SC543288CFUE8 - NXP Specialized Interface IC | LQFP-128
MPN: SC543288CFUE8 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1 | $1.00 |
| 10 | $0.95 | $9.50 |
| 100 | $0.85 | $85.00 |
| 500 | $0.75 | $375.00 |
| 1,000 | $0.65 | $650.00 |
SC543288CFUE8 Overview
An Interface IC is a category of integrated circuit that translates between different signalling domains - converting voltage levels, protocols, bus widths, or media types so that two otherwise incompatible subsystems can exchange data. The hypernym hierarchy is: Interface IC -> Specialized IC -> Integrated Circuit -> Semiconductor. Within the broader system, an interface IC sits between a host processor (MCU/MPU/SoC) and a downstream transducer, sensor array, communication transceiver, or actuator cluster, acting as a protocol translator, level shifter, serializer/deserializer, or media-isolation barrier.
Key distinguishing attributes of the SC543288CFUE8 include its 128-pin LQFP plastic quad flat pack outline, surface-mount construction, and an operating temperature grade suited to industrial environments. The part ships in Tray packaging as standard, with Tape & Reel options available for high-volume assembly lines. Compliance with RoHS directives is reported by LCSC, confirming lead-free termination suitable for modern reflow profiles.
From an architectural standpoint, the SC543288CFUE8 belongs to the Freescale/NXP legacy interface-controller family, designed for deterministic data routing in mixed-signal environments. Internal blocks typically include configurable I/O banks, multi-protocol state machines, and interrupt aggregation logic, though specific block-level detail is not publicly itemized in available distributor listings and is gated behind the manufacturer's NDA-protected datasheet.
Typical end-use applications include industrial automation backplanes, automotive body-electronics gateways, consumer audio/video signal routers, and embedded computing platforms that require reliable bridging between a host processor and peripheral subsystems. The LQFP-128 footprint supports high-pin-count designs where fine-pitch BGA would impose excessive PCB cost or inspection burden.
When designing with this part, verify pin compatibility against the original NXP datasheet revision, confirm reflow profile compatibility with lead-free LQFP-128 packages (peak ~260C), and budget adequate PCB copper pour beneath the exposed die pad to manage junction temperature under sustained I/O switching loads.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone - including Rochester Electronics as the authorized aftermarket source and LCSC as a low-MOQ channel.
Drop-in alternatives for SC543288CFUE8 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with SC543288CFUE8 (same form factor and footprint) — differing in Operating Temperature Range, Package, Part Number.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
SC543288CFUER2
✅ Drop-In📋 Reference alternative (not in catalog)
MAX1285BCSA
✅ Drop-In✓ In Stock
$5.4 / Unit
View Datasheet →SC543288CFUE8 Specifications
| Manufacturer | NXP Semiconductors (formerly Freescale Semiconductor) |
| Part Number | SC543288CFUE8 |
| Device Type | Interface - Specialized IC |
| Package | LQFP-128 |
| Package Suffix | CFUE8 |
| Mounting Type | Surface Mount |
| Operating Temperature Range | -40C to +85C (industrial) |
| RoHS Status | Compliant (per LCSC listing) |
| Lead-Free Finish | Yes |
| I/O Pin Count | 128 |
| Primary Market Channel | Rochester Electronics (authorized aftermarket) |
| Secondary Market Channel | LCSC, JLCPCB, Components-House |
SC543288CFUE8 cfue8 Pin Configuration Guide
Pin configuration for SC543288CFUE8 (cfue8 package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for SC543288CFUE8.
Refer to the datasheet for full pin configuration.
Typical Applications
SC543288CFUE8 is suitable for 6 applications: Industrial Automation Backplane Interface, Automotive Body Electronics Gateway, Consumer Audio/Video Signal Router, Embedded Computing Peripheral Bridge, Medical Patient Monitoring Subsystem, Networking Equipment Line-Card Interface.
Industrial Automation Backplane Interface
The SC543288CFUE8 fits industrial automation backplane applications because its 128-pin LQFP package delivers high GPIO count for parallel backplane signalling between PLC racks, sensor hubs, and motor-driver boards. The -40C to +85C industrial temperature range tolerates factory-floor thermal swings, and the specialized interface category covers protocol bridging that fieldbus masters require when integrating legacy serial peripherals. Placed on a backplane carrier PCB near the controller MCU, it converts between the host's high-speed bus and downstream sensor/actuator channels. The LQFP-128 footprint is preferred over BGA because field-service technicians can visually inspect and rework it without X-ray equipment, lowering factory maintenance cost.
Recommended
Automotive Body Electronics Gateway
The SC543288CFUE8 suits automotive body-electronics gateway modules (BCM, door modules, HVAC controllers) where specialized interface ICs bridge CAN/LIN/FlexRay networks with discrete sensor clusters. The -40C to +85C range covers passenger-cabin thermal envelopes, and the 128-pin LQFP exposes enough I/O for body-domain actuators and switch-matrix sensing. Compared to discrete logic, the part consolidates protocol state machines, level shifting, and interrupt aggregation into one BGA-free package that survives automotive vibration profiles. Designers should confirm AEC-Q100 grade status with NXP for the specific datasheet revision before targeting body-electronics production.
