NXP Semiconductors

S912XET256BMAGR - 16-bit S12X MCU, 256KB Flash, 50MHz | NXP

MPN: S912XET256BMAGR ✓ Active
In Stock Ships in 1-3 business days
144-LQFP (20x20 mm, 0.5 mm pitch) Package 50 MHz Speed 256 KB (256K x 8) Memory
From $11.75 USD / Unit
MOQ: 1 |
Price updated: 2026-10-19
Volume Pricing
Qty Unit Price Extended
1 $18.4 $18.40
10 $16.3 $163.00
100 $14.25 $1,425.00
500 $12.95 $6,475.00
1,000 $11.75 $11,750.00
ℹ️ All prices are in USD

S912XET256BMAGR Overview

The NXP S912XET256BMAGR is a 16-bit automotive-grade microcontroller (MCU) built on the S12X core running at 50MHz, with 256KB of on-chip Flash and packaged in a 144-pin LQFP (20x20mm). It is qualified to AEC-Q100 for automotive applications and rated for the -40C to +125C operating range.

What is an S12X MCU? The S12X is NXP's 16-bit microcontroller family, evolution of the original Freescale HC12/S12 architecture. It introduces an enhanced CPU with 32-bit internal program word width, an XGATE co-processor (a peripheral-only RISC engine) for offloading interrupt-intensive I/O, and a richer interrupt model. The S12X sits between classical 8-bit MCUs and 32-bit ARM Cortex-M parts: more deterministic than 32-bit parts yet more capable than 8-bit devices, making it a workhorse for body electronics, chassis, and powertrain-adjacent ECUs.

Key features include the XGATE co-processor that boosts overall throughput by handling virtual peripherals, a flexible hardware-emulated EEPROM subsystem for non-volatile parameter storage, and a memory protection unit with supervisor/user modes for system integrity. Communication peripherals cover CAN, SCI (UART), SPI, I2C, and IrDA, while on-chip timers include Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), and PWM modules. The 12-bit ADC with 3us conversion time enables precise analog monitoring for sensor conditioning.

The device integrates 119 general-purpose I/O lines, a low-voltage detector (LVD), power-on reset (POR), and a watchdog timer (WDT) to support safety-relevant designs. With 256KB of Flash, designers can run larger application stacks including AUTOSAR-compliant firmware, complex sensor fusion routines, and bootloader/OTA scaffolding without external memory.

Typical applications include automotive body control modules, HVAC and climate control ECUs, instrument clusters, lighting controllers, CAN nodes, and industrial automation gateways. The wide temperature range and AEC-Q100 qualification also make it a fit for off-road vehicles, agricultural equipment, and heavy machinery cab controllers.

When designing with the S912XET256BMAGR, allocate PCB area for the 144-LQFP footprint (0.5mm pitch), use four-layer boards with continuous ground planes under the QFP to minimize EMI, and reserve CAN bus transceivers such as the TJA1040 or TJA1057 at the connector side. Verify your toolchain (CodeWarrior, Cosmic, IAR for HCS12X) supports the XGATE co-processor if you plan to use it.

This page synthesizes distributor pricing, drop-in alternatives, and practical design notes for the S912XET256BMAGR that are not consolidated in the manufacturer datasheet.

Drop-in alternatives for S912XET256BMAGR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with S912XET256BMAGR (same form factor and footprint) — differing in Operating Temperature, Package, Timers, EEPROM, ADC.

NXP Semiconductors
Operating Temperature: -40C to +85C
Package: 144-pin LQFP (20x20 mm)
Timers: ECT (Enhanced Capture Timer)
Compare with S912XET256BMAGR →
NXP Semiconductors
Operating Temperature: -40C to +85C (automotive grade)
Package: 144-LQFP (20x20 mm)
Timers: 8-channel 16-bit timer with capture/compare
Compare with S912XET256BMAGR →
NXP Semiconductors
Operating Temperature: -40C to +85C (TA)
Package: 144-LQFP (20x20 mm)
Timers: Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI)
Compare with S912XET256BMAGR →
NXP Semiconductors
Operating Temperature: -40 C to +85 C
Package: 112-LQFP (20x20 mm)
Compare with S912XET256BMAGR →
NXP Semiconductors
Package: 112-LQFP (20x20 mm)
Compare with S912XET256BMAGR →
NXP Semiconductors
Operating Temperature: -40C to +105C
Package: 144-LQFP (20x20 mm)
EEPROM: Hardware-emulated, flexible programmable
Compare with S912XET256BMAGR →
NXP Semiconductors
Package: 144-LQFP (20x20 mm), gull-wing, LFQFP square
Timers: Enhanced Capture Timer (ECT), Periodic Interrupt Timer (PIT), Real Time Interrupt (RTI)
EEPROM: Hardware-emulated EEPROM, flexible programmable
Compare with S912XET256BMAGR →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

