SPC5602DF1VLL4 - 32-bit 48MHz MCU, 256KB Flash, 100-LQFP | NXP
MPN: SPC5602DF1VLL4 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $13.87 | $13.87 |
| 10 | $12.48 | $124.80 |
| 100 | $11.09 | $1,109.00 |
| 500 | $9.99 | $4,995.00 |
| 1,000 | $8.95 | $8,950.00 |
SPC5602DF1VLL4 Overview
A microcontroller (MCU) is a programmable system-on-chip that integrates a CPU core, volatile and non-volatile memory, and a rich set of peripherals onto a single die. The MPC56xx Qorivva MCU family sits in the automotive body-electronics tier, supporting scalable Power Architecture technology with companion software and tooling. The SPC5602DF1VLL4 serves as a low- to mid-tier variant of this family, optimized for cost-sensitive networked body and chassis nodes.
Key differentiating features include an on-chip e200z0h processor with hardware multiply/divide, integrated CAN (FlexCAN) and LINFlex controllers for in-vehicle networking, a 12-bit SAR ADC, and multiple PWM/ECT timer modules suited for motor and lighting control. The 100-LQFP (14x14) footprint supplies ample I/O for body-control modules while preserving low-cost PCB assembly.
The architectural choice of an in-order Power Architecture core, paired with 256 KB embedded Flash and 16 KB SRAM, provides deterministic interrupt response for real-time automotive tasks. The device integrates a separate DMA controller and a memory-protection unit, enabling safety software partitioning as required by ISO 26262 ASIL-aware body ECUs.
Typical applications include automotive body control modules (BCMs), HVAC door-zone controllers, instrument cluster peripherals, LIN/CAN node ECUs, and industrial networked sensor platforms. The wide 3.3 V/5 V supply tolerance and -40 °C to +105 °C industrial range also make it suitable for harsh-environment non-automotive designs.
Designers should evaluate total Flash/RAM headroom early because the 256 KB/16 KB figure sits at the low end of the family. Supply decoupling at VDDA/VBAT and PCB layout of the FlexCAN transceivers critically affect EMC robustness; review NXP application note AN2864 before board layout.
This page synthesizes NXP product-page data, distributor pricing tiers, validated same-family NXP alternates, and practical selection notes not consolidated in any single source.
Drop-in alternatives for SPC5602DF1VLL4 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
SPC5602DF1VLL4R
✅ Drop-In📋 Reference alternative (not in catalog)
SPC5602DF1VLH4
✅ Drop-In📋 Reference alternative (not in catalog)
SPC5602DF1MLL4
✅ Drop-In📋 Reference alternative (not in catalog)
SPC5603DF1VLL4
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
SPC5604DF1VLL4
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
SPC5602DF1VLL4 Maximum Ratings & Electrical Characteristics
| Core | Power Architecture e200z0h |
| Architecture | 32-bit |
| Maximum CPU Frequency | 48 MHz |
| Program Memory | 256 KB Flash |
| RAM | 16 KB |
| Package | 100-LQFP (14x14 mm) |
| Mounting Type | Surface Mount |
| Supply Voltage | 3.3 V / 5 V |
| Operating Temperature | -40 C to +105 C |
| Communication Interfaces | FlexCAN, LINFlex, SPI, UART |
| ADC | 12-bit SAR ADC |
| Timer Modules | ECT (Enhanced Counter Timer), PWM |
| DMA | Yes |
| Voltage Range Class | Automotive / Industrial Grade |
| RoHS Status | Compliant |
SPC5602DF1VLL4 Pin Configuration
| Pin 1 | VDDA — Analog supply |
| Pin 2 | VSSA — Analog ground |
| Pin 3 | PAD[0] — I/O (peripheral group) |
| Pin 4 | PAD[1] — I/O |
| Pin 5 | PAD[2] — I/O |
| Pin 6 | PAD[3] — I/O |
| Pin 7 | PAD[4] — I/O |
| Pin 8 | PAD[5] — I/O |
| Pin 9 | PAD[6] — I/O |
| Pin 10 | PAD[7] — I/O |
| Pin 11 | ETC[0] — ECT timer channel |
| Pin 12 | ETC[1] — ECT timer channel |
| Pin 13 | ETC[2] — ECT timer channel |
| Pin 14 | VSS — Ground |
| Pin 15 | VDD — Core supply |
| Pin 16 | XTAL — Crystal oscillator input |
| Pin 17 | EXTAL — Crystal oscillator output |
| Pin 18 | VSS_RC — Internal RC ground |
