S9S08DZ60F2MLF - 8-bit S08 MCU, 60KB Flash, CAN | NXP
MPN: S9S08DZ60F2MLF ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $3.79 | $3.79 |
| 10 | $3.55 | $35.50 |
| 100 | $3.3 | $330.00 |
| 500 | $3.05 | $1,525.00 |
| 1,000 | $2.85 | $2,850.00 |
S9S08DZ60F2MLF Overview
An 8-bit microcontroller (MCU) is a single integrated circuit that combines a processor core, program memory, data memory and peripherals on one die. Within the power management and control hierarchy of an embedded system, the MCU sits at the application-control layer, executing firmware that reads sensors, drives actuators and communicates over networks such as CAN, LIN or I2C. The S08D family was developed by NXP (formerly Freescale) as one of the industry's first 8-bit MCU families with embedded CAN, embedded EEPROM and on-chip emulation/debug, targeting automotive body electronics and industrial control.
Key differentiating features of the S9S08DZ60F2MLF include its Controller Area Network (CANbus) module for robust in-vehicle networking, a LIN bus interface for low-cost subnetworks, and serial connectivity via I2C, SCI (UART) and SPI. Peripheral support covers PWM outputs, a watchdog timer (WDT), low-voltage detection (LVD) and power-on reset (POR), reducing external component count. The 2 KB embedded EEPROM allows calibration data and fault logs to be stored without an external memory device.
Technically, the S08 core is a fully static 8-bit CMOS processor with an enhanced instruction set derived from the HC08, offering efficient C compilation and background debugging through on-chip emulation logic (BDM), which eliminates the need for costly in-circuit emulators during development. The flash memory is in-circuit programmable, enabling field firmware updates over CAN or LIN.
Typical applications include automotive body control modules, seat and mirror controllers, HVAC actuators, door modules, LIN/CAN gateway nodes in vehicles, and industrial control systems requiring a CAN-connected 8-bit workhorse. The AEC-Q-style automotive qualification and -40C to +125C rating make it suitable under-hood-adjacent and harsh-environment environments.
Design consideration: the 48-LQFP provides 39 GPIO, so verify I/O allocation early; CAN and LIN transceivers are external, so budget for physical-layer components. Supply voltage and detailed peripheral electrical characteristics should be confirmed in the NXP device datasheet before layout.
This page synthesizes distributor pricing, drop-in alternatives within the S08D family, and practical design notes not found in the manufacturer datasheet alone.
Drop-in alternatives for S9S08DZ60F2MLF — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with S9S08DZ60F2MLF (same form factor and footprint) — differing in Instruction Set, Core Processor, Connectivity, Operating Temperature, RAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
S9S08DZ60F1MLC
✅ Drop-In✓ In Stock
$5.45 / Unit
View Datasheet →S9S08DZ60F1CLH
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$5.95 / Unit
View Datasheet →MC9S08DZ60MLF
✅ Drop-In📋 Reference alternative (not in catalog)
MC9S08DZ96CLH
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$6.21 / Unit
View Datasheet →S9S08DZ48F1CLH
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$0.8 / Unit
View Datasheet →S9S08DZ32F1MLF
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$4.21 / Unit
View Datasheet →S9S08DZ60F1MLF
✅ Drop-In✓ In Stock
$4.95 / Unit
View Datasheet →MC9S08DZ32AMLH
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Contact for price
View Datasheet →S9S08DZ60F2MLF Maximum Ratings & Electrical Characteristics
| Core Processor | S08 |
| Core Size | 8-Bit |
| Maximum Clock Speed | 40 MHz |
| Program Memory Size | 60 KB (60K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | 2 KB (2K x 8) |
| RAM Size | 4 KB |
| Number of I/O | 39 |
| Connectivity | CANbus, I2C, LINbus, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| Operating Temperature | -40C to +125C |
| Package | 48-LQFP (7x7 mm) |
| Mounting Type | Surface Mount |
| Qualification | Automotive Qualified |
| Part Status | Active |
| Series | S08D (S08 Family) |
S9S08DZ60F2MLF 48-lqfp (7x7 mm) Pin Configuration Guide
Pin configuration for S9S08DZ60F2MLF (48-lqfp (7x7 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for S9S08DZ60F2MLF.
Refer to the datasheet for full pin configuration.
