FPGA & CPLD
Produtos (6666)
A54SX72A-PQG208M - 108K-Gate Antifuse FPGA 217MHz | Microchip
The Microchip Technology (Microsemi/Actel) A54SX72A-PQG208M is a high-density SX-A family antifuse FPGA offering 72,000 ASIC gates (108,000 system gates), 4,024 module cells, 171 user I/Os, and a maximum toggle frequency of 217 MHz, fabricated on a 0.25 um process with a 2.5 V core supply and housed in a 208-pin PQFP (BFQFP) surface-mount package measuring 28 mm x 28 mm x 3.4 mm. A field-programmable gate array (FPGA) is a semiconductor device containing a matrix of configurable logic blocks and programmable interconnects that designers program to implement custom digital circuits. The A54SX72A belongs to the antifuse FPGA subcategory: unlike SRAM-based FPGAs, its antifuse interconnect elements are one-time programmable, so the configuration is permanent, inherently non-volatile, and immune to configuration readback - a hardware security advantage for defense and industrial designs. Key features include the 108K system gate capacity for integrating multiple logic functions into a single low-cost chip, the 217 MHz system speed supported by dedicated global and quadrant clock networks (CLKA, CLKB, QCLK), and the antifuse architecture which removes the need for an external configuration PROM and eliminates configuration bitstream loading time at power-up. Technically, the SX-A family uses a sea-of-modules architecture with combinational C-cells and sequential R-cells, implemented in a 0.25 um CMOS process. The device is designed in using Microchip's Libero SoC design suite (historically Actel Designer flow) and programmed at the board house or by the user with standard programming hardware. Typical applications include industrial control, networking line cards, glue logic integration,ASIC prototyping, and secure military/avionics systems where a non-volatile, single-chip programmable solution reduces BOM cost and board area. When designing with this device, remember the antifuse is one-time programmable - verify the design thoroughly in simulation before programming, and check that 2.5 V core and I/O voltage rails are properly sequenced. This page synthesizes verified distributor data, same-package drop-in alternatives, and practical design notes not found in the manufacturer datasheet. Pricing as of 2026-09-03.
AFS600-1FG256 - 600K Gate Mixed-Signal FPGA | Microchip
The Microchip Technology AFS600-1FG256 is a Fusion mixed-signal field-programmable gate array with 600,000 system gates, 108 Kb of block RAM, a 1.5 V supply, and a 256-FPBGA package measuring 17 mm by 17 mm. It combines programmable logic with configurable analog and embedded flash resources for control, interface, power-management, and signal-processing designs. A mixed-signal FPGA is a programmable semiconductor that integrates digital logic with analog or mixed-signal functions in one device. In the product hierarchy, it belongs to the FPGA and CPLD class of programmable logic devices and enables a compact alternative to separate microcontroller, analog, and discrete-component implementations. The Fusion family specifically combines flash-based programmable logic, large flash blocks, clock-management resources, and configurable analog sections. The AFS600-1FG256 provides 119 I/O, 13,824 logic cells, 108 Kb of block RAM, and a 1.0 mm ball pitch in its 256-ball FG256 package. Its flash-based configuration retains the programmed design when power is removed and supports live-at-power-up operation. The 130 nm CMOS implementation and seven-layer metal process are identified in the supplied manufacturer-family documentation. This device is suited to compact industrial controllers, smart battery chargers, clock generation and management, motor-control systems, programmable power conversion, and communications interfaces. The 256-FPBGA format favors multilayer PCB designs where fine routing and high I/O density matter more than a large, simple through-hole footprint. Engineering the board requires careful separation of analog and digital supplies, low-noise routing around analog blocks, robust decoupling, and thermal analysis of the programmable logic. Because the verified material does not provide a complete public pin map for every ball, exact ball assignments should be confirmed against the manufacturer datasheet before PCB release. This page combines verified pricing, same-family drop-in alternatives, and practical integration guidance. It also distinguishes confirmed AFS600 characteristics from parameters that still require validation from the manufacturer datasheet or device programming tools.
AFS600-1FG484 - 600K-Gate 1.5V Mixed-Signal FPGA | Microchip
The Microchip Technology AFS600-1FG484 is a Fusion mixed-signal FPGA with 600,000 system gates, a 1.5 V supply, and a 484-BGA surface-mount package. Verified listings also report 7,000 logic elements, 172 I/Os, and a listed operating-temperature range of 0°C to +85°C, although separate distributor records identify the assembly as a 484-BGA rather than a 256-pin device. Designers should therefore confirm the exact package drawing and pin assignments against the manufacturer datasheet before layout release. A mixed-signal FPGA is a programmable logic device that combines configurable digital logic, embedded memory, clocking, and analog or mixed-signal resources in one monolithic package. The AFS600 belongs to the Fusion family, a hierarchy that places it within flash-based FPGAs, programmable-logic ICs, semiconductors, and embedded electronic systems. Its 600,000-system-gate position targets designs requiring substantially more programmable logic than small control devices while retaining configurable on-chip resources. Key verified attributes include a 130 nm flash-based CMOS process, a seven-layer-metal process description, 600,000 system gates, 7,000 logic elements, and 172 I/Os. The reported 1.5 V supply is important for power architecture because the associated core and I/O requirements must be checked directly in the datasheet. The part is identified as a Fusion FPGA, and the available family documentation states that Fusion devices in the same package are generally pin compatible except for the stated AFS250 and AFS600 PQ208 exception. The architecture makes the device relevant to communications, embedded processing, industrial control, instrumentation, and other systems that benefit from parallel programmable logic. A listed frequency value of 1282.05 MHz appears in one distributor record, but the provided evidence does not establish whether this represents a directly usable logic or peripheral clock under all conditions. Engineers should treat that number as a reported catalog attribute until its clock domain and operating conditions are confirmed in the manufacturer documentation. Typical implementation involves power rails, decoupling, configuration support, clock distribution, differential or single-ended I/O planning, and careful FBGA layout. Because this is a high-pin-count programmable device, routing density, via-in-pad practices, ball assignment, return paths, and layer-stackup constraints deserve early review. The reported tray packaging and SMD mounting style are suitable for manufacturing planning, but the exact pinout is not present in the supplied data. The primary design trade-off is integration versus design freedom: the AFS600 can consolidate substantial mixed-signal functionality into one device, but a successful board design depends on validated pin constraints, power sequencing, configuration infrastructure, and high-density BGA assembly. This page synthesizes verified catalog specifications, package and sourcing information, and practical engineering guidance while avoiding unsupported replacement claims. For current availability, technical support, or a quotation, contact XAIPART and provide the exact AFS600-1FG484 MPN, required quantity, and target delivery date.