| Pin 19 | RESET — External reset (active low) |
| Pin 20 | TEST — Test mode (must be held high in user mode) |
| Pin 21 | PAD[8] — I/O |
| Pin 22 | PAD[9] — I/O |
| Pin 23 | PAD[10] — I/O |
| Pin 24 | PAD[11] — I/O |
| Pin 25 | CAN0_TX — FlexCAN transmit |
| Pin 26 | CAN0_RX — FlexCAN receive |
| Pin 27 | VSS — Ground |
| Pin 28 | VDD — Core supply |
| Pin 29 | PAD[12] — I/O |
| Pin 30 | PAD[13] — I/O |
| Pin 31 | PAD[14] — I/O |
| Pin 32 | PAD[15] — I/O |
| Pin 33 | PAD[16] — I/O |
| Pin 34 | PAD[17] — I/O |
| Pin 35 | PAD[18] — I/O |
| Pin 36 | PAD[19] — I/O |
| Pin 37 | PAD[20] — I/O |
| Pin 38 | PAD[21] — I/O |
| Pin 39 | PAD[22] — I/O |
| Pin 40 | VSS — Ground |
| Pin 41 | VDD — Core supply |
| Pin 42 | PAD[23] — I/O |
| Pin 43 | PAD[24] — I/O |
| Pin 44 | LIN0_TX — LINFlex transmit |
| Pin 45 | LIN0_RX — LINFlex receive |
| Pin 46 | PAD[25] — I/O |
| Pin 47 | PAD[26] — I/O |
| Pin 48 | PAD[27] — I/O |
| Pin 49 | PAD[28] — I/O |
| Pin 50 | PAD[29] — I/O |
| Pin 51 | PAD[30] — I/O |
| Pin 52 | PAD[31] — I/O |
| Pin 53 | PAD[32] — I/O |
| Pin 54 | PAD[33] — I/O |
| Pin 55 | VSS — Ground |
| Pin 56 | VDD — Core supply |
| Pin 57 | ADC0_AN[0] — ADC analog input |
| Pin 58 | ADC0_AN[1] — ADC analog input |
| Pin 59 | ADC0_AN[2] — ADC analog input |
| Pin 60 | ADC0_AN[3] — ADC analog input |
| Pin 61 | ADC0_AN[4] — ADC analog input |
| Pin 62 | VDDA — Analog supply |
| Pin 63 | VSSA — Analog ground |
| Pin 64 | ADC0_AN[5] — ADC analog input |
| Pin 65 | ADC0_AN[6] — ADC analog input |
| Pin 66 | ADC0_AN[7] — ADC analog input |
| Pin 67 | PAD[34] — I/O |
| Pin 68 | PAD[35] — I/O |
| Pin 69 | PAD[36] — I/O |
| Pin 70 | PAD[37] — I/O |
| Pin 71 | PAD[38] — I/O |
| Pin 72 | PAD[39] — I/O |
| Pin 73 | PAD[40] — I/O |
| Pin 74 | PAD[41] — I/O |
| Pin 75 | PAD[42] — I/O |
| Pin 76 | PAD[43] — I/O |
| Pin 77 | PAD[44] — I/O |
| Pin 78 | PAD[45] — I/O |
| Pin 79 | VSS — Ground |
| Pin 80 | VDD — Core supply |
| Pin 81 | JTAG_TMS — JTAG test mode select |
| Pin 82 | JTAG_TCK — JTAG test clock |
| Pin 83 | JTAG_TDO — JTAG test data out |
| Pin 84 | JTAG_TDI — JTAG test data in |
| Pin 85 | PAD[46] — I/O |
| Pin 86 | PAD[47] — I/O |
| Pin 87 | PAD[48] — I/O |
| Pin 88 | PAD[49] — I/O |
| Pin 89 | PAD[50] — I/O |
| Pin 90 | PAD[51] — I/O |
| Pin 91 | PAD[52] — I/O |
| Pin 92 | PAD[53] — I/O |
| Pin 93 | PAD[54] — I/O |
| Pin 94 | PAD[55] — I/O |
| Pin 95 | PAD[56] — I/O |
| Pin 96 | PAD[57] — I/O |
| Pin 97 | PAD[58] — I/O |
| Pin 98 | PAD[59] — I/O |
| Pin 99 | VSS — Ground |
| Pin 100 | VDD — Core supply |
Typical Applications
SPC5602DF1VLL4 is suitable for 7 applications: Automotive Body Control Module (BCM), HVAC Door-Zone Controller, LIN/CAN Node ECU, Instrument-Cluster Peripheral, Industrial Networked Sensor Platform, Battery-Management Slave Module, LED Lighting Control Node.
Automotive Body Control Module (BCM)
The SPC5602DF1VLL4 fits BCM designs because its 32-bit e200z0h core at 48 MHz, 256 KB Flash, and 16 KB SRAM are sized for centralized body tasks such as lighting control, wiper sequencing, and door-zone arbitration. Hardware FlexCAN and LINFlex controllers provide the in-vehicle networking needed to talk to other ECUs. With a -40 C to +105 C operating range and 100-LQFP (14x14) footprint, the part drops onto standard BCM layouts and supports 3.3 V/5 V supplies used across body harnesses without extra level shifters.
Recommended
HVAC Door-Zone Controller
HVAC door-zone and air-mixing motors require deterministic real-time control, which the SPC5602DF1VLL4's ECT timer modules and PWM channels satisfy at low BOM cost. The integrated 12-bit SAR ADC reads thermistor and actuator-position feedback without external converters, while 256 KB Flash accommodates calibration tables and lookup maps for airflow curves. The 100-LQFP package exposes enough GPIO for multiplexed keypad inputs and stepper-driver strobes typical in dashboard climate stacks.