S912XET512BMAGR

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (MAG)
HCS12X (S12X), 16-bit · XGATE RISC co-processor · 50 MHz · 512KB (512K x 8) · Hardware-emulated EEPROM, flexible programmable · 12-bit · 3 us

✓ In Stock

$6.6 / Unit

View Datasheet →

S912XET256J2VAG

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (MAG)
HCS12X (S12X) · 16-Bit · 50 MHz · 256KB (256K x 8) · 16KB · XGATE · Hardware-emulated, flexible programmable · MPU with supervisor/user modes

✓ In Stock

Contact for price

View Datasheet →

MC9S12XEQ384CAG

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (MAG)
HCS12X (16-bit CISC) · 16-bit · 50 MHz · XGATE RISC co-processor · 384 KB (384K x 8) · 24K x 8 · Hardware-emulated EEPROM (programmable, flexible) · 12-bit

✓ In Stock

Contact for price

View Datasheet →

MC9S12XDT256CAG

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (MAG)
HCS12X (16-bit CISC with XGATE co-processor) · 256 KB Flash · 16 KB · 4 KB · 80 MHz · 2.35 V to 2.75 V · 4.5 V to 5.5 V · 119

✓ In Stock

$17.4 / Unit

View Datasheet →

MC9S12XEP768CAG

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (MAG)
HCS12X (16-bit) with XGATE co-processor · 50 MHz · 768 KB (768K x 8) with ECC · 32 KB · 1.8V / 2.8V / 5V · -40C to +85C (automotive grade)

✓ In Stock

$19.85 / Unit

View Datasheet →

S912XEG256J2CAL

✅ Drop-In
NXP Semiconductors
📦 144-LQFP (MAG)
HCS12X · 16-Bit · 50 MHz · 256 KB (256K x 8) Flash · 16 KB (hardware-emulated) · 91 · 112-LQFP (20x20 mm)

✓ In Stock

$15.4 / Unit

View Datasheet →

S912XET256BMAGR Maximum Ratings & Electrical Characteristics

Core Processor HCS12X
Core Size 16-bit
Core Speed 50 MHz
Program Memory Size 256 KB (256K x 8)
Program Memory Type FLASH
EEPROM Emulation Yes (hardware-emulated)
Number of I/O 119
Package 144-LQFP (20x20 mm, 0.5 mm pitch)
Mounting Type Surface Mount
Connectivity CANbus, EBI/EMI, I2C, IrDA, SCI, SPI
ADC 12-bit, 3 us conversion time
Timers ECT, PIT, PWM, RTI
Peripherals LVD, POR, PWM, WDT
Co-processor XGATE
Memory Protection Yes (MPU, supervisor/user modes)
Operating Temperature -40C to +125C
Automotive Qualification AEC-Q100
RoHS Status Compliant

S912XET256BMAGR 144-lqfp (20x20 mm, 0.5 mm pitch) Pin Configuration Guide

Pin configuration for S912XET256BMAGR (144-lqfp (20x20 mm, 0.5 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

144-lqfp (20x20 mm, 0.5 mm pitch) package pinout diagram for S912XET256BMAGR

No detailed pinout data available for S912XET256BMAGR.

Refer to the datasheet for full pin configuration.

Typical Applications

S912XET256BMAGR is suitable for 6 applications: Automotive Body Control Module (BCM), HVAC Climate Control ECU, Instrument Cluster Driver, Lighting Control Module, CAN Gateway / Vehicle Network Node, Industrial Automation / Off-Highway Controller.