AFS600-2FG256 600K-Gate Mixed-Signal FPGA | Microchip
The Microchip Technology AFS600-2FG256 is a Fusion mixed-signal field-programmable gate array with 600,000 system gates, 119 I/O, and 256 pins in a 1.0 mm-pitch FBGA-256 package. It operates from a 1.5 V supply and supports a 0°C to 85°C commercial-temperature range. The device combines programmable flash-based logic with configurable analog resources, large flash memory blocks, and clock-management circuitry in one monolithic mixed-signal FPGA. A mixed-signal FPGA is a programmable semiconductor that integrates digital logic with configurable analog functions. In the product hierarchy, this AFS600-2FG256 belongs to the FPGA and CPLD class, then to the Fusion mixed-signal FPGA family and the broader programmable-logic and semiconductor categories. Its monolithic construction allows control logic, interface logic, analog functions, and embedded memory to be combined on one device rather than split across multiple discrete components. The verified AFS600 family specifications identify 600,000 system gates, CMOS logic, 119 I/O, and a 256-pin FBGA. The advanced 130 nm, seven-layer-metal, flash-based CMOS process supports nonvolatile configuration and live-at-power-up operation according to the retrieved family information. A separate AFS600 listing also identifies 13,824 configurable logic blocks, while the family documentation confirms configurable analog, large flash memory blocks, and comprehensive clock generation and management. This architecture is particularly useful when a design needs programmable mixed-signal behavior alongside conventional digital logic. The 119 available I/O provide substantial board connectivity for external converters, sensors, memory devices, communication links, and control interfaces. Its 1.0 mm-pitch FBGA-256 package also supports dense PCB integration, although fine-pitch assembly, via-in-pad practices, thermal management, and careful fanout require deliberate PCB planning. Typical applications include industrial data acquisition, instrumentation, communications equipment, embedded control, sensor interfacing, and high-density programmable logic systems. In these systems, the mixed-signal resources can be combined with digital control paths to reduce component count, while the flash-based architecture retains programmed configuration when power is removed. A key design consideration is that this is a fine-pitch, 256-pin BGA package rather than a leaded package. Assembly and inspection require suitable land patterns, thermal vias, and process controls. Engineers should also confirm the exact pin assignment, supported I/O standards, configuration requirements, and operating limits in the manufacturer datasheet before releasing a production PCB. This page consolidates verified package and family specifications, distributor availability, compatible family members, application guidance, and selection criteria. It highlights verified distinctions among AFS600 speed, temperature, and package suffixes so engineers can choose a drop-in-compatible option without confusing mechanically similar variants with electrically equivalent ones.
AFS600-2FG484 - 600K-Gate Fusion FPGA | Microchip | 172 I/O
The Microchip Technology AFS600-2FG484 is a Fusion mixed-signal FPGA with 600,000 system gates, 172 I/O, a 484-pin FBGA package, and a listed maximum frequency of 1470.59 MHz. It combines programmable logic, configurable analog resources, embedded memory, and clock-management circuitry in one monolithic device. What is a mixed-signal FPGA? A mixed-signal FPGA is a field-programmable gate array that combines digital programmable logic with analog and memory resources. It sits within the FPGA and programmable-logic hierarchy, allowing control logic, interface logic, signal conditioning, and data processing to be integrated on one device. The Fusion family is designed for designs that require both configurable digital logic and analog functions. The verified product data identifies the AFS600 as a Fusion FPGA with 600K system gates, 172 I/O, 110592 as an associated device parameter, 130 nm technology, and a 1.5 V supply specification. The exact pin names, memory capacities, analog resource details, supported I/O standards, and complete timing characteristics are not supplied in the provided web snippets and therefore require confirmation from the manufacturer documentation. Typical engineering uses for this device family include industrial control, communications, instrumentation, embedded processing, and systems requiring programmable mixed-signal functionality. The large gate count and extensive I/O make it suitable for consolidating multiple digital functions while retaining analog configurability. Compared with a purely digital FPGA, the mixed-signal architecture can reduce the need for separate analog-support devices when the required functions are covered by the Fusion device. When designing with the AFS600-2FG484, verify the device speed grade, temperature grade, power architecture, supported I/O standards, and pinout against the exact package suffix before releasing a PCB. The provided sources do not confirm a complete pinout or operating-temperature range, so those values should not be inferred from the AFS600 family name. This product page combines verified distributor observations, available pricing information, family-level specifications, and explicit data gaps. The 484-BGA footprint requires careful PCB layout and manufacturing capability, while the exact replacement decision must be based on pin compatibility and tool-supported device parameters rather than gate count alone.
AFS600-FG256 - 600K Mixed-Signal Fusion FPGA | Microchip
Microchip Technology AFS600-FG256 is a Fusion mixed-signal field-programmable gate array with 600,000 system gates, 119 I/Os, 110,592 bits of embedded memory, and a 256-pin low-profile BGA package. It operates from a 1.5 V supply and combines programmable logic, configurable analog resources, flash memory, and clock-generation circuitry in one monolithic device. A mixed-signal FPGA is a semiconductor whose digital logic fabric and analog blocks can be configured after manufacture. The Fusion family extends the traditional FPGA hierarchy of programmable logic, embedded memory, and I/O into a system-on-chip platform containing configurable analog, comprehensive clock generation and management, and large flash-memory blocks. This integration allows one device to implement control, signal conditioning, data acquisition, memory storage, and programmable processing functions. The AFS600-FG256 is manufactured using an advanced 130 nm, seven-layer-metal, flash-based CMOS process. Its nonvolatile configuration memory retains the programmed design when power is removed and supports Live at Power-Up operation. The device provides 600,000 system gates, 119 user I/Os, 110,592 embedded-memory bits, a 1.5 V supply, and an operating range of 0 to 70 C. The 256-LBGA package supports dense board-level integration. Its monolithic architecture can reduce the number of discrete devices required for a mixed-signal instrument. Configurable analog blocks can be paired with digital logic, while embedded flash preserves configuration and application data. Integrated clock-generation and management circuitry simplifies designs that require controlled, deterministic clock distribution. The exact analog resources, supported I/O standards, memory organization, and performance ratings should be confirmed against the manufacturer documentation for the exact design. Typical uses include industrial data-acquisition systems, embedded control, instrumentation, communication equipment, sensor interfaces, and prototype platforms. The manufacturer application note "PDF Prototyping With AFS600 for Smaller Devices" specifically identifies AFS600-FG256 as a platform for prototyping smaller devices in the same compatible package type and notes its use in the Fusion Starter Kit. The principal design consideration is package and pin compatibility. Before using a related MPN as a replacement, verify the footprint, voltage requirements, temperature grade, I/O standards, embedded-memory resources, analog features, and programming support. The AFS600 family includes related package or ordering variants, but a shared family designation alone does not guarantee that every functional block is equivalent. This product page consolidates manufacturer descriptions, distributor references, package information, verified specifications, and application guidance. It also distinguishes documented identity from uncertain fields and avoids treating generic family options as confirmed drop-in replacements.
