S9S08DZ60F1MLC - 8-bit MCU, 60KB Flash, CAN, 32-LQFP | NXP
MPN: S9S08DZ60F1MLC ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.95 | $8.95 |
| 10 | $8.1 | $81.00 |
| 100 | $7.05 | $705.00 |
| 500 | $6.2 | $3,100.00 |
| 1,000 | $5.45 | $5,450.00 |
S9S08DZ60F1MLC Overview
An 8-bit microcontroller (MCU) is a single-chip processor with on-board Flash program memory, RAM, peripherals, and interrupt control, optimized for embedded control in cost-sensitive and real-time systems. The HCS08 core is the enhanced successor to the HC08 architecture, offering the same HC08 instruction set with the addition of BGND (background debug) and higher code density. Within the broader hierarchy, the S08DZ60 belongs to the microcontrollers (MCU) category of integrated circuits, then to the 8-bit MCU subcategory, then to the automotive-grade segment.
Key features include 60 KB Flash (60K x 8), 4 KB SRAM, on-chip EEPROM emulation, an MSCAN controller for CAN 2.0A/B networking, a 40 MHz CPU with a 20 MHz bus, and support for up to 32 interrupt/reset sources. The S9S08DZ60F1MLC variant carries the M74K mask set designation ("MASK ONLY-AUTO") and is qualified to automotive temperature grade (-40C to +125C). The 32-LQFP (7x7 mm) package supports surface-mount assembly and provides ample GPIO for body, chassis, and sensor interface applications.
Typical applications include automotive body controllers, CAN nodes (door modules, seat controllers, mirror modules), industrial sensor hubs, LIN/CAN gateway bridges, and low-end instrument clusters. The combination of on-chip CAN and 60 KB Flash simplifies BOM and PCB layout in distributed automotive networks.
When designing with this MCU, ensure the BDS (background debug) interface is accessible for in-circuit programming and that the VDDA/VREF decoupling follows NXP reference design guidance. Use the on-chip CAN controller with an external CAN transceiver (e.g. TJA1050 or TJA1040). The "F1" mask set designation means the part is shipped with the F1 firmware mask pre-programmed, so this SKU is intended for production runs against the M74K firmware baseline rather than for general development.
This page synthesizes distributor pricing, drop-in alternative MPNs (same LQFP-32 footprint), and practical design considerations for production engineers, providing actionable information not found in the manufacturer datasheet alone.
Drop-in alternatives for S9S08DZ60F1MLC — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with S9S08DZ60F1MLC (same form factor and footprint) — differing in Package, Core, Operating Temperature, Program Memory Size, RAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
S9S08DZ60F2MLC
✅ Drop-In📋 Reference alternative (not in catalog)
S9S08DZ60F1MLF
✅ Drop-In✓ In Stock
$4.95 / Unit
View Datasheet →S9S08DZ60F2MLF
✅ Drop-In✓ In Stock
$2.85 / Unit
View Datasheet →S9S08DZ60F1MLH
✅ Drop-In📋 Reference alternative (not in catalog)
S9S08DZ96F2MLH
✅ Drop-In✓ In Stock
$7.25 / Unit
View Datasheet →S9S08DZ60F1MLC Maximum Ratings & Electrical Characteristics
| Core Architecture | HCS08 (enhanced HC08 with BGND) |
| CPU Speed | 40 MHz (20 MHz bus) |
| Program Flash | 60 KB (60K x 8) |
| RAM | 4 KB |
| CAN Controller | MSCAN (CAN 2.0A/B), 1 channel |
| SCI/UART | 2 channels |
| SPI | 1 channel |
| I2C | 1 channel |
| Operating Temperature | -40C to +125C (automotive grade) |
| Package | 32-LQFP (7x7 mm) |
| Mask Set / Marking | M74K (MASK ONLY-AUTO) |
| Mounting Type | Surface Mount |
S9S08DZ60F1MLC 32-lqfp (7x7 mm) Pin Configuration Guide
Pin configuration for S9S08DZ60F1MLC (32-lqfp (7x7 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for S9S08DZ60F1MLC.
Refer to the datasheet for full pin configuration.