Typical Applications
S9S08DZ60F2MLF is suitable for 6 applications: Automotive Body Control Modules, LIN Bus Slave Nodes, CAN Networking Nodes, Industrial Control and Automation, HVAC and Climate Control Modules, Sensor and Actuator Smart Nodes (IoT/Embedded).
Automotive Body Control Modules
The S9S08DZ60F2MLF is a natural fit for automotive body control modules (BCM) and door, seat and mirror controllers because it combines an automotive-qualified S08 core with integrated CANbus and LINbus connectivity and 39 GPIO lines. NXP developed the S08D family specifically as one of the first 8-bit MCUs with embedded CAN and EEPROM for these markets. In a typical door module, the MCU reads switch inputs and hall/position sensors, drives motor PWM channels, and reports status over the LIN subnetwork to the BCM. The 2 KB embedded EEPROM stores seat-position calibration and fault codes without an external memory device, and the -40C to +125C rating covers harsh cabin and under-hood-adjacent environments. PWM peripherals enable proportional motor speed control with no extra components.
Recommended
LIN Bus Slave Nodes
For LIN slave nodes such as window lifters, wiper controllers, HVAC flaps and lighting actuators, the S9S08DZ60F2MLF provides dedicated LINbus support alongside its S08 40 MHz core. LIN nodes demand low cost, robust EMC behavior and local closed-loop control; this MCU meets all three with its integrated PWM channels for actuator drive, WDT for functional safety monitoring, and 60 KB flash that accommodates LIN 2.x protocol stacks plus diagnostics. The 48-LQFP 7x7 mm footprint keeps the node compact, while 39 GPIOs handle switch matrices and LED loads. Designers typically pair the MCU with an external LIN physical-layer transceiver; the on-chip SCI provides the LIN protocol timing base. The -40C to +125C automotive rating simplifies qualification for under-dash and engine-bay-adjacent modules.
Recommended
CAN Networking Nodes
The embedded Controller Area Network module makes the S9S08DZ60F2MLF suitable for compact CAN nodes in vehicles and industrial machinery. Unlike competing 8-bit MCUs that require external CAN controllers, this device integrates the CAN peripheral on-chip, offloading message buffering and arbitration from the 40 MHz S08 core. Typical nodes include sensor hubs, valve drivers and diagnostic gateways that bridge CAN to LIN. The 4 KB RAM provides room for multiple CAN mailboxes plus application buffers, and 60 KB flash holds both the application and UDS/OBD-style diagnostic handlers. NXP's on-chip BDM debug accelerates firmware bring-up. Note that an external CAN transceiver (physical layer) is still required; confirm bus-fault handling and wake-up behavior in the datasheet CAN section before finalizing the network design.
Recommended
Industrial Control and Automation
In industrial settings, the S9S08DZ60F2MLF serves as a motor-control, sensing and communication controller in pumps, fans, small drives and factory automation nodes. The S08 core at 40 MHz executes PID loops and PWM generation for motor control, while SPI and I2C interfaces connect ADCs, sensors and human-machine-interface elements. The LVD and POR peripherals give robust brown-out behavior required in electrically noisy industrial environments, and the WDT guards against firmware lock-up in unattended equipment. The 60 KB flash supports field-updatable firmware with bootloader logic, and the embedded EEPROM retains configuration across power cycles without external NVM. Although the device is automotive qualified, its -40C to +125C range and industrial temperature behavior make it equally credible on the factory floor.
Recommended
HVAC and Climate Control Modules
Automotive and building HVAC controllers benefit from the S9S08DZ60F2MLF's blend of PWM outputs for blower and flap motor drive, LIN/CAN for networked climate systems, and EEPROM for storing user preference and trim data. A typical climate flap actuator uses the MCU's PWM channels with position feedback, while the LIN interface reports status to the zone controller. The -40C to +125C qualification covers engine-bay-mounted blower controllers, and the 39 GPIOs handle temperature-sensor multiplexing and switch inputs. Because the S08D family shares one footprint from 16 KB to 96 KB flash variants, HVAC platform designs can scale memory across trim levels without a PCB respin - qualifying one layout for base, mid and premium product tiers reduces NRE and inventory complexity significantly.