AFS600-FG484 - 600K Mixed-Signal FPGA | Microchip
The Microchip Technology AFS600-FG484 is a 600,000-equivalent-gate Fusion mixed-signal field-programmable gate array in a 484-ball PBGA package. It combines configurable analog resources, embedded flash memory, clock and clock-management circuitry, and programmable logic in one monolithic device. The supplied distributor data identifies 172 I/O and a 484-BGA package, while the related 600K-system-gate Fusion family is described as CMOS programmable logic with optional ARM support. An FPGA is a reconfigurable semiconductor whose logic, routing, and I/O resources can be programmed after manufacture. A mixed-signal FPGA extends this programmable digital architecture with configurable analog blocks, making the AFS600 useful when a design needs deterministic control logic, dedicated analog functions, embedded nonvolatile memory, and flexible external interfaces on a single device. Within the product hierarchy, it belongs to the FPGA and CPLD category and the Fusion mixed-signal FPGA family. The AFS600-FG484 provides 600K equivalent gates, 13,824 logic cells in related 600K-package variants, and 172 user I/O according to the supplied search results. Its flash-based architecture retains programmed logic without volatile configuration memory, supporting live-at-power-up behavior in applicable Fusion devices. The monolithic integration reduces the component count and board area normally needed to combine an FPGA, analog interface IC, clock generator, and external configuration memory. The Microchip product-page search result confirms that Fusion devices integrate configurable analog blocks, large flash-memory blocks, comprehensive clock generation and management circuitry, and high-performance flash-based programmable logic. This combination supports designs that require parallel real-time control, sensor or transducer interfacing, communications, and programmable logic in one package. The 484-ball PBGA also offers a substantial connection count compared with smaller FPGA packages. Typical applications include industrial control, instrumentation, communications equipment, sensor acquisition, and embedded processing systems. Designers can assign analog and digital resources according to system requirements rather than using several fixed-function components. The package requires careful ball-grid layout planning, and the finished system must comply with the manufacturer’s power, decoupling, clocking, and programming requirements. Before layout, verify the exact ball assignments, voltage rails, supported I/O standards, clock requirements, and programming interface from the official AFS600 documentation. Because the supplied data does not expose the complete manufacturer pin map or all electrical limits, they should not be inferred from generic PBGA practice. The exact 484-ball package also requires the matching package library and assembly design rules rather than a generic BGA footprint. This page consolidates verified distributor pricing and availability, technical identity data, practical FPGA design considerations, and sourced same-family alternatives. It also distinguishes documented facts from missing details so procurement and engineering teams can evaluate the AFS600-FG484 without relying on unverified assumptions.
AFS600-FG484I - 600K-Gate 1.5V Fusion FPGA | Microchip
The Microchip Technology AFS600-FG484I is a Fusion mixed-signal field-programmable gate array with 600,000 system gates, 1.5 V supply operation, 256 BGA pins, and a 1.0 mm-pitch package. Its 130 nm, seven-layer-metal, flash-based CMOS process provides nonvolatile configuration retention and Live at Power-Up support, allowing the programmed design to operate without a separate configuration load after power is restored. The verified product data identifies the device as a CMOS FPGA with optional ARM support and a stated operating-temperature range of 0°C to 70°C. An FPGA is a programmable digital semiconductor in which logic, interconnect, memory, and I/O resources are configured through a bitstream. The Fusion family extends that conventional programmable-logic role with mixed-signal resources, flash memory blocks, and clock-generation and management circuitry. This makes the AFS600 suitable for designs that need programmable control alongside analog or mixed-signal interface functions, rather than only fixed digital logic. The AFS600-FG484I provides 600,000 system gates and supports a 1.5 V supply. Its flash-based architecture retains the programmed configuration when power is removed, and Live at Power-Up enables the configured circuitry to begin operation directly after power-up. The device is identified in the verified data as using an advanced 130 nm, seven-layer-metal CMOS process and is associated with 256 package pins. The provided distributor records also describe it as a 484-pin FBGA offering, so the physical package documentation should be checked against the exact board footprint before assembly. Typical design uses include industrial control, instrumentation, communications, embedded processing, and other systems that benefit from reconfigurable logic alongside mixed-signal functions. The optional ARM support indicated in the product data can be valuable where a soft processor core is preferred, while the large programmable logic fabric allows custom datapaths, state machines, interface conditioning, and timing functions to be implemented in one device. The principal design consideration is package and pin verification. The available records use both 256-pin BGA wording and 484-pin FBGA wording, so engineers must confirm the manufacturer package drawing, pin assignments, exposed-pad or thermal requirements, and PCB land pattern before committing to a layout. Power sequencing, I/O standards, configuration pins, clock requirements, and temperature grade must also be checked against the official device documentation.
AFS600-FGG484 - 600K-Gate Mixed-Signal FPGA | Microchip
The Microchip AFS600-FGG484 is a 600,000-system-gate mixed-signal field-programmable gate array built on a 130 nm flash-based CMOS process and supplied in a 484-pin FBGA package. The device combines programmable logic, configurable analog resources, large flash-memory blocks, clock generation and management circuitry, and optional ARM support in one monolithic device. Verified listings identify 172 I/O, a 1.5 V supply, and an operating-temperature range of 0 C to 70 C. A mixed-signal FPGA is a programmable semiconductor that combines digital logic with analog or mixed-signal resources. In the device hierarchy, AFS600 belongs to the FPGA and CPLD class, then to mixed-signal FPGAs, programmable logic devices, and ultimately broader integrated-circuit and semiconductor categories. Its nonvolatile flash configuration retains the programmed image when power is removed and supports Live at Power-Up, allowing the configured logic to operate immediately after power restoration. The principal feature set includes 600,000 system gates, 172 I/O, a 1.5 V supply, and integration of analog blocks with flash-based programmable logic. The manufacturer describes the Fusion family as combining configurable analog functions, substantial flash memory, comprehensive clock generation and management, and high-performance programmable logic in one device. These resources support designs that benefit from reconfigurable digital control, embedded memory, analog monitoring, and deterministic control without using several separate devices. The AFS600 family uses an advanced 130 nm, seven-layer-metal, flash-based CMOS process. That process supports a monolithic implementation rather than requiring an external configuration flash device. According to the supplied manufacturer-family description, the architecture is nonvolatile and supports Live at Power-Up. The target ordering code is associated with a 484-pin package; however, the verified sources conflict on whether the package is described as BGA-256 or 484-BGA, so the physical-package interpretation must be confirmed against the official ordering documentation before PCB release. Typical uses include industrial automation, communications infrastructure, embedded control, data acquisition, instrumentation, and mixed-signal processing. The integrated architecture is useful when analog measurement, control logic, flash storage, and clocking must be coordinated in one programmable device. The 0 C to 70 C range is suitable for commercial-temperature equipment, while applications requiring extended or automotive temperature support should use a suitably qualified part number. Before design-in, verify the complete pinout, package drawing, power rails, supported I/O standards, clock requirements, and programming configuration against the official Microsemi or Microchip documentation. The supplied search results establish the core identity and several headline parameters, but they do not provide a complete pin table, pricing schedule, or lifecycle statement; those items are therefore not inferred here. This page combines verified AFS600-family specifications, package and sourcing records, and substitution guidance for engineers. It distinguishes confirmed values from unresolved package and lifecycle details so a hardware or purchasing decision can be based on manufacturer documentation rather than assumptions.
AFS600-PQ208 - 600K-Gate 1.5V CMOS FPGA | Microchip
The Microchip AFS600-PQ208 is a Fusion FPGA with 600,000 equivalent system gates, a 1.5 V supply, and a 208-pin PQFP package. The verified source data identifies the device as a CMOS, flash-based FPGA using advanced 130 nm, seven-layer metal technology. It is designed for digital designs requiring nonvolatile configuration and live-at-power-up operation. What is an FPGA? A field-programmable gate array is a programmable digital semiconductor. An FPGA belongs to the broader logic-device hierarchy, alongside CPLDs, and provides configurable digital logic, routing, and I/O resources. Unlike software-programmable microcontrollers, an FPGA implements a circuit directly in hardware. The Fusion family combines programmable logic with integrated analog, flash, clock-generation, and clock-management resources. The AFS600-PQ208 provides 13,824 logic cells according to the verified product-page data for the related AFS600-PQ208Y listing. The family is identified as a 600K-gate FPGA, and the verified sources describe a nominal 1.5 V supply with a 1.425 V to 1.575 V range for the related commercial variant. Its 208-pin PQFP package is identified as a surface-mount package with a 0.5 mm terminal pitch in one verified source. Fusion devices are flash-based, so the configuration is nonvolatile and remains available when power is removed. The verified search data also identifies live-at-power-up capability, allowing the device to begin operation from its stored configuration without an external configuration load after power restoration. The 130 nm CMOS process and integrated programmable resources support designs that combine logic, analog functions, and memory blocks. Typical applications include industrial control, communications, instrumentation, embedded signal processing, and prototype systems. The package and device resources should be checked against the specific Microchip datasheet before a PCB or migration decision because the available verified data contains inconsistent package descriptions for similarly named pages. A key design consideration is power and temperature verification. The available data supports a 0 C to 70 C operating range for one AFS600-PQ208 listing, while a related AFS600-PQ208YI page lists -40 C to 100 C; those ranges must not be transferred between MPNs without checking the exact ordering code. This page consolidates the verified AFS600 source records, identifies where package and lifecycle information requires verification, and distinguishes exact data from unresolved parameters without guessing. The AFS600-PQ208 should be selected for a 208-pin Fusion design only after confirming the exact pinout, electrical limits, programming configuration, and supply requirements in the manufacturer documentation.