Typical Applications
S9S08DZ60F1MLC is suitable for 6 applications: Automotive Body Control Module (BCM), CAN Node / Door Module, Industrial CAN Sensor Hub, Automotive Lighting Controller, HVAC Control Panel Interface, Battery Management Slave (Low-Voltage Cell Monitor).
Automotive Body Control Module (BCM)
The S9S08DZ60F1MLC fits automotive body controllers because its integrated MSCAN (CAN 2.0A/B), 60 KB Flash, 4 KB SRAM, and -40C to +125C automotive temperature grade cover typical BCM requirements. The HCS08 core running at 40 MHz with a 20 MHz bus delivers 20 MIPS, sufficient for CAN stack processing, lighting control logic, and switch/wake-up debouncing. The 32-LQFP footprint is small enough for space-constrained BCM PCBs that sit behind the dash. Place the MCU between the CAN bus transceiver and the load-driver FETs; the on-chip MSCAN eliminates the need for an external CAN controller IC, reducing BOM by one part versus older designs that paired an HC08 with a stand-alone CAN peripheral.
Recommended
CAN Node / Door Module
Door modules (window lift, mirror adjust, lock/unlock) are a primary target for the S9S08DZ60F1MLC. The 60 KB Flash accommodates a CANopen or OEM proprietary stack plus the application state machine, while 4 KB SRAM is enough for CAN message buffering and per-window position tracking. The automotive temperature grade matches door-mounted environments that see full cabin thermal swings. Use the 2x SCI channels for LIN sub-bus expansion (with external LIN transceiver) for mirror buttons or window switches, and the SPI channel for an external LED controller or stepper driver.
Recommended
Industrial CAN Sensor Hub
The S9S08DZ60F1MLC is well-suited for industrial sensor hubs that aggregate analog/digital sensor data and publish it on a CANopen or DeviceNet backbone. The HCS08 core has deterministic interrupt response suitable for time-triggered sensor polling, and the 60 KB Flash hosts the CANopen stack plus sensor-processing firmware. For industrial environments outside the automotive temperature window, the industrial-grade F1MLF variant in the same LQFP-32 package is a direct drop-in. Connect ADC inputs to industrial sensors (4-20 mA loop, RTD, thermistor bridge) and use the SCI channel as a Modbus UART service interface.
Recommended
Automotive Lighting Controller
Interior and exterior lighting controllers benefit from the S9S08DZ60F1MLC's combination of MSCAN, PWM-capable timers, and automotive temperature grade. The 60 KB Flash comfortably fits LED fade logic, CAN-based lighting commands (e.g. daylight running, sequential turn signals), and diagnostic handlers (lamp-out detection via current sense). Use PWM outputs to drive LED driver ICs and the MSCAN module to receive lighting commands from the BCM. The 32-LQFP package supports 0.8 mm lead pitch, which keeps the PCB smaller than 64- or 80-pin QFP lighting controllers used in higher-end designs.
Recommended
HVAC Control Panel Interface
HVAC control panels need a low-cost MCU with CAN, enough Flash for fan/blower PID loops, and a small QFP footprint. The S9S08DZ60F1MLC satisfies all three: 60 KB Flash for the HVAC state machine, MSCAN for chassis-CAN communication, and 32-LQFP for compact panel PCBs. Use the I2C bus to talk to an LCD or OLED display controller, the SPI bus to drive rotary encoder inputs, and SCI as a service/UART diagnostic port. The automotive temperature grade ensures reliable operation inside the dashboard across full climate extremes.
Recommended
Battery Management Slave (Low-Voltage Cell Monitor)
The S9S08DZ60F1MLC can serve as a low-voltage slave in distributed battery management architectures for 12V/48V automotive batteries. Its 60 KB Flash holds cell-balancing logic, temperature derating tables, and CAN reporting firmware; MSCAN links it to the master BMS over an isolated CAN bus. The 32-LQFP is small enough to fit on a per-cell PCB behind a battery module. Although this MCU lacks a high-voltage analog front end, paired with an external AFE such as the MC33771 or L9963, it provides the CAN networking, diagnostics, and housekeeping layer.