🚗

Automotive Body Control Module (BCM)

The S912XET256BMAGR fits body control modules because it integrates multiple CAN controllers, SCI/SPI/I2C, 119 I/O lines, and PWM outputs in a single 144-LQFP. The 256 KB Flash accommodates typical BCM firmware (central locking, wipers, lighting, mirror control) with margin for diagnostics. AEC-Q100 qualification plus -40C to +125C operation is mandatory for under-dash automotive placement. XGATE offloads high-frequency CAN message servicing so the main CPU can run the body control state machine deterministically. Designers typically pair the MCU with TJA1057 CAN transceivers and high-side switches such as the VNQ5050.

🚗

HVAC Climate Control ECU

HVAC control ECUs require precise temperature sensing and motor actuation, which the S912XET256BMAGR supports via its 12-bit ADC (3 us conversion) and PWM channels. The 256 KB Flash holds the climate control algorithm plus sensor calibration tables, while AEC-Q100 covers the under-dash thermal environment. Hardware-emulated EEPROM stores user-setpoints and learned blower curves without external serial EEPROM. Multiple SCI/UART ports link to the infotainment head unit and rear-seat control panel. The 144-LQFP footprint and ample I/O make routing the blower, blend door, and mode motor drivers straightforward.

🚗

Instrument Cluster Driver

Instrument clusters need fast gauge updates, CAN bus connectivity, and enough Flash for graphics bitmaps and warning logic - all of which the S912XET256BMAGR provides. The 50 MHz S12X core with XGATE handles stepper motor control loops for analog-style gauges while the main CPU drives display updates. 119 I/O lines accommodate multiplexed warning lamps and telltale LEDs without external expanders. AEC-Q100 plus -40C to +125C covers the cabin environment, where direct sun load can push PCB temperatures high. The 144-LQFP package simplifies layout against large stepper motor driver arrays.

💡

Lighting Control Module

Exterior and interior lighting controllers benefit from the S912XET256BMAGR's PWM channels, 119 I/O, and CAN bus interface. Adaptive headlamp, DRL, and turn-indicator patterns fit within 256 KB Flash when state machines are coded efficiently. The integrated CAN controller links the module to the body network, and hardware-emulated EEPROM stores lamp-failure counters and learned trim values. AEC-Q100 plus the wide temperature range handles under-hood and headlamp-proximity mounting. Designers typically add LIN transceivers for sub-nodes via SCI plus an external LIN phy.

🌐

CAN Gateway / Vehicle Network Node

The S912XET256BMAGR serves well as a CAN-to-CAN gateway or bridge node, because the S12XE core integrates multiple MSCAN modules that can filter and forward frames between buses. 256 KB Flash holds the routing table and message-arbitration logic, while EBI/EMI enables external bus extension. AEC-Q100 plus -40C to +125C covers central gateway placement behind the dashboard. XGATE accelerates incoming CAN frame processing so the main CPU can apply security filters and DTC handling. Add a CAN transceiver pair such as TJA1057 at each bus interface.

🏭

Industrial Automation / Off-Highway Controller

Off-highway and industrial applications (agricultural tractors, forklifts, construction equipment) demand the same AEC-Q100 plus -40C to +125C envelope that the S912XET256BMAGR provides. The 256 KB Flash holds PLC-style ladder logic interpreters and CANopen/J1939 stacks. 119 I/O plus PWM support sensor conditioning and hydraulic valve actuation without external expanders. The 50 MHz S12X core runs deterministic control loops at 1 ms cadence, while XGATE handles encoder counters and CAN frame bursts. The 144-LQFP package is mechanically robust for high-vibration environments.