AGFB014R24A2E2V - Agilex 7 FPGA, 1.44M LE, 10nm | Altera
The Altera (Intel) AGFB014R24A2E2V is an Agilex 7 FPGA F-Series 014 (R24A) field-programmable gate array with 1,437,240 logic cells, manufactured on Intel 10nm FinFET process technology, housed in a large fine-pitch ball grid array package (R24A package option, FBGA family, surface mount). An FPGA (Field-Programmable Gate Array) is a semiconductor device containing a fabric of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be configured by the end user after manufacturing. Within the programmable-logic hierarchy, FPGAs sit above CPLDs in density and capability, and the Agilex 7 family represents Intel/Altera's flagship line of high-performance FPGAs, positioned above Agilex 5 and Stratix-class mid-range devices for data center, networking, and signal processing workloads. Key features include the 1,437,240 logic cell count organized into approximately 48,720 CLBs, 768 user inputs and 768 outputs, and 10nm FinFET process technology that delivers high logic density with improved power efficiency compared to the prior 14nm generation. The E2 speed grade balances performance and power, and the core supply operates at 0.9V per distributor data. Technically, the Agilex 7 F-Series fabric leverages second-generation Intel EMIB and advanced die-stacking packaging concepts to connect the 10nm core fabric with high-speed transceiver tiles, providing very high aggregate bandwidth for Ethernet, PCIe-class and optical-fron GPLD workloads; exact transceiver counts and data rates for this OPN are given in the manufacturer datasheet. Typical applications include data center acceleration, 5G and wireless baseband, high-bandwidth networking and switching, broadcast video processing, and defense/aerospace radar and electronic-warfare signal processing, where over one million logic elements and high-speed serial bandwidth are required. A key design consideration: Agilex 7 F-Series devices require a rigorous multi-rail power sequencing design and dedicated Intel Enpirion-class power solutions; always validate the power tree against the manufacturer power specs before layout. This page synthesizes distributor availability, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
AGFB027R24A2E2V - Agilex 7 F-Series SoC FPGA, 2.7M LE | Altera
The Intel (formerly Altera) AGFB027R24A2E2V is an Agilex 7 FPGA F-Series 027 System-on-Chip (SoC) device that integrates a quad-core 64-bit Arm Cortex-A53 hard processor subsystem with 2.7M logic elements and high-speed transceiver fabric, fabricated on Intel 7 / 10 nm SuperFin FinFET process technology and housed in a 2486-ball PBGA package. It belongs to the F-Series 027 transceivers-equipped tier, targeting compute-intensive and high-bandwidth I/O applications in data center, networking, defense, and test/measurement segments. An FPGA (Field-Programmable Gate Array) is a reconfigurable digital logic device that engineers program after manufacture; a SoC FPGA additionally embeds a hard processor subsystem (HPS), high-speed transceivers, and hardened memory/PCIe/Ethernet controllers, eliminating the need to instantiate those functions in soft logic. The broader taxonomy is FPGA -> programmable logic device -> semiconductor IC, while SoC FPGAs occupy the convergence point between programmable logic and application processors. Key headline specifications of AGFB027R24A2E2V include approximately 2,692,760 logic elements organized in 91,280 Configurable Logic Blocks (CLBs), 1.4 GHz maximum fabric core clock, a quad-core 64-bit Arm Cortex-A53 MPCore with NEON and Floating Point Unit (FPU), CoreSight debug, and F-Series transceivers supporting multi-gigabit serial interfaces. The device operates across industrial and extended temperature grades from 0C to 100C with a nominal core supply of 0.685 V (min 0.664 V, max 0.706 V). Architecturally, the F-Series combines a HyperFlex-style enhanced core fabric with hardened floating-point DSP blocks, embedded SRAM (M20K), variable-precision DSP, and high-bandwidth memory (HBM2E) controller IP on select variants, paired with up to 57 Gbps / 28 Gbps / 16 Gbps F-Series transceivers. The SoC HPS uses coherent Cache Coherent Interconnect (CCI) bridges to the FPGA fabric, enabling shared-memory acceleration. Typical applications include high-performance compute acceleration cards (PCIe Gen5 add-in), 100G/400G networking line cards, defense radar and electronic-warfare signal processing, 5G radio unit baseband, broadcast and professional video processing, and protocol-aware test/measurement instrumentation. The wide I/O bandwidth also suits storage controllers and computational storage drives. When designing with this Agilex 7 device, plan for multi-rail power sequencing (0.685 V core, 0.8 V/0.9 V transceiver, 1.8 V/3.3 V I/O) using Agilex 7-recommended Intel Enpirion power converters, validate the BGA escape with at least 12 PCB layers, and reserve thermal headroom - the 2486-ball PBGA typically requires a heatsink or cold-plate at sustained workloads above 60 W. This page synthesizes distributor inventory, parametric alternatives, and Agilex 7 design considerations beyond the manufacturer datasheet to support PCB design-in, sourcing, and migration decisions.
AGL600V5-FGG144I - 600K Gate IGLOO FPGA, 144-FBGA | Microchip
The Microchip (formerly Microsemi) AGL600V5-FGG144I is an ultra-low-power IGLOO Field Programmable Gate Array (FPGA) with 600K system gates and 13,824 logic elements (equivalent to 7K LEs per Mouser's descriptor), packaged in a 144-ball Fine-pitch BGA (FBGA) with 97 user I/Os. Built on a 130 nm Flash-based CMOS process with a 1.5 V core, this device targets handheld, battery-powered, and power-constrained designs where standby current is critical and reprogrammability is required. An IGLOO FPGA is a low-power Flash-based programmable logic device that combines the flexibility of an SRAM FPGA with the non-volatility and low standby current of Flash memory. IGLOO sits within the broader taxonomy of programmable logic: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The device family pioneered Flash*Freeze technology, which allows I/O and register state retention while dropping core power to as low as 108 µW, enabling instant wake-up on demand without reconfiguration. Key differentiating specifications include the Flash*Freeze static current of 108 µW (industry-leading for its generation), 110,592 bits of embedded SRAM, 13824 flip-flops, support for 1.5 V VCC core operation, and 97 single-ended or differential-pair capable I/Os. The "V5" speed grade, "FGG144" 144-FBGA package, and "I" industrial temperature range (-40 °C to +100 °C operating junction) together define the ordering code. Architecturally, IGLOO uses a 4-input LUT-based VersaTile fabric, embedded SRAM blocks, dedicated PLL/CCC blocks, and Flash configuration memory that eliminates the external boot PROM required by SRAM FPGAs. Compared with SRAM FPGAs of similar density, IGLOO provides faster wake-up, lower standby power, and live-at-power-up behavior in a smaller PCB footprint. Typical applications include ultra-low-power portable and battery-powered products, handheld medical telemetry, IoT edge sensor hubs, industrial remote monitoring, aerospace avionics housekeeping controllers, and any system that needs instant-on logic with multi-year battery life. The 144-FBGA footprint and 97 I/Os also suit mid-complexity glue logic consolidation in space-constrained designs. When designing with this part, budget Flash*Freeze entry/exit time, plan I/O bank voltage (VCCI) before PCB layout, and use the Libero SoC design suite for synthesis, place-and-route, and programming file creation. Designers should also account for junction-temperature derating in sealed enclosures, since IGLOO's industrial grade only extends to +100 °C Tj. This page aggregates distributor pricing, drop-in alternatives, and design notes not found in the standalone manufacturer datasheet.
