Si5330B-B00205-GM - 1:4 LVDS Clock Buffer 710 MHz 24-QFN
MPN: Si5330B-B00205-GM ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $5.42 | $5.42 |
| 10 | $4.91 | $49.10 |
| 100 | $4.05 | $405.00 |
| 500 | $3.42 | $1,710.00 |
| 1,000 | $2.88 | $2,880.00 |
Si5330B-B00205-GM Overview
A clock buffer is a fanout device that takes one reference clock and produces multiple, phase-aligned copies for routing across a printed circuit board. Within the broader clock-tree hierarchy, the Si5330B sits between an upstream PLL/oscillator (frequency generation) and downstream transceivers, ASICs, FPGAs, or ADCs (clock consumption). Unlike a PLL-based clock generator, a buffer preserves the input frequency exactly and only regenerates the edges, minimizing added jitter and avoiding frequency translation artifacts.
Key features include 710 MHz maximum input/output frequency, LVDS output format, 1:4 fanout, integrated input level translation (1.8 V, 2.5 V, or 3.3 V core with separate output-bank supply), and minimal crosstalk with strong supply-noise rejection. The exposed-pad QFN-24 package provides a low thermal resistance path for noise-sensitive systems.
The device uses a differential LVDS output stage with internal source-terminated architecture, yielding sub-picosecond additive jitter at typical reference frequencies. Independent VDD pins for the input core and the output bank allow level translation without external circuitry, simplifying mixed-voltage designs.
Typical applications include high-speed ADC/DAC sampling clocks, FPGA logic clock distribution, telecom/datacom line-card reference clocks, and PCI Express or serializer/deserializer reference fanout. Its low jitter makes it ideal for any noise-sensitive clock domain that needs a clean, multi-drop copy of a single reference.
When designing with the Si5330B, follow the datasheet recommended termination for both LVDS inputs and outputs (typically 100 ohm differential) and decouple each VDD pin with a 0.1 uF ceramic placed as close to the IC as possible. The exposed pad must be soldered to a continuous ground plane for both thermal dissipation and controlled impedance. The custom B00205 ordering code defines the factory-set input/output configuration, so verify the variant matches your board's required direction.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on any single distributor listing.
Drop-in alternatives for Si5330B-B00205-GM — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with Si5330B-B00205-GM (same form factor and footprint) — differing in Function, Number of Outputs, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
Si5330B-B00205-GMR
✅ Drop-In✓ In Stock
$4.55 / Unit
View Datasheet →Si5330B-A00205-GM
✅ Drop-In📋 Reference alternative (not in catalog)
Si5330B-B00204-GM
✅ Drop-In📋 Reference alternative (not in catalog)
Si5330B-B00206-GM
✅ Drop-In📋 Reference alternative (not in catalog)
Si5330B-B00205-GM Specifications
| Function | Clock fanout buffer (distribution), level translator |
| Number of Inputs | 1 |
| Number of Outputs | 4 differential (or 8 single-ended) |
| Fanout Ratio | 1:4 |
| Maximum Input Frequency | 710 MHz |
| Maximum Output Frequency | 710 MHz |
| Output Format | LVDS |
| Input Format | Single-ended or differential |
| Supply Voltage - Core | 1.8 V, 2.5 V, or 3.3 V |
| Supply Voltage - Output Bank | Independent of core supply |
| Propagation Delay | 4 ns (maximum, per datasheet Rev 1.0) |
| Operating Temperature Range | -40 C to +85 C |
| Package | 24-QFN with exposed pad |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
Si5330B-B00205-GM Pin Configuration
| Pin 1 | IN+ — Differential clock input, non-inverting |
| Pin 2 | IN- — Differential clock input, inverting |
| Pin 3 | VDD_CORE — Core supply voltage (1.8/2.5/3.3 V) |
| Pin 4 | GND — Ground |