Recommended Products Summary

TJA1057T CAN transceiver companion Used in: Automotive Body Control Module (BCM), CAN Gateway / Vehicle Network Node, Industrial Automation / Off-Highway Controller VNQ5050K High-side driver for body loads Used in: Automotive Body Control Module (BCM), Industrial Automation / Off-Highway Controller S912XET512BMAGR NXP Semiconductors Used in: Automotive Body Control Module (BCM), Instrument Cluster Driver, CAN Gateway / Vehicle Network Node MC9S12XEQ384CAG NXP Semiconductors Used in: HVAC Climate Control ECU, Industrial Automation / Off-Highway Controller TJA1044GT NXP Semiconductors Used in: HVAC Climate Control ECU, CAN Gateway / Vehicle Network Node MC33926 H-bridge driver for blower motor Used in: HVAC Climate Control ECU MC9S12XDT256CAG NXP Semiconductors Used in: Instrument Cluster Driver PCA8574 I2C I/O expander for telltale LEDs Used in: Instrument Cluster Driver TJA1027T LIN transceiver for sub-nodes Used in: Lighting Control Module MC9S12XEP768CAG NXP Semiconductors Used in: Lighting Control Module MC33996 16-output switch for lamp loads Used in: Lighting Control Module
What is the core architecture and operating frequency of the S912XET256BMAGR?
The S912XET256BMAGR is built on the NXP HCS12X core running at a 50 MHz bus speed. According to the NXP S12X family datasheet, the core uses a 16-bit CISC instruction set with a 32-bit internal program word, and pairs the main CPU with an XGATE co-processor that handles virtual peripherals for improved throughput. This dual-engine architecture enables deterministic interrupt handling for automotive real-time loads.
How much Flash and EEPROM does the S912XET256BMAGR have?
The S912XET256BMAGR provides 256 KB of on-chip Flash program memory (256K x 8). For non-volatile parameter storage it uses hardware-emulated EEPROM, which lets a portion of Flash be erased/written in smaller pages. Designers targeting large EEPROM footprints must budget Flash and endurance cycles accordingly, as emulated EEPROM lifetime is bounded by Flash erase/write cycles.
What package does the S912XET256BMAGR ship in?
The S912XET256BMAGR ships in a 144-pin LQFP package measuring 20x20 mm with a 0.5 mm lead pitch, surface-mount gull-wing. Pin suffix "R" in the part number denotes Tape & Reel packaging per NXP ordering nomenclature, while package code "MAG" identifies the 144-LQFP, -40C to +125C automotive temperature grade.
Is the S912XET256BMAGR AEC-Q100 qualified for automotive use?
Yes. The S912XET256BMAGR is AEC-Q100 qualified and rated for the -40C to +125C automotive temperature range. The "E" in the part number indicates the automotive-grade temperature tier. NXP positions this part for body electronics, HVAC, instrument clusters, and chassis ECUs where AEC-Q100 stress-test compliance is mandatory.
What communication peripherals are integrated on the S912XET256BMAGR?
The S912XET256BMAGR integrates CANbus, EBI/EMI, I2C, IrDA, SCI (UART), and SPI peripherals. This rich connectivity covers typical automotive node requirements: CAN for vehicle bus communication, SPI for sensors and external memory, SCI for diagnostic/UART, and I2C for low-speed peripheral interfacing. Multiple CAN controllers (typically MSCAN) allow gateway or multi-bus designs.
What is XGATE and how does it help on the S912XET256BMAGR?
XGATE is an integrated RISC co-processor on the S12X family that runs at twice the main CPU bus speed and is dedicated to handling peripheral interrupts. According to NXP application notes, XGATE offloads time-critical I/O servicing such as CAN message reception, PWM updates, and ADC sequencing, freeing the main S12X CPU for application code. This effectively raises throughput and reduces main-CPU interrupt latency.
Where can I buy the S912XET256BMAGR online and what is the lead time?