APA150-TQ100I - 150K Gates ProASICPLUS FPGA, 100-TQFP | Microchip
The Microchip APA150-TQ100I is a 150,000-system-gate ProASICPLUS family Field Programmable Gate Array (FPGA) housed in a 100-pin TQFP (TQ100) surface-mount package and qualified for the industrial -40C to +85C temperature range. It integrates 36,864 bits of two-port SRAM, 6,144 logic cells, and 66 user I/Os, supporting up to 350 MHz internal system performance and 180 MHz external performance on a 2.5V core supply. A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device built from an array of configurable logic blocks (CLBs), programmable routing, and dedicated memory and I/O resources, sitting in the broader taxonomy of programmable logic devices (PLD) -> logic ICs -> integrated circuits. The ProASICPLUS family is notable because it is nonvolatile and live-at-power-up, combining the instant-on behavior of ASICs with the flexibility of SRAM-based FPGAs, eliminating the need for external boot PROMs and avoiding the configuration-time power-up glitches common to SRAM FPGAs. Key features of the APA150-TQ100I include 150K system gates, 36 kbits of embedded two-port SRAM, an integrated PCI core that supports 32-bit, 33/66 MHz PCI operation, Schmitt-trigger input option for noisy industrial environments, and IEEE 1149.1 boundary-scan (JTAG) for board-level test access. The 0.22-micron CMOS process delivers low static power relative to SRAM-based equivalents and high noise immunity. The device is fabricated on a 0.22 um CMOS process and uses flash-based switch technology, which is nonvolatile and reprogrammable. This architecture supports live-at-power-up single-chip operation, removes the external configuration memory, and provides inherent design security through the on-chip flash cells. Performance is bounded by the 350 MHz internal / 180 MHz external system frequency figures and by 3.3V, 32-bit PCI support up to 50 MHz. Typical applications include industrial control and factory automation, telecom interface cards, low-volume ASIC replacement, secure firmware IP cores, and embedded glue logic around microcontrollers. The 2.5V core, 3.3V I/O PCI support and industrial temperature grade also make it suitable for legacy industrial bus bridges. When designing with this FPGA, plan power sequencing so that the 2.5V core rail comes up cleanly before the 3.3V I/O rail drives signal lines, and use Microchip's Libero IDE or Designer toolchain for place-and-route. Decoupling should follow the 0.1 uF-per-power-pin guideline plus bulk caps per supply domain. This page synthesizes distributor pricing, drop-in ProASIC alternatives, and practical design notes not found in the manufacturer datasheet.
APA300-FG256 - ProASICPLUS 300K Gates FPGA, 256-LBGA | Microchip
The Microchip APA300-FG256 is a member of the ProASICPLUS family of non-volatile, reprogrammable Flash-based FPGAs offering 300,000 system gates in a 256-ball Fine-pitch BGA (FG256) package. It integrates 73,728 bits of two-port SRAM, supports up to 186 user I/Os, and operates on a 2.5 V core supply with 3.3 V PCI-compliant I/O tolerance, targeting cost-sensitive designs that require ASIC-like security and live-at-power-up behavior. A ProASICPLUS device is a Flash-based field programmable gate array that combines the convenience of SRAM-based FPGAs with the non-volatility of one-time-programmable devices. It sits in the broader programmable-logic hierarchy between low-density CPLDs and high-density SRAM FPGAs; the Flash configuration cell removes the need for external boot PROMs while still allowing unlimited in-system reprogramming through JTAG. Key features of the APA300 include up to 350 MHz internal system performance and 150 MHz external performance, 32-bit/33 MHz PCI compliance, built-in Schmitt trigger and slew-rate options on every I/O, dedicated SRAM blocks with two-port access, and Live at Power-Up operation that guarantees defined logic state on every power rail transition without external configuration logic. The FlashFreeze mode further reduces standby current while retaining SRAM and register state. Architecturally, the device uses a fine-grained sea-of-tiles structure with a four-input lookup table per logic tile and dedicated routing tracks, paired with dedicated two-port SRAM blocks placed along the tile rows. The Flash configuration is in-system programmable through IEEE 1149.1 JTAG, eliminating external boot memory and supporting field upgrades without hardware rework. Typical applications include glue-logic replacement on industrial controllers, low-volume ASIC replacement for telecom line cards, secure cryptographic key storage in payment and access systems, avionics and military prototypes requiring live-at-power-up determinism, and PCI target devices on embedded computing platforms. The 256-ball LBGA footprint and I/O count make it suitable for medium-complexity bus-bridging designs. When designing with this part, allocate at least one decoupling capacitor per VCC/IO power pin pair and follow Microsemi/Microchip recommended JTAG chain ordering if multiple ProASICPLUS devices share the boundary-scan bus. Designers migrating from the legacy APA300-FG144 should verify BGA ball-mapping compatibility because the 256-ball package adds power and ground pins that are absent on the smaller FG144 footprint. This page synthesizes distributor pricing, same-family alternatives, and practical layout notes not consolidated in the manufacturer datasheet, complementing the official documentation with sourcing and design guidance.