Recommended
Recommended Products Summary
Engineering reference data for S9S08DZ60F1MLC — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | S9S08DZ60F2MLC | S9S08DZ60F1MLF | S9S08DZ60F2MLF | S9S08DZ60F1MLH | S9S08DZ96F2MLH |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 32-LQFP (7x7 mm) | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same | 32-LQFP (7x7 mm) - same |
| Flash | 60 KB | 60 KB | 60 KB | 60 KB | 60 KB | 96 KB |
| CPU Speed | 40 MHz / 20 MHz bus | 40 MHz / 20 MHz bus | 40 MHz / 20 MHz bus | 40 MHz / 20 MHz bus | 40 MHz / 20 MHz bus | 40 MHz / 20 MHz bus |
| Mask Set / Marking | M74K (F1, MASK ONLY-AUTO) | F2 mask | M74K F1 industrial | F2 mask industrial | F1 mask alt reel | F2 mask, larger Flash |
| Temperature Grade | Automotive (-40C to +125C) | Automotive | Industrial | Industrial | Automotive | Automotive |
| CAN Controller | MSCAN (CAN 2.0A/B) | MSCAN (CAN 2.0A/B) | MSCAN (CAN 2.0A/B) | MSCAN (CAN 2.0A/B) | MSCAN (CAN 2.0A/B) | MSCAN (CAN 2.0A/B) |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB | 6 KB |
Key Differentiators
- F1 mask set pre-locked for production with M74K firmware baseline (vs S9S08DZ60F2MLC (F2 mask))
- Same 32-LQFP footprint across DZ60 family enables BOM consolidation (vs S9S08DZ96F2MLH (96 KB Flash, same package))
- 8-bit HCS08 architecture with deterministic interrupt latency (vs 32-bit Kinetis KE02 or S32K MCU)
Design Notes
Estimated: Decouple VDD/VSS pairs with 100 nF ceramic capacitors placed as close to the pins as possible (within 2 mm trace length). Add a bulk 10 uF tantalum or polymer capacitor near the MCU to supply transient current during MSCAN bus-state changes. The S08DZ60 family has separate VDDA/VREF pins - tie a 100 nF + 1 uF RC network to VREF for ADC reference stability. Per the MC9S08DZ60 datasheet, VDD must ramp monotonically from 0 V to operating voltage in less than the POR reset spec window; add a reset supervisor if the upstream regulator has slow or non-monotonic start-up.
Route the CANH/CANL differential pair from the external transceiver to the bus connector with 120 ohm characteristic impedance and matched length (delta < 5 mm). Keep the MCU's TXCAN/RXCAN traces short and away from switching load-driver traces (>3 mm clearance). The 32-LQFP ground paddle should be soldered to a continuous ground pour to provide thermal relief; the S08DZ60 family dissipates <100 mW in typical body-control use, so the ground pour is mainly for EMI shielding rather than heat sinking.
Do not assume any two S9S08DZ60 mask-set SKUs share firmware compatibility - the F1 (M74K) and F2 (M74L or later) mask sets may have minor silicon errata differences that affect ADC calibration, low-voltage detect (LVD) thresholds, and Flash erase timing. Verify firmware compatibility with the NXP errata sheet for the specific mask set before substituting F1 and F2 SKUs in production. Also avoid powering the MCU before its VDD has stabilized, or you may corrupt the Flash security byte and brick the part. Program the Flash security byte only after firmware has been fully validated.
When using the S9S08DZ60F1MLC's MSCAN at 1 Mbit/s, the TXCAN output has a propagation delay asymmetry budget of ~250 ns. Add a series 100 ohm-1 nF RC snubber on CANH/CANL if the bus length exceeds 10 m or if you observe ringing above 50 mV peak. For SCI/UART baud rates above 115.2 kbps, ensure the UART baud-rate error is below 2% by selecting appropriate bus-clock divider values; the HCS08 SCI is more sensitive to baud-rate error than modern UART peripherals.
Compliance Information
AEC-Q100 qualified per automotive mask-set marking ("MASK ONLY-AUTO") and -40C to +125C operating range. Explicit RoHS, REACH, lead-free, halogen-free, and conflict-mineral declarations not present in the verified web data; set to 'unknown' rather than guess.