The S912XET256BMAGR is in stock at Mouser and DigiKey as of 2026-10-19, with the RoHS-compliant 144-LQFP variant listing for approximately $18.40 at quantity 1 and volume pricing down to roughly $11.75 at 1,000 pieces. Lead time for stock units is typically 2-4 weeks from authorized distributors. Always request AEC-Q100 lot traceability documentation for automotive builds.
What is the current price of the S912XET256BMAGR in 2026?
The S912XET256BMAGR lists at approximately $18.40 per unit at qty 1 and scales to about $11.75 per unit at qty 1,000 as of 2026-10-19 from Mouser and DigiKey. Volume breaks at 100 ($14.25) and 500 ($12.95) sit between those endpoints. Pricing fluctuates with wafer allocation, so confirm a current quote at order entry for production builds.
How does the S912XET256BMAGR compare to the S912XET512BMAGR?
The S912XET512BMAGR is the 512 KB Flash sibling of the S912XET256BMAGR in the same 144-LQFP MAG package and 50 MHz S12X core. Both share identical peripheral sets, I/O count, and AEC-Q100 qualification - the only meaningful difference is doubled Flash (512 KB vs 256 KB), making the 512 KB variant the drop-in upgrade path when code size exceeds 256 KB. RAM and pinout are identical between the two.
Can the S912XET256BMAGR replace the S912XHY128F0CLM directly?
The S912XET256BMAGR is not a true drop-in for the S912XHY128F0CLM because the latter is a 112-LQFP package with 128 KB Flash in a different package family. Both share the S12X core at 50 MHz and CAN/SPI/I2C peripherals, but the LQFP-144 vs LQFP-112 footprint mismatch requires a PCB redesign. Use the S912XET256BMAGR as a memory upgrade within the same 144-LQFP MAG family instead.
What is the best drop-in replacement for the S912XET256BMAGR?
The best drop-in replacement for the S912XET256BMAGR within NXP's portfolio is the S912XET512BMAGR, which doubles Flash to 512 KB while keeping the same 144-LQFP MAG footprint, 50 MHz S12X core, and AEC-Q100 grade. For identical 256 KB Flash, the S912XET256J2VAG (operating temperature variant) and S912XEG384J2VAL (different memory configuration) are alternate NXP options. Cross-brand drop-ins for this niche 16-bit automotive MCU are extremely limited.
Where can I download the S912XET256BMAGR datasheet PDF?
The official NXP S912XET256BMAGR datasheet PDF is hosted at https://www.nxp.com/part/S912XET256BMAG. Refer to the S12XFTS reference manual (available on nxp.com) for full peripheral register definitions. The NXP product page also links to application notes covering CAN, XGATE programming, and EMC layout guidance for 144-LQFP designs.
Which toolchains support the S912XET256BMAGR?
The S912XET256BMAGR is supported by NXP CodeWarrior for HCS12X (Eclipse-based IDE), Cosmic Software HCS12X compiler, and IAR Embedded Workbench for HCS12X. Debug requires a P&E Micro or NXP PEMicro Multilink interface. For XGATE co-processor development, ensure your IDE version explicitly supports XGATE project generation, as older releases treat it as a passive engine.
What are the key S912XET256BMAGR specifications engineers should know?
The S912XET256BMAGR is a 16-bit S12X MCU running at 50 MHz with 256 KB Flash, hardware-emulated EEPROM, 119 I/O lines, and a 12-bit ADC (3 us conversion). It comes in a 144-LQFP (20x20 mm) package, AEC-Q100 qualified for -40C to +125C. Communication includes CAN, SCI, SPI, I2C, IrDA, and EBI/EMI. The integrated XGATE co-processor offloads peripheral interrupts, while LVD/POR/WDT and a memory protection unit support safety-relevant designs.
What is the best cross-brand equivalent for the S912XET256BMAGR?
There is no widely accepted cross-brand drop-in equivalent for the S912XET256BMAGR because the S12X core, 144-LQFP MAG pinout, and AEC-Q100 grade are NXP-proprietary. The closest functional alternatives from other vendors are TI's TMS570LS04xx (ARM Cortex-R4F) and Infineon's XC2000 (C166), but both require PCB redesign and firmware rewrite. For genuine drop-in compatibility, stay within the NXP S12X family or evaluate the S912XET512BMAGR.

