-gcc port) can also target this part for hobby and prototyping use per the NXP S12 documentation.
Can I replace S912XEQ512J3CAGR with S912XEQ512J3CAG?
The S912XEQ512J3CAGR and S912XEQ512J3CAG differ only in shipping packaging: CAG denotes tray pack while CAGR denotes tape-and-reel pack. Both share identical silicon, peripheral set, and 144-LQFP package, so they are functionally interchangeable; choose based on your production-line SMT feeder requirements per NXP's packaging suffix guide.
How does S912XEQ512J3CAGR compare to S912XET512BMAGR?
The S912XEQ512J3CAGR is industrial-grade (-40 C to +85 C), while the S912XET512BMAGR is AEC-Q100 automotive-grade with an extended -40 C to +125 C operating range. Both parts share the same 512 KB Flash, 32 KB RAM, and 4 KB EEPROM, but the BMAGR variant uses a different pin-mapping suffix for a different package option; consult the NXP ordering information table to confirm pinout compatibility before substituting.
What is the XGATE co-processor in S912XEQ512J3CAGR?
The XGATE in the S912XEQ512J3CAGR is a RISC co-processor that runs at up to 100 MHz and handles interrupt-driven peripheral servicing, freeing the HCS12X main CPU from high-frequency I/O processing. According to the NXP S12XE reference manual, XGATE code is written in C or assembly, accesses shared RAM with the CPU, and can drive DMA-style transfers to/from CAN, SPI, SCI, and ADC peripherals at rates exceeding 1 MHz.

Données de référence d'ingénierie pour S912XEQ512J3CAGR — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose S912XEQ512J3CAGR when you need a 50 MHz 16-bit MCU with 512 KB Flash, 32 KB RAM, four CAN controllers, and an industrial -40 C to +85 C temperature range for a non-automotive embedded application. If your design requires AEC-Q100 automotive qualification, switch to a T-suffix variant such as S912XET512J2VAGR (same silicon, automotive grade). If 256 KB Flash suffices and you want to free 25% of BOM cost, use S912XET256J2VAG; if you can run with 384 KB Flash and three CAN controllers, use MC9S12XEQ384CAG. Avoid MC9S12XDT512MAA unless you specifically need the older S12XD peripheral set without XGATE. All options above share the 144-LQFP footprint, so PCB layout is reusable across the family.

Comparaison avec les alternatives

Paramètre Ce produit S912XEQ512J3CAG S912XET512J2VAGR S912XET256J2VAG S912XET512BMAGR MC9S12XEQ384CAG MC9S12XDT512MAA
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 144-LQFP (20x20 mm) 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP (20x20 mm) - same 144-LQFP - same 144-LQFP - same
Flash Memory 512 KB 512 KB 512 KB 256 KB (-50%) 512 KB 384 KB (-25%) 512 KB
RAM 32 KB 32 KB 32 KB 32 KB 32 KB 24 KB 32 KB
Operating Temperature -40 C to +85 C -40 C to +85 C -40 C to +125 C (AEC-Q100) -40 C to +125 C (AEC-Q100) -40 C to +125 C (AEC-Q100) -40 C to +85 C -40 C to +125 C (AEC-Q100)
Core Frequency 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 50 MHz 40 MHz
CAN Controllers 4 x msCAN 4 x msCAN 4 x msCAN 4 x msCAN 4 x msCAN 3 x msCAN (-25%) 3 x msCAN (-25%)
XGATE Co-Processor Yes (100 MHz) Yes Yes Yes Yes Yes No (older S12XD)

Principaux différenciateurs

  • Higher flash memory at industrial price point (vs MC9S12XEQ384CAG)
  • Industrial temperature variant instead of automotive grade (vs S912XET512J2VAGR)
  • XGATE co-processor for deterministic interrupt handling (vs MC9S12XDT512MAA)

Notes de conception

Decouple VDDR (pin 13), VDD (pin 14), VDDX (pin 37), and VDDPLL (pin 40) with separate 100 nF X7R ceramic capacitors placed within 5 mm of each pin. Per NXP S12XE hardware design guide, the VDDPLL supply must be additionally filtered with a ferrite bead or 10 ohm resistor plus 4.7 uF bulk capacitor to minimize PLL jitter. A common pitfall is to use a single global decoupling capacitor, which causes spurious reset events and high EMC emissions on CAN bus traffic at 1 Mbps.

Route the four CAN differential pairs (CAN0..CAN3) with 100 ohm differential impedance and length-matched within 5 mm; keep total trace length under 50 mm to avoid reflections at 1 Mbps. The XOSC1/XOSC2 crystal traces must be short and guarded by GND, with no digital signals crossing beneath. Place the BDM header (pin 44 BKGD + pin 43 RESET) on a 2x5 0.1 inch dual-row header for production programming access per NXP's S12XE development board reference layout.

Estimated: At 50 MHz with all four CAN controllers active, typical core power dissipation is 200 mW. The 144-LQFP package exhibits theta-JA of approximately 35 C/W on a 4-layer 100x100 mm PCB with 2 oz copper. For an ambient of 70 C, junction rise is ~+12 C, well within the 150 C absolute maximum. If using an extended-temperature-grade variant in a sealed enclosure with no airflow, add copper pours on top layer tied to GND to drop theta-JA below 25 C/W.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Yes
Minerais de conflit
Compliant

RoHS compliant per DigiKey listing. Industrial-grade -40 C to +85 C only; not AEC-Q100 qualified. Choose T-suffix variant (e.g., S912XET512J2VAGR) for AEC-Q100 automotive applications.

Données vérifiées le : 2026-10-19 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

S912XEQ512J3CAGR S912XEQ512J3CAGR datasheet NXP HCS12X 512KB flash MCU 16-bit microcontroller 50MHz four CAN S12XE 144-LQFP microcontroller S912XEQ512J3CAGR automotive body control S912XEQ512J3CAGR vs S912XET512J2VAGR S912XEQ512J3CAGR drop-in replacement buy S912XEQ512J3CAGR online price S912XEQ512J3CAGR XGATE co-processor

Composants & termes associés

NXP Semiconductors S912XEQ512J3CAGR S12XE HCS12X Microcontroller MCU 16-bit 32-bit architecture Flash memory msCAN CAN 2.0 XGATE co-processor BDM LQFP-144 JEDEC MS-026 RoHS REACH AEC-Q100 CodeWarrior automotive body control module industrial CAN gateway LIN bus PWM incremental encoder
RFQ de devis rapide
Renseignez tous les détails — notre équipe commerciale vous répondra sous 24 heures
Référence Fabricant Boîtier QTY Prix cible Total
Total : 0,00 USD
✓
Devis envoyé !

Nous répondrons à votre e-mail sous 24 heures

1
RFQ envoyée
2
Devis reçu
3
Commande passée
4
Paiement
5
Expédié
6
Livré
Voir les détails de la RFQ