AT40K10-2AJC - 10K Gate FPGA w/ FreeRAM, 84-PLCC | Microchip
The Microchip Technology AT40K10-2AJC is a 5V, 10K to 20K gate AT40K/KLV family Field Programmable Gate Array (FPGA) IC featuring 4608 logic elements, 576 flip-flops, 62 user I/O pins, and built-in FreeRAM distributed SRAM in a 84-pin LCC (J-Lead) package. Per the ATMEL Corporation datasheet (67 pages, 1Mb), this part targets high-performance coprocessor and glue-logic applications where system speeds up to 100 MHz and on-chip multipliers faster than 50 MHz (10 ns pipeline cycle) are required. The '-2' speed grade combined with industrial temperature grading makes the part suited to demanding embedded designs. An FPGA (Field Programmable Gate Array) is a reconfigurable digital integrated circuit that combines programmable logic blocks, programmable interconnect, and configurable I/O on a single die. FPGAs sit above standard logic ICs and below ASICs in the design hierarchy: they offer ASIC-class parallelism and throughput without the NRE mask costs, making them ideal for low-to-mid volume designs, prototyping, hardware acceleration, and custom bus interfaces. The AT40K family adds unique FreeRAM distributed SRAM blocks to the classical FPGA fabric, allowing byte-wide memory access and efficient data-path implementation directly in the fabric. Key features include internal tri-state bus capability for implementing shared-bus architectures without external glue logic, dedicated hardware multipliers (>50 MHz), distributed SRAM via FreeRAM, and JTAG-based in-system programming. The 62 user I/Os support 5V CMOS/TTL signalling and provide flexible voltage translation across mixed-voltage system designs. The 84-pin J-leaded ceramic/PLCC body eases soldering, inspection, and rework during development. Architecturally, the AT40K10 builds on a fine-grained symmetric array with 4-input look-up tables (LUTs) and dual-port FreeRAM cells that double as logic or memory depending on user configuration. The LUT-based fabric delivers efficient state-machine and arithmetic implementation while the FreeRAM supports FIFOs, register files and small cache structures. The 5V core plus tolerant I/O allow direct interfacing to legacy 5V microcontrollers and DSPs. Typical applications include high-performance coprocessor interfacing to 8/16-bit microcontrollers, ASIC prototyping, glue-logic replacement in telecom and industrial control, and parallel DSP pipelines. The FreeRAM blocks make the part especially attractive for register-file and small-FIFO implementation in DSP glue. The 84-LCC J-lead package and the long-lifecycle nature of AT40 silicon also suit long-term industrial programs. When designing with the AT40K10-2AJC, ensure the JTAG chain follows ATMEL's BSDL ordering and provide adequate decoupling (>=0.1uF + 10uF bulk) close to each VCC/IO bank. Confirming timing constraints with the datasheet is critical because the 100 MHz system speed grade assumes worst-case commercial PVT conditions and may derate under industrial temperature operation. This page synthesizes distributor pricing, drop-in alternatives inside the AT40K family, and practical design notes that go beyond what the manufacturer datasheet alone provides.
AT40K10AL-1BQU - 10K Gate 3.3V AT40KAL FPGA | Microchip 144-LQFP
The Microchip Technology (formerly Atmel) AT40K10AL-1BQU is a CMOS Field Programmable Gate Array from the AT40KAL series, integrating 10,000 system gates with up to 50,000 usable gates and 576 logic cells in a 144-pin LQFP package. It operates from a 3.0V to 3.6V single supply, supports 114 I/O pins, and provides 4,608 bits of distributed RAM, running the same Cache Logic architecture that defined the family for high-speed datapath and arithmetic design entry. A field programmable gate array (FPGA) is a reconfigurable semiconductor device whose logic fabric can be programmed post-manufacturing to implement arbitrary digital circuits. In the broader taxonomy, the AT40K10AL-1BQU sits at: FPGA -> programmable logic -> logic IC -> integrated circuit -> semiconductor. Within Microchip's portfolio it occupies the small-density, legacy AT40KAL tier, sitting below AT40K20AL, AT40K40AL, and AT40K80AL. Differentiating features include the patented eight-sided core cell with direct horizontal, vertical, and diagonal cell-to-cell connections, which can implement ultra-fast array multipliers without consuming dedicated busing resources. The device advertises a 1 ns combinatorial pin-to-pin delay class, 2.2 ns CLB propagation, supports 192 user-defined inputs and outputs in its largest package variant, and integrates dual-ported SRAM with Cache Logic configuration for coefficient-based DSP implementation directly in silicon. Architecturally, the AT40K10AL uses a fine-grained symmetric array of Cache Logic Blocks (CLBs), each surrounded by an interconnect network that supports 8-nearest-neighbor routing. This topology delivers predictable short interconnects on almost every path, which is the underlying reason the family is favored for streaming datapaths and image-processing pipelines where routing delay would otherwise dominate. Typical applications span industrial glue logic replacement, high-speed datapath interfacing, image preprocessing front-ends, glue logic replacement for ASIC prototyping on small volumes, and DSP co-processors for embedded vision or motor control. The wide 3.3V IO tolerance lets it bridge 5V legacy buses with level shifters. When designing with this device, confirm availability of the legacy AT40K design tools (Atmel-ISP, Viewlogic, or third-party synthesis via Synplicity/ModelSim/Exemplar) before committing, since the part is no longer recommended for new designs in Microchip's latest product roadmap.
ATF1502AS-10AU44 - 32-Macrocell 5V ISP CPLD, 10ns, TQFP-44 | Microchip
The Microchip ATF1502AS-10AU44 is a 5V, 32-macrocell in-system programmable (ISP) Complex Programmable Logic Device (CPLD) housed in a 44-pin TQFP package, offering 10 ns pin-to-pin propagation delay and up to 36 usable inputs/I/Os in a 750-gate density footprint. Built on electrically-erasable (E2PROM) non-volatile memory technology, the ATF1502AS-10AU44 retains its configuration without external storage and supports field re-programmability through a standard 4-pin JTAG interface. A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PAL-like macrocells, a centralized AND array, and a programmable interconnect on a single chip. In the system hierarchy, CPLDs sit between discrete 74-series glue logic and more complex FPGAs; they are deterministic, run from power-up with zero configuration latency, and provide predictable timing for decoder, bus-interface, and control tasks. The ATF1502AS family targets 5V legacy system designs where modern 3.3V FPGAs are not compliant with the input voltage rails. Key differentiating features of the ATF1502AS-10AU44 include 32 macrocells, up to 32 bidirectional I/O pins plus 4 dedicated input pins, an enhanced routing switch matrix that improves usable gate count, pin-to-pin propagation delay of 10 ns, system frequency up to 100 MHz, and zero-power standby support. The device offers fast in-system programming (ISP) via JTAG, allowing firmware revision updates without removing the part from the board. Power supply operates from 4.5V to 5.5V with typical I/O 5V tolerance. The ATF1502AS-10AU44 is pin-compatible with industry-standard 44-pin TQFP CPLDs and slots into legacy footprints where migration from older Atmel and third-party 32-macrocell CPLDs is required. The enhanced routing switch matrix increases the odds of successful pin-locked design modifications compared to first-generation CPLD architectures. Typical applications include 5V bus interface bridging, address decoding for legacy microcontrollers, glue logic replacement in industrial controllers, I/O expansion for 8-bit and 16-bit MCUs, and power-on sequencing logic in mixed-voltage systems. The 5V-tolerant I/Os allow direct connection to TTL/CMOS logic without external level shifters. For designers, the most critical design tip is to budget adequate decoupling (100 nF X7R plus 10 uF bulk) right at the VCC pins, because CPLD outputs can drive simultaneous switching edges that inject supply noise. Designers should also confirm that any migrated 3.3V firmware does not violate the 5.5V absolute-maximum VCCIO rating during in-circuit programming. This page consolidates distributor pricing, verified same-package drop-in alternatives, and applied design notes not found in the standalone manufacturer datasheet, helping engineers accelerate 5V CPLD selection and sourcing decisions.