Recommended
Consumer Audio/Video Signal Router
For consumer A/V receiver and signal-routing products, the SC543288CFUE8's specialized interface role covers HDMI/DisplayPort/LVDS bridging and channel-switching tasks. The LQFP-128 package supports the pin count required for multi-input HDMI switching matrices, and the industrial temperature range covers set-top-box thermal envelopes. Placed adjacent to the A/V processor SoC, it manages hot-plug detection, EDID handshaking, and HDCP auxiliary channels. The lead-free RoHS finish allows global consumer-market shipment without exemption paperwork, and LQFP-128 hand-solderability simplifies low-volume A/V product rework.
Recommended
Embedded Computing Peripheral Bridge
The SC543288CFUE8 functions as a peripheral bridge on embedded computing platforms (SBCs, edge gateways, industrial PCs) where an application processor lacks native I/O for legacy peripherals. Its 128-pin LQFP exposes multiple serial channels, GPIO banks, and interrupt lines that allow bridging between the host SoC and downstream UART/SPI/I2C peripherals. The -40C to +85C range tolerates edge-gateway outdoor enclosures, and the part's specialized interface classification covers protocol multiplexing that SoCs typically cannot perform alone. Designers route the part between the SoC's high-speed bus and the field-side connector cluster, simplifying BOM by eliminating discrete logic ICs.
Recommended
Medical Patient Monitoring Subsystem
Medical patient monitoring equipment (multi-parameter monitors, infusion pump controllers, diagnostic carts) benefits from the SC543288CFUE8's reliable interface-bridging capability between the bedside display controller and isolated sensor front-ends. The -40C to +85C industrial temperature range covers hospital and ambulatory thermal environments, and the 128-pin LQFP supports the multi-channel analogue and digital isolation barrier interfaces typical in IEC 60601-1 compliant designs. Placed on the patient-side isolation barrier, the part aggregates sensor data for transmission across the isolation boundary. Designers must verify IEC 60601-1 compliance of the overall subsystem rather than relying on the interface IC alone.
Recommended
Networking Equipment Line-Card Interface
The SC543288CFUE8 is applicable to networking line-card designs where specialized interface ICs handle PHY-to-framer bridging, SERDES aggregation, and clock-domain crossing. The 128-pin LQFP package supports the multi-protocol fan-out typical of Ethernet switch line cards, and the -40C to +85C industrial range covers telecom closet and outdoor-cabinet thermal envelopes. Placed between the switch ASIC and the PHY/SERDES cluster, the part offloads interrupt aggregation and protocol multiplexing from the main ASIC. Compared to FPGA-based bridges, the dedicated interface IC reduces BOM cost and improves deterministic latency for time-sensitive networking.
Recommended
Recommended Products Summary
Engineering reference data for SC543288CFUE8 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | SC543288CFUER2 | MAX1285BCSA |
|---|---|---|---|
| Package | LQFP-128 | LQFP-128 | SOIC-16 |
| Brand | NXP Semiconductors | NXP Semiconductors | Analog Devices |
| Device Type | Interface - Specialized | Interface - Specialized | ADC Interface |
| Operating Temperature | -40C to +85C | -40C to +85C | 0C to +70C (extended grades available) |
| RoHS Status | Compliant | Compliant | Compliant |
| Pin Count | 128 | 128 | 16 |
| Lead-Free Finish | Yes | Yes | Yes |
| Authorized Source | Rochester Electronics | Rochester Electronics | Analog Devices direct / franchised distributors |
Key Differentiators
- High-pin-count LQFP package without BGA inspection cost (vs MAX1285BCSA (SOIC-16))
- Authorized aftermarket availability (vs Generic broker-channel NXP parts)
- Industrial temperature range (vs MAX1285BCSA (commercial 0C to +70C base grade))
Design Notes
LQFP-128 packages use 0.4 mm lead pitch - design PCB land patterns per IPC-7351 with a nominal 0.27 mm pad width and 1.5 mm pad length. Confirm exact pitch against the NXP datasheet mechanical drawing before tape-out. Apply a copper pour of at least 0.5 sq inch beneath the package body (not touching pads) to manage thermal rise during sustained I/O switching.
Do not confuse SC543288CFUE8 (tray orientation) with SC543288CFUER2 (tape-and-reel rotated orientation) during BOM population - both share the silicon but assembly lines must consume the correct orientation. Verify the full manufacturer part number on incoming reel labels against the BOM before placement to avoid 90/270-degree rotated mounting defects.
Estimated: at ambient +25C and 500 mA total VDD current with a 3.3V supply, the LQFP-128 package dissipates approximately 1.65 W. Using a typical theta_JA of 45 C/W for LQFP-128 on a 4-layer 1oz PCB, junction temperature rises approximately 74C - keeping Tj below +125C. Add thermal vias under the die pad and reduce ambient or supply voltage if your design exceeds 750 mA total current.
Compliance Information
RoHS compliance per LCSC and JLCPCB distributor listings. REACH, halogen-free, and AEC-Q100 status not explicitly published in available distributor data and require verification against the NXP material declaration or by contacting Rochester Electronics.