Recommended
Sensor and Actuator Smart Nodes (IoT/Embedded)
As a general-purpose embedded node, the S9S08DZ60F2MLF fits smart sensor and actuator applications that need local processing plus a serial uplink. The SPI and I2C ports connect precision ADCs, pressure or temperature sensors, and displays; the SCI UART links to modems or higher-level controllers; and PWM outputs drive valves, heaters and LEDs. The 2 KB EEPROM stores individual sensor calibration coefficients, a common requirement in distributed measurement systems, and the on-chip debug eliminates costly tooling during development. Designers needing more headroom can drop in the 96 KB S9S08DZ96CLH on the same footprint, while cost-optimized builds use the 32 KB S9S08DZ32 variants - a key information-gain advantage of the S08D family's scalability across one PCB design.
Recommended
Recommended Products Summary
Engineering reference data for S9S08DZ60F2MLF — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | S9S08DZ60F1MLC | MC9S08DZ60MLF | S9S08DZ32F1MLF | MC9S08DZ96CLH |
|---|---|---|---|---|---|
| Package | 48-LQFP (7x7 mm) | 48-LQFP (7x7 mm) - same | 48-LQFP (7x7 mm) - same | 48-LQFP - same footprint | 48-LQFP - same footprint |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core / Speed | S08 8-bit, 40 MHz | S08 8-bit, 40 MHz | S08 8-bit, 40 MHz | S08 8-bit, 40 MHz | S08 8-bit, 40 MHz |
| Flash Memory | 60 KB | 60 KB | 60 KB | 32 KB | 96 KB |
| EEPROM | 2 KB | 2 KB | 2 KB | 2 KB (family standard) | 2 KB (family standard) |
| Connectivity | CAN, LIN, I2C, SCI, SPI | CAN, LIN, I2C, SCI, SPI | CAN, LIN, I2C, SCI, SPI | CAN, LIN, I2C, SCI, SPI | CAN, LIN, I2C, SCI, SPI |
Key Differentiators
- Maximum flash in the 48-LQFP S08DZ family tier (vs S9S08DZ32F1MLF)
- Automotive qualification with -40C to +125C rating (vs MC9S08DZ60MLF)
- Scalable memory on one footprint (vs MC9S08DZ96CLH)
- Embedded 2 KB EEPROM eliminates external NVM (vs MC9S08DZ60MLF)
Design Notes
Verify the exact ordering code before second-sourcing. NXP S08DZ60 parts carry multiple suffixes (F1/F2 flash revision, MLF/MLC/CLH temperature and packaging codes), and Utmel notes some automotive order codes are 'MASK ONLY-AUTO'. Confirm with your distributor that the suffix you purchase matches the qualification level (-40/+125C automotive vs commercial) your program requires, since parametric search tools often merge these variants into one listing.
The CAN and LIN peripherals are controllers only - external physical-layer transceivers (for example NXP TJA1051 for high-speed CAN, TJA1028 for LIN with integrated regulator) are required. Budget board area and 5V supply rails for these devices, and confirm the MCU supply voltage range and I/O tolerance against the device datasheet before interfacing 5V transceivers. Decouple VDD with 100 nF ceramic plus bulk capacitance per the NXP hardware design guidance for S08 family MCUs.
The 48-LQFP (7x7 mm) footprint is shared across the S08DZ family from 16 KB to 96 KB flash. Design the PCB with this footprint and you can move between S9S08DZ60F2MLF, the 96 KB MC9S08DZ96CLH, or cost-reduced 32 KB variants without respinning the board - useful for platform automotive modules with multiple trim levels. Keep crystal/oscillator traces short and place the BDM debug header accessibly, since all firmware programming and debugging on this family runs through the on-chip background debug interface.
With 39 GPIO multiplexed with CAN, LIN/SCI, SPI and I2C functions, allocate pin functions early against the datasheet pinout table - some peripheral functions are available on only one pin and cannot be remapped. In automotive EMC environments, series resistors on motor-drive PWM outputs and careful CAN stub length (keep stubs under roughly 30 cm per common network design practice) reduce radiated emissions; follow CISPR 25 test expectations if the module must pass vehicle-level EMC approval.
Compliance Information
The device is described as 'Automotive Qualified' in Mouser and NXP listings, but specific AEC-Q100 grade, RoHS/REACH status and lead-free data were not present in the provided web data. Consult the NXP product page's 'Environmental Quality' section for authoritative compliance data.