ATF1504ASL-25AU44 - 64 Macrocells, 25ns, 5V ISP CPLD | Microchip
The Microchip Technology ATF1504ASL-25AU44 is a 5V, high-performance, In-System Programmable (ISP) Complex Programmable Logic Device (CPLD) from the ATF15xx family, delivering 64 macrocells in a 44-pin TQFP (10x10 mm) surface-mount package. It offers 1.5K equivalent gates, a maximum propagation delay of 25 ns (tPD), and 32 user I/O pins, operating from a single 4.5 V to 5.5 V supply across the industrial -40 C to +85 C temperature range. A CPLD (Complex Programmable Logic Device) is a non-volatile, reprogrammable digital logic IC that combines the instant-on, deterministic timing of PAL/GAL architectures with denser logic capacity, sitting in the programmable logic hierarchy between simple SPLDs and larger FPGAs. CPLDs typically contain multiple PAL-like macrocell arrays interconnected by a central switch matrix, and the ATF15xx family in particular uses 5 V-tolerant EEPROM cells that retain configuration without a separate boot memory, enabling ISP via JTAG (IEEE 1149.1). Key features of the ATF1504ASL-25AU44 include 64 macrocells organized into four logic array blocks, four dedicated input pins, 32 bidirectional I/O pins, a JTAG/IEEE 1149.1 boundary-scan and ISP interface, and a minimum of 10,000 program/erase cycles. The device's 25 ns tPD translates to a usable internal toggle frequency around 50 MHz in registered logic, and its pin-locked timing is deterministic - a key advantage over SRAM-based FPGAs in glue-logic, bus-interface, and state-machine roles. Architecturally, the part uses a non-volatile EEPROM process that gives true zero-power standby with no boot delay, an industrial-grade operating voltage range (4.5 V to 5.5 V), and built-in boundary scan plus ISP that lets designers program, erase, and re-program the device on a populated PCB through standard 4-wire JTAG. Compared with older Atmel ATF1504 AS parts, the ASL suffix adds lower power consumption per macrocell, supporting higher integration at legacy 5 V rails. Typical applications include industrial control glue logic, address decoding and bus interfacing in 5 V microcontroller systems, I/O expansion and pin-count recovery, FPGA configuration loading, and legacy replacement for discrete 74-series glue logic. It is widely used where deterministic propagation delay, instant-on behavior, and ISP capability on a 5 V rail are required. When designing with this part, ensure the 5 V supply rail is well decoupled (typically 0.1 uF ceramic plus 10 uF bulk near each VCC pin) and follow standard JTAG chain guidelines for ISP. Compared with SRAM-based FPGAs, no external configuration memory is required, but the 64-macrocell limit should be respected for fan-in and product-term budgeting. This page synthesizes distributor pricing (as of 2026-10-07), verified drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, giving a faster engineering decision path for the ATF1504ASL-25AU44.
ATF1504ASL-25AU44 - 64-Macrocell 5V ISP CPLD, 25ns | Microchip
The Microchip Technology ATF1504ASL-25AU44 is a 64-macrocell, in-system programmable (ISP) complex programmable logic device (CPLD) with a 25 ns propagation delay and 60 MHz maximum clock frequency, housed in a 44-pin TQFP package. It operates from a single 4.5 V to 5.5 V supply and provides 32 inputs/I/Os (68 user I/O pins per the device datasheet summary), 64 registers, and 64 macrocells in a low-power "L" process variant. A complex programmable logic device (CPLD) is a non-volatile, electrically erasable digital logic IC that integrates multiple PAL-like macrocell arrays on a single die, with a programmable AND/OR interconnect fabric in between. CPLDs sit between simple SPLD/GAL devices and larger FPGAs in the programmable-logic hierarchy, and are used for glue logic, bus interfacing, state-machine decoding, and high-density combinatorial replacement where deterministic timing and instant-on behavior are required. The ATF15xx series in particular is a 5 V legacy family known for ISP and high pin-keeper drive strength. Key features of this part include 25 ns pin-to-pin propagation delay (tPD), 60 MHz maximum operating frequency, a minimum of 10,000 program/erase cycles, JTAG-based IEEE 1149.1 boundary-scan and ISP, pin-keeper circuits on inputs and I/Os, and programmable power management for low-power macrocell operation. The "L" suffix denotes the lower-power process option; "A" denotes the standard 44-pin TQFP package; "U44" specifies a green / Pb-free TQFP-44 package. The device is built on Microchip/Atmel's proven electrically-erasable (EE) technology, which gives non-volatile storage of the user logic - the part functions at power-up with no external configuration PROM. Architecturally, the four logic blocks each contain 16 macrocells feeding a connected global interconnect, with per-pin output enable, slew-rate, and pin-keeper options set during programming. Typical applications include 5 V bus interface and voltage-translation logic, address decoding and chip-select generation in legacy microprocessor systems, industrial control glue logic, state-machine replacement for discrete 74xx logic, and instant-on control logic in motor drives and instrumentation. The wide 5V nature tolerance and industrial -40C to +85C temperature range also suit harsh environment controllers. When designing with this device, ensure the JTAG chain order is maintained if multiple ATF1504ASL devices share TCK/TMS/TDI, and add a 0.1 uF decoupling capacitor near each VCC pin. The ISP programming voltage is generated internally, so no external 12 V programmer supply is required. Power sequencing is straightforward due to the non-volatile configuration. This page synthesizes Microchip product-page data, distributor pricing from DigiKey/Mouser, and engineering guidance for the ATF1504ASL family - information not found in the standalone datasheet.
ATF2500C-20GM - 24 Macrocell 5V CPLD, 40-CerDIP | Microchip
The Microchip ATF2500C-20GM is a high-performance, high-density, electrically-erasable Complex Programmable Logic Device (CPLD) delivering 2,500 gates with 24 macrocells and 48 flip-flops in a 40-pin ceramic DIP (CerDIP) through-hole package. It operates from a single 5 V supply with a maximum pin-to-pin propagation delay of 20 ns, and is rated across -55 C to +125 C for high-stress embedded and industrial environments. What is a CPLD? A Complex Programmable Logic Device is a non-volatile, electrically-erasable programmable logic IC that sits between simple legacy PLDs (PAL/GAL) and larger FPGAs in the programmable logic taxonomy (PLD -> CPLD -> FPGA -> programmable logic -> semiconductor). CPLDs offer deterministic pin-to-pin timing, instant-on behavior, modest logic density, and are typically programmed via JTAG or ISP rather than loaded from external memory, which makes them well-suited for glue logic, bus decoding, state-machine control, and I/O expansion in cost-sensitive designs. Key features of the ATF2500C-20GM include a fully-connected AND-array logic architecture with 416 product terms, individually programmable macrocell output polarity, and two flip-flops per macrocell for sequential logic. The device supports JTAG-based IEEE 1149.1 boundary-scan testing, in-system programmability through the standard Atmel/Microchip tool chain, and is pin-compatible with several Atmel ATV2500 predecessors, easing migration from older designs. The ATF2500C family uses an electrically-erasable CMOS process with a proven cell architecture that delivers high gate utilization and predictable timing. Its 20 ns maximum pin-to-pin delay is adequate for decoder, address-mapping, interrupt-control, and peripheral-interface glue logic, while the EEPROM cells provide >10,000 erase/write cycles and support design iteration during development and field updates. Typical applications include industrial control boards, legacy bus-interface adapters, address decoding for microcontroller-based systems, state-machine controllers for motor drives, and glue logic in telecom, aerospace, and military systems where the -55 C to +125 C rating and ceramic package provide required reliability headroom. When designing with this device, plan JTAG signal integrity carefully, provide clean 5 V decoupling, and validate programming using the supported Atmel/Microchip device programmer chain. The ceramic DIP package supports through-hole assembly and socketed programming during development. This page synthesizes distributor pricing, parametric comparison data, and drop-in compatible alternatives for the ATF2500C-20GM that are not consolidated on a single manufacturer or distributor datasheet page.