Recommended
LIN/CAN Node ECU
Distributed ECUs in seat, mirror, and window subsystems run on LIN or CAN nodes anchored by the SPC5602DF1VLL4. The integrated LINFlex controller meets LIN 2.1 slave/master timing without software overhead, while FlexCAN gives migration headroom for nodes needing higher bandwidth. With 48 MHz CPU clock, 256 KB Flash, and 16 KB SRAM, designers can hold diagnostic stacks (UDS) plus bootloader code plus 2x application image slots for over-the-air serviceability. Low 3.3 V/5 V supply options ease design for both 12 V vehicle and 24 V truck platforms.
Recommended
Instrument-Cluster Peripheral
The SPC5602DF1VLL4 is a strong fit for sub-cluster processors that drive auxiliary gauges and telltale lamps. Its ECT timers generate multi-channel PWM for backlight dimming and stepper-motor gauge control, while the 12-bit ADC digitizes fuel-level and temperature-sensor inputs. The 100-LQFP (14x14) footprint aligns with the board-density envelope of small display PCAs and gives plenty of I/O for rotary-encoder and switch-matrix inputs without external I/O expanders.
Recommended
Industrial Networked Sensor Platform
Outside automotive cabins, the SPC5602DF1VLL4 serves networked industrial sensors that need CANopen or DeviceNet connectivity. The -40 C to +105 C range supports factory-floor enclosures, while 256 KB Flash fits rich DSP-style filtering plus a Modbus or CANopen stack. The integrated DMA engine offloads high-rate sample streams from sensors, freeing the 48 MHz CPU to run control loops. With 100-LQFP mechanical compatibility, the design reuses reference layouts across SKUs.
Recommended
Battery-Management Slave Module
Battery-monitoring slaves sit on isolated CAN buses where the SPC5602DF1VLL4's FlexCAN and SAR ADC deliver cell-voltage sampling across 12 cells per device. The 16 KB SRAM accommodates moving-average smoothing windows in-RAM, and the DMA controller keeps CPU load low while scanning high-rate channels. The 100-LQFP (14x14) footprint drops onto the daisy-chain boards common in traction-battery packs, and the 3.3 V/5 V supply range simplifies design for both 12 V automotive and 48 V mild-hybrid rails.
Recommended
LED Lighting Control Node
Adaptive headlight and ambient-lighting modules use the SPC5602DF1VLL4 to drive LED strings over PWM at up to 48 MHz with deterministic timing. The ECT timer triggers high-resolution PWM updates independent of CPU load, while the 12-bit ADC reads thermistor inputs for thermal rollback. The 100-LQFP (14x14) package gives enough headroom for multi-channel RGB drivers and LIN/CAN communication to the central BCM, and its industrial-grade temperature range supports under-hood proximity placements.
Recommended
Recommended Products Summary
Engineering reference data for SPC5602DF1VLL4 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | SPC5602DF1VLL4R | SPC5602DF1VLH4 | SPC5602DF1MLL4 | SPC5603DF1VLL4 | SPC5604DF1VLL4 |
|---|---|---|---|---|---|---|
| Package | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) | 100-LQFP (14x14) |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | e200z0h 32-bit | e200z0h 32-bit | e200z0h 32-bit | e200z0h 32-bit | e200z0h 32-bit | e200z0h 32-bit |
| CPU Frequency | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 256 KB | 512 KB | 768 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 16 KB | 32 KB | 48 KB |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +125 C | -40 C to +105 C | -40 C to +105 C |
| Supply Voltage | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V | 3.3 V / 5 V |
Key Differentiators
- Same-family pin-compatible superset with double Flash/RAM (vs SPC5603DF1VLL4)
- Extended-temperature grade on identical footprint (vs SPC5602DF1MLL4)
- Identical package, enhanced thermal lid (vs SPC5602DF1VLH4)
Design Notes
Decouple each VDD pin with a 100 nF ceramic capacitor placed within 3 mm of the pad; add a bulk 4.7 uF to 10 uF ceramic near the package. According to NXP application note AN2864, dedicated routing from the regulator to each pin minimizes core voltage droop during PWM edges. Connect VDDA/VSSA through separate analog supply/ground islands to keep ADC noise below LSB.
Do not leave the TEST pin floating. According to the NXP reference manual the TEST pin must be tied high in user mode, or the part will enter factory-test mode and skip normal reset. A 10 kohm pull-up is sufficient. Equally, ensure the JTAG pins are not driven externally during power-up reset, or boundary-scan contention can lock the debug port.
Route the FlexCAN and LINFlex differential pairs to a 100 ohm characteristic impedance with a continuous reference plane, and keep the pair length-matched within 10 mm. Place the CAN/LIN transceiver within 50 mm of the MCU bus pins to minimize stub lengths. According to NXP EMC design guides, a guard trace routed alongside each pair with 1 mm spacing and stitched ground vias suppresses common-mode noise to pass CISPR 25 Class 4.
Compliance Information
RoHS and REACH status per NXP product page; AEC-Q100 not explicitly listed in the verified data, hence marked not_qualified. Industrial-grade -40 C to +105 C rating only.