TMS320DM367ZCE - 432MHz ARM DSP | 338-BGA | Texas Instruments
MPN: TMS320DM367ZCE ✓ ActiveTMS320DM367ZCE Overview
A digital signal processor is a semiconductor designed to execute mathematical operations on sampled signals with predictable execution time. In the wider embedded hierarchy, a DSP combines a processor core, memory interfaces, peripherals, and fixed- or floating-point acceleration. The DM367 architecture belongs to this family of high-performance embedded processors, where software-configurable arithmetic functions are used for filtering, transforms, control, decoding, and real-time data movement.
The TMS320DM367ZCE operates at 432 MHz according to distributor product records. Its ARM-based architecture supports integration with embedded operating systems and application-specific firmware, while DSP acceleration addresses workloads where conventional general-purpose processing would consume excessive cycles. The 338-BGA package provides a large pin count for external memory, high-speed interfaces, and mixed-signal system connections without requiring a larger board footprint than a 13 x 13 mm device.
The processor is identified in listings as TMS320DM367, TMS320DM36, TMS320DM3, TMS320DM, TMS320D, and TMS320. These searchable device descriptors can help locate the correct ordering code in engineering documentation and component databases. The ZCE suffix identifies the specific package configuration ordered as TMS320DM367ZCE, so package drawing, ball map, PCB land pattern, and assembly requirements must be checked against the manufacturer documentation before hardware release.
Typical applications include industrial vision, networked media processing, audio and video systems, communications infrastructure, and embedded control platforms that require a combination of high-speed computation and external memory bandwidth. Designers should partition memory and peripherals according to the device's documented interface map, preserve the specified power and ground distribution, and validate signal integrity across every high-speed connection.
A key design consideration is that a BGA package cannot be evaluated from the distributor catalog description alone. Use the manufacturer pin-description table, ball-map drawing, recommended land pattern, and power-supply requirements during schematic capture and PCB layout. Confirm operating-temperature, voltage, interface, and memory requirements for the exact ordering code before committing the design to production.
This product page consolidates the confirmed device identity, package format, processor frequency, ordering designation, lifecycle-oriented sourcing guidance, pinout limitations, and engineering trade-offs. It also distinguishes exact drop-in replacements from related processors, helping teams avoid assuming that similar ARM or DSP devices can share the same 338-BGA land pattern without formal pin and parameter validation.
Drop-in alternatives for TMS320DM367ZCE — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
No drop-in alternatives available for this product.
Request AlternativesTMS320DM367ZCE Specifications
| Device Type | ARM digital signal processor (DSP) |
| Processor Frequency | 432 MHz |
| Architecture | ARM-based |
| Device Family | DM367 |
| Ordering Designation | TI-SPECIAL |
| Package Type | 338-ball BGA |
| Package Dimensions | 13 x 13 mm |
| Ball Count | 338 balls |
| Mounting Type | Surface mount |
| Moisture Sensitivity Level | 3 (168 hours) |
| HTSUS Code | 8542.31.0001 |
| RoHS Status | RoHS |
| REACH Status | Vendor undefined |
TMS320DM367ZCE 13 x 13 mm Pin Configuration Guide
Pin configuration for TMS320DM367ZCE (13 x 13 mm package). Pin numbering, functions, and connection diagrams are defined in the manufacturer datasheet. Refer to it for the exact footprint and soldering guidelines.
No detailed pinout data available for TMS320DM367ZCE.
Refer to the datasheet for full pin configuration.
Typical Applications
TMS320DM367ZCE is suitable for 6 applications: Industrial Machine Vision, Industrial Automation and Control, Audio Signal Processing, Video and Multimedia Processing, Network Communications Equipment, Programmable Audio and Communications Platform.
Industrial Machine Vision
The TMS320DM367ZCE fits machine-vision controllers that combine image acquisition, preprocessing, and network-assisted decision making. Its 432 MHz execution rate provides substantial real-time computing capacity, while the ARM-based architecture supports higher-level control and communications. The device is particularly attractive when an imaging pipeline needs deterministic signal processing without relying entirely on a separate DSP. The 338-ball BGA also offers extensive connectivity for camera interfaces, memory, and industrial I/O, although high-speed layout, thermal validation, and careful ball assignment remain essential.
Recommended
Industrial Automation and Control
The TMS320DM367ZCE is suited to embedded automation controllers that combine real-time control calculations with supervisory ARM-based processing. At 432 MHz, it can execute feedback, filtering, or condition-monitoring routines while the higher-level software coordinates communications and supervisory functions. Its large BGA connection count can support external memory and multiple peripheral interfaces needed by a complex controller. Design teams should partition real-time and non-real-time tasks carefully, verify voltage and timing requirements, and confirm operating-temperature limits for the deployed equipment.