| Pin 5 | Q0+ — LVDS output 0, non-inverting |
| Pin 6 | Q0- — LVDS output 0, inverting |
| Pin 7 | VDD_BANK0 — Output bank 0 supply |
| Pin 8 | GND — Ground |
| Pin 9 | Q1+ — LVDS output 1, non-inverting |
| Pin 10 | Q1- — LVDS output 1, inverting |
| Pin 11 | VDD_BANK1 — Output bank 1 supply |
| Pin 12 | GND — Ground |
| Pin 13 | Q2+ — LVDS output 2, non-inverting |
| Pin 14 | Q2- — LVDS output 2, inverting |
| Pin 15 | VDD_BANK2 — Output bank 2 supply |
| Pin 16 | GND — Ground |
| Pin 17 | Q3+ — LVDS output 3, non-inverting |
| Pin 18 | Q3- — LVDS output 3, inverting |
| Pin 19 | VDD_BANK3 — Output bank 3 supply |
| Pin 20 | GND — Ground |
| Pin 21 | NC — Not connected (per datasheet) |
| Pin 22 | NC — Not connected (per datasheet) |
| Pin 23 | NC — Not connected (per datasheet) |
| Pin 24 | EPAD — Exposed pad - must be soldered to ground plane for thermal/electrical performance |
Typical Applications
Si5330B-B00205-GM is suitable for 6 applications: High-Speed ADC/DAC Sampling Clock Distribution, FPGA Logic Clock Distribution, Telecom/Datacom Line-Card Reference Clock, PCI Express Reference Clock Fanout, Test and Measurement Instrumentation, Industrial Embedded Computing Platform.
High-Speed ADC/DAC Sampling Clock Distribution
The Si5330B-B00205-GM delivers clean 1:4 LVDS copies of a sampling reference clock to multiple high-speed ADC/DAC channels with low additive jitter. Its 710 MHz ceiling comfortably covers JESD204B/C subclass-1 reference rates and RF ADC baseband clocks. Placing the Si5330B between the system PLL and the converter bank keeps the distribution short, reducing skew between channels and avoiding the jitter penalty of cascading buffers. The independent output-bank supply pin lets the same part fan out into 1.8 V or 2.5 V converter domains without extra level shifters.
Recommended
FPGA Logic Clock Distribution
The Si5330B-B00205-GM fans a single FPGA reference clock out to multiple logic banks, transceivers, and memory controllers on the same PCB. Its sub-picosecond additive jitter preserves the FPGA's internal PLL input quality, while the LVDS outputs deliver robust differential signaling across longer PCB traces. The exposed-pad 24-QFN package also supports the thermal and EMI needs of dense FPGA boards, and the 710 MHz maximum comfortably exceeds typical transceiver reference rates.
Recommended
Telecom/Datacom Line-Card Reference Clock
Line cards in routers and switches need a clean reference for SERDES, framers, and switching ASICs. The Si5330B-B00205-GM serves as the on-card fanout point, translating a backplane LVDS reference into multiple LVDS copies for downstream devices. Its low crosstalk and high supply-noise rejection keep the SERDES reference eye-diagram intact even in noisy switching environments, and the 1:4 ratio matches typical line-card fanout budgets without wasting outputs.
Recommended
PCI Express Reference Clock Fanout
PCIe base clocks (100 MHz HCSL/LVDS) can be fanned out by the Si5330B-B00205-GM with minimal additive jitter and tight channel-to-channel skew. With its 710 MHz bandwidth, the part handles not only 100 MHz PCIe Gen 1-5 references but also the higher reference rates used by next-generation PCIe over optical links. Independent supply rails simplify the mixed 1.8 V/3.3 V power trees common on PCIe add-in cards.
Recommended
Test and Measurement Instrumentation
ATE and bench instruments need a coherent multi-drop clock for parallel ADC sampling, trigger distribution, and timing references. The Si5330B-B00205-GM provides four matched LVDS copies of a precision external reference, simplifying multi-channel phase-coherent acquisitions. Low additive jitter preserves ENOB of downstream ADCs, and the 24-QFN exposed-pad footprint eases layout in dense instrument chassis with controlled impedance stackups.