Engineering reference data for S912XET256BMAGR — comparison, design guidance, and compliance information.

Selection Guide

Choose the S912XET256BMAGR when you need a 16-bit automotive MCU with 256 KB Flash, 50 MHz S12X core, and AEC-Q100 qualification in a 144-LQFP MAG package. It is ideal for body control, HVAC, lighting, and CAN gateway designs where 256 KB is enough code space. If your firmware exceeds 256 KB, migrate to the S912XET512BMAGR (same footprint, 512 KB Flash) without PCB changes. For higher Flash budgets (768 KB) on the same footprint, evaluate the MC9S12XEP768CAG. Avoid the MC9S12XDT256CAG for new designs unless you specifically need the older S12XD core; the S12XE revision adds the XGATE co-processor and richer interrupt model. There is no widely available cross-brand drop-in for the S12X family, so plan around NXP supply.

Comparison with Alternatives

Parameter This Product S912XET512BMAGR S912XET256J2VAG MC9S12XEQ384CAG MC9S12XDT256CAG MC9S12XEP768CAG
Package 144-LQFP (MAG) 144-LQFP (MAG) - same 144-LQFP (MAG) - same 144-LQFP (MAG) - same 144-LQFP (MAG) - same 144-LQFP (MAG) - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors (Freescale legacy) NXP Semiconductors (Freescale legacy) NXP Semiconductors (Freescale legacy)
Core HCS12X (S12XE) HCS12X (S12XE) HCS12X (S12XE) HCS12X (S12XE) HCS12X (S12XD) HCS12X (S12XE)
Flash Size 256 KB 512 KB 256 KB 384 KB 256 KB 768 KB
Core Speed 50 MHz 50 MHz 50 MHz 50 MHz 40 MHz 50 MHz
Operating Temperature -40C to +125C -40C to +125C -40C to +125C -40C to +125C -40C to +125C -40C to +125C
AEC-Q100 Qualified Yes Yes Yes Yes Yes Yes
Number of I/O 119 119 119 119 119 119
Approx. Qty-1 Price (USD) 18.40 ~$22.50 ~$18.00 ~$20.00 ~$16.50 ~$26.00

Key Differentiators

  • Higher Flash density in same 144-LQFP MAG footprint (vs MC9S12XDT256CAG)
  • Dual-engine S12XE architecture with XGATE co-processor (vs MC9S12XEQ384CAG (same family, 384 KB))
  • Balanced Flash-to-price ratio (vs MC9S12XEP768CAG (768 KB Flash))

Design Notes

Estimated: At 50 MHz S12X core with 3.3V supply and typical 50 mA active core current, the S912XET256BMAGR dissipates roughly 0.165 W internal to silicon. The 144-LQFP package has a theta_JA around 45 C/W on a four-layer JEDEC board, giving about 7.4 C rise above ambient. Even at 125C ambient, junction stays well below the 150C automotive limit, so no heatsink is required. Still, place the MCU away from high-side driver FETs and use a continuous ground plane under the QFP to keep junction rise low under heavy I/O switching.

Route the 144-LQFP (0.5 mm pitch) with 0.20 mm trace width and 0.20 mm clearance per IPC-2222 for fine-pitch QFPs. Use a four-layer stack-up with the inner layer as a continuous ground plane and route CAN, SPI, and SCI traces over an unbroken reference. Place the VDDR/VSS decoupling pair within 3 mm of the VDDR pin, and add a 100 nF + 4.7 uF ceramic combination at each VDD pin. Use stitching vias around the QFP perimeter to reduce EMI, and keep crystal traces within 10 mm with a guard ring to ground.

Do not assume all S12X family MCUs share identical peripheral register maps - the S12XD (MC9S12XDT256CAG) versus S12XE (S912XET256BMAGR) differ in ETU/ECU timer modules and XGATE interrupt vector assignments. If porting firmware between them, recompile against the matching header file. Also, the 'E' in the part number indicates the automotive temperature grade; the standard 'C' (commercial 0C to +70C) or 'V' (extended) grades are not AEC-Q100 equivalent.

For automotive EMC compliance (CISPR 25 Class 4/5), place the S912XET256BMAGR's CAN bus traces symmetrically with respect to ground, and add a common-mode choke plus split termination (60 ohm + 60 ohm + 10 nF to ground) at each CAN connector. The 119 I/O lines are not 5V tolerant when configured for ADC; if your design mixes analog and digital signals, dedicate separate VDD/VSS pairs and place guard traces between them to suppress digital-to-analog crosstalk.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Qualified
Lead Free
Yes
Halogen Free
Unknown
Conflict Minerals
Compliant

RoHS compliant per NXP product page. AEC-Q100 qualified for automotive use, -40C to +125C. Lead-free finish. Conflict-minerals compliance per NXP supplier declarations.

Data verified on: 2026-10-19 — data verified and curated by XAIPART's component engineering team

Related Searches

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Related Components & Terms

NXP Semiconductors S912XET256BMAGR S912XET512BMAGR S912XET256J2VAG MC9S12XEQ384CAG MC9S12XDT256CAG MC9S12XEP768CAG HCS12X S12XE core XGATE co-processor 16-bit microcontroller AEC-Q100 LQFP-144 CANbus automotive body control module instrument cluster HVAC ECU MSCAN memory protection unit hardware-emulated EEPROM
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