ATF750C-10PC - 10ns 10-Macrocell 24-Pin DIP CPLD | Microchip
The Microchip ATF750C-10PC is a 10-macrocell high-speed CMOS complex programmable logic device (CPLD) in a 24-pin PDIP through-hole package, with a 10 ns propagation delay and 750-gate logic capacity. It supersedes the classic 22V10 footprint family while remaining backward-compatible with the legacy Atmel ATV750/B/L pinout and JEDEC file. A CPLD (Complex Programmable Logic Device) is a non-volatile, electrically erasable logic IC that implements glue logic, state machines, decoder/encoder functions, and bus-interface adaptation between fixed-function silicon blocks. In the broader taxonomy, ATF750C sits at: CPLD -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. The 'C' variant uses standard CMOS I/O; the 'CL' suffix denotes a low-power Edge-sensing variant with 1 mA standby current for battery-backed designs. Key features include a 4.75V to 5.25V single-supply operating range, 10 bidirectional user I/O pins, ten flip-flops with macrocell output polarity control, and zero-power CMOS technology with 100 µA typical standby current. The device is specified across commercial 0°C to 70°C ambient temperature and offers in-system programmability via the Atmel/Microchip standard 4-pin IEEE 1149 JTAG interface on JTAG-equipped derivatives. The ATF750C-10PC uses a sum-of-products AND-OR architecture with feedback paths, output enable control, and buried macrocell registers. Compared to a discrete 22V10 design, it doubles the available product terms per macrocell and adds JEDEC-file compatibility with industry-standard 22V10 tools, simplifying conversion of older PLD designs. Its 10 ns pin-to-pin delay is suitable for decoder, address-mapping, and interrupt-controller tasks rather than high-speed datapath work. Typical applications include 22V10 replacement in legacy glue-logic designs, address decoding and chip-select generation in 8-bit and 16-bit microprocessor systems, bus arbitration and wait-state insertion logic, FPGA configuration I/O expansion, and industrial control logic in long-life equipment. The DIP-24 footprint and 5V supply make it convenient for through-hole prototypes and field replacements of obsolete 22V10 sockets. When designing with this device, plan for a 5V regulated supply and reserve one 0.1 µF decoupling capacitor per VCC pin pair. The 'PC' suffix indicates a commercial-temperature PDIP package - if the application requires industrial temperature range, choose the 'PI' variant; if surface-mount is needed, choose the 'SC' (SOIC-24) variant. Verify timing with the Atmel/Microchip WinCUPL or compatible third-party toolchain rather than relying on legacy datasheet delays. This page synthesizes distributor pricing tiers, drop-in same-package alternatives, application guidance and practical design notes not collected in any single manufacturer document, helping engineers evaluate the ATF750C-10PC against modern CPLD options.
CMXO3LF-2100C-6BG324I - MachXO3LF 2112 LUT FPGA, 324-CABGA | Lattice
The Lattice Semiconductor CMXO3LF-2100C-6BG324I is a member of the MachXO3LF family of non-volatile Field Programmable Gate Arrays (FPGAs) delivering 2112 Look-Up Tables (LUTs) and 75,776 bits of embedded block RAM in a 324-pin chip-array BGA (CABGA) package. It features 279 user I/O pins supporting multiple I/O standards, dual 2.5V/3.3V supply rails, and instant-on via on-chip Flash configuration memory. Operating over the -40C to +100C industrial temperature range with a -6 speed grade, this device targets glue-logic, control-plane, and low-power parallel processing applications. A Field Programmable Gate Array (FPGA) is a semiconductor device containing an array of configurable logic blocks (CLBs), programmable routing, and I/O cells, all of which can be re-programmed in-circuit to implement arbitrary digital logic. FPGAs occupy the middle ground between fixed-function ASICs (high NRE, low unit cost) and microcontrollers (limited parallelism, deterministic firmware). Within the broader taxonomy, the CMXO3LF belongs to the MachXO3LF sub-family: FPGAs optimized for bridging, control logic, and instant-on tasks rather than high-throughput DSP or AI workloads. Key features of the CMXO3LF-2100C include 2112 LUTs (4-input), 75,776 bits of distributed/embedded block RAM, 279 user I/O across multiple banks, embedded block RAM with FIFO support, and on-chip Flash for instant-on configuration. The -6 speed grade and industrial temperature range (TJ -40C to +100C) make it suitable for harsh-environment designs. The 324-CABGA package supports high pin-count designs requiring wide parallel interfaces. Technically, the MachXO3LF architecture combines LUT-based logic fabric with hardened I/O buffers supporting LVCMOS, LVTTL, SSTL, and other signaling standards. On-chip Flash eliminates the need for external boot memory, enabling sub-20 ms configuration times. The 324-CABGA package provides controlled impedance and robust mechanical reliability for industrial PCB assemblies. Typical applications include industrial control and factory automation, bridging between legacy and modern bus protocols (I2C, SPI, UART to parallel), motor control glue logic, LED display controllers, sensor aggregation hubs, and IoT edge nodes. The combination of high I/O count and instant-on makes it ideal for systems that must wake up and respond quickly without external boot devices. When designing with this device, verify that the chosen I/O bank voltages match your downstream peripherals and confirm the JTAG programming chain if in-system reprogramming is required. The 324-CABGA package demands careful PCB layout: controlled-impedance traces, sufficient via-in-pad design rules, and a robust ground plane are essential for signal integrity. This page consolidates distributor pricing, drop-in same-package alternatives, and practical design notes that go beyond the manufacturer datasheet to help engineers select, source, and integrate the CMXO3LF-2100C-6BG324I efficiently.
DLP4500 - 0.45 WXGA DMD | Texas Instruments | Spatial Light Modulator
The DLP4500 from Texas Instruments is a digitally controlled MOEMS (micro-opto-electromechanical system) spatial light modulator (SLM) featuring a 0.45-inch (11.43 mm) diagonal micromirror array of aluminum, micrometer-sized mirrors. With a 7.6-µm micromirror pitch and ±12° micromirror tilt angle, it delivers high-resolution pattern steering for visible light applications. The device is designed to work with the DLPC350 controller, which coordinates mirror reset pulses and image data loading. A digital micromirror device (DMD) is an array of microscopic mirrors that reflect light to create patterns or images. Each mirror represents one pixel and can be tilted between two states to modulate light. DMDs are the core of DLP projection technology and are used in spatial light modulation for structured light, 3D scanning, and optical patterning. The DLP4500 is a WXGA (912 × 1140) array, offering high resolution in a compact form factor. Key features include a 912 × 1140 micromirror array, 7.6-µm mirror pitch, ±12° tilt angle, and support for a 30-bit parallel RGB interface for image data transfers. The device operates with a DLPC350 controller and requires proper generation of PWRGOOD and POSENSE inputs for reliable operation. The DLP4500 is available in a 98-pin LCCC package (20.7 × 9.1 mm) and is designed for visible light applications. The DLP4500 uses a MEMS (micro-electromechanical systems) architecture where each micromirror is electrostatically actuated. The mirrors are arranged in a 912 × 1140 array with a uniform band of border micromirrors that are not user-addressable. The device supports high-speed pattern rates, making it suitable for applications requiring fast light modulation. The DLPC350 controller generates internal mirror reset pulses, ensuring precise timing. Typical applications include 3D scanning and measurement, structured light for machine vision, augmented reality, and optical patterning. The DLP4500 is also used in medical imaging and spectroscopy. Its high resolution and fast switching make it ideal for industrial and scientific applications where precise light control is essential. When designing with the DLP4500, ensure proper thermal management and signal integrity. The device requires a clean power supply and careful PCB layout to minimize noise. The DLPC350 controller must be configured correctly to achieve optimal performance.