Recommended
Industrial Embedded Computing Platform
Industrial SBCs and embedded modules need a robust, noise-tolerant clock distribution for SoCs, FPGAs, and high-speed peripherals. The Si5330B-B00205-GM's -40 C to +85 C industrial temperature range, supply-noise rejection, and exposed-pad QFN package suit factory-floor environments. Independent supply rails let the same buffer feed a 1.8 V SoC and a 3.3 V peripheral from a single upstream reference, reducing BOM cost.
Recommended
Recommended Products Summary
Engineering reference data for Si5330B-B00205-GM — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | Si5330B-B00205-GMR | Si5330B-A00205-GM | Si5330B-B00204-GM | Si5330B-B00206-GM |
|---|---|---|---|---|---|
| Package | 24-QFN Exposed Pad | 24-QFN Exposed Pad - same | 24-QFN Exposed Pad - same | 24-QFN Exposed Pad - same | 24-QFN Exposed Pad - same |
| Brand | Skyworks Solutions | Skyworks Solutions | Skyworks Solutions | Skyworks Solutions | Skyworks Solutions |
| Function | 1:4 LVDS Clock Buffer | 1:4 LVDS Clock Buffer - same | 1:4 LVDS Clock Buffer - same | 1:4 LVDS Clock Buffer - same | 1:4 LVDS Clock Buffer - same |
| Maximum Frequency | 710 MHz | 710 MHz | 710 MHz | 710 MHz | 710 MHz |
| Output Format | LVDS | LVDS | LVDS | LVDS | LVDS |
| Supply Voltage - Core | 1.8/2.5/3.3 V | 1.8/2.5/3.3 V | 1.8/2.5/3.3 V | 1.8/2.5/3.3 V | 1.8/2.5/3.3 V |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Ordering Code | B00205 | B00205 (tape and reel) | A00205 | B00204 | B00206 |
Key Differentiators
- Integrated level translation between 1.8/2.5/3.3 V domains (vs Generic 1:4 LVDS clock buffers without independent output-bank supplies)
- Minimal crosstalk and superior supply-noise rejection (vs Earlier Si5330 (non-B) revision)
- 1:4 fanout with single differential input (vs Single-ended-only clock buffers)
Design Notes
The exposed pad (EPAD, pin 24) MUST be soldered to a continuous, low-impedance ground plane using an array of thermal vias (typically 4-9 vias under the pad). This serves both as the primary thermal dissipation path and as the reference ground for the controlled-impedance LVDS traces. Failure to solder the EPAD will degrade thermal performance and may cause output jitter degradation.
Route LVDS pairs as 100 ohm differential (microstrip or stripline) with length matching to within a few picoseconds of equivalent electrical length. Place the AC-coupling or termination resistors as close to the Si5330B outputs as possible, and avoid stubs. Skew between the Si5330B outputs is already low per datasheet, but PCB mismatches add directly to channel-to-channel skew.
Decouple each VDD pin (VDD_CORE, VDD_BANK0-3) with a 0.1 uF ceramic capacitor placed as close to the pin as possible. Add a bulk 1 uF or 10 uF capacitor per rail near the Si5330B. The independent output-bank supply pins let you level-translate between 1.8 V, 2.5 V, and 3.3 V domains - connect each VDD_BANK to the appropriate downstream device supply.
Do not assume any Si5330B-x ordering code is interchangeable. The B00205 suffix defines factory-set input/output directions and enable polarity - a different suffix may not be pin-compatible. Also, do not exceed the 710 MHz maximum; pushing beyond it risks duty-cycle distortion and increased jitter. Always consult the datasheet pinout for your specific order code.
Compliance Information
RoHS and REACH compliant per distributor listings. Not AEC-Q100 qualified - this is a commercial/industrial grade part rated -40 C to +85 C. For automotive applications, consult Skyworks for AEC-Q100 variants if available.