Recommended
Audio Signal Processing
The TMS320DM367ZCE can serve as the processing platform in professional audio, communications, or multimedia systems requiring fast convolution, filtering, mixing, and format handling. Its 432 MHz ARM-based architecture with DSP capabilities allows audio algorithms to run alongside networking and control software. A practical design would connect suitable converters through compatible serial or parallel audio interfaces, provide the required external memory, and isolate sensitive analog and digital sections appropriately. Firmware architecture should preserve deterministic execution for latency-sensitive audio paths.
Recommended
Video and Multimedia Processing
The TMS320DM367ZCE is appropriate for multimedia gateways, video processing nodes, and display-oriented embedded systems where real-time computation and connected peripherals are required. The 432 MHz processor can support filtering, scaling, encoding-adjacent operations, and control logic, while the 338-ball package provides the interconnect capacity needed for memory and external media devices. Integration requires verified display and data interfaces, stable clocking, and careful PCB signal-integrity work. The system architecture should prevent high-bandwidth traffic from interfering with latency-sensitive processing.
Recommended
Network Communications Equipment
The TMS320DM367ZCE can serve in protocol-heavy communications equipment where packet handling, filtering, and real-time control must coexist with higher-level network functions. Its ARM-based processor architecture supports modern embedded software stacks, while DSP execution accelerates repetitive signal operations. The broad BGA connection count can accommodate external memory and multiple communications peripherals. Engineers should establish memory bandwidth margins, isolate sensitive clock and data routes, and verify that all selected interface timings, levels, and power requirements conform to the exact device documentation.
Recommended
Programmable Audio and Communications Platform
The TMS320DM367ZCE fits a programmable platform used to prototype algorithms, combine communications functions, and connect multiple data sources. Its 432 MHz execution capability allows developers to move DSP workloads away from slower general-purpose controllers while retaining ARM-based operating-system support. The 338-ball BGA provides extensive peripheral access but demands a disciplined PCB stack-up and escape strategy. A successful prototype should preserve pin multiplexing options, provide robust power delivery, and expose test points for clocks, reset, boot control, and high-speed buses.
Recommended
Recommended Products Summary
Engineering reference data for TMS320DM367ZCE — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Brand | Texas Instruments |
| Package | 338-ball BGA (13 x 13 mm) |
| Processor Frequency | 432 MHz |
| Architecture | ARM-based |
| Device Type | Digital signal processor |
| Device Family | DM367 |
| Ordering Designation | TI-SPECIAL |
| Moisture Sensitivity Level | MSL 3 (168 hours) |
| HTSUS Code | 8542.31.0001 |
| REACH Status | Vendor undefined |
Key Differentiators
- Integrated ARM-based processing and DSP functionality (vs General-purpose 432 MHz ARM processor)
- Dense integration in a 13 x 13 mm BGA (vs Lower-pin-count processor package)
- Purpose-built real-time processing position (vs Cortex-M microcontroller)
Design Notes
Use the exact manufacturer land pattern for the 338-ball, 13 x 13 mm BGA rather than adapting a generic 338-ball footprint. Preserve the documented power and ground ball assignments, maintain the recommended layer count and stack-up, and provide adequate escape routing for interfaces requiring external access. A manufacturing review should compare drill, pad, solder-mask, and paste data against the released package drawing before PCB artwork is frozen.
Assign signals directly from the manufacturer pin-description table and check alternate pin multiplexing before final schematic capture. Pay particular attention to clocks, resets, boot-mode inputs, high-speed memory interfaces, and signals brought out through adjacent balls. Do not infer continuity or power grouping from the 13 x 13 mm package drawing alone, because the BGA ball map and exposed thermal requirements govern the implementation.
Power sequencing, voltage rails, and decoupling must follow the manufacturer requirements for the DM367 device family and the selected ZCE ordering code. Place bulk and high-frequency decoupling according to the reference layout, keep return paths continuous beneath switching circuitry, and verify that the board can deliver the required transient current without exceeding regulator or package limits. Confirm rail tolerances and startup behavior in the final power tree.
Do not treat another 432 MHz ARM processor as a drop-in replacement merely because its clock rate matches. Validate BGA dimensions, ball numbering, voltage, temperature grade, clocking, memory interface, peripheral functions, reserved pins, boot behavior, and software support. For a new PCB, use the exact Texas Instruments ordering code and released package documentation; for an existing PCB, obtain formal manufacturer or qualified-channel validation before substitution.
Compliance Information
The component record identifies RoHS and lists REACH status as vendor undefined. AEC-Q100 qualification, lead-free status, halogen-free status, and conflict-minerals compliance are not established for this ordering code.
